BM6201FS For air-conditioner fan motor 600V PrestoMOS™ built-in Three phase brushless fan motor driver BM6201FS General Description This motor driver IC adopts PrestoMOS™ as the output transistor, and put in a small full molding package with the high voltage gate driver chip. The protection circuits ~ overcurrent, overheating, under voltage lock out ~ and the high voltage bootstrap diode with current regulation are built into, and provides optimum motor drive system for a wide variety of applications by the combination with controller BD6201X series, and enables motor unit standardization. Key Specifications Output MOSFET voltage: 600V Driver output current (DC): ±1.5A(Max.) Driver output current (Pulse): ±2.5A(Max.) Output MOSFET DC on resistance: 2.7Ω (Typ.) Operating case temperature: -20°C to +100°C Power dissipation: 3.0W Package SSOP-A54_42 Features 600V PrestoMOS™ built-in Output current 1.5A Bootstrap operation by floating high side driver (including diode) 3.3V logic input compatible Protection circuits provided: OCP, TSD and UVLO Fault output (open drain) W(Typ.) x D(Typ.) x H(Max.) 22.0mm x 14.1mm x 2.4mm Applications Air conditioners; air cleaners; water pumps; dishwashers; washing machines General OA equipment SSOP-A54_42 Typical Application Circuit VREG FG R8 Q1 C13 R1 VSP R9 DTR C7 C14 BD6201X C1 C2~C4 C8 HW HV HU R2 M VREG C11 C5 C9 C10 R5 R4 VCC GND R3 C6 BM6201FS D1 R6 R7 C12 VDC Fig.1 Application circuit example - BM6201FS & BD6201X Product structure : Silicon hybrid integrated circuit .http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 14 · 001 This product is not designed protection against radioactive rays 1/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Block diagram and pin configuration VDC VCC VDC VCC 1 FOB 42 41 5 UL 6 VDC VDC FOB BU 3 40 FAULT UH VCC SDB 39 LEVEL SHIFT & GATE DRIVER 38 BU UH UL U U U U FAULT TRIP BV 37 BV VL 13 SDB 36 LEVEL SHIFT & GATE DRIVER 35 34 FAULT TRIP 33 32 V V M VDC VDC VDC VDC BW WH WL WH 20 W WL 21 SDB 31 LEVEL SHIFT & GATE DRIVER 30 TRIP 29 28 BW W W W FOB PGND FAULT FOB 23 V V VH VL VH 12 PGND VCC PGND PGND VCC 25 GND GND 27 Fig.2 Block diagram Fig.3 Pin configuration Pin descriptions (NC: No Connection) Pin Name 1 VCC 2 NC 3 FOB 4 NC 5 UH 6 UL 7 NC : Function Pin Name 42 VDC High voltage power supply 41 VDC High voltage power supply 40 BU Phase U high side control input 39 U Phase U output Phase U low side control input 38 U Phase U output : 37 BV 11 NC 36 V Phase V output 12 VH Phase V high side control input 35 V Phase V output 13 VL Phase V low side control input 14 NC Low voltage power supply Function Fault signal output (open drain) Phase U floating power supply Phase V floating power supply : : 34 VDC High voltage power supply 19 NC 33 VDC High voltage power supply 20 WH Phase W high side control input 21 WL Phase W low side control input 22 NC 32 BW Phase W floating power supply 23 FOB 31 W Phase W output 24 NC 30 W Phase W output 25 VCC 26 NC 29 PGND Ground (current sense pin) 27 GND 28 PGND Ground (current sense pin) Fault signal output (open drain) Low voltage power supply Ground http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 2/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Functional descriptions 1) Control input pins (UH, UL, VH, VL, WH, WL) Truth table The input threshold voltage of the control pins are 2.5V and 0.8V, with a hysteresis voltage of approximately 0.4V. The IC will accept input voltages up to the VCC voltage. When the same phase control pins are input high at the same time, the high side and low side gate driver outputs low. However, it wishes measures as the dead time is installed in the control signals. The control input pins are connected internally to pull-down resistors (100kΩ nominal). However, when the switching noise on the output stage may affect the input on these pins and cause undesired operation. In such cases, attaching an external pull-down resistor (10kΩ recommended) between each control pin and ground, or connecting each pin to an input voltage of 0.8V or less (preferably GND), is recommended. HIN LIN HO LO L L L L H L H L L H L H H H Inhibition 2) Under voltage lock out (UVLO) circuit To