Triple-Channel Digital Isolators ADuM1300/ADuM1301 Data Sheet FEATURES GENERAL DESCRIPTION Qualified for automotive applications Low power operation 5 V operation 1.2 mA per channel maximum at 0 Mbps to 2 Mbps 3.5 mA per channel maximum at 10 Mbps 32 mA per channel maximum at 90 Mbps 3 V operation 0.8 mA per channel maximum at 0 Mbps to 2 Mbps 2.2 mA per channel maximum at 10 Mbps 20 mA per channel maximum at 90 Mbps Bidirectional communication 3 V/5 V level translation High temperature operation: 125°C High data rate: dc to 90 Mbps (NRZ) Precise timing characteristics 2 ns maximum pulse width distortion 2 ns maximum channel-to-channel matching High common-mode transient immunity: >25 kV/μs Output enable function 16-lead SOIC wide body package RoHS-compliant models available Safety and regulatory approvals UL recognition: 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice #5A VDE Certificate of Conformity DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 560 V peak TÜV approval: IEC/EN/UL/CSA 61010-1 The ADuM130x1 are triple-channel digital isolators based on the Analog Devices, Inc., iCoupler® technology. Combining high speed CMOS and monolithic transformer technology, these isolation components provide outstanding performance characteristics superior to alternatives, such as optocouplers. APPLICATIONS By avoiding the use of LEDs and photodiodes, iCoupler devices remove the design difficulties commonly associated with optocouplers. The typical optocoupler concerns regarding uncertain current transfer ratios, nonlinear transfer functions, and temperature and lifetime effects are eliminated with the simple iCoupler digital interfaces and stable performance characteristics. The need for external drivers and other discrete components is eliminated with these iCoupler products. Furthermore, iCoupler devices consume one-tenth to one-sixth of the power of optocouplers at comparable signal data rates. The ADuM130x isolators provide three independent isolation channels in a variety of channel configurations and data rates (see the Ordering Guide). Both models operate with the supply voltage on either side ranging from 2.7 V to 5.5 V, providing compatibility with lower voltage systems as well as enabling a voltage translation functionality across the isolation barrier. In addition, the ADuM130x provide low pulse width distortion (<2 ns for CRW grade) and tight channel-to-channel matching (<2 ns for CRW grade). Unlike other optocoupler alternatives, the ADuM130x isolators have a patented refresh feature that ensures dc correctness in the absence of input logic transitions and when power is not applied to one of the supplies. 1 Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329. General-purpose multichannel isolation SPI interface/data converter isolation RS-232/RS-422/RS-485 transceivers Industrial field bus isolation Automotive systems FUNCTIONAL BLOCK DIAGRAMS GND1 2 15 GND2 VIA 3 ENCODE DECODE 14 VOA VIB 4 ENCODE DECODE 13 VOB VIC 5 ENCODE DECODE 12 VOC NC 6 11 NC NC 7 10 VE2 GND1 8 9 GND2 VDD1 1 GND1 2 Figure 1. ADuM1300 Functional Block Diagram Rev. J 16 VDD2 15 GND2 VIA 3 ENCODE DECODE 14 VOA VIB 4 ENCODE DECODE 13 VOB VOC 5 DECODE ENCODE 12 VIC NC 6 11 NC VE1 7 10 VE2 GND1 8 9 GND2 03787-002 16 VDD2 03787-001 VDD1 1 Figure 2. ADuM1301 Functional Block Diagram Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2003–2014 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADuM1300/ADuM1301 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Insulation Characteristics ......................................................... 20 General Description ......................................................................... 1 Recommended Operating Conditions .................................... 20 Functional Block Diagrams ............................................................. 1 Absolute Maximum Ratings ......................................................... 21 Revision History ............................................................................... 3 ESD Caution................................................................................ 21 Specifications..................................................................................... 4 Pin Configurations and Function Descriptions ......................... 22 Electrical Characteristics—5 V, 105°C Operation ................... 4 Typical Performance Characteristics ........................................... 23 Electrical Characteristics—3 V, 105°C Operation ................... 6 Applications Information .............................................................. 25 Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V, 105°C Operation ........................................................................... 8 PC Board Layout ........................................................................ 25 Electrical Characteristics—5 V, 125°C Operation ................. 11 DC Correctness and Magnetic Field Immunity .......................... 25 Electrical Characteristics—3 V, 125°C Operation ................. 13 Power Consumption .................................................................. 26 Electrical Characteristics—Mixed 5 V/3 V, 125°C Operation... 15 Insulation Lifetime ..................................................................... 27 Electrical Characteristics—Mixed 3 V/5 V 125°C Operation ... 17 Outline Dimensions ....................................................................... 28 Package Characteristics ............................................................. 19 Ordering Guide .......................................................................... 28 Regulatory Information ............................................................. 19 Automotive Products ................................................................. 29 Propagation Delay-Related Parameters ................................... 25 Insulation and Safety-Related Specifications .......................... 19 Rev. J | Page 2 of 32 Data Sheet ADuM1300/ADuM1301 REVISION HISTORY 4/14—Rev. I to Rev. J Change to Table 9 ............................................................................19 3/12—Rev. H to Rev. I Created Hyperlink for Safety and Regulatory Approvals Entry in Features Section ................................................................. 1 Change to PC Board Layout Section ............................................25 Updated Outline Dimensions ........................................................28 Moved Automotive Products Section ...........................................28 5/08—Rev. G to Rev. H Added ADuM1300W and ADuM1301W Parts ............. Universal Changes to Features List ................................................................... 