ATMEL AT28C64-20SC 64k (8k x 8) cmos e2prom Datasheet

AT28C64/X
Features
•
•
•
•
•
•
•
•
•
•
Fast Read Access Time - 120 ns
Fast Byte Write - 200 µs or 1 ms
Self-Timed Byte Write Cycle
Internal Address and Data Latches
Internal Control Timer
Automatic Clear Before Write
Direct Microprocessor Control
READY/BUSY Open Drain Output
DATA Polling
Low Power
30 mA Active Current
100 µA CMOS Standby Current
High Reliability
Endurance: 104 or 105 Cycles
Data Retention: 10 Years
5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
JEDEC Approved Byte-Wide Pinout
Commercial and Industrial Temperature Ranges
64K (8K x 8)
CMOS
E2PROM
Description
The AT28C64 is a low-power, high-performance 8,192 words by 8 bit nonvolatile
Electrically Erasable and Programmable Read Only Memory with popular, easy to
use features. The device is manufactured with Atmel’s reliable nonvolatile technology.
(continued)
Pin Configurations
Pin Name
Function
A0 - A12
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
I/O0 - I/O7
Data Inputs/Outputs
RDY/BUSY
Ready/Busy Output
NC
No Connect
DC
Don’t Connect
PDIP, SOIC
Top View
AT28C64/X
LCC, PLCC
Top View
TSOP
Top View
Note: PLCC package pins 1 and
17 are DON’T CONNECT.
0001G
2-193
Description (Continued)
The AT28C64 is accessed like a Static RAM for the read
or write cycles without the need for external components.
During a byte write, the address and data are latched internally, freeing the microprocessor address and data bus
for other operations. Following the initiation of a write cycle, the device will go to a busy state and automatically
clear and write the latched data using an internal control
timer. The device includes two methods for detecting the
end of a write cycle, level detection of RDY/BUSY (unless
pin 1 is N.C.) and DATA POLLING of I/O7. Once the end
of a write cycle has been detected, a new access for a
read or write can begin.
The CMOS technology offers fast access times of 120 ns
at low power dissipation. When the chip is deselected the
standby current is less than 100 µA.
Atmel’s 28C64 has additional features to ensure high
quality and manufacturability. The device utilizes error correction internally for extended endurance and for improved data retention characteristics. An extra 32-bytes of
E2PROM are available for device identification or tracking.
Block Diagram
Absolute Maximum Ratings*
Temperature Under Bias................. -55°C to +125°C
Storage Temperature...................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ................... -0.6V to +6.25V
All Output Voltages
with Respect to Ground .............-0.6V to VCC + 0.6V
Voltage on OE and A9
with Respect to Ground ................... -0.6V to +13.5V
2-194
AT28C64/X
*NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the
device at these or any other conditions beyond those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
AT28C64/X
Device Operation
READ: The AT28C64 is accessed like a Static RAM.
When CE and OE are low and WE is high, the data stored
at the memory location determined by the address pins is
asserted on the outputs. The outputs are put in a high impedance state whenever CE or OE is high. This dual line
control gives designers increased flexibility in preventing
bus contention.
BYTE WRITE: Writing data into the AT28C64 is similar to
writing into a Static RAM. A low pulse on the WE or CE
input with OE high and CE or WE low (respectively) initiates a byte write. The address location is latched on the
falling edge of WE (or CE); the new data is latched on the
rising edge. Internally, the device performs a self-clear before write. Once a byte write has been started, it will automatically time itself to completion. Once a programming
operation has been initiated and for the duration of tWC, a
read operation will effectively be a polling operation.
FAST BYTE WRITE: The AT28C64E offers a byte write
time of 200 µs maximum. This feature allows the entire
device to be rewritten in 1.6 seconds.
READY/BUSY: Pin 1 is an open drain READY/BUSY
output that can be used to detect the end of a write cycle.
RDY/BUSY is actively pulled low during the write cycle
and is released at the completion of the write. The open
drain connection allows for OR-tying of several devices to
the same RDY/BUSY line. Pin 1 is not connected for the
AT28C64X.
DATA POLLING: The AT28C64 provides DATA POLLING to signal the completion of a write cycle. During a
write cycle, an attempted read of the data being written
results in the complement of that data for I/O7 (the other
outputs are indeterminate). When the write cycle is finished, true data appears on all outputs.