secure the lowest power supply voltage necessary to operate the driver, and to prevent under voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver and the lower side driver. When the supply voltage falls to VUVL or below, the controller forces driver outputs low. When the voltage rises to VUVH or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. Even if the controller returns to normal operation, the output begins from the following control input signal. VCC VCCUVH VCCUVL HIN LIN HO LO VB VBUVH VBUVL HIN LIN HO LO Fig.4 Low voltage monitor - UVLO - timing chart http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 3/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS 3) Bootstrap operation VB DX L HO VB VDC DX CB OFF H VS HO VDC CB ON VS VCC VCC H LO L ON Fig.5 Charging period LO OFF Fig.6 Discharging period The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap capacitor (CB) as shown in the above figure. In a word, this operation is repeated while the output of an external transistor is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V). The resistance series connection with DX has the impedance of approximate 200Ω. The capacitance value for the bootstrap is following: Example) Floating driver power supply quiescence current IBBQ : 150µA(max.) Bootstrap diode reverse bias current ILBD : 10µA(max.) Carrier frequency FPWM : 20kHz Output MOSFET total gate charge Qg : 25nC(max.) Floating driver transmission loss QLOSS : 1nC(max.) Drop voltage of the floating driver power supply dVDROP : 3V CBOOT » (( IBBQ + ILBD ) / FPWM + 2 x Qg + QLOSS ) / dVDROP ≈ 20nF The drop voltage can be allowed actually becomes small further by the range of the use power supply voltage, the output MOSFET on resistance, the forward voltages of the internal boot diode (the drop voltage to the capacitor by the charge current), and the power supply voltage monitor circuits etc. Please set the tenfold or more the calculation value to the criterion about the capacitance value to secure the margin in consideration of temperature characteristics and the value change, etc. Moreover, the example of the mentioned above assumes the synchronous rectification switching. Because the total gate charge is needed only by the carrier frequency in the upper switching section, for example 150° commutation driving, it becomes a great capacity shortage in the above settings. Please set it after often confirming actual application operation. 4) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the gate driver exceeds the preset temperature (150°C nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (125°C nominal). The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not use the IC in an environment where activation of the circuit is assumed. Moreover, it is not possible to follow to the output MOSFET junction temperature rising rapidly because it is a gate driver chip that monitors the temperature and it is likely not to function effectively. 5) Overcurrent protection (OCP) circuit The overcurrent protection circuit can be activated by connecting a low value resistor for current detection between the PGND pin and the GND pin. When the PGND pin voltage reaches or surpasses the threshold value (0.9V nominal), the gate driver outputs low to the gate of all output MOSFETs, thus initiating the overcurrent protection operation. http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 4/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS 6) Fault signal output When the gate driver detects the either state that should be protected, voltage monitor (UVLO), overheating (TSD) or overcurrent (OCP), the FOB pin outputs low (open drain). When these are detected with either of the gate driver chip because the FOB pin is wired-OR connection with each phase gate driver chip internally, another phase also entering the protection operation. Even when this function is not used, the FOB pin is pull-up to the voltage of 3V or more and at least the resistor 10kΩ or more. Moreover, the signal from the outside of the chip is not passed built-in analog filter, but the internal control signals (UVLO / TSD / OCP) passes the filter (2.0µs Min.) for the malfunction prevention by the switching noise etc. TSD OCP UVLO FILTER SHUTDOWN FOB FAULT Fig.7 Fault signal bi-directional input pin interface The release time of return from the protection operation can be change to insert the external capacitor. Refer to the formula to the below. 