1 Added Table 4 ..................................................................................11 Added Table 5 ..................................................................................13 Added Table 6 ..................................................................................15 Added Table 7 ..................................................................................17 Changes to Table 12 ........................................................................20 Changes to Table 13 ........................................................................21 Added Automotive Products Section ...........................................27 Changes to Ordering Guide ...........................................................28 11/07—Rev. F to Rev. G Changes to Note 1 and Figure 2 ...................................................... 1 Added ADuM130xARW Change vs. Temperature Parameter ... 3 Added ADuM130xARW Change vs. Temperature Parameter ... 5 Added ADuM130xARW Change vs. Temperature Parameter ... 8 Changes to Figure 14 ......................................................................16 6/07—Rev. E to Rev. F Updated VDE Certification Throughout ....................................... 1 Changes to Features, Note 1, Figure 1, and Figure 2 .................... 1 Changes to Regulatory Information Section ...............................10 Added Table 10 ................................................................................12 Added Insulation Lifetime Section ...............................................17 Updated Outline Dimensions ........................................................19 Changes to Ordering Guide ...........................................................19 2/06—Rev. D to Rev. E Updated Format ................................................................. Universal Added TÜV Approval ....................................................... Universal Changes to Figure 2 .......................................................................... 1 5/05—Rev. C to Rev. D Changes to Format ............................................................. Universal Changes to Figure 2 .......................................................................... 1 Changes to Table 6 .......................................................................... 10 Changes to Ordering Guide ........................................................... 18 6/04—Rev. B to Rev. C Changes to Format ............................................................. Universal Changes to Features .......................................................................... 1 Changes to Electrical Characteristics—5 V Operation................ 3 Changes to Electrical Characteristics—3 V Operation................ 5 Changes to Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V Operation ............................................................................ 7 Changes to Ordering Guide ........................................................... 18 5/04—Rev. A to Rev. B Changes to the Format ...................................................... Universal Changes to the Features.................................................................... 1 Changes to Table 7 and Table 8 ..................................................... 14 Changes to Table 9 .......................................................................... 15 Changes to the DC Correctness and Magnetic Field Immunity Section .............................................................................................. 19 Changes to the Power Consumption Section .............................. 20 Changes to the Ordering Guide .................................................... 21 9/03—Rev. 0 to Rev. A Edits to Regulatory Information ................................................... 13 Edits to Absolute Maximum Ratings ............................................ 15 Deleted the Package Branding Information ................................ 16 9/03—Revision 0: Initial Version Rev. J | Page 3 of 32 ADuM1300/ADuM1301 Data Sheet SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. These specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions. Table 1. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent Output Supply Current per Channel, Quiescent ADuM1300 Total Supply Current, Three Channels 1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (BRW and CRW Grades Only) VDD1 Supply Current VDD2 Supply Current 90 Mbps (CRW Grade Only) VDD1 Supply Current VDD2 Supply Current ADuM1301 Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (BRW and CRW Grades Only) VDD1 Supply Current VDD2 Supply Current 90 Mbps (CRW Grade Only) VDD1 Supply Current VDD2 Supply Current For All Models Input Currents Symbol Min Typ Max Unit IDDI (Q) IDDO (Q) 0.50 0.19 0.53 0.24 mA mA IDD1 (Q) IDD2 (Q) 1.6 0.7 2.5 1.0 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 6.5 1.9 8.1 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (90) IDD2 (90) 57 16 77 18 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. IDD1 (Q) IDD2 (Q) 1.3 1.0 2.1 1.4 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 5.0 3.4 6.2 4.2 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (90) IDD2 (90) 43 29 57 37 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IIA, IIB, IIC, IE1, IE2 −10 Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages VIH, VEH VIL, VEL VOAH, VOBH, VOCH 2.0 Logic Low Output Voltages VOAL, VOBL, VOCL SWITCHING SPECIFICATIONS ADuM130xARW Minimum Pulse Width 2 Maximum Data Rate 3 Propagation Delay 4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew 5 Channel-to-Channel Matching 6 +0.01 +10 0.8 (VDD1 or VDD2) − 0.1 (VDD1 or VDD2) − 0.4 5.0 4.8 0.0 0.04 0.2 PW 1 50 tPHL, tPLH PWD 65 11 tPSK tPSKCD/tPSKOD Rev. J | Page 4 of 32 0.1 0.1 0.4 V V V V V V V 1000 ns Mbps 100 ns 40 ns ps/°C 50 ns 50 ns Test Conditions IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels Data Sheet Parameter ADuM130xBRW Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 ADuM130xCRW Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) Common-Mode Transient Immunity at Logic High Output 7 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate Input Dynamic Supply Current per Channel 8 Output Dynamic Supply Current per Channel8 ADuM1300/ADuM1301 Symbol Min Typ PW Max Unit Test Conditions 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 15 3 ns Mbps ns ns ps/°C ns ns tPSKOD 6 ns CL = 15 pF, CMOS signal levels 11.1 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPHL, tPLH PWD 10 20 32 50 3 5 PW tPSK tPSKCD 10 2 ns Mbps ns ns ps/°C ns ns tPSKOD 5 ns CL = 15 pF, CMOS signal levels tPHL, tPLH PWD 90 18 8.3 120 27 0.5 3 32 2 tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels VIx = VDD1 or VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V tR/tF |CMH| 25 2.5 35 ns kV/µs |CML| 25 35 kV/µs 1.2 0.19 0.05 Mbps mA/Mbps mA/Mbps fr IDDI (D) IDDO (D) The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations. 2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 7 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 8 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 Rev. J | Page 5 of 32 ADuM1300/ADuM1301 Data Sheet ELECTRICAL CHARACTERISTICS—3 V, 105°C OPERATION All voltages are relative to their respective ground. 2.7 V ≤ VDD1 ≤ 3.6 V, 2.7 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V. These specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions. Table 2. