Rohm BH6799FVM 5v single-phase full wave fan motor driver Datasheet

Datasheet
DC Brushless Fan Motor Driver
5V Single-phase Full wave
Fan motor driver
BH6799FVM
●Description
This is the summary of models that suit for notebook PC cooling fan motor. They employ Bi-CMOS process and realize low
ON resistance, low power consumption and quiet drive.
●Features
■ Compact package (MSOP8)
■ BTL soft switching drive
■ Constant voltage output for hall element
■ Lock protection and auto restart
(without external capacitor)
■ Rotating speed pulse signal (FG) output
●Package(s)
MSOP8
W(Typ.) x D(Typ.) x H(Max.)
2.90mm x 4.00mm x 0.90mm
●Application
■ Compact 5V fan such as notebook PC cooling fan
MSOP8
●Absolute maximum ratings
Symbol
Limit
Unit
Supply voltage
Vcc
7
V
Power dissipation
Pd
585*
mW
Operating temperature
Topr
-40 to +105
℃
Storage temperature
Tstg
-55 to +150
℃
Iomax
1000**
mA
FG signal output voltage
Vfg
7
V
FG signal output current
Ifg
5
mA
Tjmax
150
℃
Parameter
Output current
Junction temperature
*
**
Reduce by 4.68mW/℃ over Ta=25ºC(70.0mm×70.0mm×1.6mm glass epoxy board)
This value is not to exceed Pd
●Operating conditions
Parameter
Symbol
Limit
Unit
Operating supply voltage range
Vcc
2.0 to 6.0
V
Hall input voltage range
Vh
0.4 to Vcc-1.1
V
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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Datasheet
BH6799FVM
●Electrical characteristics(Unless otherwise specified Ta=25℃,Vcc=5V)
Parameter
Symbol
Limits
Unit
Conditions
Characteristics
Min.
Typ.
Max.
Icc
-
5
8
mA
Fig.1
Vhofs
-
-
±6
mV
-
Output voltage
Vo
-
0.32
0.49
V
Input-output Gain
Gio
45
48
51
dB
FG low voltage
Vfgl
-
-
0.3
V
Input hysteresis voltage
Vhys
±5
±10
±15
mV
Fig.5
Lock detection ON time
Ton
0.35
0.50
0.65
s
Fig.6
Lock detection OFF time
Toff
3.5
5.0
6.5
s
Fig.7
Hall bias voltage
Vhb
1.1
1.3
1.5
V
Circuit current
Input offset voltage
Io＝250mA
Upper and Lower total
Fig.2,3
-
Ifg=3mA
Fig.4
Ihb=5mA
Fig.8
●Truth table
H+
H-
OUT1
OUT2
FG
H
L
H
L
L(Output Tr：ON)
L
H
L
H
H(Output Tr：OFF)
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Datasheet
BH6799FVM
●Reference data
105℃
4
Output
Output LL voltage
voltage [V]
[V]
Circuit current , Icc [mA]
5
25℃
-40℃
3
2
1.0
0.0
0.8
-0.2
Output
Output H
H voltage
voltage [V]
[V]
6
0.6
105℃
25℃
0.4
-40℃
-1.0
0.0
0
2
4
6
0.0
8
0.1
0.2
0.3
0.4
0.5
0.6
0.0
0.7
0.5
0.2
2V
5V
0.4
0.5
0.6
0.7
1.0
105℃
15
Lock
Lockdetection
detectionON
ONtime,
time,Ton
Ton[s]
[s]
Input hysteresis voltage, Vhys [mV]
0.3
0.3
Fig.3 Output H voltage
20
0.4
0.2
Output current, Io [A]
Fig.2 Output L voltage
Fig.1 Circuit current
0.1
0.1
Output current, Io[A]
Supply voltage, Vcc[ V]
FGlow
lowvoltage,
voltage,Vfgl
Vfgl[V]
[V]
FG
105℃
-0.6
Operating Voltage Range
0
25℃
10
-40℃
5
Operating Voltage Range
0
-5
-40℃
-10
25℃
-15
105℃
0.8
-40℃
0.6
25℃
0.4
105℃
0.2
Operating Voltage Range
6V
0.0
-20
0
1
2
3
4
5
0.0
0
2
4
6
8
0.0
2.0
4.0
6.0
8.0
FG current, Ifg[mA]
Supply voltage,Vcc[V]
Supply voltage, Vcc[V]
Fig.4 FG low voltage
Fig.5 Input hysteresis voltage
Fig.6 Lock detection ON time
7.0
1.6
105℃
25℃
6.5
Hallbias
biasvoltage,
voltage,Vhb
Vhb[V]
[V]
Hall
Lock detection OFF time, Toff [s]
25℃
-0.4
-0.8
0.2
1
-40℃
-40℃
6.0
5.5
25℃
5.0
4.5
105℃
4.0
3.5
1.2
-40℃
0.8
0.4
Operating Voltage Range
3.0
0.0
0
2
4
6
8
Supply voltage, Vcc[V]
Fig.7 Lock detection OFF time
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0
2
4
6
8
10
Hall bias current, Ihb[mA]
Fig.8 Hall bias voltage
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Datasheet
BH6799FVM
●Block diagram, application circuit, and pin assignment
M
GND
OUT2
1
Incorporates soft switching
function. Adjust at an
optimum value because
gradient of switching of
output waveform depends on
hall element output.
P.5
8
H+
OUT1
OSC
2
7
Lock
Protection
HB
HALL
TSD
P.7
Vcc
HALL
Bias
3
Take a measure against
Vcc voltage rise due to
reverse connection of
power supply and back
electromotive force.
