CALMIRCO CM1213-02ST 1, 2, 4, 6 and 8-channel low capacitance esd protection array Datasheet

CM1213
1, 2, 4, 6 and 8-Channel Low Capacitance ESD Protection Arrays
Features
Product Description
•
•
The CM1213 family of diode arrays has been designed
to provide ESD protection for electronic components or
sub-systems requiring minimal capacitive loading.
These devices are ideal for protecting systems with
high data and clock rates or for circuits requiring low
capacitive loading. Each ESD channel consists of a
pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or
negative (VN) supply rail. A Zener diode is embedded
between VP and VN, offering two advantages. First, it
protects the VCC rail against ESD strikes, and second,
it eliminates the need for a bypass capacitor that would
otherwise be needed for absorbing positive ESD
strikes to ground. The CM1213 will protect against
ESD pulses up to ±8kV per the IEC 61000-4-2 standard and using the MIL-STD-883D (Method 3015)
specification for Human Body Model (HBM) ESD, all
pins are protected from contact discharges of greater
than ±15kV.
•
•
•
•
•
•
•
•
1, 2, 4, 6 and 8 channels of ESD protection
Provides ESD protection to IEC61000-4-2 Level 4
- 8kV contact discharge
- 15kV air discharge
Low channel input capacitance of 1.0pF typical
Minimal capacitance change with temperature and
voltage
Channel input capacitance matching of 0.02pF typical is ideal for differential signals
Mutual capacitance between signal pin and adjacent signal pin - 0.11pF typical
Zener diode protects supply rail and eliminates the
need for external by-pass capacitors
Each I/O pin can withstand over 1000 ESD strikes
Available in SOT, SOIC and MSOP packages
Lead-free version available
Applications
•
•
•
•
•
•
USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals
IEEE1394 Firewire® ports at 400Mbps / 800Mbps
DVI ports, HDMI ports in notebooks, set top boxes,
digital TVs, LCD displays
Serial ATA ports in desktop PCs and hard disk
drives
PCI Express ports
General purpose high-speed data line ESD
protection
These devices are particularly well-suited for protecting
systems using high-speed ports such as USB2.0,
IEEE1394 (Firewire®, iLink™), Serial ATA, DVI, HDMI
and corresponding ports in removable storage, digital
camcorders, DVD-RW drives and other applications
where extremely low loading capacitance with ESD
protection are required in a small package footprint.
The CM1213 family of devices is available with
optional lead-free finishing.
Electrical Schematics
VP
CH1
VP
CH1
VN
CM1213-02ST/SO
CM1213-02SS/SR
CH6
CH1
VP
CH3
N.C.
N.C.
CH1
VN
CH2
CH1
CH2
VP
N.C.
N.C.
VN
CH3
CH4
CH2
VN
CM1213-01ST/SO
CH4
VP
CH2
CH5
VN
CM1213-04ST/SO
CM1213-04MS/MR
CH4
CH8
CH3
CH1
CM1213-A4MR
CH7
CH2
VN
CM1213-06MS/MR
CM1213-06SN/SM
CH6
VP
CH3
CH5
CH4
CM1213-08MS/MR
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
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Fax: 408.263.7846
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1
CM1213
PACKAGE / PINOUT DIAGRAMS
Top View
CH1
VN
1
NC
CH2
2
CH1
3
4-Lead SOT143-4
CH1
VP
4
CH2
Top View
3
CH3
4
3
5
VP
4
CH3
CH1
1
CH2
2
VN
3
CH3
4
6-Lead SOT23-6
8
CH6
7
VP
6
CH5
5
CH4
8-Lead SOIC-8
Top View
Top View
1
10
NC
CH1
1
10
NC
CH1
1
10
CH8
NC
2
9
CH4
CH2
2
9
NC
CH2
2
9
CH7
VP
3
8
VN
VN
3
8
VP
CH3
3
8
VP
CH5
CH2
4
7
NC
CH3
4
7
NC
CH4
4
CH4
NC
5
6
CH3
CH4
5
6
NC
VN
5
CH6
7
VP
6
5
8-Lead MSOP-8
10-Lead MSOP-10
10-Lead MSOP-10
D128 /
D138
VN
CH2
S134
2
2
Top View
CH4
6
CH1
8
D124 /
D134
CH2
D127 /
D137
1
VN
5-Lead SOT23-5
Top View
CH1
1
D126 /
D136
3-Lead SOT23-3
3
2
VN
5
D124 /
D134
CH1
1
D123 /
D133
VN
2
VP
D122 /
D132
D121 /
D131
VP
3
4
Top View
Top View
Top View
1
7
CH6
6
CH5
10-Lead MSOP-10
Note: These drawings are not to scale.
