Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Features ■ Small size/surface-mount packaging ■ Monolithic IC reliability ■ Low impulse noise ■ Make-before-break, break-before-make operation ■ Clean, bounce-free switching ■ Low, matched ON-resistance ■ Built-in current limiting, thermal shutdown, and SLIC protection ■ 5 V only operation, very low power consumption ■ Battery monitor, all OFF state upon loss of battery ■ No EMI ■ Latched logic level inputs, no driver circuitry ■ Only one external protector required Applications ■ Central office ■ DLC ■ PBX ■ DAML ■ HFC/FITL Description The L7583A/B/C/D Line Card Access Switch is a monolithic solid-state device providing the equivalent switching functionality of three 2 form C switches. The L7583 is designed to provide power ringing access, line test access (test out), and SLIC test access (test in) to tip and ring in central office, digital loop carrier, private branch exchange, digitally added main line, and hybrid fiber coax/fiber-in-the-loop analog line card applications. An additional pair of solidstate contacts are also available to provide access for testing of the ringing generator. The L7583A/B has seven states: the idle talk state (line break switches closed, all other switches open), the power ringing state (ringing access switches closed, all other switches open), loop access state (loop access switches closed, all switches open), SLIC test state (test in switches closed, all other switches open), simultaneous loop and SLIC access state (loop and test in switches closed, all others open), ringing generator test state (ring test switches closed, all others open), and an all OFF state. The seven states in the L7583A/B are also in the L7583C/D, with an additional simultaneous testout and ring-test state, making the L7583C/D appropriate for digital loop carrier and other Bellcore TR-57 applications. The L7583 offers break-before-make or makebefore-break switching, with simple logic level input control. Because of the solid-state construction, voltage transients generated when switching into an inductive ringing lead during ring cadence or ring trip are minimized, possibly eliminating the need for external zero cross switching circuitry. State control is via logic level inputs, so no additional driver circuitry is required. The line break switch is a linear switch that has exceptionally low ON-resistance and an excellent ON-resistance matching characteristic. The ringing access switch has a breakdown voltage rating >480 V which is sufficiently high, with proper protection, to prevent breakdown in the presence of a transient fault condition (i.e., passing the transient on to the ringing generator). Incorporated into the L7583Axx and L7583Cxx is a diode bridge/SCR clamping circuit, current-limiting circuitry, and a thermal shutdown mechanism to provide protection to the SLIC device and subsequent circuitry during fault conditions. This is shown in Figure 1 as version A. Positive and negative lightning is reduced by the current-limiting circuitry and steered to ground via diodes and the integrated SCR. Power cross is also reduced by the current-limiting and thermal shutdown circuits. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Description (continued) The L7583Bxx and L7583Dxx versions provide only an integrated diode bridge along with current limiting and thermal shutdown (see Figure 2 for version B). This will cause positive faults to be directed to ground and negative faults to battery. In either polarity, faults are reduced by the current-limit and/or thermal shutdown mechanisms. To protect the L7583 from an overvoltage fault condition, use of a secondary protector is required. The secondary protector must limit the voltage seen at the tip/ ring terminals to prevent the breakdown voltage of the switches from being exceeded. To minimize stress on the solid-state contacts, use of a foldback- or crowbartype secondary protector is recommended. With proper choice of secondary protection, a line card using the L7583 will meet all relevant ITU-T, LSSGR, FCC, or UL* protection requirements. The L7583 operates off of a 5 V supply only. This gives the device extremely low idle and active power dissipation and allows use with virtually any range of battery voltage. This makes the L7583 especially appropriate for remote power applications such as DAML or FOC/ FITL or other Bellcore TA 909 applications where power dissipation is particularly critical. A battery voltage is also used by the L7583, only as a reference for the integrated protection circuit. The L7583 will enter an all OFF state upon loss of battery. During power ringing, to turn on and maintain the ON state, the ring access switch and ring test switch will draw a nominal 2 mA or 4 mA from the ring generator. The L7583A/B/C/D device is packaged in a 24-pin, plastic DIP (L7583AF/BF/CF/DF) and in a 28-pin, plastic SOG (L7583AAJ/BAJ/CAJ/DAJ). * UL is a registered trademark of Underwriters Laboratories, Inc. Pin Information FGND 1 24 VBAT SCR AND TRIP CKT NC 2 NC 3 TTESTin 4 21 RTESTin TBAT 5 20 RBAT 22 NC SW1 TLINE TRINGING 6 SW3 SW5 NC SW2 SW4 8 18 RRINGING SW9 TSD 11 1 28 VBAT NC 2 27 NC NC 3 26 NC NC 4 SW10 17 RTESTout TTESTin 5 TBAT 6 TLINE 7 TRINGING 8 NC 9 TTESTout 10 15 INTESTin NC 11 14 INRING VDD 12 TSD 13 DGND 12 SW2 24 RTESTin 23 RBAT SW3 SW4 SW5 SW6 22 RLINE 21 NC SW7 16 LATCH CONTROL LOGIC 25 NC SW1 SW8 9 VDD 10 19 RLINE SW6 7 SW7 TTESTout 23 NC FGND 20 RRINGING SW8 SW9 SW10 19 RTESTout 18 LATCH CONTROL LOGIC 17 INTESTin 16 INRING 13 INTESTout DGND 14 15 INTESTout 12-2364.a (F) Note: Shown with A/C version protection. The 24-pin DIP is available with either A/C or B/D version protection. 