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent Output Supply Current per Channel, Quiescent ADuM1300 Total Supply Current, Three Channels 1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (BRW and CRW Grades Only) VDD1 Supply Current VDD2 Supply Current 90 Mbps (CRW Grade Only) VDD1 Supply Current VDD2 Supply Current ADuM1301 Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (BRW and CRW Grades Only) VDD1 Supply Current VDD2 Supply Current 90 Mbps (CRW Grade Only) VDD1 Supply Current VDD2 Supply Current For All Models Input Currents Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages Logic Low Output Voltages SWITCHING SPECIFICATIONS ADuM130xARW Minimum Pulse Width 2 Maximum Data Rate 3 Propagation Delay 4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew 5 Channel-to-Channel Matching 6 Symbol Min Typ Max Unit IDDI (Q) IDDO (Q) 0.26 0.11 0.31 0.15 mA mA IDD1 (Q) IDD2 (Q) 0.9 0.4 1.7 0.7 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 3.4 1.1 4.9 1.6 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (90) IDD2 (90) 31 8 48 13 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. IDD1 (Q) IDD2 (Q) 0.7 0.6 1.4 0.9 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 2.6 1.8 3.7 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (90) IDD2 (90) 24 16 36 23 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IIA, IIB, IIC, IE1, IE2 −10 +0.01 +10 VIH, VEH 1.6 VIL, VEL VOAH, VOBH, VOCH (VDD1 or VDD2) − 0.1 3.0 (VDD1 or VDD2) − 0.4 2.8 VOAL, VOBL, VOCL 0.0 0.04 0.2 PW 1 50 tPHL, tPLH PWD 75 11 tPSK tPSKCD/tPSKOD Rev. J | Page 6 of 32 0.4 0.1 0.1 0.4 V V V V V V V 1000 ns Mbps 100 ns 40 ns ps/°C 50 ns 50 ns Test Conditions IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels Data Sheet Parameter ADuM130xBRW Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 ADuM130xCRW Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) Common-Mode Transient Immunity at Logic High Output 7 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate Input Dynamic Supply Current per Channel 8 Output Dynamic Supply Current per Channel8 ADuM1300/ADuM1301 Symbol Min Typ PW Max Unit Test Conditions 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 26 3 ns Mbps ns ns ps/°C ns ns tPSKOD 6 ns CL = 15 pF, CMOS signal levels 11.1 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPHL, tPLH PWD 10 20 38 50 3 5 PW tPSK tPSKCD 16 2 ns Mbps ns ns ps/°C ns ns tPSKOD 5 ns CL = 15 pF, CMOS signal levels tPHL, tPLH PWD 90 20 8.3 120 34 0.5 3 45 2 tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels VIx = VDD1 or VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V tR/tF |CMH| 25 3 35 ns kV/µs |CML| 25 35 kV/µs 1.1 0.10 0.03 Mbps mA/Mbps mA/Mbps fr IDDI (D) IDDO (D) The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations. 2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 7 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 8 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 Rev. J | Page 7 of 32 ADuM1300/ADuM1301 Data Sheet ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V OR 3 V/5 V, 105°C OPERATION All voltages are relative to their respective ground. 5 V/3 V operation: 4.5 V ≤ VDD1 ≤ 5.5 V, 2.7 V ≤ VDD2 ≤ 3.6 V; 3 V/5 V operation: 2.7 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C; VDD1 = 3.0 V, VDD2 = 5 V or VDD1 = 5 V, VDD2 = 3.0 V. These specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions. Table 3. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent 5 V/3 V Operation 3 V/5 V Operation Output Supply Current per Channel, Quiescent 5 V/3 V Operation 3 V/5 V Operation ADuM1300 Total Supply Current, Three Channels 1 DC to 2 Mbps VDD1 Supply Current 5 V/3 V Operation 3 V/5 V Operation VDD2 Supply Current 5 V/3 V Operation 3 V/5 V Operation 10 Mbps (BRW and CRW Grades Only) VDD1 Supply Current 5 V/3 V Operation 3 V/5 V Operation VDD2 Supply Current 5 V/3 V Operation 3 V/5 V Operation 90 Mbps (CRW Grade Only) VDD1 Supply Current 5 V/3 V Operation 3 V/5 V Operation VDD2 Supply Current 5 V/3 V Operation 3 V/5 V Operation ADuM1301 Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current 5 V/3 V Operation 3 V/5 V Operation VDD2 Supply Current 5 V/3 V Operation 3 V/5 V Operation 10 Mbps (BRW and CRW Grades Only) VDD1 Supply Current 5 V/3 V Operation 3 V/5 V Operation VDD2 Supply Current 5 V/3 V Operation 3 V/5 V Operation Symbol Min Typ Max Unit Test Conditions 0.50 0.26 0.53 mA 0.31 mA 0.11 0.19 0.15 mA 0.24 mA 1.6 0.9 2.5 1.7 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. 0.4 0.7 0.7 1.0 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. 6.5 3.4 8.1 4.9 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. 1.1 1.9 1.6 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. 57 31 77 48 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. 8 16 13 18 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. 1.3 0.7 2.1 1.4 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. 0.6 1.0 0.9 1.4 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. 5.0 2.6 6.2 3.7 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. 1.8 3.4 2.5 4.2 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDDI (Q) IDDO (Q) IDD1 (Q) IDD2 (Q) IDD1 (10) IDD2 (10) IDD1 (90) IDD2 (90) IDD1 (Q) IDD2 (Q) IDD1 (10) IDD2 (10) Rev. J | Page 8 of 32 Data Sheet Parameter 90 Mbps (CRW Grade Only) VDD1 Supply Current 5 V/3 V Operation 3 V/5 V Operation VDD2 Supply Current 5 V/3 V Operation 3 V/5 V Operation For All Models Input Currents Logic High Input Threshold 5 V/3 V Operation 3 V/5 V Operation Logic Low Input Threshold 5 V/3 V Operation 3 V/5 V Operation Logic High Output Voltages Logic Low Output Voltages SWITCHING SPECIFICATIONS ADuM130xARW Minimum Pulse Width 2 Maximum Data Rate 3 Propagation Delay 4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew 5 Channel-to-Channel Matching 6 ADuM130xBRW Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 ADuM130xCRW Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, Opposing-Directional Channels6 ADuM1300/ADuM1301 Symbol Min Typ Max Unit Test Conditions 43 24 57 36 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. 16 29 23 37 mA mA 45 MHz logic signal freq. 45 MHz logic signal freq. +0.01 +10 µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IDD1 (90) IDD2 (90) IIA, IIB, IIC, IE1, IE2 −10 VIH, VEH 2.0 1.6 V V VIL, VEL 0.8 0.4 VOAH, VOBH, VOCH (VDD1 or VDD2) − 0.1 (VDD1 or VDD2) (VDD1 or VDD2) − 0.4 (VDD1 or VDD2) − 0.2 VOAL, VOBL, VOCL 0.0 0.1 0.04 0.1 0.2 0.4 PW tPHL, tPLH PWD 1 50 70 11 tPSK tPSKCD/tPSKOD PW V V V V V V V 1000 ns Mbps 100 ns 40 ns ps/°C 50 ns 50 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 6 3 ns Mbps ns ns ps/°C ns ns tPSKOD 22 ns tPHL, tPLH PWD 10 15 35 IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL 50 3 5 tPSK tPSKCD 11.1 ns Mbps 40 ns 2 ns ps/°C 14 ns 2 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSKOD 5 CL = 15 pF, CMOS signal levels PW tPHL, tPLH PWD 90 20 Rev. J | Page 9 of 32 8.3 120 30 0.5 3 ns ADuM1300/ADuM1301 Parameter For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) 5 V/3 V Operation 3 V/5 V Operation Common-Mode Transient Immunity at Logic High Output 7 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate 5 V/3 V Operation 3 V/5 V Operation Input Dynamic Supply Current per Channel 8 5 V/3 V Operation 3 V/5 V Operation Output Dynamic Supply Current per Channel8 5 V/3 V Operation 3 V/5 V Operation Data Sheet Symbol Min Typ Max Unit Test Conditions tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels tR/tF CL = 15 pF, CMOS signal levels |CMH| 25 3.0 2.5 35 ns ns kV/µs |CML| 25 35 kV/µs 1.2 1.1 Mbps Mbps 0.19 0.10 mA/Mbps mA/Mbps 0.03 0.05 mA/Mbps mA/Mbps VIx = VDD1 or VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V fr IDDI (D) IDDO (D) The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations. 