6
H-
FG
4
5
This is an open drain
output. Connect a
pull-up resistor.
P.8
OSC : Internal reference oscillation circuit
TSD : Thermal shut down(heat rejection circuit)
PIN No.
Terminal name
1
OUT2
2
H+
Hall input terminal+
3
HB
Hall bias terminal
4
H-
Hall input terminal-
5
FG
FG signal output terminal
6
Vcc
Power supply terminal
7
OUT1
Motor output terminal 1
8
GND
GND terminal
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Function
Motor output terminal 2
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BH6799FVM
●Description of operations
1) Lock protection and automatic restart circuit
Motor rotation is detected by hall signal, and lock detection ON time (Ton) and lock detection OFF time (Toff) are set
by IC internal counter. External part (C or R) is not required. Timing chart is shown in Fig.9.
Idling
H+
OUT1
Toff
Ton
OUT2
Output Tr OFF
FG
Motor
locking
Lock
detection
ON
Depends on hall signal.
(H in this figure)
Lock
Recovers
release normal
operation
Fig.9 Lock protection timing chart
2) Soft switching function (silent drive setting)
Input signal to hall amplifier is amplified to produce an output signal.
When the hall element output signal is small, the gradient of switching of output waveform is gentle; When it is large,
the gradient of switching of output waveform is steep. Enter an appropriate hall element output to IC where output
waveform swings sufficiently.
(H+)-(H-)
OUT1
Fig.10 Relation between hall element output amplitude and output waveform
3) Hall input setting
Hall input voltage range is shown in operating conditions.
Hall input voltage range
Vcc
Vcc-1.1V
0.4V
GND
Fig.11 Hall input voltage range
Adjust the value of hall element bias resistor R1 in Fig.12 so that the input voltage of a hall amplifier is input in "hall
input voltage range" including signal amplitude.
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BH6799FVM
○Reducing the noise of hall signal
Hall element may be affected by Vcc noise depending on the wiring pattern of board. In this case, place a
capacitor like C1 in Fig.12. In addition, when wiring from the hall element output to IC hall input is long, noise may
be loaded on wiring. In this case, place a capacitor like C2 in Fig.12.
H+
H-
HB
C2
C1
RH
bias current
= Vhb / (RH+R1)
R1
Fig.12 Application near of hall signal
●Equivalent circuit
1) Hall input terminal
2) Motor output terminal
Vcc
OUT1
H+、H-
OUT2
GND
3) Hall bias terminal
4) FG output terminal
FG
HB
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BH6799FVM
●Safety measure
1) Reverse connection protection diode
Reverse connection of power results in IC destruction as shown in Fig.13. When reverse connection is possible,
reverse connection destruction preventive diode must be added between power supply and Vcc.
In normal energization
Reverse power connection
Vcc
After reverse connection
destruction prevention
Vcc
Vcc
Circuit
block
Each
pin
Circuit
block
Each
pin
Circuit
block
GND
Large current flows
Thermal destruction
GND
Internal circuit impedance high
amperage small
Each
pin
GND
No destruction
Fig.13 Flow of current when power is connected reversely
2) Measure against Vcc voltage rise by back electromotive force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, Vcc voltage rises because the diode prevents current flow to power supply.
ON
ON
ON
Phase
switching
ON
Fig.14 Vcc voltage rise by back electromotive force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between Vcc and GND. If necessary, add both (C)..
(B) Zener diode
(A) Capacitor
ON
ON
ON
ON
(C) Capacitor and zener diode
ON
ON
Fig.15 Measure against Vcc voltage rise
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BH6799FVM
3) Problem of GND line PWM switching
Do not perform PWM switching of GND line because the potential of GND terminal cannot be kept at the minimum.
Vcc
M
Motor
Driver
Controller
GND
PWM input
Prohibited
Fig.16 GND Line PWM switching prohibited
4) FG output
FG output is an open drain and requires pull-up resistor.
The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG output terminal is
directly connected to power supply, could damage the IC.
Vcc
Pull-up
resistor
FG
Protection
Resistor R1
Connector
of board
Fig.17 Protection of FG terminal
●Thermal derating curve
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured
at a specified condition. Fig.18 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x
70 [mm] x 1.6 [mm] (copper foil area below 3 [%]))
Pd(mW)
700
600
585
500
400
300
200
100
0
25
50
75
100 105 125
150
Ta(℃)
＊ Reduce by 4.68 mW/°C over 25°C.
(70.0mm×70.0mm×1.6mm glass epoxy board)
Fig.18 Thermal derating curve
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Datasheet
BH6799FVM
●Notes for use
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
11)
12)
13)
14)
Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum ratings.
Because the cause of this damage cannot be identified as a short circuit or an open circuit, if any over rated values
will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing
a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back
electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,
except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the
motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage
including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and
property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating
conditions.
Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175ºC (typ.) and has a
hysteresis width of 25ºC (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes
an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect
the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an
environment where the operation of this circuit is assumed.
Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it
is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the
capacitor between output and GND below 100uF.
IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do
not use in a manner where parasitic element is actuated.
In use
We are sure that the example of application circuit is preferable, but please check the character further more in
application to a part which requires high precision. In using the unit with external circuit constant changed, consider
the variation of externally equipped parts and our IC including not only static character but also transient character
and allow sufficient margin in determining.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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Datasheet
BH6799FVM
●Physical Dimension
MSOP8
<Tape and Reel information>
2.8±0.1
4.0±0.2
8 7 6 5
0.6±0.2
+6°
4° −4°
0.29±0.15
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.08±0.05
0.75±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
MSOP8
(TOP VIEW)
Ｈ６７
９ ９
Lot No.
1PIN MARK
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
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Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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