Altera EPM2210ZF100I Max ii device family Datasheet

Section I. MAX II Device Family Data
Sheet
This section provides designers with the data sheet specifications for MAX® II devices.
The chapters contain feature definitions of the internal architecture, Joint Test Action
Group (JTAG) and in-system programmability (ISP) information, DC operating
conditions, AC timing parameters, and ordering information for MAX II devices.
This section includes the following chapters:
■
Chapter 1, Introduction
■
Chapter 2, MAX II Architecture
■
Chapter 3, JTAG and In-System Programmability
■
Chapter 4, Hot Socketing and Power-On Reset in MAX II Devices
■
Chapter 5, DC and Switching Characteristics
■
Chapter 6, Reference and Ordering Information
Revision History
Refer to each chapter for its own specific revision history. For information about when
each chapter was updated, refer to the Chapter Revision Dates section, which appears
in the complete handbook.
© October 2008
Altera Corporation
MAX II Device Handbook
I–2
MAX II Device Handbook
Section I: MAX II Device Family Data Sheet
Revision History
© October 2008 Altera Corporation
1. Introduction
MII51001-1.8
Introduction
The MAX® II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layermetal-flash process, with densities from 240 to 2,210 logic elements (LEs) (128 to 2,210
equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices offer high
I/O counts, fast performance, and reliable fitting versus other CPLD architectures.
Featuring MultiVolt core, a user flash memory (UFM) block, and enhanced in-system
programmability (ISP), MAX II devices are designed to reduce cost and power while
providing programmable solutions for applications such as bus bridging, I/O
expansion, power-on reset (POR) and sequencing control, and device configuration
control.
Features
The MAX II CPLD has the following features:
© October 2008
■
Low-cost, low-power CPLD
■
Instant-on, non-volatile architecture
■
Standby current as low as 29 µA
■
Provides fast propagation delay and clock-to-output times
■
Provides four global clocks with two clocks available per logic array block (LAB)
■
UFM block up to 8 Kbits for non-volatile storage
■
MultiVolt core enabling external supply voltages to the device of either 3.3 V/2.5 V
or 1.8 V
■
MultiVolt I/O interface supporting 3.3-V, 2.5-V, 1.8-V, and 1.5-V logic levels
■
Bus-friendly architecture including programmable slew rate, drive strength, bushold, and programmable pull-up resistors
■
Schmitt triggers enabling noise tolerant inputs (programmable per pin)
■
I/Os are fully compliant with the Peripheral Component Interconnect Special
Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V
operation at 66 MHz
■
Supports hot-socketing
■
Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry
compliant with IEEE Std. 1149.1-1990
■
ISP circuitry compliant with IEEE Std. 1532
Altera Corporation
MAX II Device Handbook
1–2
Chapter 1: Introduction
Features
Table 1–1 shows the MAX II family features.
Table 1–1. MAX II Family Features
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
LEs
240
570
1,270
2,210
240
570
Typical Equivalent Macrocells
192
440
980
1,700
192
440
128 to 240
240 to 570
570 to 1,270
1,270 to 2,210
128 to 240
240 to 570
8,192
8,192
8,192
8,192
8,192
8,192
Maximum User I/O pins
80
160
212
272
80
160
tPD1 (ns) (1)
4.7
5.4
6.2
7.0
7.5
9.0
fCNT (MHz) (2)
304
304
304
304
152
152
tSU (ns)
1.7
1.2
1.2
1.2
2.3
2.2
tCO (ns)
4.3
4.5
4.6
4.6
6.5
6.7
Feature
Equivalent Macrocell Range
UFM Size (bits)
Notes to Table 1–1:
(1) tPD1 represents a pin-to-pin delay for the worst case I/O placement with a full diagonal path across the device and combinational logic
implemented in a single LUT and LAB that is adjacent to the output pin.
(2) The maximum frequency is limited by the I/O standard on the clock input pin. The 16-bit counter critical delay will run faster than this number.
f
For more information about equivalent macrocells, refer to the MAX II Logic Element to
Macrocell Conversion Methodology white paper.