2ms or more is recommended. 2.0 VPU 10 ) · R · C [s] 9 8 Release time: t [ms]_ t = - ln ( 1 - VPU R FOB VPU = 5V 7 6 VPU = 15V 5 4 3 2 C 1 0 0.01 0.1 1 Capacitance: C [µF] Fig.8 Release time setting application circuit Fig.9 Release time (reference data @R=100kΩ) When using controller BD6201X series as a control IC, since the external fault signal input pin of the side of the control IC has the internal pull-up resistor, it can be directly linked with FOB pin. Refer to figure 10. BD6201XFS BM6201FS VREG 100k FIB FOB C Fig.10 Interface equivalent circuit http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 5/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS 7) Switching time XH, XL VDS trr ton td(on) tr 90% 90% ID 10% 10% td(off) tf toff Fig.11 Switching time definition Parameter High side switching time Low side switching time http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 Symbol tdH(on) trH trrH tdH(off) tfH tdL(on) trL trrL tdL(off) tfL Reference 820 110 200 590 20 880 120 180 670 50 6/19 Unit ns ns ns ns ns ns ns ns ns ns Conditions VDC=300V, VCC=15V, ID=0.75A VIN= 0V↔5V, Inductive load TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Absolute maximum ratings (Ta=25°C) Parameter Output MOSFET Ratings Symbol Unit BM6201FS 600*1 VDSS V 1 Supply voltage VDC -0.3 to 600* V Output voltage VU, VV, VW -0.3 to 600*1 V 1 High side supply pin voltage High side floating supply voltage VBU, VBV, VBW -0.3 to 600* V VBU-VU, VBV-VV, VBW-VW -0.3 to 20 V Low side supply voltage VCC -0.3 to 20 V All others VI/O -0.3 to VCC V Driver outputs (DC) IOMAX(DC) ±1.5*2 A Driver outputs (Pulse) IOMAX(PLS) ±2.5*2 A Fault signal output Power dissipation Thermal resistance Operating case temperature 1 IOMAX(FOB) 5* mA 3 Pd 3.00* W Rthj-c 15 °C/W TC -20 to 100 °C Storage temperature TSTG -55 to 150 °C Junction temperature Tjmax 150 °C *1 Do not, however, exceed Pd or ASO. *2 Pw ≤ 10µs, Duty cycle ≤ 1% *3 Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 24mW/°C above 25°C. Operating conditions (Tc=25°C) Parameter Supply voltage Range Symbol Min. Typ. Max. Unit VDC - 310 400 V VBU-VU, VBV-VV, VBW-VW 13.5 15 16.5 V Low side supply voltage VCC 13.5 15 16.5 V Minimum input pulse width TMIN 0.8 - - µs Dead time TDT 1.5 - - µs Shunt resistor (PGND) RS 0.4 - - Ω Junction temperature Tj - - 125 °C High side floating supply voltage http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 7/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=15V) Parameter Symbol Limits Min. Typ. Max. Unit Conditions Power supply HS quiescence current IBBQ 30 70 150 µA XH=XL=L, each phase LS quiescence current ICCQ 0.4 0.9 1.5 mA XH=XL=L V(BR)DSS 600 - - V Output MOSFET D-S breakdown voltage Leak current ID=1mA, XH=XL=L IDSS - - 100 µA VDS=600V, XH=XL=L RDS(ON) - 2.7 3.5 Ω ID=0.75A VSD - 1.1 1.5 V ID=0.75A Leak current ILBD - - 10 µA VBX=600V Forward voltage VFBD 1.5 1.8 2.1 V IBD=-5mA, including series-R Series resistance RBD - 200 - Ω Input bias current IXIN 30 50 70 µA Input high voltage VXINH 2.5 - VCC V Input low voltage VXINL 0 - 0.8 V VBUVH 9.5 10.0 10.5 V VBX - VX VBX - VX DC on resistance Diode forward voltage Bootstrap diode Control inputs VIN=5V UVLO HS release voltage HS lockout voltage VBUVL 8.5 9.0 9.5 V LS release voltage VCCUVH 11.0 11.5 12.0 V LS lockout voltage VCCUVL 10.0 10.5 11.0 V VSNS 0.8 0.9 1.0 V Output low voltage VFOL - - 0.8 V Input high voltage VFINH 2.5 - VCC V Input low voltage VFINL 0 - 0.8 V Noise masking time TMASK 2.0 - - µs Overcurrent protection Threshold voltage Fault output http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 8/19 IO=+10mA TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS 2.0 2.0 1.5 1.5 Supply Current : Icc [mA] Supply Current : Icc [mA] Typical performance curves (Reference data) 1.0 0.5 1.0 0.5 125°C 25°C -25°C 0.0 0.0 12 14 16 18 20 12 14 16 18 20 Supply Voltage : VCC [V] Supply Voltage : VCC [V] Fig.12 Quiscence