12-2365.d (F) Note: Shown with B/D version protection. The 28-pin SOG is available with either A/C or B/D version protection. Figure 1. 24-Pin, Plastic DIP (600 mil) Figure 2. 28-Pin, Plastic SOG 2 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Pin Information (continued) Table 1. Pin Descriptions DIP SOG Symbol Description 1 1 FGND Fault ground. 2 3 4 5 2 3, 4 5 6 6 7 7 8 8 9 NC NC TTESTin TBAT TLINE TRINGING 10 TTESTout 9, 11 NC 10 11 12 13 VDD TSD 12 14 DGND DIP 24 SOG 28 No connection. No connection. Test (in) access on TIP. Connect to TIP on SLIC side. 23 22 21 20 27, 26 25, 21 24 23 Connect to TIP on line side. Connect to return ground for ringing generator. Test (out) access on TIP. No connection. 19 18 22 20 17 16 19 18 5 V supply. 15 14 Temperature shutdown pin. Can be used as a logic level input or an output. See Tables 16 and 17, Truth Tables, and the Switching Behavior section of this data sheet for input pin description. As an output flag, will read 5 V when the device is in its operational mode and 0 V in the thermal shutdown mode. To disable the thermal shutdown mechanism, tie this pin to 5 V (not recommended). Digital ground. 13 17 16 15 Symbol Description VBAT Battery voltage. Used as a reference for protection circuit. NC No connection. NC No connection. RTESTin Test (in) access on RING. RBAT Connect to RING on SLIC side. R LINE Connect to RING on line side. RRINGING Connect to ringing generator. RTESTout Test (out) access on RING. LATCH Data input control, active-high, transparent low. INTESTin Logic level switch input control. INRING Logic level switch input control. INTESTout Logic level switch input control. Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Table 2. Absolute Maximum Ratings Parameter Operating Temperature Range Storage Temperature Range Relative Humidity Range Pin Soldering Temperature (t = 10 s max) 5 V Power Supply Battery Supply Logic Input Voltage Input-to-output Isolation Pole-to-pole Isolation Lucent Technologies Inc. Min Max Unit –40 –40 5 — — — — — — 110 150 95 260 7 –85 7 330 330 °C °C % °C V V V V V 3 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Handling Precautions Although protection circuitry has been designed into this device, proper precautions should be taken to avoid exposure to electrostatic discharge (ESD) during handling and mounting. Lucent Technologies Microelectronics Group employs a human-body model (HBM) and a charged-device model (CDM) for ESD-susceptibility testing and protection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used to define the model. No industry-wide standard has been adopted for CDM. However, a standard HBM (resistance = 1500 Ω, capacitance = 100 pF) is widely used and therefore can be used for comparison purposes. The HBM ESD threshold presented here was obtained by using these circuit parameters. Table 3. HBM ESD Threshold Voltage Device L7583 Rating 1000 V Electrical Characteristics TA = –40 °C to +85 °C, unless otherwise specified. Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Table 4. Power Supply Specifications Supply VDD Min 4.5 Typ 5 Max 5.5 Unit V Supply VBAT* Min –19 Typ — Max –72 Unit V * VBAT is used only as a reference for internal protection circuitry. If VBAT rises above –10 V, the device will enter an all OFF state and remain in this state until the battery voltage drops below –15 V. Table 5. Test In Switches, 1 and 2 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C ON-resistance: +25 °C +85 °C –40 °C Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity* Test Condition Measure Min Typ Max Unit Vswitch (differential) = –320 V to Gnd Vswitch (differential) = –60 V to +260 V Vswitch (differential) = –330 V to Gnd Vswitch (differential) = –60 V to +270 V Vswitch (differential) = –310 V to Gnd Vswitch (differential) = –60 V to +250 V Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA Iswitch (on) = ±5 mA, ±10 mA Iswitch (on) = ±5 mA, ±10 mA Iswitch (on) = ±5 mA, ±10 mA ∆ VON ∆ VON ∆ VON — — — 45 — 33 — 70 — Ω Ω Ω Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA — — 200 — V/µs * Applied voltage is 100 Vp-p square wave at 100 Hz. 4 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Electrical Characteristics (continued) Table 6. Break Switches, 3 and 4 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C ON-resistance: +25 °C +85 °C –40 °C ON-resistance Match ON-state Voltage* dc Current Limit: +85 °C –40 °C Dynamic Current Limit (t = <0.5 µs) Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity† Test Condition Measure Vswitch (differential) = –320 V to Gnd Vswitch (differential) = –60 V to +260 V Vswitch (differential) = –330 V to Gnd Vswitch (differential) = –60 V to +270 V Vswitch (differential) = –310 V to Gnd Vswitch (differential) = –60 