MAX II and MAX IIG devices are available in three speed grades: –3, –4, and –5, with
–3 being the fastest. Similarly, MAX IIZ devices are available in two speed grades: –6,
–7, with –6 being faster. These speed grades represent the overall relative
performance, not any specific timing parameter. For propagation delay timing
numbers within each speed grade and density, refer to the DC and Switching
Characteristics chapter in the MAX II Device Handbook.
Table 1–2 shows MAX II device speed-grade offerings.
Table 1–2. MAX II Speed Grades
Speed Grade
Device
EPM240
–3
–4
–5
–6
–7
v
v
v
—
—
v
v
v
—
—
v
v
v
—
—
v
v
v
—
—
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
MAX II Device Handbook
EPM240Z
—
—
—
v
v
EPM570Z
—
—
—
v
v
© October 2008 Altera Corporation
Chapter 1: Introduction
Features
1–3
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA, and
thin quad flat pack (TQFP) packages (refer to Table 1–3 and 1–3). MAX II devices
support vertical migration within the same package (for example, you can migrate
between the EPM570, EPM1270, and EPM2210 devices in the 256-pin FineLine BGA
package). Vertical migration means that you can migrate to devices whose dedicated
pins and JTAG pins are the same and power pins are subsets or supersets for a given
package across device densities. The largest density in any package has the highest
number of power pins; you must lay out for the largest planned density in a package
to provide the necessary power pins for migration. For I/O pin migration across
densities, cross reference the available I/O pins using the device pin-outs for all
planned densities of a given package type to identify which I/O pins can be migrated.
The Quartus® II software can automatically cross-reference and place all pins for you
when given a device migration list.
Table 1–3. MAX II Packages and User I/O Pins
144-Pin
TQFP
144-Pin
Micro
FineLine
BGA (1)
256-Pin
Micro
FineLine
BGA (1)
256-Pin
FineLine
BGA
324-Pin
FineLine
BGA
80
—
—
—
—
—
76
76
116
—
160
160
—
—
—
—
116
—
212
212
—
—
—
—
—
—
—
—
204
272
EPM240Z
54
80
—
—
—
—
—
—
—
EPM570Z
—
76
—
—
—
116
160
—
—
256-Pin
Micro
FineLine
BGA
256-Pin
FineLine
BGA
324-Pin
FineLine
BGA
Device
68-Pin
Micro
FineLine
BGA (1)
100-Pin
Micro
FineLine
BGA (1)
100-Pin
FineLine
BGA (1)
100-Pin
TQFP
—
80
80
—
76
—
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
Note to Table 1–3:
(1) Packages available in lead-free versions only.
Table 1–4. MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes
68-Pin
Micro
FineLine
BGA
100-Pin
Micro
FineLine
BGA
100-Pin
FineLine
BGA
100-Pin
TQFP
144-Pin
TQFP
144-Pin
Micro
FineLine
BGA
Pitch (mm)
0.5
0.5
1
0.5
0.5
0.5
0.5
1
1
Area (mm2)
25
36
121
256
484
49
121
289
361
5×5
6×6
11 × 11
16 × 16
22 × 22
7×7
11 × 11
17 × 17
19 × 19
Package
Length × width
(mm × mm)
© October 2008
Altera Corporation
MAX II Device Handbook
1–4
Chapter 1: Introduction
Referenced Documents
MAX II devices have an internal linear voltage regulator which supports external
supply voltages of 3.3 V or 2.5 V, regulating the supply down to the internal operating
voltage of 1.8 V. MAX IIG and MAX IIZ devices only accept 1.8 V as the external
supply voltage. MAX IIZ devices are pin-compatible with MAX IIG devices in the
100-pin Micro FineLine BGA and 256-pin Micro FineLine BGA packages. Except for
external supply voltage requirements, MAX II and MAX II G devices have identical
pin-outs and timing specifications. Table 1–5 shows the external supply voltages
supported by the MAX II family.
