DISCRETE SEMICONDUCTORS DATA SHEET BUW11W; BUW11AW Silicon diffused power transistors Product specification File under Discrete Semiconductors, SC06 1997 Aug 14 Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW DESCRIPTION High-voltage, high-speed, glass-passivated NPN power transistor in a SOT429 package. e APPLICATIONS • Converters 2 • Inverters • Switching regulators 1 • Motor control systems. 3 MBB008 1 PINNING PIN 2 3 MBK117 DESCRIPTION 1 base 2 collector; connected to mounting base 3 emitter Fig.1 Simplified outline (SOT429) and symbol. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS collector-emitter peak voltage VCESM VCEO MAX. UNIT VBE = 0 BUW11W 850 V BUW11AW 1000 V BUW11W 400 V BUW11AW 450 V 1.5 V collector-emitter voltage open base VCEsat collector-emitter saturation voltage see Figs 7 and 9 IC collector current (DC) see Figs 2 and 4 5 A ICM collector current (peak value) see Fig 2 10 A Ptot total power dissipation Tmb ≤ 25 °C; see Fig.3 100 W tf fall time resistive load; see Figs 11 and 12 0.8 µs THERMAL CHARACTERISTICS SYMBOL Rth j-mb PARAMETER thermal resistance from junction to mounting base 1997 Aug 14 1 VALUE UNIT 1.25 K/W Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCESM VCEO ICsat PARAMETER collector-emitter peak voltage CONDITIONS MIN. MAX. UNIT VBE = 0 BUW11W − 850 V BUW11AW − 1000 V BUW11W − 400 V BUW11AW − 450 V BUW11W − 3 A BUW11AW − 2.5 A − 5 A collector-emitter voltage open base collector saturation current IC collector current (DC) see Figs 2 and 4 ICM collector current (peak value) tp < 2 ms; see Fig 2 IB base current (DC) IBM base current (peak value) − 10 A − 2 A tp < 2 ms − 4 A Tmb ≤ 25 °C; see Fig.3 Ptot total power dissipation − 100 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VCEOsust PARAMETER CONDITIONS collector-emitter sustaining voltage IC = 100 mA; IBoff = 0; L = 25 mH; see Figs 5 and 6 BUW11W BUW11AW VCEsat VBEsat ICES MIN. TYP. MAX. UNIT 400 − − V 450 − − V collector-emitter saturation voltage BUW11W IC = 3 A; IB = 600 mA; see Figs 7 and 9 − − 1.5 V BUW11AW IC = 2.5 A; IB = 500 mA; see Figs 7 and 9 − − 1.5 V base-emitter saturation voltage BUW11W IC = 3 A; IB = 600 mA; see Fig.7 − − 1.4 V BUW11AW IC = 2.5 A; IB = 500 mA; see Fig.7 − − 1.4 V VCE = VCESMmax; VBE = 0; note 1 − − 1 mA VCE = VCESMmax; VBE = 0; Tj = 125 °C; note 1 − − 2 mA mA collector-emitter cut-off current IEBO emitter-base cut-off current VEB = 9 V; IC = 0 − − 10 hFE DC current gain VCE = 5 V; IC = 5 mA; see Fig.10 10 18 35 VCE = 5 V; IC = 500 mA; see Fig.10 10 20 35 1997 Aug 14 2 Philips Semiconductors Product specification Silicon diffused power transistors SYMBOL PARAMETER BUW11W; BUW11AW CONDITIONS MIN. TYP. MAX. UNIT Switching times resistive load (see Figs 11 and 12) ton ts tf turn-on time BUW11W ICon = 3 A; IBon = −IBoff = 600 mA − − 1 µs BUW11AW ICon = 2.5 A; IBon = −IBoff = 500 mA − − 1 µs BUW11W ICon = 3 A; IBon = −IBoff = 600 mA − − 4 µs BUW11AW ICon = 2.5 A; IBon = −IBoff = 500 mA − − 4 µs BUW11W ICon = 3 A; IBon = −IBoff = 600 mA − − 0.8 µs BUW11AW ICon = 2.5 A; IBon = −IBoff = 500 mA − − 0.8 µs storage time fall time Switching times inductive load (see Figs 13 and 14) ts storage time BUW11W BUW11AW tf ICon = 3 A; IB = 600 mA − 1.1 1.4 µs ICon = 3 A; IB = 600 mA; Tj = 100 °C − 1.2 1.5 µs ICon = 2.5 A; IB = 500 mA − 1.1 1.4 µs ICon = 2.5 A; IB = 500 mA; Tj = 100 °C − 1.2 1.5 µs fall time BUW11W BUW11AW ICon = 3 A; IB = 600 mA − 80 150 ns ICon = 3 A; IB = 600 mA; Tj = 100 °C − 140 300 ns ICon = 2.5 A; IB = 500 mA − 80 150 ns ICon = 2.5 A; IB = 500 mA; Tj = 100 °C − 140 300 ns Note 1. Measured with a half-sinewave voltage (curve tracer). 