V to +250 V Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA TLINE = ±10 mA, ±40 mA, TBAT = –2 V TLINE = ±10 mA, ±40 mA, TBAT = –2 V TLINE = ±10 mA, ±40 mA, TBAT = –2 V Per ON-resistance test condition of SW3, SW4 Iswitch = ILIMIT @ 50 Hz/60 Hz RON ∆ VON ∆ VON ∆ VON Magnitude SW3 – RON SW4 VON Min Typ Max Unit — — — — 19.5 — — 28 14.5 — 0.2 1.0 Ω Ω Ω Ω — — 220 V Vswitch (on) = ±10 V Vswitch (on) = ±10 V Break switches in ON state; ringing access switches OFF; apply ±1000 V at 10/1000 µs pulse; appropriate secondary protection in place Iswitch Iswitch Iswitch 80 — — — — 2.5 — 250 — mA mA A Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA — — 200 — V/µs * This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded. † Applied voltage is 100 Vp-p square wave at 100 Hz. Lucent Technologies Inc. 5 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Electrical Characteristics (continued) Table 7. Ring Test Return Switch, 5 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C ON-resistance Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity* Test Condition Measure Min Typ Max Unit Vswitch (differential) = –320 V to Gnd Vswitch (differential) = –60 V to +260 V Vswitch (differential) = –330 V to Gnd Vswitch (differential) = –60 V to +270 V Vswitch (differential) = –310 V to Gnd Vswitch (differential) = –60 V to +250 V Iswitch (on) = ±0 mA, ±10 mA Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA ∆ VON — 50 100 Ω Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA — — 200 — V/µs * Applied voltage is 100 Vp-p square wave at 100 Hz. Table 8. Ringing Test Switch, 6 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C ON-resistance ON Voltage Steady-state Current* Release Current Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity† Test Condition Measure Min Typ Max Unit Vswitch (differential) = –60 V to +190 V Vswitch (differential) = +60 V to –190 V Vswitch (differential) = –60 V to +200 V Vswitch (differential) = +60 V to –200 V Vswitch (differential) = –60 V to +180 V Vswitch (differential) = +60 V to –180 V Iswitch (on) = ±70 mA, ±80 mA Iswitch (on) = ±1 mA — — Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA ∆ VON — — — — — — — — — — 500 20 1.5 100 — Ω V mA µA Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA — — 200 — V/µs * Choice of secondary protector and series current-limit resistor should ensure these ratings are not exceeded. † Applied voltage is 100 Vp-p square wave at 100 Hz. 6 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Electrical Characteristics (continued) Table 9. Ring Return Switch, 7 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C dc Current Limit Dynamic Current Limit (t = <0.5 µs) ON-resistance ON-state Voltage* Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity† Test Condition Vswitch (differential) = –320 V to Gnd Vswitch (differential) = –60 V to +260 V Vswitch (differential) = –330 V to Gnd Vswitch (differential) = –60 V to +270 V Vswitch (differential) = –310 V to Gnd Vswitch (differential) = –60 V to +250 V Vswitch (on) = ±10 V Break and loop switches in OFF state; ring return switch ON; apply ±1000 V at 10/1000 µs pulse; appropriate secondary protection in place Iswitch (on) = ±0 mA, ±10 mA Iswitch = ILIMIT @ 50 Hz/60 Hz Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Measure Min Typ Max Unit Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA Iswitch Iswitch — — 200 2.5 — — mA A ∆ VON VON — — — — 100 130 Ω V Iswitch Iswitch Iswitch — — — — — — — — 200 1 1 1 — µA µA µA V/µs * This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded. † Applied voltage is 100 Vp-p square wave at 100 Hz. Table 10. Ringing Access Switch, 8 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C ON Voltage Ring Generator Current During Ring Steady-state Current† Surge Current† Release Current ON-resistance Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity‡ Test Condition Measure Min Typ Max Unit Vswitch (differential) = –255 V to +210 V Vswitch (differential) = +255 V to –210 V Vswitch (differential) = –270 V to +210 V Vswitch (differential) = +270 V to –210 V Vswitch (differential) = –245 V to +210 V Vswitch (differential) = +245 V to –210 V Iswitch (on) = ±1 mA VCC = 5 V INRING = 1 INTESTin = 0 INTESTout = 0 — — — Iswitch (on) = ±70 mA, ±80 mA Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA — — — — * 3 — V mA — — — ∆ VON — — — — — — 500 — 150 2 — 12 mA A µA Ω Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Iswitch Iswitch Iswitch — — — — — — — — 200 1 1 1 — µA µA µA V/µs IRINGSOURCE * At the time of publication of this data sheet, the current device design will be a nominal 4 mA. Devices are being redesigned to reduce this current to less than 2 mA nominally. Consult your Lucent Technologies Microelectronics Group account executive for additional details. † Choice of secondary protector and series current-limit resistor should ensure these ratings are not exceeded. ‡ Applied voltage is 100 Vp-p square wave at 100 Hz. Lucent Technologies Inc. 7 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Electrical Characteristics (continued) Table 11. Loop Access Switches, 9 and 10 Parameter OFF-state Leakage Current: +25 °C +85 °C –40 °C ON-resistance: +25 °C +85 °C –40 °C ON-state Voltage* dc Current Limit: +85 °C –40 °C Dynamic Current Limit (t = <0.5 µs) Isolation: +25 °C +85 °C –40 °C dV/dt Sensitivity† Test Condition Measure Min Typ Max Unit Vswitch (differential) = –320 V to Gnd Vswitch (differential) = –60 V to +260 V Vswitch (differential) = –330 V to Gnd Vswitch (differential) = –60 V to +270 V Vswitch (differential) = –310 V to Gnd Vswitch (differential) = –60 V to +250 V Iswitch — — 1 µA Iswitch — — 1 µA Iswitch — — 1 µA Iswitch (on) = ±5 mA, ±10 mA Iswitch (on) = ±5 mA, ±10 mA Iswitch (on) = ±5 mA, ±10 mA Iswitch = ILIMIT @ 50 Hz/60 Hz ∆ Von ∆ Von ∆ Von VON — — — — 45 — 33 — — 70 — 130 Ω Ω Ω V Vswitch (on) = ±10 V Vswitch (on) = ±10 V Break switches in ON state; ringing access switches OFF; apply ±1000 V at 10/1000 µs pulse; appropriate secondary protection in place Iswitch Iswitch Iswitch 80 — — — — 2.5 — 250 — mA mA A Vswitch (both poles) = ±320 V, Logic inputs = Gnd Vswitch (both poles) = ±330 V, Logic inputs = Gnd Vswitch (both poles) = ±310 V, Logic inputs = Gnd — Iswitch Iswitch Iswitch — — — — — — — — 200 1 1 1 — µA µA µA V/µs * This parameter is not tested in production. Choice of secondary protector should ensure this rating is not exceeded. † Applied voltage is 100 Vp-p square wave at 100 Hz. 8 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Electrical Characteristics (continued) Table 12. Additional Electrical Characteristics Parameter Digital Input Characteristics: Input Low Voltage Input High Voltage Input Leakage Current (high) Input Leakage Current (low) Power Requirements: Power Dissipation VDD Current VBAT Current Digital Input Characteristics: Input Low Voltage Input High Voltage Input Leakage Current (high) Input Leakage Current (low) Temperature Shutdown Requirements*: Shutdown Activation Temperature Shutdown Circuit Hysteresis Test Condition Measure Min Typ — — VDD = 5.5 V, VBAT = –75 V, Vlogicin = 5 V VDD = 5.5 V, VBAT = –75 V, Vlogicin = 0 V — — llogicin — 3.5 — — — — 1.5 — 1 V V µA llogicin — — 1 µA IDD, IBAT IDD — — 3 6 5 10 mW mW IDD IDD — — 560 900 0.750 1.9 µA mA IBAT IBAT — — 4 4 10 10 µA µA — — VDD = 5.5 V, VBAT = –58 V, Vlogicin = 5 V VDD = 5.5 V, VBAT = –58 V, Vlogicin = 0 V — — llogicin — 3.5 — — — — 1.5 — 1 V V µA llogicin — — 1 µA — — — — 110 10 125 — 150 25 °C °C VDD = 5 V, VBAT = –48 V, idle/talk state or all OFF state, ringing state or access state VDD = 5 V, idle/talk state or all OFF state, ringing state or access state VBAT = –48 V, idle/talk state or all OFF state, ringing state or access state Max Unit * Temperature shutdown flag (TSD) will be high during normal operation and low during temperature shutdown state. Zero Cross Current Turn Off The ring access switch (SW8) is designed to turn off on the next zero current crossing after application of the appropriate logic input control. This switch requires a current zero cross to turn off. Switch 8, once on, will remain in the ON state (regardless of logic input) until a current zero cross. Therefore, to ensure proper operation of switch 8, this switch should be connected, via proper impedance, to the ringing generator or some other ac source. Do not attempt to switch pure dc with switch 8. The ringing test access switch, SW6, also has similar characteristics to switch 8 and should also only be used to switch signals with zero current crossings. For a detailed explanation of the operation of switches 6 and 8, please refer to the An Introduction to L758X Series of Line Card Access Switches Application Note. Lucent Technologies Inc. 9 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Switching Behavior switch is waiting for the next zero current cross, so it can close. During this interval, current that is limited to the dc break switch current-limit value will be source from the ring node of the SLIC. When switching from the power ringing state to the idle/talk state, via simple logic level input control, the L7583 is able to provide control with respect to the timing when the ringing access contacts are released relative to the state of the line break contacts. This current is presented to the internal protection circuit. If the SCR-type protector is used (A or C codes), if by random probability the ring-to-idle transition occurs during a portion of the ring cycle when the ringing voltage exceeds the protection circuit SCR turn-on voltage, and if current in excess of the SCR’s turn-on current is also available, the SCR may turn on. Once the SCR is triggered on, if the SLIC is capable of supplying current in excess of the holding current, the SCR may be latched on by the SLIC. Make-before-break operation occurs when the line break switch contacts are closed (or made) before the ringing access switch contact is opened (or broken). Break-before-make operation occurs when the ringing access contact is opened before the line break switch contacts are closed. Using the logic level input pins RING, TESTin, and TESTout, either make-before-break or break-beforemake operation of the L7583 is easily achieved. The logic sequences for either mode of operation are given in Table 13 and Table 14. See the Truth Tables (Table 16 and Table 17) for an explanation of logic states. The probability of this event depends on