Table 1–5. MAX II External Supply Voltages
EPM240
EPM570
EPM1270
EPM2210
EPM240G
EPM570G
EPM1270G
EPM2210G
EPM240Z
EPM570Z (1)
3.3 V, 2.5 V
1.8 V
1.5 V, 1.8 V, 2.5 V, 3.3 V
1.5 V, 1.8 V, 2.5 V, 3.3 V
Devices
MultiVolt core external supply voltage (VCCINT) (2)
MultiVolt I/O interface voltage levels (VCCIO)
Notes to Table 1–5:
(1) MAX IIG and MAX IIZ devices only accept 1.8 V on their VCCINT pins. The 1.8-V VCCINT external supply powers the device core directly.
(2) MAX II devices operate internally at 1.8 V.
Referenced Documents
This chapter references the following documents:
■
DC and Switching Characteristics chapter in the MAX II Device Handbook
■
MAX II Logic Element to Macrocell Conversion Methodology white paper
Document Revision History
Table 1–6 shows the revision history for this chapter.
Table 1–6. Document Revision History
Date and Revision
Changes Made
October 2008,
version 1.8
■
Updated “Introduction” section.
■
Updated new Document Format.
December 2007,
version1.7
■
Updated Table 1–1 through Table 1–5.
■
Added “Referenced Documents” section.
December 2006,
version 1.6
■
Added document revision history.
—
August 2006,
version 1.5
■
Minor update to features list.
—
July 2006,
version 1.4
■
Minor updates to tables.
—
MAX II Device Handbook
Summary of Changes
—
Updated document with MAX IIZ information.
© October 2008 Altera Corporation
Chapter 1: Introduction
Document Revision History
1–5
Table 1–6. Document Revision History
Date and Revision
Changes Made
June 2005,
version 1.3
■
Updated timing numbers in Table 1-1.
—
December 2004,
version 1.2
■
Updated timing numbers in Table 1-1.
—
June 2004,
version 1.1
■
Updated timing numbers in Table 1-1.
—
© October 2008
Altera Corporation
Summary of Changes
MAX II Device Handbook
1–6
MAX II Device Handbook
Chapter 1: Introduction
Document Revision History
© October 2008 Altera Corporation
2. MAX II Architecture
MII51002-2.2
Introduction
This chapter describes the architecture of the MAX II device and contains the
following sections:
■
“Functional Description” on page 2–1
■
“Logic Array Blocks” on page 2–4
■
“Logic Elements” on page 2–6
■
“MultiTrack Interconnect” on page 2–12
■
“Global Signals” on page 2–16
■
“User Flash Memory Block” on page 2–18
■
“MultiVolt Core” on page 2–22
■
“I/O Structure” on page 2–23
Functional Description
MAX® II devices contain a two-dimensional row- and column-based architecture to
implement custom logic. Row and column interconnects provide signal interconnects
between the logic array blocks (LABs).
The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic functions. LABs
are grouped into rows and columns across the device. The MultiTrack interconnect
provides fast granular timing delays between LABs. The fast routing between LEs
provides minimum timing delay for added levels of logic versus globally routed
interconnect structures.
The MAX II device I/O pins are fed by I/O elements (IOE) located at the ends of LAB
rows and columns around the periphery of the device. Each IOE contains a
bidirectional I/O buffer with several advanced features. I/O pins support Schmitt
trigger inputs and various single-ended standards, such as 66-MHz, 32-bit PCI, and
LVTTL.
MAX II devices provide a global clock network. The global clock network consists of
four global clock lines that drive throughout the entire device, providing clocks for all
resources within the device. The global clock lines can also be used for control signals
such as clear, preset, or output enable.
© October 2008
Altera Corporation
MAX II Device Handbook
2–2
Chapter 2: MAX II Architecture
Functional Description
Figure 2–1 shows a functional block diagram of the MAX II device.