Pin Discriptions
PIN
1
2
3
PIN
1
2
3
4
5
6
1-CHANNEL, 3-LEAD SOT23-3 PACKAGES
NAME
TYPE
DESCRIPTION
CH1
I/O
ESD Channel
VP
PWR
Positive voltage supply rail
VN
GND
Negative voltage supply rail
4-CHANNEL, 6-LEAD SOT23-6 PACKAGE
TYPE
DESCRIPTION
I/O
ESD Channel
GND
Negative voltage supply rail
CH2
I/O
ESD Channel
CH3
I/O
ESD Channel
VP
PWR
Positive voltage supply rail
CH4
I/O
ESD Channel
NAME
CH1
VN
2-CHANNEL, 4-LEAD SOT143-4 PACKAGE
NAME
TYPE
DESCRIPTION
VN
GND
Negative voltage supply rail
CH1
I/O
ESD Channel
CH2
I/O
ESD Channel
VP
PWR
Positive voltage supply rail
PIN
2-CHANNEL, 5-LEAD SOT23-5 PACKAGE
NAME
TYPE
DESCRIPTION
1
2
3
4
5
4-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213-04MS/MR)
PIN
NAME
TYPE
DESCRIPTION
1
CH1
I/O
ESD Channel
2
NC
No Connect
VP
3
PWR
Positive voltage supply rail
4
CH2
I/O
ESD Channel
5
NC
No Connect
6
CH3
I/O
ESD Channel
7
NC
No Connect
VN
8
GND
Negative voltage supply rail
9
CH4
I/O
ESD Channel
10
NC
No Connect
PIN
1
2
3
4
5
6
7
8
9
10
PIN
1
2
3
4
4-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213-A4MR)
NAME
TYPE
DESCRIPTION
CH1
I/O
ESD Channel
CH2
I/O
ESD Channel
VN
GND
Negative voltage supply rail
CH3
I/O
ESD Channel
CH4
I/O
ESD Channel
NC
No Connect
NC
No Connect
VP
PWR
Positive voltage supply rail
NC
No Connect
NC
No Connect
PIN
1
2
3
4
5
6
7
8
NC
VN
CH1
CH2
VP
GND
I/O
I/O
PWR
No Connect
Negative voltage supply rail
ESD Channel
ESD Channel
Positive voltage supply rail
6-CHANNEL, 8-LEAD MSOP-8/SOIC-8 PACKAGE
NAME
TYPE
DESCRIPTION
CH1
I/O
ESD Channel
CH2
I/O
ESD Channel
VN
GND
Negative voltage supply rail
CH3
I/O
ESD Channel
CH4
I/O
ESD Channel
CH5
I/O
ESD Channel
VP
PWR
Positive voltage supply rail
CH6
I/O
ESD Channel
8-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213-08MS/MR)
PIN
NAME
TYPE
DESCRIPTION
1
CH1
I/O
ESD Channel
2
CH2
I/O
ESD Channel
3
CH3
I/O
ESD Channel
4
CH4
I/O
ESD Channel
VN
5
GND
Negative voltage supply rail
6
CH5
I/O
ESD Channel
7
CH6
I/O
ESD Channel
VP
PWR
Positive voltage supply rail
8
9
CH7
I/O
ESD Channel
10
CH8
I/O
ESD Channel
© 2006 California Micro Devices Corp. All rights reserved.