the characteristics of the given SLIC and of the holding current of the L7583 A or C device. The SCR hold current distribution is designed to be safely away from the test limit of 80 mA. The higher the distribution, the lower the probability of the latch. When using an L758X in the make-before-break mode, during the ring-to-idle transition, for a period of up to one-half the ringing frequency, the ring break switch and the pnpn-type ring access switch can both be in the ON state. This is the maximum time after the logic signal at INRING has transitioned that the ring access If this situation is of concern for a given board design, either use the A or C series device in the break-beforemake mode (eliminates the original 25 ms current pulse) or use a B or D series device (eliminates the SCR). Table 13. Make-Before-Break Operation RING TESTin TESTout TSD State Timing Power Ringing Makebeforebreak — 5V 0V 0V Float 0V 0V 0V Float 0V 0V 0V 10 Float SW8 waiting for next zero current crossing to turn off maximum time—one-half of ringing. In this transition state, current that is limited to the dc break switch current-limit value will be sourced from the ring node of the SLIC. Idle/Talk Zero cross current has occurred. Break Ring Ring All Other Switches Return Access Access 3&4 Switch 7 Switch 8 Switches Open Closed Closed Open Closed Open Closed Open Closed Open Open Open Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Switching Behavior (continued) Table 14. Break-Before-Make Operation INPUT TESTin TESTout TSD State Timing Break Switches 3&4 — Open Ring Return Switch 7 Closed Hold this state for ≤25 ms. SW8 waiting for zero current to turn off. Zero current has occurred and SW8 has opened. Release break switches. Open Open Closed Open Open Open Open Open Closed Open Open Open 5V 0V 0V Float 5V 0V 5V Float Power Ringing All Off 5V 0V 5V Float All Off 0V 0V 0V Float Idle/Talk Ring Access All Other Switch Switches 8 Closed Open Notes: Break-before-make operation can be achieved using TSD as an input. In lines two and three of Table 14, instead of using the logic input pins to force the all OFF state, force TSD to ground. This will override the logic inputs and also force the all OFF state. Hold this state for 25 ms. During this 25 ms all OFF state, toggle the inputs from 10 (ringing state) to 00 (idle/talk state). After 25 ms, release TSD to return switch control to the input pins which will set the idle talk state. When using the L7583A/B/C/D in this mode, forcing TSD to ground will override the INPUT pins and force an all OFF state. Setting TSD to 5 V will allow switch control via the logic INPUT pins. However, setting TSD to 5 V will also disable the thermal shutdown mechanism. This is not recommended. Therefore, to allow switch control via the logic INPUT pins, allow TSD to float. Thus, when using TSD as an input, the two recommended states are 0 (overrides logic input pins and forces all OFF state) and float (allows switch control via logic input pins and thermal shutdown mechanism is active). This may require use of an open-collector buffer. Also note that TSD operation in L7583 is different than TSD operation of the L7581, where application of 5 V does not disable the thermal shutdown mechanism. Power Supplies Both the 5 V and battery supply are brought onto the L7583. The L7583 requires only the 5 V supply for switch operation; that is, state control is powered exclusively off of the 5 V supply. Because of this, the L7583 offers extremely low power dissipation, both in the idle and active states. The battery voltage is not used for switch state control. The battery is used as a reference voltage by the integrated secondary protection circuit. When the voltage at TBAT or RBAT drops 2 V to 4 V below the battery, the integrated SCR will trigger, thus preventing faultinduced overvoltage situations at the TBAT/RBAT nodes. Loss of Battery Voltage As an additional protection feature, the L7583 monitors the battery voltage. Upon loss of battery voltage, the L7583 will automatically enter an all OFF state and remain in that state until the battery voltage is restored. Lucent Technologies Inc. The L7583 is designed such that the device will enter the all OFF state if the battery rises above –10 V and will remain off until the battery drops below –15 V. Monitoring the battery for the automatic shutdown feature will draw a small current from the battery, typically 4 µA. This will add slightly to the overall power dissipation of the device. Impulse Noise Using the L7583 will minimize and possibly eliminate the contribution to the overall system impulse noise that is associated with ringing access switches. Because of this characteristic of the L7583, it may not be necessary to incorporate a zero cross switching scheme. This ultimately depends upon the characteristics of the individual system and is best evaluated at the board level. 