Figure 2–1. MAX II Device Block Diagram
IOE
IOE
IOE
IOE
IOE
IOE
IOE
Logic
Element
Logic
Element
Logic
Element
IOE
Logic
Element
Logic
Element
Logic
Element
IOE
Logic
Element
Logic
Element
Logic
Element
IOE
Logic
Element
Logic
Element
Logic
Element
Logic Array
BLock (LAB)
MultiTrack
Interconnect
MultiTrack
Interconnect
Each MAX II device contains a flash memory block within its floorplan. On the
EPM240 device, this block is located on the left side of the device. On the EPM570,
EPM1270, and EPM2210 devices, the flash memory block is located on the bottom-left
area of the device. The majority of this flash memory storage is partitioned as the
dedicated configuration flash memory (CFM) block. The CFM block provides the nonvolatile storage for all of the SRAM configuration information. The CFM
automatically downloads and configures the logic and I/O at power-up, providing
instant-on operation.
f
For more information about configuration upon power-up, refer to the Hot Socketing
and Power-On Reset in MAX II Devices chapter in the MAX II Device Handbook.
A portion of the flash memory within the MAX II device is partitioned into a small
block for user data. This user flash memory (UFM) block provides 8,192 bits of
general-purpose user storage. The UFM provides programmable port connections to
the logic array for reading and writing. There are three LAB rows adjacent to this
block, with column numbers varying by device.
Table 2–1 shows the number of LAB rows and columns in each device, as well as the
number of LAB rows and columns adjacent to the flash memory area in the EPM570,
EPM1270, and EPM2210 devices. The long LAB rows are full LAB rows that extend
from one side of row I/O blocks to the other. The short LAB rows are adjacent to the
UFM block; their length is shown as width in LAB columns.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Functional Description
2–3
Table 2–1. MAX II Device Resources
LAB Rows
UFM Blocks
LAB Columns
Long LAB Rows
Short LAB Rows
(Width) (1)
Total LABs
EPM240
1
6
4
—
24
EPM570
1
12
4
3 (3)
57
EPM1270
1
16
7
3 (5)
127
EPM2210
1
20
10
3 (7)
221
Devices
Note to Table 2–1:
(1) The width is the number of LAB columns in length.
Figure 2–2 shows a floorplan of a MAX II device.
Figure 2–2. MAX II Device Floorplan (Note 1)
I/O Blocks
I/O Blocks
Logic Array
Blocks
Logic Array
Blocks
2 GCLK
Inputs
2 GCLK
Inputs
I/O Blocks
UFM Block
CFM Block
Note to Figure 2–2:
(1) The device shown is an EPM570 device. EPM1270 and EPM2210 devices have a similar floorplan with more LABs. For EPM240 devices, the CFM
and UFM blocks are located on the left side of the device.
© October 2008
Altera Corporation
MAX II Device Handbook
2–4
Chapter 2: MAX II Architecture
Logic Array Blocks
Logic Array Blocks
Each LAB consists of 10 LEs, LE carry chains, LAB control signals, a local interconnect,
a look-up table (LUT) chain, and register chain connection lines. There are 26 possible
unique inputs into an LAB, with an additional 10 local feedback input lines fed by LE
outputs in the same LAB. The local interconnect transfers signals between LEs in the
same LAB. LUT chain connections transfer the output of one LE’s LUT to the adjacent
LE for fast sequential LUT connections within the same LAB. Register chain
connections transfer the output of one LE’s register to the adjacent LE’s register
within an LAB. The Quartus® II software places associated logic within an LAB or
adjacent LABs, allowing the use of local, LUT chain, and register chain connections
for performance and area efficiency. Figure 2–3 shows the MAX II LAB.
Figure 2–3. MAX II LAB Structure
Row Interconnect
Column Interconnect
LE0
Fast I/O connection
to IOE (1)
Fast I/O connection
to IOE (1)
LE1
DirectLink
interconnect from
adjacent LAB
or IOE
LE2
DirectLink
interconnect from
adjacent LAB
or IOE
LE3
LE4
LE5
LE6
DirectLink
interconnect to
adjacent LAB
or IOE
DirectLink
interconnect to
adjacent LAB
or IOE
LE7
LE8
LE9
Logic Element
LAB
Local Interconnect
Note to Figure 2–3:
(1) Only from LABs adjacent to IOEs.