2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 7 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 8 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 Rev. J | Page 10 of 32 Data Sheet ADuM1300/ADuM1301 ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. These specifications apply to ADuM1300W and ADuM1301W automotive grade versions. Table 4. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent Output Supply Current per Channel, Quiescent ADuM1300W, Total Supply Current, Three Channels 1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current ADuM1301W, Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current For All Models Input Currents Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages Logic Low Output Voltages SWITCHING SPECIFICATIONS ADuM130xWSRWZ Minimum Pulse Width 2 Maximum Data Rate 3 Propagation Delay 4 Pulse Width Distortion, |tPLH − tPHL|4 Propagation Delay Skew 5 Channel-to-Channel Matching 6 ADuM130xWTRWZ Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 Symbol Typ Max Unit IDDI (Q) IDDO (Q) 0.50 0.19 0.53 mA 0.24 mA IDD1 (Q) IDD2 (Q) 1.6 0.7 2.5 1.0 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 6.5 1.9 8.1 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (Q) IDD2 (Q) 1.3 1.0 2.1 1.4 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 5.0 3.4 6.2 4.2 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IIA, IIB, IIC, IE1, IE2 Min −10 +0.01 +10 VIH, VEH 2.0 VIL, VEL VOAH, VOBH, VOCH VDD1, VDD2 − 0.1 5.0 VDD1, VDD2 − 0.4 4.8 VOAL, VOBL, VOCL 0.0 0.04 0.2 PW tPHL, tPLH PWD tPSK tPSKCD/tPSKOD 1 50 65 PW 0.8 0.1 0.1 0.4 V V V V V V V CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 15 3 tPSKOD 6 ns tPHL, tPLH PWD 27 32 3 5 Rev. J | Page 11 of 32 IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL 1000 ns Mbps 100 ns 40 ns 50 ns 50 ns ns Mbps ns ns ps/°C ns ns 10 18 Test Conditions ADuM1300/ADuM1301 Parameter For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) Common-Mode Transient Immunity at Logic High Output 7 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate Input Dynamic Supply Current per Channel 8 Output Dynamic Supply Current per Channel8 Data Sheet Symbol Min Typ Max Unit Test Conditions tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels VIx = VDD1/VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V tR/tF |CMH| 25 2.5 35 ns kV/µs |CML| 25 35 kV/µs 1.2 0.19 0.05 Mbps mA/Mbps mA/Mbps fr IDDI (D) IDDO (D) The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations. 2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 7 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 8 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 Rev. J | Page 12 of 32 Data Sheet ADuM1300/ADuM1301 ELECTRICAL CHARACTERISTICS—3 V, 125°C OPERATION All voltages are relative to their respective ground. 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.0 V. These specifications apply to ADuM1300W and ADuM1301W automotive grade versions. Table 5. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent Output Supply Current per Channel, Quiescent ADuM1300W, Total Supply Current, Three Channels 1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current ADuM1301W, Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current For All Models Input Currents Symbol Min Typ Max Unit IDDI (Q) IDDO (Q) 0.26 0.11 0.31 0.15 mA mA IDD1 (Q) IDD2 (Q) 0.9 0.4 1.7 0.7 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 3.4 1.1 4.9 1.6 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (Q) IDD2 (Q) 0.7 0.6 1.4 0.9 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 2.6 1.8 3.7 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IIA, IIB, IIC, IE1, IE2 −10 Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages VIH, VEH VIL, VEL VOAH, VOBH, VOCH 1.6 Logic Low Output Voltages VOAL, VOBL, VOCL SWITCHING SPECIFICATIONS ADuM130xWSRWZ Minimum Pulse Width 2 Maximum Data Rate 3 Propagation Delay 4 Pulse Width Distortion, |tPLH − tPHL|4 Propagation Delay Skew 5 Channel-to-Channel Matching 6 ADuM130xWTRWZ Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, Opposing-Directional Channels6 +0.01 +10 0.4 VDD1, VDD2 − 0.1 3.0 VDD1, VDD2 − 0.4 2.8 0.0 0.04 0.2 PW tPHL, tPLH PWD tPSK tPSKCD/tPSKOD 1 50 75 PW 0.1 0.1 0.4 V V V V V V V CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 26 3 tPSKOD 6 ns tPHL, tPLH PWD 34 45 3 5 Rev. J | Page 13 of 32 IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL 1000 ns Mbps 100 ns 40 ns 50 ns 50 ns ns Mbps ns ns ps/°C ns ns 10 20 Test Conditions ADuM1300/ADuM1301 Parameter For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) Common-Mode Transient Immunity at Logic High Output 7 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate Input Dynamic Supply Current per Channel 8 Output Dynamic Supply Current per Channel8 Data Sheet Symbol Min Typ Max Unit Test Conditions tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels VIx = VDD1/VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V tR/tF |CMH| 25 3 35 ns kV/µs |CML| 25 35 kV/µs 1.1 0.10 0.03 Mbps mA/Mbps mA/Mbps fr IDDI (D) IDDO (D) The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations. 2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 7 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 8 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 Rev. J | Page 14 of 32 Data Sheet ADuM1300/ADuM1301 ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 125°C OPERATION 1 All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C; VDD1 = 5 V, VDD2 = 3.0 V. These specifications apply to ADuM1300W and ADuM1301W automotive grade versions. Table 6. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent Output Supply Current per Channel, Quiescent ADuM1300W, Total Supply Current, Three Channels 2 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current ADuM1301W, Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current For All Models Input Currents Symbol Min Typ Max Unit IDDI (Q) IDDO (Q) 0.50 0.11 0.53 0.15 mA mA IDD1 (Q) IDD2 (Q) 1.6 0.4 2.5 0.7 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 6.5 1.1 8.1 1.6 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (Q) IDD2 (Q) 1.3 0.6 2.1 0.9 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 5.0 1.8 6.2 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. +0.01 +10 µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IIA, IIB, IIC, IE1, IE2 −10 Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages VIH, VEH VIL, VEL VOAH, VOBH, VOCH 2.0 Logic Low Output Voltages VOAL, VOBL, VOCL SWITCHING SPECIFICATIONS ADuM130xWSRWZ Minimum Pulse Width 3 Maximum Data Rate 4 Propagation Delay 5 Pulse Width Distortion, |tPLH − tPHL|4 Propagation Delay Skew 6 Channel-to-Channel Matching 7 ADuM130xWTRWZ Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 0.8 VDD1, VDD2 − 0.1 VDD1, VDD2 VDD1, VDD2 − 0.4 VDD1, VDD2 − 0.2 0.0 0.04 0.2 PW 1 50 tPHL, tPLH PWD tPSK 70 tPSKCD/tPSKOD PW 0.1 0.1 0.4 V V V V IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH V V V IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL 1000 ns Mbps 100 ns 40 ns 50 ns 50 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 6 3 ns Mbps ns ns ps/°C ns ns tPSKOD 22 ns tPHL, tPLH PWD 10 20 30 40 3 5 Rev. J | Page 15 of 32 Test Conditions ADuM1300/ADuM1301 Parameter For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) Common-Mode Transient Immunity at Logic High Output 8 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate Input Dynamic Supply Current per Channel 9 Output Dynamic Supply Current per Channel8 Data Sheet Symbol Min Typ Max Unit Test Conditions tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels VIx = VDD1/VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V tR/tF |CMH| 25 3.0 35 ns kV/µs |CML| 25 35 kV/µs 1.2 0.19 0.03 Mbps mA/Mbps mA/Mbps fr IDDI (D) IDDO (D) All voltages are relative to their respective ground. The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations. 3 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 4 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 5 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 6 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 7 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 8 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 9 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 2 Rev. J | Page 16 of 32 Data Sheet ADuM1300/ADuM1301 ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 125°C OPERATION All voltages are relative to their respective ground. 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at TA = 25°C; VDD1 = 3.0 V, VDD2 = 5 V. These apply to ADuM1300W and ADuM1301W automotive grade versions. Table 7. Parameter DC SPECIFICATIONS Input Supply Current per Channel, Quiescent Output Supply Current per Channel, Quiescent ADuM1300W, Total Supply Current, Three Channels 1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current ADuM1301W, Total Supply Current, Three Channels1 DC to 2 Mbps VDD1 Supply Current VDD2 Supply Current 10 Mbps (TRWZ Grade Only) VDD1 Supply Current VDD2 Supply Current For All Models Input Currents Symbol Min Typ Max Unit IDDI (Q) IDDO (Q) 0.26 0.19 0.31 0.24 mA mA IDD1 (Q) IDD2(Q) 0.9 0.7 1.7 1.0 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 3.4 1.9 4.9 2.5 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. IDD1 (Q) IDD2 (Q) 0.7 1.0 1.4 1.4 mA mA DC to 1 MHz logic signal freq. DC to 1 MHz logic signal freq. IDD1 (10) IDD2 (10) 2.6 3.4 3.7 4.2 mA mA 5 MHz logic signal freq. 5 MHz logic signal freq. +0.01 +10 µA 0 V ≤ VIA, VIB, VIC ≤ VDD1 or VDD2, 0 V ≤ VE1, VE2 ≤ VDD1 or VDD2 IIA, IIB, IIC, IE1, IE2 −10 Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages VIH, VEH VIL, VEL VOAH, VOBH, VOCH 1.6 Logic Low Output Voltages VOAL, VOBL, VOCL SWITCHING SPECIFICATIONS ADuM130xWSRWZ Minimum Pulse Width 2 Maximum Data Rate 3 Propagation Delay 4 Pulse Width Distortion, |tPLH − tPHL|4 Propagation Delay Skew 5 Channel-to-Channel Matching 6 ADuM130xWTRWZ Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |tPLH − tPHL|4 Change vs. Temperature Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional Channels6 Channel-to-Channel Matching, OpposingDirectional Channels6 0.4 VDD1, VDD2 − 0.1 VDD1, VDD2 VDD1, VDD2 − 0.4 VDD1, VDD2 − 0.2 0.0 0.04 0.2 PW 1 50 tPHL, tPLH PWD tPSK 70 tPSKCD/tPSKOD PW 0.1 0.1 0.4 V V V V IOx = −20 µA, VIx = VIxH IOx = −4 mA, VIx = VIxH V V V IOx = 20 µA, VIx = VIxL IOx = 400 µA, VIx = VIxL IOx = 4 mA, VIx = VIxL 1000 ns Mbps 100 ns 40 ns 50 ns 50 ns CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels 100 CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels CL = 15 pF, CMOS signal levels tPSK tPSKCD 6 3 ns Mbps ns ns ps/°C ns ns tPSKOD 22 ns tPHL, tPLH PWD 10 20 30 40 3 5 Rev. J | Page 17 of 32 Test Conditions ADuM1300/ADuM1301 Parameter For All Models Output Disable Propagation Delay (High/Low to High Impedance) Output Enable Propagation Delay (High Impedance to High/Low) Output Rise/Fall Time (10% to 90%) 5 V/3 V Operation 3 V/5 V Operation Common-Mode Transient Immunity at Logic High Output 7 Common-Mode Transient Immunity at Logic Low Output7 Refresh Rate Input Dynamic Supply Current per Channel 8 Output Dynamic Supply Current per Channel8 Data Sheet Symbol Min Typ Max Unit Test Conditions tPHZ, tPLH 6 8 ns CL = 15 pF, CMOS signal levels tPZH, tPZL 6 8 ns CL = 15 pF, CMOS signal levels tR/tF CL = 15 pF, CMOS signal levels |CMH| 25 3.0 2.5 35 |CML| 25 35 kV/µs 1.1 0.10 0.05 Mbps mA/Mbps mA/Mbps fr IDDI (D) IDDO (D) ns ns kV/µs VIx = VDD1/VDD2, VCM = 1000 V, transient magnitude = 800 V VIx = 0 V, VCM = 1000 V, transient magnitude = 800 V The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total VDD1 and VDD2 supply currents as a function of data rate for ADuM1300W/ADuM1301W channel configurations. 2 The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. 3 The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed. 4 tPHL propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. tPLH propagation delay is measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal. 5 tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the recommended operating conditions. 6 Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier. 7 CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD2. CML is the maximum common-mode voltage slew rate that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed. 8 Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate. 1 Rev. J | Page 18 of 32 Data Sheet ADuM1300/ADuM1301 PACKAGE CHARACTERISTICS Table 8. Parameter Resistance (Input-to-Output) 1 Capacitance (Input-to-Output)1 Input Capacitance 2 IC Junction-to-Case Thermal Resistance, Side 1 Symbol RI-O CI-O CI θJCI IC Junction-to-Case Thermal Resistance, Side 2 θJCO Min Typ 1012 1.7 4.0 33 Max 28 Unit Ω pF pF °C/W Test Conditions f = 1 MHz Thermocouple located at center of package underside °C/W Device is considered a 2-terminal device; Pin 1, Pin 2, Pin 3, Pin 4, Pin 5, Pin 6, Pin 7, and Pin 8 are shorted together and Pin 9, Pin 10, Pin 11, Pin 12, Pin 13, Pin 14, Pin 15, and Pin 16 are shorted together. 2 Input capacitance is from any input data pin to ground. 