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03/02/06
CM1213
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish
# of Channels
Leads
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
1
3
SOT23-3
CM1213-01ST
D121
CM1213-01SO
D131
2
4
SOT143-4
CM1213-02SS
D122
CM1213-02SR
D132
2
5
SOT23-5
CM1213-02ST
D123
CM1213-02SO
D133
Part Marking
4
6
SOT23-6
CM1213-04ST
D124
CM1213-04SO
D134
4
10
MSOP-10
CM1213-04MS
D124
CM1213-04MR
D134
4
10
MSOP-10
⎯
⎯
CM1213-A4MR
S134
6
8
SOIC-8
CM1213-06SN
D126
CM1213-06SM
D136
6
8
MSOP-8
CM1213-06MS
D127
CM1213-06MR
D137
8
10
MSOP-10
CM1213-08MS
D128
CM1213-08MR
D138
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
6.0
V
-40 to +85
°C
-65 to +150
°C
(VN - 0.5) to (VP + 0.5)
V
Operating Supply Voltage (VP - VN)
Operating Temperature Range
Storage Temperature Range
DC Voltage at any channel input
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Package Power Rating
SOT23-3 Package (CM1213-01ST/SO)
SOT143-4 Package (CM1213-02SS/SR)
SOT23-5 Package (CM1213-02ST/SO)
SOT23-6 Package (CM1213-04ST/SO)
MSOP-8 Package (CM1213-06MS/MR)
MSOP-10 Package (CM1213-08MS/MR, CM1213-04MS/MR, CM1213-A4MR)
SOIC-8 Package (CM1213-06SN/SM)
RATING
UNITS
-40 to +85
°C
225
225
225
225
400
400
600
mW
mW
mW
mW
mW
mW
mW
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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CM1213
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
3.3
5.5
V
8.0
μA
0.80
0.80
0.95
0.95
V
V
VP
Operating Supply Voltage (VP-VN)
IP
Operating Supply Current
(VP-VN)=3.3V
VF
Diode Forward Voltage
Top Diode
Bottom Diode
IF = 8mA; TA=25°C
Channel Leakage Current
TA=25°C; VP=5V, VN=0V
±0.1
±1.0
μA
CIN
Channel Input Capacitance
At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V;
Note 2 applies
1.0
1.5
pF
ΔCIN
Channel Input Capacitance
Matching
At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V;
Note 2 applies
0.02
pF
CMUTUAL
Mutual Capacitance between signal pin and adjacent signal pin
At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V;
Note 2 applies
0.11
pF
VESD
ESD Protection
Peak Discharge Voltage at any
channel input, in system
a) Contact discharge per
IEC 61000-4-2 standard
b) Human Body Model,
MIL-STD-883, Method
3015
ILEAK
0.60
0.60
Notes 2, 4 & 5; TA=25°C
±8
kV
Notes 2, 3 & 5; TA=25°C
±15
kV
VCL
Channel Clamp Voltage
Positive Transients
Negative Transients
TA=25°C, IPP = 1A, tP = 8/20uS;
Notes 2, & 5
RDYN
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1A, tP = 8/20uS
Any I/O pin to Ground; Note 2 and 5
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
+8.8
-1.4
V
V
0.7
0.4
Ω
Ω
All parameters specified at TA = -40°C to +85°C unless otherwise noted.
These parameters guaranteed by design and characterization.
Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded.
Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded.
These measurements performed with no external capacitor on VP (VP floating).
© 2006 California Micro Devices Corp. All rights reserved.
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CM1213
Performance Information
Input Channel Capacitance Performance Curves
Input Capacitance (pF)
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
Input Voltage (V)
Typical Variation of CIN vs. VIN
Input Capacitance (pF)
(f=1MHz, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN, 25°C)
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0V DC Input Bias
1.65V DC Input Bias
-50
-25
0
25
50
75
100
Temperature (°C)
Typical Variation of CIN vs. Temp
(f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V,
0.1 μF chip capacitor between VP and VN)
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
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Tel: 408.263.3214
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Fax: 408.263.7846
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CM1213
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V)
Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V)
© 2006 California Micro Devices Corp. All rights reserved.
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CM1213
Application Information
Design Considerations
In order to realize the maximum protection against
ESD pulses, care must be taken in the PCB layout to
minimize parasitic series inductances on the Supply/
Ground rails as well as the signal trace segment
between the signal input (typically a connector) and the
ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an
input channel. The parasitic series inductance back to
the power supply is represented by L1 and L2. The voltage VCL on the line being protected is:
inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a
voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22μF ceramic chip
capacitor be connected between VP and the ground
plane.
As a general rule, the ESD Protection Array should be
located as close as possible to the point of entry of
expected electrostatic discharges. The power supply
bypass capacitor mentioned above should be as close
to the VP pin of the Protection Array as possible, with
minimum PCB trace lengths to the power supply,
ground planes and between the signal input and the
ESD device to minimize stray series inductance.
VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD ) / dt
+ L2 x d(IESD ) / dt
where IESD is the ESD current pulse, and VSUPPLY is
the positive supply voltage.
An ESD current pulse can rise from zero to its peak
value in a very short time. As an example, a level 4
contact discharge per the IEC61000-4-2 standard
results in a current pulse that rises from zero to 30
Amps in 1ns. Here d(IESD)/dt can be approximated by
Additional Information
See also California Micro Devices Application Note
AP209, “Design Considerations for ESD Protection”, in
the Applications section at www.calmicro.com.
ΔIESD/Δt, or 30/(1x10-9). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL!
Similarly for negative ESD pulses, parasitic series
inductance from the VN pin to the ground rail will lead
to drastically increased negative voltage on the line
being protected.