WRITE PROTECTION: Inadvertent writes to the device
are protected against in the following ways. (a) VCC
sense— if VCC is below 3.8V (typical) the write function is
inhibited. (b) VCC power on delay— once VCC h a s
reached 3.8V the device will automatically time out 5 ms
(typical) before allowing a byte write. (c) Write Inhibit—
holding any one of OE low, CE high or WE high inhibits
byte write cycles.
CHIP CLEAR: The contents of the entire memory of the
AT28C64 may be set to the high state by the CHIP CLEAR
operation. By setting CE low and OE to 12 volts, the chip
is cleared when a 10 msec low pulse is applied to WE.
DEVICE IDENTIFICATION: A n e x t r a 3 2 - b y t e s o f
E2PROM memory are available to the user for device
identification. By raising A9 to 12 ± 0.5V and using address locations 1FE0H to 1FFFH the additional bytes may
be written to or read from in the same manner as the regular memory array.
2-195
DC and AC Operating Range
AT28C64-12
AT28C64-15
AT28C64-20
AT28C64-25
0°C - 70°C
0°C - 70°C
0°C - 70°C
0°C - 70°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
Com.
Operating
Temperature (Case)
Ind.
VCC Power Supply
Operating Modes
Mode
CE
OE
WE
I/O
Read
VIL
VIL
VIH
DOUT
Write (2)
VIL
VIH
VIL
DIN
VIH
(1)
Standby/Write Inhibit
X
X
High Z
Write Inhibit
X
X
VIH
Write Inhibit
X
VIL
X
Output Disable
X
VIH
X
High Z
VIL
High Z
Chip Erase
VH
VIL
(3)
3. VH = 12.0V ± 0.5V.
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
DC Characteristics
Symbol
Parameter
Condition
Min
Max
Units
ILI
Input Load Current
VIN = 0V to VCC + 1V
10
µA
ILO
Output Leakage Current
VI/O = 0V to VCC
10
µA
ISB1
VCC Standby Current CMOS
CE = VCC - 0.3V to VCC + 1.0V
100
µA
ISB2
VCC Standby Current TTL
CE = 2.0V to VCC + 1.0V
Com.
2
mA
Ind.
3
mA
ICC
VCC Active Current AC
f = 5 MHz; IOUT = 0 mA
CE = VIL
Com.
30
mA
Ind.
45
mA
VIL
Input Low Voltage
0.8
V
VIH
Input High Voltage
VOL
Output Low Voltage
IOL = 2.1 mA
= 4.0 mA for RDY/BUSY
VOH
Output High Voltage
IOH = -400 µA
2-196
AT28C64/X
2.0
V
.45
2.4
V
V
AT28C64/X
AC Read Characteristics
Symbol
Parameter
tACC
AT28C64-12
AT28C64-15
AT28C64-20
AT28C64-25
Min
Min
Min
Min
Max
Max
Max
Max
Units
Address to Output Delay
120
150
200
250
ns
tCE
(1)
CE to Output Delay
120
150
200
250
ns
tOE
(2)
OE to Output Delay
10
60
10
70
10
80
10
100
ns
tDF (3, 4)
CE or OE High to Output
Float
0
45
0
50
0
55
0
60
ns
tOH
Output Hold from OE, CE
or Address, whichever
occurred first
0
0
0
0
ns
AC Read Waveforms (1, 2, 3, 4)
Notes: 1. CE may be delayed up to tACC - tCE after the address
transition without impact on tACC.
2. OE may be delayed up to tCE - tOE after the falling
edge of CE without impact on tCE or by tACC - tOE
after an address change without impact on tACC.
3. tDF is specified from OE or CE whichever occurs first
(CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Output Test Load
Input Test Waveforms and
Measurement Level
tR, tF < 20 ns
Pin Capacitance (f = 1 MHz, T = 25°C) (1)
Typ
Max
Units
CIN
4
6
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
Conditions
1. This parameter is characterized and is not 100% tested.
2-197
AC Write Characteristics
Symbol
Parameter
tAS, tOES
Address, OE Set-up Time
10
ns
tAH
Address Hold Time
50
ns
tWP
Write Pulse Width (WE or CE)
100
tDS
Data Set-up Time
50
ns
tDH, tOEH
Data, OE Hold Time
10
ns
tCS, tCH
CE to WE and WE to CE Set-up and Hold Time
0
ns
tDB
Time to Device Busy
tWC
Write Cycle Time
AC Write Waveforms
WE Controlled
CE Controlled
2-198
AT28C64/X
Min
Max
1000
Units
ns
50
ns
AT28C64
1.0
ms
AT28C64E
200
µs
AT28C64/X
Data Polling Characteristics (1)
Symbol
Parameter
tDH
Data Hold Time
tOEH
OE Hold Time
Min
OE to Output Delay
tWR
Write Recovery Time
Max
Units
10
ns
10
ns
(2)
tOE
Typ
ns
0
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See AC Read Characteristics.