1 REGULATORY INFORMATION The ADuM130x are approved by the organizations listed in Table 9. Refer to Table 14 and the Insulation Lifetime section for details regarding recommended maximum working voltages for specific crossisolation waveforms and insulation levels. Table 9. UL Recognized under 1577 Component Recognition Program1 CSA Approved under CSA Component Acceptance Notice #5A VDE Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 2 Single protection, 2500 V rms isolation voltage Basic insulation per CSA 60950-1-03 and IEC 60950-1, 800 V rms (1131 V peak) maximum working voltage Reinforced insulation per CSA 60950-1-03 and IEC 60950-1, 400 V rms (566 V peak) maximum working voltage File 205078 Reinforced insulation, 560 V peak TÜV Approved according to IEC 61010-1:2001 (2nd Edition), EN 61010-1:2001 (2nd Edition), UL 61010-1:2004 CSA C22.2.61010.1:2005 Reinforced insulation, 400 V rms maximum working voltage File 2471900-4880-0001 Certificate U8V 05 06 56232 002 File E214100 1 2 In accordance with UL 1577, each ADuM130x is proof tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current leakage detection limit = 5 µA). In accordance with DIN V VDE V 0884-10, each ADuM130x is proof tested by applying an insulation test voltage ≥1050 V peak for 1 sec (partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval. INSULATION AND SAFETY-RELATED SPECIFICATIONS Table 10. Parameter Rated Dielectric Insulation Voltage Minimum External Air Gap (Clearance) Symbol L(I01) Value 2500 7.7 min Unit V rms mm Minimum External Tracking (Creepage) L(I02) 8.1 min mm Minimum Internal Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group CTI 0.017 min >175 IIIa mm V Rev. J | Page 19 of 32 Conditions 1-minute duration Measured from input terminals to output terminals, shortest distance through air Measured from input terminals to output terminals, shortest distance path along body Insulation distance through insulation DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) ADuM1300/ADuM1301 Data Sheet DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 INSULATION CHARACTERISTICS These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by protective circuits. The asterisk (*) marking on packages denotes DIN V VDE V 0884-10 approval for 560 V peak working voltage. Table 11. Description Installation Classification per DIN VDE 0110 For Rated Mains Voltage ≤ 150 V rms For Rated Mains Voltage ≤ 300 V rms For Rated Mains Voltage ≤ 400 V rms Climatic Classification Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage Input-to-Output Test Voltage, Method B1 Input-to-Output Test Voltage, Method A After Environmental Tests Subgroup 1 After Input and/or Safety Test Subgroup 2 and Subgroup 3 Highest Allowable Overvoltage Safety-Limiting Values Case Temperature Side 1 Current Side 2 Current Insulation Resistance at TS Conditions VIORM × 1.875 = VPR, 100% production test, tm = 1 sec, partial discharge < 5 pC VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC Symbol Characteristic Unit VIORM VPR I to IV I to III I to II 40/105/21 2 560 1050 V peak V peak 896 672 V peak V peak VTR 4000 V peak TS IS1 IS2 RS 150 265 335 >109 °C mA mA Ω VPR VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC Transient overvoltage, tTR = 10 seconds Maximum value allowed in the event of a failure (see Figure 3) VIO = 500 V 350 RECOMMENDED OPERATING CONDITIONS Table 12. 250 SIDE #2 Parameter Operating Temperature (TA) 1 Operating Temperature (TA) 2 Supply Voltages (VDD1, VDD2)1, 3 Supply Voltages (VDD1, VDD2) 2, 3 Input Signal Rise and Fall Times 200 150 SIDE #1 100 Rating −40°C to +105°C −40°C to +125°C 2.7 V to 5.5 V 3.0 V to 5.5 V 1.0 ms 50 Does not apply to ADuM1300W and ADuM1301W automotive grade versions. Applies to ADuM1300W and ADuM1301W automotive grade versions. 3 All voltages are relative to their respective ground. See the DC Correctness and Magnetic Field Immunity section for information on immunity to external magnetic fields. 1 0 0 50 100 150 CASE TEMPERATURE (°C) 200 Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting Values with Case Temperature per DIN V VDE V 0884-10 03787-003 SAFETY-LIMITING CURRENT (mA) 300 2 Rev. J | Page 20 of 32 Data Sheet ADuM1300/ADuM1301 ABSOLUTE MAXIMUM RATINGS Ambient temperature = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 13. Parameter Storage Temperature (TST) Ambient Operating Temperature (TA)1 Ambient Operating Temperature (TA)2 Supply Voltages (VDD1, VDD2)3 Input Voltage (VIA, VIB, VIC, VE1, VE2)3, 4 Output Voltage (VOA, VOB, VOC)3, 4 Average Output Current per Pin5 Side 1 (IO1) Side 2 (IO2) Common-Mode Transients6 Rating −65°C to +150°C −40°C to +105°C −40°C to +125°C −0.5 V to +7.0 V −0.5 V to VDDI + 0.5 V −0.5 V to VDDO + 0.5 V ESD CAUTION −23 mA to +23 mA −30 mA to +30 mA −100 kV/µs to +100 kV/µs Does not apply to ADuM1300W and ADuM1301W automotive grade versions. Applies to ADuM1300W and ADuM1301W automotive grade versions. 3 All voltages are relative to their respective ground. 4 VDDI and VDDO refer to the supply voltages on the input and output sides of a given channel, respectively. See the PC Board Layout section. 5 See Figure 3 for maximum rated current values for various temperatures. 6 This refers to common-mode transients across the insulation barrier. Common-mode transients exceeding the Absolute Maximum Ratings may cause latch-up or permanent damage. 1 2 Table 14. Maximum Continuous Working Voltage 1 Parameter AC Voltage, Bipolar Waveform AC Voltage, Unipolar Waveform Basic Insulation Reinforced Insulation DC Voltage Basic Insulation Reinforced Insulation 1 Max 565 Unit V peak Constraint 50-year minimum lifetime 1131 560 V peak V peak Maximum approved working voltage per IEC 60950-1 Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10 1131 560 V peak V peak Maximum approved working voltage per IEC 60950-1 Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10 Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details. Table 15. Truth Table (Positive Logic) VIx Input 1 H L X X X X 1 2 VEx Input1, 2 H or NC H or NC L H or NC L X VDDI State1 Powered Powered Powered Unpowered Unpowered Powered VDDO State1 Powered Powered Powered Powered Powered Unpowered VOx Output1 Notes H L Z H Outputs return to the input state within 1 µs of VDDI power restoration. Z Indeterminate Outputs return to the input state within 1 µs of VDDO power restoration if the VEx state is H or NC. Outputs return to a high impedance state within 8 ns of VDDO power restoration if the VEx state is L. VIx and VOx refer to the input and output signals of a given channel (A, B, or C). VEx refers to the output enable signal on the same side as the VOx outputs. VDDI and VDDO refer to the supply voltages on the input and output sides of the given channel, respectively. In noisy environments, connecting VEx to an external logic high or low is recommended. Rev. J | Page 21 of 32 ADuM1300/ADuM1301 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS VDD1 1 16 VDD2 *GND1 2 15 GND2* 14 VOA VIA 3 TOP VIEW 13 VOB VIC 5 (Not to Scale) 12 VOC 11 NC NC 6 VIB 4 ADuM1300 VIB 4 10 VE2 9 GND2* NC = NO CONNECT ADuM1301 14 VOA TOP VIEW 13 VOB VOC 5 (Not to Scale) 12 VIC NC 6 11 NC VE1 7 03787-004 NC 7 *GND1 8 16 VDD2 15 GND2* *GND1 8 10 VE2 9 NC = NO CONNECT GND2* 03787-005 VIA 3 VDD1 1 *GND1 2 *PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED, AND CONNECTING BOTH TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED, AND CONNECTING BOTH TO GND2 IS RECOMMENDED. *PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED, AND CONNECTING BOTH TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED, AND CONNECTING BOTH TO GND2 IS RECOMMENDED. Figure 5. ADuM1301 Pin Configuration Figure 4. ADuM1300 Pin Configuration Table 16. ADuM1300 