current (Low side drivers) Fig.13 Low side drivers operating current (FPWM:20kHz, one phase switching) 3.0 120 Supply Current : IQVBX [µA] _ Supply Current : Icc [mA] 125°C 25°C -25°C 2.5 2.0 1.5 125°C 25°C -25°C 1.0 100 80 60 40 125°C 25°C -25°C 20 12 14 16 18 20 12 14 16 18 Supply Voltage : VCC [V] Supply Voltage : VBX-VX [V] Fig.14 Low side drivers operating current (FPWM:20kHz, two phase switching) Fig.15 Quiescence current (High side driver, each phase) http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 9/19 20 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Typical performance curves (Reference data) - Continued 250 250 200 150 125°C 25°C -25°C Input Current : IHIN/ILIN [µA] _ Supply Current : I QVBX [µA] _ 300 200 150 100 50 125°C 25°C -25°C 0 100 12 14 16 18 0 20 5 Fig.16 High side driver operating current (FPWM:20kHz, each phase) 15 20 Fig.17 Input bias current (UH,UL,VH,VL,WH,WL) 20 20 125°C 25°C -25°C Internal Logical Voltage : V OUT [V] Internal Logical Voltage : V OUT [V] 10 Input Voltage : VHIN/VLIN [V] Supply Voltage : VBX-VX [V] 15 10 5 0 125°C 25°C -25°C 15 10 5 0 1.0 1.5 2.0 2.5 0.6 0.7 0.8 0.9 1.0 1.1 Input Voltage : VIN [V] Input Voltage : VPGND [V] Fig.18 Input threshold voltage (UH,UL,VH,VL,WH,WL,FOB) Fig.19 Overcurrent detection voltage http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 10/19 1.2 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Typical performance curves (Reference data) - Continued 8 Noise Masking Time : TMASK [µs] Internal Logical Voltage : V OUT [V] 20 15 10 5 6 4 2 TSD UVLO OCP 0 0 -25 100 110 120 130 140 150 160 170 180 Fig.20 Thermal shut down 25 50 75 100 125 Fig.21 Noise masking time 1.0 200 0.8 150 Output Voltage : V FOB [V] Propagation Delay Time : TdFOB [ns] 0 Junction Temperature : Tj [°C] Junction Temperature : Tj [°C] 100 ON OFF 50 0.6 0.4 0.2 0 125°C 25°C -25°C 0.0 -25 0 25 50 75 100 125 0 2 4 6 8 Junction Temperature : Tj [°C] Output Current : IFOB [mA] Fig.22 External fault input propagation delay (FOB) Fig.23 Fault output on resistance http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 11/19 10 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Typical performance curves (Reference data) - Continued 20 Internal Logical Voltage : V OUT [V] Internal Logical Output Voltage : V OUT [V] 20 125°C 25°C -25°C 15 125°C 25°C -25°C 10 5 0 10 5 0 8 9 10 11 12 13 8 9 10 11 12 Supply Voltage : VBX - VX [V] Supply Voltage : VCC [V] Fig.24 Under voltage lock out (High side driver, each phase) Fig.25 Under voltage lock out (Low side drivers) 1500 13 1500 Solid : Low side Dashed : High side Input/Output Propagation Delay : Td [ns] Minimum Input Pulse Width : T PWmin [ns] 125°C 125°C 25°C 25°C -25°C -25°C 15 1000 500 0 Solid : Td(ON) Dashed : Td(OFF) 1000 500 0 12 13 14 15 16 17 18 12 Supply Voltage : VCC [V] 14 15 16 17 18 Supply Voltage : VCC [V] Fig.26 Minimum input pulse width http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 13 Fig.27 Input/Output propagation delay 12/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Typical performance curves (Reference data) - Continued 2.0 125°C 25°C -25°C 6 Forward Voltage : V SD [V] Output On Resistance : R DSON [ohm] 8 4 2 1.5 1.0 0.5 -25°C 25°C 125°C 0 0.0 0.0 0.5 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 Drain Current : IDS [A] Source Current : ISD [A] Fig.28 Output MOSFET on resistance Fig.29 Output MOSFET body diode 1.2 4 125°C 25°C -25°C 3 Voltage : VBOOTR [V] Forward Voltage : V FBD [V] 1.0 0.8 0.6 0.4 1 -25°C 25°C 125°C 0.2 2 0 0.0 0 2 4 6 8 10 0 Bootstrap Diode Current : IBD [mA] 4 6 8 10 Bootstrap Series Resistor Current : IBR [mA] Fig.30 Bootstrap diode forward voltage http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 2 Fig.31 Bootstrap series resistor 13/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Typical performance curves (Reference data) - Continued 15 200 125°C 25°C -25°C -25°C 25°C 125°C EON 150 E [µJ] E [µJ] 10 100 5 50 EOFF 0 0 0.0 0.5 1.0 0.0 1.5 Drain Current : IO [A] 0.5 1.0 1.5 Drain Current : IO [A] Fig.32 High side switching loss (VDC=300V) Fig.33 High side recovery loss (VDC=300V) 15 200 125°C 25°C -25°C -25°C 25°C 125°C EON 150 E [µJ] E [µJ] 10 