The CM1213 has an integrated Zener diode between
VP and VN. This greatly reduces the effect of supply rail
L2
VP
POSITIVE SUPPLY RAIL
VCC
PATH OF ESD CURRENT PULSE IESD
0.22μF
L1
D1
ONE
CHANNEL
LINE BEING
PROTECTED
SYSTEM OR
CIRCUITRY
BEING
PROTECTED
CHANNEL
INPUT
D2 OF
25A
CM1213
VCL
0A
GROUND RAIL
VN
CHASSIS GROUND
Figure 3. Application of Positive ESD Pulse between Input Channel and Ground
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
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Tel: 408.263.3214
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CM1213
Mechanical Details
The CM1213 is available in SOT23-3, SOT143-4,
SOT23-5, SOT23-6, MSOP-8, SOIC-8 and MSOP-10
packages with a lead-free finishing option.The various
package drawings are presented below.
SOT23-3 Mechanical Specifications
Dimensions for CM1213-01ST/SO devices supplied in
3-pin SOT23 packages are presented below.
Mechanical Package Diagrams
For complete information on the SOT23-3, see the California Micro Devices SOT23 Package Information document.
TOP VIEW
b
3
PACKAGE DIMENSIONS
E1 E
Package
SOT23-3 (JEDEC name is TO-236)
Pins
3
Dimensions
1
Millimeters
Inches
Min
Max
Min
Max
A
0.89
1.12
0.0350
0.0441
0.01
0.10
0.0004
0.0039
b
0.30
0.50
0.0118
0.0197
c
0.08
0.20
0.0031
0.0079
D
2.80
3.04
0.1102
0.1197
E
2.10
2.64
0.0827
0.1039
E1
1.20
1.40
0.0472
0.0551
0.95 BSC
e1
L
L1
# per tape
and reel
SIDE VIEW
D
A1 A
0.0374 BSC
1.90 BSC
0.40
e1
e
A1
e
2
0.0748 BSC
0.60
0.54 REF
0.0157
END VIEW
0.0236
0.0213 REF
3000 pieces
c
L1
L
Controlling dimension: millimeters
Package Dimensions for SOT23-3.
© 2006 California Micro Devices Corp. All rights reserved.
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CM1213
Mechanical Details (cont’d)
SOT143 Mechanical Specifications
Dimensions for CM1213-02SS/SR devices supplied in
4-pin SOT143 packages are presented below.
Mechanical Package Diagrams
For complete information on the SOT143, see the California Micro Devices SOT143 Package Information
document.
TOP VIEW
e
4
3
PACKAGE DIMENSIONS
Package
SOT143
Pins
4
Dimensions
E1 E
1
Millimeters
e1
Inches
Min
Max
Min
Max
A
0.80
1.22
0.031
0.048
A1
0.05
0.15
0.002
0.006
b
0.30
0.50
0.012
0.019
b2
0.76
0.89
0.030
0.035
c
0.08
0.20
0.003
0.008
D
2.80
3.04
0.110
0.119
E
2.10
2.64
0.082
0.103
E1
1.20
1.40
0.047
0.055
e
1.92 BSC
0.075 BSC
e1
0.20 BSC
0.008 BSC
L
0.4
L1
0.6
0.54 REF
# per tape
and reel
0.016
2
SIDE VIEW
D
A
b2
b
A1
END VIEW
0.024
c
0.021 REF
3000 pieces
L1
Controlling dimension: millimeters
L
Package Dimensions for SOT143.
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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CM1213
Mechanical Details (cont’d)
SOT23-5 Mechanical Specifications
Dimensions for CM1213-02ST/SO devices supplied in
5-pin SOT23 packages are presented below.
Mechanical Package Diagrams
For complete information on the SOT23-5, see the California Micro Devices SOT23 Package Information document.
TOP VIEW
e1
e
5
4
E1 E
PACKAGE DIMENSIONS
Package
SOT23-5 (JEDEC name is MO-178)
Pins
5
Dimensions
1
Inches
SIDE VIEW
Max
Min
Max
A
--
1.45
--
0.0571
A1
0.00
0.15
0.0000
0.0059
b
0.30
0.50
0.0118
0.0197
c
0.08
0.22
0.0031
0.0087
D
2.75
3.05
0.1083
0.1201
E
2.60
3.00
0.1024
0.1181
E1
1.45
1.75
0.0571
0.0689
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
0.30
L1
# per tape
and reel
0.60
0.60 REF
3
b
Millimeters
Min
L
2
0.0118
D
A
A1
END VIEW
0.0236
c
0.0236 REF
L1
L
3000 pieces
Controlling dimension: millimeters
Package Dimensions for SOT23-5.
© 2006 California Micro Devices Corp. All rights reserved.
