TI1 CDCS502 Crystal oscillator / clock generator with optional ssc Datasheet

CDCS502
www.ti.com........................................................................................................................................................................................... SCAS868 – DECEMBER 2008
Crystal Oscillator / Clock Generator with optional SSC
FEATURES
APPLICATIONS
•
•
1
•
•
•
•
•
•
Part of a Family of Easy to use Clock
Generator Devices With Optional SSC
Crystal Oscillator With Integrated Crystal
Capacitors, Selectable Output Frequency and
Selectable SSC
SSC Controllable via 2 External Pins
– ±0%, ±0.5%, ±1%, ±2% Center Spread
Frequency Multiplication Selectable Between
x1 or x4 With one External Control Pin
Single 3.3V Device Power Supply
Wide Temperature Range –40°C to 85°C
Low space Consumption by 8 pin TSSOP
Package
Consumer and Industrial Applications
requiring Crystal Oscillator with the possibility
of EMI reduction through Spread Spectrum
Clocking
PACKAGE
XIN
SSC_SEL 0
SSC_SEL 1
GND
1
2
3
4
CDCS502
8
7
6
5
XOUT
VDD
OUT
FS
BLOCK DIAGRAM
V DD
GND
XIN
XO
x1 or x4
/SSC
LV
CMOS
OUT
Xout
SSC_SEL 0
SSC_SEL 1
FS
Control
Logic
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
CDCS502
SCAS868 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION
The CDCS502 is a spread spectrum capable, fundamental mode crystal oscillator with selectable frequency
multiplication.
It features an advanced gain controlled fundamental mode crystal oscillator stage with a built-in load capacitance
of 10pF. This oscillator stage accepts crystals from 8MHz to 32MHz with an ESR of up to 180Ω. The stage can
be used with crystals with power dissipation of 50µW and up.
The input signal is processed by a PLL, whose output frequency is either equal to the input frequency or
multiplied by the factor of 4.
The PLL is also able to spread the clock signal by ±0%, ±0.5%, ±1% or ±2% centered around the output clock
frequency with an triangular modulation.
By this, the device can generate output frequencies between 8MHz and 108MHz with or without SSC from a
fundamental mode crystal.
In x1 Mode with an SSC amount of 0%, the device works as a standard crystal oscillator and does not make use
of the built in PLL.
The CDCS502 operates in 3.3V environment.
It is characterized for operation from –40°C to 85°C. It is offered in an 8 Pin TSSOP package.
FUNCTION TABLE
FS
SSC_SEL 0
SSC_SEL 1
SSC Amount
fOUT/fIN
fOUT at fin = 27 MHz
0
0
0
±0.00%
1
27 MHz (1)
0
0
1
±0.50%
1
27 MHz
0
1
0
±1.00%
1
27 MHz
0
1
1
±2.00%
1
27 MHz
1
0
0
±0.00%
4
108 MHz
1
0
1
±0.50%
4
108 MHz
1
1
0
±1.00%
4
108 MHz
1
1
1
±2.00%
4
108 MHz
(1)
In this mode the signal from the crystal bypasses the internal PLL for maximum performance.
PACKAGE
XIN
SSC_SEL 0
SSC_SEL 1
GND
1
2
3
4
CDCS502
8
7
6
5
XOUT
VDD
OUT
FS
PIN FUNCTIONS
SIGNAL
PIN
TYPE
DESCRIPTION
XIN
1
I
Crystal Input
XOUT
8
O
Crystal Output
OUT
6
O
LVCMOS Clock Output
SSC_SEL 0, 1
2, 3
I
Spread Selection Pins, internal pull-up
FS
5
I
Frequency Multiplication Selection, internal pull-up
VDD
7
Power
3.3V Power Supply
GND
4
Ground
Ground
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CDCS502
CDCS502
www.ti.com........................................................................................................................................................................................... SCAS868 – DECEMBER 2008
PACKAGE THERMAL RESISTANCE FOR TSSOP (PW) PACKAGE (1)
THERMAL AIR FLOW (CFM)
CDCV304PW 8-PIN TSSOP
0
150
250
500
UNIT
RθJA
High K
149
142
138
132
°C/W
RθJA
Low K
230
185
170
150
°C/W
RθJC
High K
65
°C/W
RθJC
High K
69
°C/W
(1)
The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
VDD
Supply voltage range
–0.5 to 4.6
V
VIN
Input voltage range
–0.5 to 4.6
V
Vout
Output voltage range
–0.5 to 4.6
V
IIN
Input current (VI < 0, VI > VDD)
±20
mA
Iout
Continuous output current
±50
mA
TST
Storage temperature range
–65 to 150
°C
TJ
Maximum junction temperature
125
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
VDD
Supply voltage
fIN
Input Frequency
VIL
Low level input voltage LVCMOS
VIH
High level input voltage LVCMOS
VI
Input Voltage threshold LVCMOS
CL
Output Test Load LVCMOS