11 L7583A/B/C/D Line Card Access Switch Protection Integrated SLIC Protection Diode Bridge/SCR In the L7583Axx and the L7583Cxx versions, protection to the SLIC device or other subsequent circuitry is provided by a combination of current-limited break switches, a diode bridge/SCR clamping circuit, and a thermal shutdown mechanism. In the L7583Bxx and the L7583Dxx versions, protection to the SLIC device or other subsequent circuitry is provided by a combination of current-limited break switches, a diode bridge, and a thermal shutdown mechanism. In both protection versions, during a positive lightning event, fault current is directed to ground via steering diodes in the diode bridge. Voltage is clamped to a diode drop above ground. In the A version, negative lightning causes the SCR to conduct when the voltage goes 2 V to 4 V more negative than the battery. Fault currents are then directed to ground via the SCR and steering diodes in the diode bridge. Note that for the SCR to foldback or crowbar, the ON voltage (see Table 14) of the SCR must be less negative than the battery reference voltage. If the battery voltage is less negative than the SCR ON voltage, the SCR will conduct fault currents to ground; however, it will not crowbar. In the B/D version, negative lightning is directed to battery via steering diodes in the diode bridge. For power cross and power induction faults, in both protection versions, the positive cycle of the fault is clamped a diode drop above ground and fault currents steered to ground. In the A/C version, the negative cycle will cause the SCR to trigger when the voltage exceeds the battery reference voltage by 2 V to 4 V. When the SCR triggers, fault current is steered to ground. In the B/D version, the negative cycle of the power cross is steered to battery. Current Limiting During a lightning event, the current that is passed through the break switches and presented to the integrated protection circuit and subsequent circuitry is limited by the dynamic current-limit response of the break switches (assuming idle/talk state). When the voltage seen at the TLINE/RLINE nodes is properly clamped by an external secondary protector, upon application of a 1000 V, 10 x 1000 pulse (LSSGR lightning), the current seen at the TBAT/RBAT nodes will typically be a pulse of magnitude 2.5 A and duration less than 0.5 µs. 12 Data Sheet February 2001 During a power cross event, the current that is passed through the break switches and presented to the integrated protection circuit and subsequent circuitry is limited by the dc current-limit response of the break switches (assuming idle/talk state). The dc current limit is specified over temperature between 100 mA and 250 mA. Note that the current-limit circuitry has a negative temperature coefficient. Thus, if the device is subjected to an extended power cross, the value of current seen at TBAT/RBAT will decrease as the device heats due to the fault current. If sufficient heating occurs, the temperature shutdown mechanism will activate and the device will enter an all off mode. Temperature Shutdown Mechanism When the device temperature reaches a minimum of 110 °C, the thermal shutdown mechanism will activate and force the device into an all OFF state, regardless of the logic input pins. Pin TSD, when used as an output, will read 0 V when the device is in the thermal shutdown mode and +VDD during normal operation. During a lightning event, due to the relatively short duration, the thermal shutdown will not typically activate. During an extended power cross, the device temperature will rise and cause the device to enter the thermal shutdown mode. This forces an all off mode, and the current seen at TBAT/RBAT drops to zero. Once in the thermal shutdown mode, the device will cool and exit the thermal shutdown mode, thus reentering the state it was in prior to thermal shutdown. Current, limited to the dc current-limit value, will again begin to flow and device heating will begin again. This cycle of entering and exiting thermal shutdown will last as long as the power cross fault is present. The frequency of entering and exiting thermal shutdown will depend on the magnitude of the power cross. If the magnitude of the power cross is great enough, the external secondary protector may trigger shunting all current to ground. In the L7583, the thermal shutdown mechanism can be disabled by forcing the TSD pin to +VDD. This functionality is different from the L7581, whose thermal shutdown mechanism cannot be disabled. Electrical specifications relating to the integrated overvoltage clamping circuit are outlined in Table 15. Lucent Technologies Inc. Data Sheet February 2001 Protection (continued) Integrated SLIC Protection (continued) External Secondary Protector With the above integrated protection features, only one overvoltage secondary protection device on the loop side of the L7583 is required. The purpose of this device is to limit fault voltages seen by the L7583 so as not to exceed the breakdown voltage or input-output isolation rating of the device. To minimize stress on the L7583, use of a foldback- or crowbar-type device is recommended. A detailed explanation and design equations on the choice of the external secondary protection device are given in the An Introduction to L758X Series of Line Card Access Switches Application Note. Basic design equations governing the choice of external secondary protector are given below. ■ ■ ■ L7583A/B/C/D Line Card Access Switch where: VBATmax—Maximum magnitude of battery