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB local
interconnect is driven by column and row interconnects and LE outputs within the
same LAB. Neighboring LABs, from the left and right, can also drive an LAB’s local
interconnect through the DirectLink connection. The DirectLink connection feature
minimizes the use of row and column interconnects, providing higher performance
and flexibility. Each LE can drive 30 other LEs through fast local and DirectLink
interconnects. Figure 2–4 shows the DirectLink connection.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Logic Array Blocks
2–5
Figure 2–4. DirectLink Connection
DirectLink interconnect from
right LAB or IOE output
DirectLink interconnect from
left LAB or IOE output
LE0
LE1
LE2
LE3
LE4
LE5
DirectLink
interconnect
to left
LE6
DirectLink
interconnect
to right
LE7
Local
Interconnect
LE8
LE9
Logic Element
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its LEs. The control
signals include two clocks, two clock enables, two asynchronous clears, a
synchronous clear, an asynchronous preset/load, a synchronous load, and
add/subtract control signals, providing a maximum of 10 control signals at a time.
Although synchronous load and clear signals are generally used when implementing
counters, they can also be used with other functions.
Each LAB can use two clocks and two clock enable signals. Each LAB’s clock and
clock enable signals are linked. For example, any LE in a particular LAB using the
labclk1 signal also uses labclkena1. If the LAB uses both the rising and falling
edges of a clock, it also uses both LAB-wide clock signals. Deasserting the clock
enable signal turns off the LAB-wide clock.
Each LAB can use two asynchronous clear signals and an asynchronous load/preset
signal. By default, the Quartus II software uses a NOT gate push-back technique to
achieve preset. If you disable the NOT gate push-back option or assign a given register
to power-up high using the Quartus II software, the preset is then achieved using the
asynchronous load signal with asynchronous load data input tied high.
With the LAB-wide addnsub control signal, a single LE can implement a one-bit adder
and subtractor. This saves LE resources and improves performance for logic functions
such as correlators and signed multipliers that alternate between addition and
subtraction depending on data.
The LAB column clocks [3..0], driven by the global clock network, and LAB local
interconnect generate the LAB-wide control signals. The MultiTrack interconnect
structure drives the LAB local interconnect for non-global control signal generation.
The MultiTrack interconnect’s inherent low skew allows clock and control signal
distribution in addition to data. Figure 2–5 shows the LAB control signal generation
circuit.
© October 2008
Altera Corporation
MAX II Device Handbook
2–6
Chapter 2: MAX II Architecture
Logic Elements
Figure 2–5. LAB-Wide Control Signals
Dedicated
LAB Column
Clocks
4
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
labclkena2
labclkena1
Local
Interconnect
labclk1
labclk2
labclr2
syncload
asyncload
or labpre
labclr1
addnsub
synclr
Logic Elements
The smallest unit of logic in the MAX II architecture, the LE, is compact and provides
advanced features with efficient logic utilization. Each LE contains a four-input LUT,
which is a function generator that can implement any function of four variables. In
addition, each LE contains a programmable register and carry chain with carry-select
capability. A single LE also supports dynamic single-bit addition or subtraction mode
selectable by an LAB-wide control signal. Each LE drives all types of interconnects:
local, row, column, LUT chain, register chain, and DirectLink interconnects. See
Figure 2–6.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Logic Elements
2–7
Figure 2–6. MAX II LE
Register chain
routing from
previous LE
LAB-wide
Register Bypass
Synchronous
Load
LAB-wide
Packed
Synchronous
Register Select
Clear
LAB Carry-In
addnsub
Carry-In1
Carry-In0
Programmable
Register
LUT chain
routing to next LE
data1
data2
data3
Look-Up
Table
(LUT)
Carry
Chain
Synchronous
Load and
Clear Logic
PRN/ALD
D
Q
ADATA
Row, column,
and DirectLink
routing
data4
ENA
CLRN
labclr1
labclr2
labpre/aload
Chip-Wide
Reset (DEV_CLRn)
Asynchronous
Clear/Preset/
Load Logic
Row, column,
and DirectLink
routing
Local routing
Register
Feedback
Clock and
Clock Enable
Select
Register chain
output
labclk1
labclk2
labclkena1
labclkena2
Carry-Out0
Carry-Out1
LAB Carry-Out
Each LE’s programmable register can be configured for D, T, JK, or SR operation. Each
register has data, true asynchronous load data, clock, clock enable, clear, and
asynchronous load/preset inputs. Global signals, general-purpose I/O pins, or any
LE can drive the register’s clock and clear control signals. Either general-purpose I/O
pins or LEs can drive the clock enable, preset, asynchronous load, and asynchronous
data. The asynchronous load data input comes from the data3 input of the LE. For
combinational functions, the LUT output bypasses the register and drives directly to
the LE outputs.