1997 Aug 14 3 Philips Semiconductors Product specification Silicon diffused power transistors handbook, full pagewidth BUW11W; BUW11AW MGB948 102 IC (A) 10 ICM max IC max (1) II 1 I 10−1 (2) III DC 10−2 10−3 10 BUW11W BUW11AW 102 IV 103 VCE (V) 104 Tmb ≤ 25 °C. I - Region of permissible DC operation. II - Permissible extension for repetitive pulse operation. III - Area of permissible operation during turn-on in single transistor converters, provided RBE ≤ 100 Ω and tp ≤ 0.6 µs. IV - Repetitive pulse operation in this region is permissible provided VBE ≤ 0 and tp ≤ 5 ms. (1) Ptot max line. (2) Second breakdown limits. Fig.2 Forward bias SOAR. 1997 Aug 14 4 Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW MGD283 MGB895 5 120 handbook, halfpage handbook, halfpage IC (A) Ptot max (%) 4 80 3 2 40 1 (1) (2) 0 0 0 50 100 Tmb (oC) 0 150 400 1200 800 V CE (V) (1) BUW11W. (1) BUW11AW. Fig.3 Power derating curve. handbook, halfpage Fig.4 Reverse bias SOAR. handbook,IC halfpage + 50 V MGE239 (mA) 100 to 200 Ω 250 L 200 horizontal oscilloscope 100 vertical 6V 30 to 60 Hz Fig.5 1997 Aug 14 300 Ω 1Ω 0 MGE252 Test circuit for collector-emitter sustaining voltage. Fig.6 5 VCE (V) min VCEOsust Oscilloscope display for collector-emitter sustaining voltage. Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW MGB913 2.0 handbook, full pagewidth VBEsat VCEsat (V) 1.5 1.0 (1) (2) 0.5 (3) (4) 0 10−2 10−1 (1) VBE; Tj = 25 °C. (2) VBE; Tj = 100 °C. IC/IB = 5. 1 10 IC (A) (3) VCE; Tj = 25 °C. (4) VCE; Tj = 25 °C. Fig.7 Base-emitter and collector-emitter saturation voltages as functions of collector current; typical values. MGB910 1.6 handbook, full pagewidth VBE (V) 1.4 (1) (2) 1.2 (3) 1.0 0.8 0 Tj = 25 °C. (1) IC = 5 A. 0.25 0.5 0.75 1.0 1.25 (2) IC = 3 A. (3) IC = 1.5 A. Fig.8 Base-emitter voltage as a function of base current; typical values. 1997 Aug 14 6 IB (A) 1.5 Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW MGB873 10 (1) (2) MBC095 2 10halfpage handbook, handbook, halfpage (3) VCEsat hFE (V) VCE = 5 V 1V 1 10 10−1 10−2 10−1 1 IB (A) 1 10−2 10 10−1 1 102 10 IC (A) (1) IC = 1.5 A. (2) IC = 3 A. (3) IC = 5 A. Tj = 25 °C; solid line: typical values; dotted line: maximum values. Fig.9 Collector-emitter saturation voltage as a function of base current; typical values. Fig.10 DC current gain; typical values. handbook, halfpage MBB730 tr −IB on 90% −IB VCC handbook, halfpage 10% t RL VIM −IB off RB 0 D.U.T. −IC on 90% tp T MGE244 −IC 10% ton tf toff VCC = 250 V; tp = 20 µs; VIM = −6 to +8 V; tp/T = 0.01. The values of RB and RL are selected in accordance with ICon and IBon requirements. Fig.12 Switching time waveforms with resistive load. Fig.11 Test circuit resistive load. 1997 Aug 14 ts 7 t Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW handbook, halfpage tr IB on 90% IB 10% VCC handbook, halfpage t LC +IB −IB off VCL LB IC on 90% D.U.T. −VBE IC MGE246 10% ts toff t tf MGE238 VCL = 300 V; VCC = 30 V; VBE = −5 V; LB = 1 µH; LC = 200 µH. Fig.14 Switching time waveforms with inductive load. Fig.13 Test circuit inductive load. 1997 Aug 14 8 Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW PACKAGE OUTLINE Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-247 SOT429 α E P A A1 β q S R D Y L1(1) Q b2 L 1 2 3 c w M b b1 e e 0 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 b2 c D E e L L1 P Q q R S w Y α β mm 5.3 4.7 1.9 1.7 1.2 0.9 2.2 1.8 3.2 2.8 0.9 0.6 21 20 16 15 5.45 16 15 4.0 3.6 3.7 3.3 2.6 2.4 5.3 3.5 3.3 7.5 7.1 0.4 15.7 15.3 6° 4° 17° 13° Note 1. Terminals are uncontrolled within zone L1. OUTLINE VERSION SOT429 1997 Aug 14 REFERENCES IEC JEDEC EIAJ TO-247 EUROPEAN PROJECTION ISSUE DATE 97-06-11 9 Philips Semiconductors Product specification Silicon diffused power transistors BUW11W; BUW11AW DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Aug 14 10 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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