Pin Function Descriptions Table 17. ADuM1301 Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 Pin No. 1 2 3 4 5 6 7 Mnemonic VDD1 GND1 VIA VIB VOC NC VE1 8 9 10 GND1 GND2 VE2 11 12 13 14 15 16 NC VIC VOB VOA GND2 VDD2 11 12 13 14 15 16 Mnemonic VDD1 GND1 VIA VIB VIC NC NC GND1 GND2 VE2 NC VOC VOB VOA GND2 VDD2 Description Supply Voltage for Isolator Side 1. Ground 1. Ground reference for Isolator Side 1. Logic Input A. Logic Input B. Logic Input C. No Connect. No Connect. Ground 1. Ground reference for Isolator Side 1. Ground 2. Ground reference for Isolator Side 2. Output Enable 2. Active high logic input. VOA, VOB, and VOC outputs are enabled when VE2 is high or disconnected. VOA, VOB, and VOC outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic high or low is recommended. No Connect. Logic Output C. Logic Output B. Logic Output A. Ground 2. Ground reference for Isolator Side 2. Supply Voltage for Isolator Side 2. Rev. J | Page 22 of 32 Description Supply Voltage for Isolator Side 1. Ground 1. Ground reference for Isolator Side 1. Logic Input A. Logic Input B. Logic Output C. No Connect. Output Enable 1. Active high logic input. VOC output is enabled when VE1 is high or disconnected. VOC output is disabled when VE1 is low. In noisy environments, connecting VE1 to an external logic high or low is recommended. Ground 1. Ground reference for Isolator Side 1. Ground 2. Ground reference for Isolator Side 2. Output Enable 2. Active high logic input. VOA and VOB outputs are enabled when VE2 is high or disconnected. VOA and VOB outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic high or low is recommended. No Connect. Logic Input C. Logic Output B. Logic Output A. Ground 2. Ground reference for Isolator Side 2. Supply Voltage for Isolator Side 2. Data Sheet ADuM1300/ADuM1301 TYPICAL PERFORMANCE CHARACTERISTICS 60 20 18 50 14 40 CURRENT (mA) CURRENT/CHANNEL (mA) 16 12 5V 10 8 6 30 5V 20 3V 3V 4 10 0 20 40 60 DATA RATE (Mbps) 80 100 0 03787-008 0 0 Figure 6. Typical Input Supply Current per Channel vs. Data Rate for 5 V and 3 V Operation 20 40 60 DATA RATE (Mbps) 80 100 03787-011 2 Figure 9. Typical ADuM1300 VDD1 Supply Current vs. Data Rate for 5 V and 3 V Operation 6 16 14 12 4 CURRENT (mA) CURRENT/CHANNEL (mA) 5 3 5V 2 3V 10 8 5V 6 3V 4 1 0 20 40 60 DATA RATE (Mbps) 80 100 0 03787-009 0 0 40 60 DATA RATE (Mbps) 80 100 Figure 10. Typical ADuM1300 VDD2 Supply Current vs. Data Rate for 5 V and 3 V Operation 50 9 45 8 40 7 35 CURRENT (mA) 10 6 5 4 5V 30 25 5V 20 3V 15 3 10 1 5 0 0 20 40 60 DATA RATE (Mbps) 80 100 Figure 8. Typical Output Supply Current per Channel vs. Data Rate for 5 V and 3 V Operation (15 pF Output Load) 0 0 20 40 60 DATA RATE (Mbps) 80 100 Figure 11. Typical ADuM1301 VDD1 Supply Current vs. Data Rate for 5 V and 3 V Operation Rev. J | Page 23 of 32 03787-013 3V 2 03787-010 CURRENT/CHANNEL (mA) Figure 7. Typical Output Supply Current per Channel vs. Data Rate for 5 V and 3 V Operation (No Output Load) 20 03787-012 2 ADuM1300/ADuM1301 Data Sheet 30 40 PROPAGATION DELAY (ns) 25 15 5V 10 3V 3V 35 30 5 0 0 20 40 60 DATA RATE (Mbps) 80 100 Figure 12. Typical ADuM1301 VDD2 Supply Current vs. Data Rate for 5 V and 3 V Operation 25 –50 –25 0 50 25 TEMPERATURE (°C) 75 Figure 13. Propagation Delay vs. Temperature, C Grade Rev. J | Page 24 of 32 100 03787-019 5V 03787-014 CURRENT (mA) 20 Data Sheet ADuM1300/ADuM1301 APPLICATIONS INFORMATION PC BOARD LAYOUT The ADuM130x digital isolator requires no external interface circuitry for the logic interfaces. Power supply bypassing is strongly recommended at the input and output supply pins (see Figure 14). Bypass capacitors are most conveniently connected between Pin 1 and Pin 2 for VDD1 and between Pin 15 and Pin 16 for VDD2. The capacitor value should be between 0.01 µF and 0.1 µF. The total lead length between both ends of the capacitor and the input power supply pin should not exceed 20 mm. Bypassing between Pin 1 and Pin 8 and between Pin 9 and Pin 16 should also be considered unless the ground pair on each package side is connected close to the package. VDD2 GND2 VOA VOB VOC/VIC NC VE2 GND2 Figure 14. Recommended Printed Circuit Board Layout In applications involving high common-mode transients, care should be taken to ensure that board coupling across the isolation barrier is minimized. Furthermore, the board layout should be designed such that any coupling that does occur equally affects all pins on a given component side. Failure to ensure this could cause voltage differentials between pins exceeding the absolute maximum ratings of the device, thereby leading to latch-up or permanent damage. The pulses at the transformer output have an amplitude greater than 1.0 V. The decoder has a sensing threshold at about 0.5 V, thus establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by V = (−dβ/dt)∑∏rn2; n = 1, 2, … , N See the AN-1109 Application Note for board layout guidelines. PROPAGATION DELAY-RELATED PARAMETERS Propagation delay is a parameter that describes the time it takes a logic signal to propagate through a component. The propagation delay to a logic low output may differ from the propagation delay to a logic high output. 50% 50% Figure 15. Propagation Delay Parameters Pulse width distortion is the maximum difference between these two propagation delay values and is an indication of how accurately the timing of the input signal is preserved. Channel-to-channel matching refers to the maximum amount that the propagation delay differs between channels within a single ADuM130x component. Propagation delay skew refers to the maximum amount that the propagation delay differs between multiple ADuM130x components operating under the same conditions. 10 1 0.1 0.01 0.001 1k 10k 100k 1M 10M MAGNETIC FIELD FREQUENCY (Hz) 100M Figure 16. Maximum Allowable External Magnetic Flux Density Rev. J | Page 25 of 32 03787-017 OUTPUT (VOx) Given the geometry of the receiving coil in the ADuM130x and an imposed requirement that the induced voltage be 50% at most of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated as shown in Figure 16. 100 tPHL 03787-016 tPLH where: β is magnetic flux density (gauss). N is the number of turns in the receiving coil. rn is the radius of the nth turn in the receiving coil (cm). MAXIMUM ALLOWABLE MAGNETIC FLUX DENSITY (kgauss) INPUT (VIx) Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is therefore either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions at the input for more than ~1 µs, a periodic set of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses for more than about 5 µs, the input side is assumed to be unpowered or nonfunctional, in which case the isolator output is forced to a default state (see Table 15) by the watchdog timer circuit. The ADuM130x is extremely immune to external magnetic fields. The limitation on the magnetic field immunity of the ADuM130x is set by the condition in which induced voltage in the receiving coil of the transformer is sufficiently large enough to either falsely set or reset the decoder. The following analysis defines the conditions under which this may occur. The 3 V operating condition of the ADuM130x is examined because it represents the most susceptible mode of operation. 