Data Polling Waveforms
Chip Erase Waveforms
tS = tH = 1 µsec (min.)
tW = 10 msec (min.)
VH = 12.0V ± 0.5V
2-199
2-200
AT28C64/X
AT28C64/X
Ordering Information (1)
tACC
ICC (mA)
Ordering Code
Package
0.1
AT28C64(E)-12JC
AT28C64(E)-12PC
AT28C64(E)-12SC
AT28C64(E)-12TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
45
0.1
AT28C64(E)-12JI
AT28C64(E)-12PI
AT28C64(E)-12SI
AT28C64(E)-12TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
30
0.1
AT28C64(E)-15JC
AT28C64(E)-15PC
AT28C64(E)-15SC
AT28C64(E)-15TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
45
0.1
AT28C64(E)-15JI
AT28C64(E)-15PI
AT28C64(E)-15SI
AT28C64(E)-15TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
30
0.1
AT28C64(E)-20JC
AT28C64(E)-20PC
AT28C64(E)-20SC
AT28C64(E)-20TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
45
0.1
AT28C64(E)-20JI
AT28C64(E)-20PI
AT28C64(E)-20SI
AT28C64(E)-20TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
30
0.1
AT28C64(E)-25JC
AT28C64(E)-25PC
AT28C64(E)-25SC
AT28C64(E)-25TC
AT28C64-W
32J
28P6
28S
28T
DIE
Commercial
(0°C to 70°C)
45
0.1
AT28C64(E)-25JI
AT28C64(E)-25PI
AT28C64(E)-25SI
AT28C64(E)-25TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
(ns)
Active
Standby
120
30
150
200
250
Note:
Operation Range
1. See Valid Part Number table below.
2-201
Package Type
32J
32 Lead, Plastic J-Leaded Chip Carrier (PLCC)
28P6
28 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28S
28 Lead, 0.300" Wide, Plastic Gull Wing, Small Outline (SOIC)
28T
28 Lead, Plastic Thin Small Outline Package (TSOP)
W
Die
Options
Blank
Standard Device: Endurance = 10K Write Cycles; Write Time = 1 ms
E
High Endurance Option: Endurance = 100K Write Cycles; Write Time = 200 µs
2-202
AT28C64/X
AT28C64/X
Ordering Information
tACC
ICC (mA)
Ordering Code
Package
0.1
AT28C64X-15JC
AT28C64X-15PC
AT28C64X-15SC
AT28C64X-15TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
45
0.1
AT28C64X-15JI
AT28C64X-15PI
AT28C64X-15SI
AT28C64X-15TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
30
0.1
AT28C64X-20JC
AT28C64X-20PC
AT28C64X-20SC
AT28C64X-20TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
45
0.1
AT28C64X-20JI
AT28C64X-20PI
AT28C64X-20SI
AT28C64X-20TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
30
0.1
AT28C64X-25JC
AT28C64X-25PC
AT28C64X-25SC
AT28C64X-25TC
32J
28P6
28S
28T
Commercial
(0°C to 70°C)
45
0.1
AT28C64X-25JI
AT28C64X-25PI
AT28C64X-25SI
AT28C64X-25TI
32J
28P6
28S
28T
Industrial
(-40°C to 85°C)
(ns)
Active
Standby
150
30
200
250
Operation Range
Valid Part Numbers
The following table lists standard Atmel products that can be ordered.
Device Numbers
Speed
Package and Temperature Combinations
AT28C64 X
12
JC, JI, PC, PI, SC, SI, TC, TI
AT28C64 X
15
JC, JI, PC, PI, SC, SI, TC, TI
AT28C64 X
20
JC, JI, PC, PI, SC, SI, TC, TI
AT28C64 X
25
JC, JI, PC, PI, SC, SI, TC, TI
Package Type
32J
32 Lead, Plastic J-Leaded Chip Carrier (PLCC)
28P6
28 Lead, 0.600" Wide Plastic Dual Inline Package (PDIP)
28S
28 Lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28T
28 Lead, Plastic Thin Small Outline Package (TSOP)
2-203
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