IOH/IOL
Output Current
TA
Operating free-air temperature
NOM
MAX
UNIT
3.0
3.6
V
8
32
MHz
0.3 VDD
0.7 VDD
V
V
0.5 VDD
V
–40
10
pF
12
mA
85
°C
RECOMMENDED CRYSTAL SPECIFICATIONS (1)
PARAMETER
CONDITIONS
fX-tal
Crystal input frequency range
ESR
Effective series resistance (2)
CL
On-chip load capacitance at Xin and Xout
TX-tal
Crystal power dissipation
(1)
(2)
MIN
NOM
MAX
FS = 0
8
32
FS = 1
8
27
180
10
50
UNIT
MHz
Ω
pF
µW
For further details on the crystal, see the crystal part in the Applications section
With 5 pF crystal package parallel capacitance
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CDCS502
3
CDCS502
SCAS868 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com
DEVICE CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMET
ER
CONDITIONS
MIN
fout = 20 MHz; FS = 0, no SSC
IDD
Device supply current
18
fout = 70 MHz; FS = 1, SSC = 2%
22
32
MHz
FS = 1
32
108
MHz
10
µA
–10
µA
LVCMOS input current
VI = VDD; VDD = 3.6 V
IIL
LVCMOS input current
VI = 0 V; VDD = 3.6 V
VOL
mA
8
IIH
LVCMOS low-level output
voltage
UNIT
FS = 0
Output frequency
LVCMOS high-level output
voltage
MAX
8
fout = 20 MHz; FS = 0, SSC = 2%
fOUT
VOH
TYP
IOH = –0.1 mA
2.9
IOH = - 8 mA
2.4
IOH = –12 mA
2.2
V
IOL = 0.1 mA
0.1
IOL = 8 mA
0.5
IOL = 12 mA
0.8
tjit(CC)
Cycle to cycle jitter
fout = 108 MHz; FS = 1, SSC = 1%,
10000 Cycles
tr/tf
Rise and fall time
20%–80%
Odc
Output duty cycle
PLL active
fMOD
Modulation frequency
100
ps
0.75
45%
V
ns
55%
30
kHz
40
IDD - Input Current - mA
30
x4 Mode
20
x1 Mode
10
0
5
10
15
20
25
fi - Input Frequency - MHz
30
35
Figure 1. IDD vs Input Frequency, VCC = 3.3V, SSC = 2%
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CDCS502
CDCS502
www.ti.com........................................................................................................................................................................................... SCAS868 – DECEMBER 2008
Figure 2. Phase Noise Plot, x1 Mode, 0% SSC, 27 MHz Crystal
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CDCS502
5
CDCS502
SCAS868 – DECEMBER 2008........................................................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
SELECTION OF A CRYSTAL
The CDCS502 requires a crystal with a frequency between 8 and 32 MHz (27MHz in x4 Mode). The crystal stage
is designed with an internal load capacitance of 10pF for crystals with this shunt load capacitance. If a slightly
bigger capacity then 10pF is needed, small external capacitors can be used to get to this value. This solution
however might influence the power-up behavior of the crystal stage, so using a 10pF load capacitance crystal is
highly recommended.
For further details on capacitive load calculation, see application report (SCAA085).
NOTE:
Even though the CDCS502 is characterized down to –40°C, a standard crystal is
usually not rated for operation at this low temperature.
SSC MODULATION
The exact implementation of the SSC modulation plays a vital role for the EMI reduction. The CDCS502 uses a
triangular modulation scheme implemented in a way that the modulation frequency depends on the VCO
frequency of the internal PLL and the spread amount is independent from the VCO frequency.
The modulation frequency can be calculated by using one of the below formulas chosen by frequency
multiplication mode.
FS =0: fmod = fIN / 708
FS =1: fmod = fIN / 620
PARAMETER MEASUREMENT INFORMATION
VDD
1 kW
CDCS502
LVCMOS
1 kW
10 pF
Figure 3. Test Load
CDCS502
LVCMOS
Typical Driver
Impedance
~ 32 Ω
LVCMOS
ZL = 50 W
Series Termination
~18Ω
Figure 4. Test Load for 50-Ω Board Environment
6
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): CDCS502
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jan-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CDCS502PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CDCS502PWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CDCS502PWR
Package Package Pins
Type Drawing
TSSOP
PW
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
7.0
B0
(mm)
K0
(mm)
P1
(mm)
3.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCS502PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
Similar pages