03787-015 VDD1 GND1 VIA VIB VIC/VOC NC NC/VE1 GND1 DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY ADuM1300/ADuM1301 Data Sheet For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse (and has the worst-case polarity), it reduces the received pulse from >1.0 V to 0.75 V—still well above the 0.5 V sensing threshold of the decoder. The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the ADuM130x transformers. Figure 17 shows these allowable current magnitudes as a function of frequency for selected distances. The ADuM130x is extremely immune and can be affected only by extremely large currents operated at a high frequency very close to the component. For the 1 MHz example noted, one would have to place a 0.5 kA current 5 mm away from the ADuM130x to affect the operation of the component. DISTANCE = 1m 100 10 DISTANCE = 100mm 1 DISTANCE = 5mm 0.1 0.01 1k 10k 100k 1M 10M MAGNETIC FIELD FREQUENCY (Hz) 100M 03787-018 MAXIMUM ALLOWABLE CURRENT (kA) 1000 Figure 17. Maximum Allowable Current for Various Current-to-ADuM130x Spacings POWER CONSUMPTION The supply current at a given channel of the ADuM130x isolator is a function of the supply voltage, the data rate of the channel, and the output load of the channel. For each input channel, the supply current is given by IDDI = IDDI (Q) f ≤ 0.5 fr IDDI = IDDI (D) × (2f − fr) + IDDI (Q) f > 0.5 fr For each output channel, the supply current is given by IDDO = IDDO (Q) f ≤ 0.5 fr IDDO = (IDDO (D) + (0.5 × 10 ) × CL × VDDO) × (2f − fr) + IDDO (Q) f > 0.5 fr −3 where: IDDI (D), IDDO (D) are the input and output dynamic supply currents per channel (mA/Mbps). CL is the output load capacitance (pF). VDDO is the output supply voltage (V). f is the input logic signal frequency (MHz); it is half of the input data rate expressed in units of Mbps. fr is the input stage refresh rate (Mbps). IDDI (Q), IDDO (Q) are the specified input and output quiescent supply currents (mA). To calculate the total VDD1 and VDD2 supply current, the supply currents for each input and output channel corresponding to VDD1 and VDD2 are calculated and totaled. Figure 6 and Figure 7 provide per-channel supply currents as a function of data rate for an unloaded output condition. Figure 8 provides per-channel supply current as a function of data rate for a 15 pF output condition. Figure 9 through Figure 12 provide total VDD1 and VDD2 supply current as a function of data rate for ADuM1300/ ADuM1301 channel configurations. Note that at combinations of strong magnetic field and high frequency, any loops formed by printed circuit board traces could induce error voltages sufficiently large enough to trigger the thresholds of succeeding circuitry. Care should be taken in the layout of such traces to avoid this possibility. Rev. J | Page 26 of 32 Data Sheet ADuM1300/ADuM1301 Note that the voltage presented in Figure 19 is shown as sinusoidal for illustration purposes only. It is meant to represent any voltage waveform varying between 0 V and some limiting value. The limiting value can be positive or negative, but the voltage cannot cross 0 V. The insulation lifetime of the ADuM130x depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 18, Figure 19, and Figure 20 illustrate these different isolation voltage waveforms, respectively. Bipolar ac voltage is the most stringent environment. The goal of a 50-year operating lifetime under the ac bipolar condition determines the Analog Devices recommended maximum working voltage. RATED PEAK VOLTAGE 03787-021 Analog Devices performs accelerated life testing using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined. These factors allow calculation of the time to failure at the actual working voltage. The values shown in Table 14 summarize the peak voltage for 50 years of service life for a bipolar ac operating condition and the maximum CSA/VDE approved working voltages. In many cases, the approved working voltage is higher than the 50-year service life voltage. Operation at these high working voltages can lead to shortened insulation life in some cases. 0V Figure 18. Bipolar AC Waveform RATED PEAK VOLTAGE 03787-022 All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. In addition to the testing performed by the regulatory agencies, Analog Devices carries out an extensive set of evaluations to determine the lifetime of the insulation structure within the ADuM130x. In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower, which allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Table 14 can be applied while maintaining the 50-year minimum lifetime provided the voltage conforms to either the unipolar ac or dc voltage cases. Any cross insulation voltage waveform that does not conform to Figure 19 or Figure 20 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Table 14. 0V Figure 19. Unipolar AC Waveform RATED PEAK VOLTAGE 03787-023 INSULATION LIFETIME 0V Figure 20. DC Waveform Rev. J | Page 27 of 32 ADuM1300/ADuM1301 Data Sheet OUTLINE DIMENSIONS 10.50 (0.4134) 10.10 (0.3976) 9 16 7.60 (0.2992) 7.40 (0.2913) 8 1.27 (0.0500) BSC 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 0.51 (0.0201) 0.31 (0.0122) 10.65 (0.4193) 10.00 (0.3937) 0.75 (0.0295) 45° 0.25 (0.0098) 2.65 (0.1043) 2.35 (0.0925) SEATING PLANE 8° 0° 0.33 (0.0130) 0.20 (0.0079) COMPLIANT TO JEDEC STANDARDS MS-013-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 1.27 (0.0500) 0.40 (0.0157) 03-27-2007-B 1 Figure 21. 16-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-16) Dimensions shown in millimeters (and inches) ORDERING GUIDE Model 1, 2, 3, 4 ADuM1300ARW ADuM1300CRW ADuM1300ARWZ ADuM1300BRWZ ADuM1300CRWZ ADuM1300WSRWZ ADuM1300WTRWZ ADuM1301ARW ADuM1301BRW ADuM1301CRW ADuM1301ARWZ ADuM1301BRWZ ADuM1301CRWZ ADuM1301WSRWZ ADuM1301WTRWZ EVAL-ADuMQSEBZ Number Number Maximum of Inputs, of Inputs, Data Rate VDD1 Side VDD2 Side (Mbps) 3 0 1 3 0 90 3 0 1 3 0 10 3 0 90 3 0 1 3 0 10 2 1 1 2 1 10 2 1 90 2 1 1 2 1 10 2 1 90 2 1 1 2 1 10 Maximum Propagation Delay, 5 V (ns) 100 32 100 50 32 100 32 100 50 32 100 50 32 100 32 Maximum Pulse Width Distortion (ns) 40 2 40 3 2 40 3 40 3 2 40 3 2 40 3 Z = RoHS Compliant Part. W = Qualified for Automotive Applications. 3 Tape and reel are available. The addition of an -RL suffix designates a 13” (1,000 units) tape-and-reel option. 4 No tape-and-reel option is available for the ADuM1301CRW model. 5 RW-16 = 16-lead wide body SOIC. 1 2 Rev. J | Page 28 of 32 Temperature Range −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +125°C −40°C to +125°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +125°C −40°C to +125°C Package Option 5 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 RW-16 Data Sheet ADuM1300/ADuM1301 AUTOMOTIVE PRODUCTS The ADuM1300W/ADuM1301W models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. Rev. J | Page 29 of 32 ADuM1300/ADuM1301 Data Sheet NOTES Rev. J | Page 30 of 32 Data Sheet ADuM1300/ADuM1301 NOTES Rev. J | Page 31 of 32 ADuM1300/ADuM1301 Data Sheet NOTES ©2003–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03787-0-4/14(J) Rev. J | Page 32 of 32