voltage. Vbreakovermax—Maximum magnitude breakover voltage of external secondary protector. Vbreakovermin—Minimum magnitude breakover voltage of external secondary protector. Vbreakdownmin(break)—Minimum magnitude breakdown voltage of L7583 break switch. Vbreakdownmin(ring)—Minimum magnitude breakdown voltage of L7583 ring access switch. Vringingpeakmax—Maximum magnitude peak voltage of ringing signal. Series current-limiting fused resistors or PTCs should be chosen so as not to exceed the current rating of the external secondary protector. Refer to the manufacturer’s data sheet for requirements. |VBATmax| + |Vbreakovermax| < |Vbreakdownmin(break)| |Vringingpeakmax| + |VBATmax| + |Vbreakovermax| < |Vbreakdownmin(ring)| |Vringingpeakmax| + |VBATmax| < |Vbreakovermin| Table 15. Electrical Specifications, Protection Circuitry Parameters Related to Diodes (in Diode Bridge) Parameter Test Condition Measure Min Voltage Drop @ Continuous CurApply ±dc current limit Forward — rent (50 Hz/60 Hz) of break switches Voltage Voltage Drop @ Surge Apply ±dynamic curForward — Current rent limit of break Voltage switches Parameters Related to Protection SCR Surge Current — — — — — — Gate Trigger Current*† † Tempera— — — Gate Trigger Current ture Coefficient Hold Current — — 70 Gate Trigger Voltage Trigger current — VBAT – 4 — — Reverse Leakage Current VBAT § — 0.5 A, t = 0.5 µs VON ON-State Voltage — — 2.0 A, t = 0.5 µs Typ — Max 3 Unit V 5 — V — 25 –0.5 ‡ A mA %/°C — — — –3 –5 50 — — VBAT – 2 1.0 — — mA V µA V V * Previous versions of this data sheet specified a Trigger Current of 50 mA minimum. Trigger Current is defined as the minimum current drawn from tip and ring to turn on the SCR. The specification in this data sheet is Gate Trigger Current, which is defined as the maximum current that can flow into the battery before the SCR turns on. † Typical at 25 °C. ‡ Twice ± dynamic current limit of break switches. § In some instances, the typical ON-state voltage can range as low as –25 V. Lucent Technologies Inc. 13 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Typical Performance Characteristics CURRENT LIMITING +I ILIMIT 2/3 RON dc CURRENT-LIMIT BREAK SWITCHES VBAT – 2 VBAT – 4 RON –1.5 V VBAT –V VON <1 µA 3V 1.5 V RON +V 2/3 RON ILIMIT CURRENT LIMITING 50 mA –I 12-2311 (F) dc CURRENT LIMIT (OF BREAK SWITCHES) Figure 5. Switches 1—5, 7, 9, 10 IH 12-2309.f (F) Figure 3. Protection Circuit A/C Version +I RON dc CURRENT-LIMIT BREAK SWITCHES –VOS –V VBAT – 3 +VOS +V VBAT <1 µA 3V –I 12-2312 (F) dc CURRENT LIMIT (OF BREAK SWITCHES) Figure 6. Switches 6, 8 12-2309.b (F) Figure 4. Protection Circuit B/D Version 14 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Application VBAT (REFERENCE) RINGING TEST RETURN SW5 SW9 TEST OUT R1 SW7 RINGING RETURN SW1 TEST IN TIP TIP SW3 BREAK SCR AND TRIP CKT CROWBAR PROTECTION BATTERY FEED BREAK SW4 RING R2 RING SW10 TEST OUT SW8 RINGING ACCESS SW2 TEST IN SW6 RINGING TEST RING GENERATOR BATTERY 12-2366.d (F) Figure 7. Typical LCAS Application, Idle, or Talk State Shown (A/C-Type Internal Protection Shown) Lucent Technologies Inc. 15 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Application (continued) Table 16. Truth Table for L7583A/B 1. 2. 3. 4. 5. 6. 7. 8. 9. INRING INTESTin INTESTout TSD TESTin Switches Break Switches Ring Test Switches 0V 0V 0V 5 V/Float1 Off On Off Off Off3 V/Float1 Off Off Off Off On4 Ring TESTout Switches Switches 0V 0V 5V 5 0V 5V 0V 5 V/Float1 On Off Off Off Off5 5V 0V 0V 5 V/Float1 Off Off Off On Off6 5V 5V 0V 5 V/Float1 Off Off On Off Off7 V/Float1 On Off Off Off On8 0V 5V 5V 5 5V 0V 5V 5 V/Float1 Off Off Off Off Off9 5V 5V 5V 5 V/Float1 Off Off Off Off Off9 Don’t Care Don’t Care Don’t Care 0 V2 Off Off Off Off Off9 If TSD = 5 V, the thermal shutdown mechanism is disabled. If TSD is floating, the thermal shutdown mechanism is active. Forcing TSD to ground overrides the logic input pins and forces an all OFF state. Idle/Talk state. TESTout state. TESTin state Power ringing state. Ringing generator test state. Simultaneous TESTout and TESTin state. All OFF state. A parallel in/parallel out data latch is integrated into the L7583A/B. Operation of the data latch is controlled by the logic level input pin LATCH. The data input to the latch is the INPUT pin of the L7583A/B, and the output of the data latch is an internal node used for state control. When the LATCH control pin is at logic 0, the data latch is transparent and data control signals flow directly from INPUT, through the data latch to state control. Any changes in INPUT will be reflected in the state of the switches. When the LATCH control pin is at logic 1, the data latch is active—the L7583A/B will no longer react to changes at the INPUT control pin. The state of the switches is now latched; that is, the state of the switches will remain as they were when the LATCH input transitioned from logic 0 to logic 1. The switches will not respond to changes in INPUT as long as LATCH is held high. Note that the TSD input is not tied to the data latch. TSD is not affected by the LATCH input. TSD input will override state control via INPUT and LATCH. 