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490 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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03/02/06
CM1213
Mechanical Details (cont’d)
SOT23-6 Mechanical Specifications
CM1213-04ST/SO devices are supplied in 6-pin
SOT23 packages. Dimensions are presented below.
Mechanical Package Diagrams
For complete information on the SOT23-6, see the California Micro Devices SOT23 Package Information document.
TOP VIEW
e1
6
PACKAGE DIMENSIONS
SOT23-6 (JEDEC name is MO-178)
Pins
6
Min
Max
Min
Max
--
1.45
--
0.0571
A1
0.00
0.15
0.0000
0.0059
b
0.30
0.50
0.0118
0.0197
c
0.08
0.22
0.0031
0.0087
D
2.75
3.05
0.1083
0.1201
E
2.60
3.00
0.1024
0.1181
E1
1.45
1.75
0.0571
0.0689
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
0.30
L1
0.60
0.60 REF
# per tape
and reel
0.0118
2
3
b
Inches
A
L
4
E1 E
1
Millimeters
5
Pin 1
Marking
Package
Dimensions
e
SIDE VIEW
D
A
A1
END VIEW
0.0236
0.0236 REF
3000 pieces
c
L1
L
Controlling dimension: millimeters
Package Dimensions for SOT23-6.
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11
CM1213
Mechanical Details
SOIC-8 Mechanical Specifications
*
Dimensions for CM1213-06SN/SM devices supplied in
8-pin SOIC packages are presented below.
Mechanical Package Diagrams
For complete information on the SOIC-8, see the California Micro Devices SOIC Package Information document.
TOP VIEW
D
8
7
6
5
PACKAGE DIMENSIONS
Package
Pins
Dimensions
H
SOIC
Inches
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
3.80
e
4.19
1.27 BSC
0.150
1
2
3
4
SIDE VIEW
A
SEATING
PLANE
0.165
A1
B
e
0.050 BSC
H
5.80
6.20
0.228
0.244
L
0.40
1.27
0.016
0.050
# per tape
and reel
E
8
Millimeters
Min
E
Pin 1
Marking
END VIEW
2500 pieces
C
Controlling dimension: inches
L
Package Dimensions for SOIC-8
© 2006 California Micro Devices Corp. All rights reserved.
12
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
03/02/06
CM1213
Mechanical Details
MSOP-8 Mechanical Specifications:
Mechanical Package Diagrams
CM1213-06MS/MR devices are supplied in 8-pin
MSOP packages. Dimensions are presented below.
TOP VIEW
For complete information on the MSOP-8, see the California Micro Devices MSOP Package Information document.
D
8
PACKAGE DIMENSIONS
Package
MSOP
Pins
8
Dimensions
Millimeters
Min
Max
A
0.87
1.17
0.034
0.046
A1
0.05
0.25
0.002
0.010
B
0.30 (typ)
0.012 (typ)
C
0.18
0.007
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
0.52
# per tape
and reel
1
2
3
4
SIDE VIEW
A1
SEATING
PLANE
B
e
0.025 BSC
4.90 BSC
L
Pin 1
Marking
A
D
H
5
Inches
Max
0.65 BSC
6
E
H
Min
e
7
0.193 BSC
0.54
0.017
END VIEW
0.025
C
4000 pieces
Controlling dimension: inches
L
Package Dimensions for MSOP-8
© 2006 California Micro Devices Corp. All rights reserved.
03/02/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
13
CM1213
Mechanical Details (cont’d)
MSOP-10 Mechanical Specifications
The CM1213-08MS/MR, CM1213-A4MR and CM121304MS/MR devices are supplied in 10-pin MSOP packages. Dimensions are presented below.
*
Mechanical Package Diagrams
TOP VIEW
For complete information on the MSOP-10, see the
California Micro Devices MSOP Package Information
document.
D
10
9
8
6
7
PACKAGE DIMENSIONS
Package
MSOP
Pins
10
Dimensions
Millimeters
Max
Min
Max
A
0.75
0.95
0.028
0.038
A1
0.05
0.15
0.002
0.006
B
0.17
0.33
0.007
0.013
0.18
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
e
0.50 BSC
0.0196 BSC
H
4.90 BSC
0.193 BSC
0.40
# per tape
and reel
1
0.70
0.0137
2
3
5
4
SIDE VIEW
0.007
D
L
Pin 1
Marking
Inches
Min
C
E
H
A
A1
SEATING
PLANE
B
e
0.029
END VIEW
4000
C
Controlling dimension: inches
L
Package Dimensions for MSOP-10
© 2006 California Micro Devices Corp. All rights reserved.
14
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
03/02/06
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