100 5 50 EOFF 0 0 0.0 0.5 1.0 0.0 1.5 Drain Current : IO [A] 1.0 1.5 Drain Current : IO [A] Fig.34 Low side switching loss (VDC=300V) http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 0.5 Fig.35 Low side recovery loss (VDC=300V) 14/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Application circuit example VREG FG R8 Q1 C13 R1 VSP R9 DTR IC2 C1 C7 C14 C2~C4 C8 HW HV HU R2 M VREG C11 C5 C9 C10 R5 R4 R3 VCC GND C6 R6 IC1 D1 R7 C12 VDC Fig.36 Parts list Parts Value Manufacturer Application circuit example (150° commutation driver) Type Parts Value Ratings Type IC1 - ROHM BM6201FS C1 0.1µF 50V Ceramic IC2 - ROHM BD62012FS C2~4 2200pF 50V Ceramic R1 1kΩ ROHM MCR18EZPF1001 C5 10µF 50V Ceramic R2 150Ω ROHM MCR18EZPJ151 C6 10µF 50V Ceramic R3 22kΩ ROHM MCR18EZPF2202 C7~9 1µF 50V Ceramic R4 100kΩ ROHM MCR18EZPF1003 C10 0.1µF 50V Ceramic R5 100kΩ ROHM MCR18EZPF1003 C11 1µF 50V Ceramic R6 0.5Ω ROHM MCR50JZHFL1R50 x 3 C12 100pF 50V Ceramic R7 10kΩ ROHM MCR18EZPF1002 C13 0.1µF 630V Ceramic R8 0Ω ROHM MCR18EZPJ000 C14 0.1µF 50V Ceramic R9 0Ω ROHM MCR18EZPJ000 HX - - Hall elements Q1 - ROHM DTC124EUA D1 - ROHM KDZ20B http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 15/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Interfaces VREG UH UL VH VL WH WL BX VDC PGND 100k X Fig.37 UH, UL, VH, VL, WH, WL Fig.38 PGND VCC VREG FOB PGND GND Fig.39 FOB http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 Fig.40 VCC, GND, VDC, BX(BU/BV/BW), X(U/V/W) 16/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Notes for use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be implemented. 2) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. However, note that even if the voltage does not fall below GND in any other operating condition, it can still swing below GND potential when the motor generates back electromotive force at the PGND pin. The chip layout in this product is designed to avoid this sort of electrical potential problem, but pulling excessive current may still result in malfunctions. Therefore, it is necessary to observe operation closely to conclusively confirm that there is no problem in actual operation. If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it. 3) High voltage terminal – VDC, BU/U, BV/V and BW/W When using this IC, the high voltage terminals - VDC, BU/U, BV/V and BW/W - need a resin coating between these pins, it is judged the inter-pins distance not enough. If any special mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or ASO. In the event a large capacitor is connected between the output and ground, if VCC and VDC are short-circuited with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC. 4) Power supply lines Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. Also, connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as establishing an external diode between the power supply and the IC power supply pin. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 8) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 9) Regarding the input pin of the IC Do not force the voltage to the input pins when the power does not supply to the IC. Also, do not force the voltage to the input pins exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the IC. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 17/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Ordering information B M 6 2 0 1 ROHM Part Number BM6201 : 600V/1.5A BM6202 : 600V/2.5A F S - Package FS : SSOP-A54_42 E 2 Packaging specification E2 : Embossed taping Physical dimension, tape and reel information SSOP-A54_42 <Tape and Reel information> Tape Embossed carrier tape Quantity 1000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin Reel ) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. Marking diagram SSOP-A54_42 (TOP VIEW) PRODUCT NAME BM6201FS 1PIN MARK http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 LOT No. 18/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet BM6201FS Revision history Date Revision 26.MAR.2012 001 Changes New release http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 19/19 TSZ02201-0828AB400010-1-2 26.MAR.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.