16 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Application (continued) Table 17. Truth Table for L7583C/D INRING INTESTin INTESTout TSD TESTin Switches Break Switches Ring Test Switches 0V 0V 0V 5 V/Float1 Off On Off 0V 0V 5V 5 V/Float1 Off Off Off Off On4 0V 5V 0V 5 V/Float1 On Off Off Off Off5 5V 0V 0V 5 V/Float1 Off Off Off On Off6 5V 5V 0V 5 V/Float1 Off Off On Off Off7 V/Float1 On Off Off Off On8 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Ring TESTout Switches Switches Off Off3 0V 5V 5V 5 5V 0V 5V 5 V/Float1 Off Off Off Off Off9 5V 5V 5V 5 V/Float1 Off Off On Off On10 Don’t Care Don’t Care Don’t Care 0 V2 Off Off Off Off Off9 If TSD = 5 V, the thermal shutdown mechanism is disabled. If TSD is floating, the thermal shutdown mechanism is active. Forcing TSD to ground overrides the logic input pins and forces an all OFF state. Idle/Talk state. TESTout state. TESTin state. Power ringing state. Ringing generator test state. Simultaneous TESTout and TESTin state. All OFF state. Simultaneous TESTout—Ring Test state. A parallel in/parallel out data latch is integrated into the L7583C/D. Operation of the data latch is controlled by the logic level input pin LATCH. The data input to the latch is the INPUT pin of the L7583C/D and the output of the data latch is an internal node used for state control. When the LATCH control pin is at logic 0, the data latch is transparent and data control signals flow directly from INPUT, through the data latch to state control. Any changes in INPUT will be reflected in the state of the switches. When the LATCH control pin is at logic 1, the data latch is active; the L7583C/D will no longer react to changes at the INPUT control pin. The state of the switches is now latched; that is, the state of the switches will remain as they were when the LATCH input transitioned from logic 0 to logic 1. The switches will not respond to changes in INPUT as long as LATCH is held high. Note that the TSD input is not tied to the data latch. TSD is not affected by the LATCH input. TSD input will override state control via INPUT and LATCH. Lucent Technologies Inc. 17 Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Outline Diagrams 24-Pin, Plastic DIP (600 mil) Note: The dimensions in this outline diagram are intended for informational purposes only. For detailed schematics to assist your design efforts, please contact your Lucent Technologies Sales Representative. L N B 1 W PIN #1 IDENTIFIER ZONE H SEATING PLANE 0.38 MIN 2.54 TYP 0.58 MAX Number of Pins (N) Maximum Length (L) Maximum Width Without Leads (B) Maximum Width Including Leads (W) Maximum Height Above Board (H) 24 32.26 13.97 15.49 5.49 5-4410 (F) 18 Lucent Technologies Inc. Data Sheet February 2001 L7583A/B/C/D Line Card Access Switch Outline Diagrams (continued) 28-Pin, Plastic SOG Note: The dimensions in this outline diagram are intended for informational purposes only. For detailed schematics to assist your design efforts, please contact your Lucent Technologies Sales Representative. L N B 1 PIN #1 IDENTIFIER ZONE W H SEATING PLANE 0.10 0.61 0.51 MAX 0.28 MAX Number of Pins (N) Maximum Length (L) Maximum Width Without Leads (B) Maximum Width Including Leads (W) Maximum Height Above Board (H) 28 18.11 7.62 10.64 2.67 1.27 TYP 5-4414 (F) Lucent Technologies Inc. 19 L7583A/B/C/D Line Card Access Switch Data Sheet February 2001 Ordering Information Device Part No. ATTL7583AAJ -D ATTL7583AAJ-DT* ATTL7583AF ATTL7583BAJ-D ATTL7583BAJ-DT* ATTL7583BF ATTL7583CAJ-D ATTL7583CAJ-DT* ATTL7583CF ATTL7583DAJ-D ATTL7583DAJ-DT* ATTL7583DF Description Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Line Card Access Switch Package 28-Pin SOG (Dry-bagged) 28-Pin SOG (Tape & Reel, Dry-bagged) 24-Pin DIP 28-Pin SOG (Dry-bagged) 28-Pin SOG (Tape & Reel, Dry-bagged) 24-Pin DIP 28-Pin SOG (Dry-bagged) 28-Pin SOG (Tape & Reel, Dry-bagged) 24-Pin DIP 28-Pin SOG (Dry-bagged) 28-Pin SOG (Tape & Reel, Dry-bagged) 24-Pin DIP Comcode 107338626 107338659 107338592 107394355 107411563 107394306 107602229 107602245 107602278 107602328 107602344 107602377 *Devices on tape and reel must be ordered in 1000-piece increments. For additional information, contact your Microelectronics Group Account Manager or the following: INTERNET: http://www.lucent.com/micro E-MAIL: [email protected] N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18109-3286 1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106) ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256 Tel. (65) 778 8833, FAX (65) 777 7495 CHINA: Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road, Shanghai 200233 P. R. China Tel. (86) 21 6440 0468, ext. 325, FAX (86) 21 6440 0652 JAPAN: Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700 EUROPE: Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 7000 582 368, FAX (44) 1189 328 148 Technical Inquiries: GERMANY: (49) 89 95086 0 (Munich), UNITED KINGDOM: (44) 1344 865 900 (Ascot), FRANCE: (33) 1 40 83 68 00 (Paris), SWEDEN: (46) 8 594 607 00 (Stockholm), FINLAND: (358) 9 3507670 (Helsinki), ITALY: (39) 02 6608131 (Milan), SPAIN: (34) 1 807 1441 (Madrid) Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. N o liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Copyright © 2001 Lucent Technologies Inc. All Rights Reserved February 2001 DS01-111ALC (Replaces DS00-052ALC)