Each LE has three outputs that drive the local, row, and column routing resources. The
LUT or register output can drive these three outputs independently. Two LE outputs
drive column or row and DirectLink routing connections and one drives local
interconnect resources. This allows the LUT to drive one output while the register
drives another output. This register packing feature improves device utilization
because the device can use the register and the LUT for unrelated functions. Another
special packing mode allows the register output to feed back into the LUT of the same
LE so that the register is packed with its own fan-out LUT. This provides another
mechanism for improved fitting. The LE can also drive out registered and
unregistered versions of the LUT output.
© October 2008
Altera Corporation
MAX II Device Handbook
2–8
Chapter 2: MAX II Architecture
Logic Elements
LUT Chain and Register Chain
In addition to the three general routing outputs, the LEs within an LAB have LUT
chain and register chain outputs. LUT chain connections allow LUTs within the same
LAB to cascade together for wide input functions. Register chain outputs allow
registers within the same LAB to cascade together. The register chain output allows an
LAB to use LUTs for a single combinational function and the registers to be used for
an unrelated shift register implementation. These resources speed up connections
between LABs while saving local interconnect resources. Refer to “MultiTrack
Interconnect” on page 2–12 for more information about LUT chain and register chain
connections.
addnsub Signal
The LE’s dynamic adder/subtractor feature saves logic resources by using one set of
LEs to implement both an adder and a subtractor. This feature is controlled by the
LAB-wide control signal addnsub. The addnsub signal sets the LAB to perform either
A + B or A – B. The LUT computes addition; subtraction is computed by adding the
two’s complement of the intended subtractor. The LAB-wide signal converts to two’s
complement by inverting the B bits within the LAB and setting carry-in to 1, which
adds one to the least significant bit (LSB). The LSB of an adder/subtractor must be
placed in the first LE of the LAB, where the LAB-wide addnsub signal automatically
sets the carry-in to 1. The Quartus II Compiler automatically places and uses the
adder/subtractor feature when using adder/subtractor parameterized functions.
LE Operating Modes
The MAX II LE can operate in one of the following modes:
■
“Normal Mode”
■
“Dynamic Arithmetic Mode”
Each mode uses LE resources differently. In each mode, eight available inputs to the
LE, the four data inputs from the LAB local interconnect, carry-in0 and carryin1 from the previous LE, the LAB carry-in from the previous carry-chain LAB, and
the register chain connection are directed to different destinations to implement the
desired logic function. LAB-wide signals provide clock, asynchronous clear,
asynchronous preset/load, synchronous clear, synchronous load, and clock enable
control for the register. These LAB-wide signals are available in all LE modes. The
addnsub control signal is allowed in arithmetic mode.
The Quartus II software, in conjunction with parameterized functions such as library
of parameterized modules (LPM) functions, automatically chooses the appropriate
mode for common functions such as counters, adders, subtractors, and arithmetic
functions.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Logic Elements
2–9
Normal Mode
The normal mode is suitable for general logic applications and combinational
functions. In normal mode, four data inputs from the LAB local interconnect are
inputs to a four-input LUT (see Figure 2–7). The Quartus II Compiler automatically
selects the carry-in or the data3 signal as one of the inputs to the LUT. Each LE can use
LUT chain connections to drive its combinational output directly to the next LE in the
LAB. Asynchronous load data for the register comes from the data3 input of the LE.
LEs in normal mode support packed registers.
Figure 2–7. LE in Normal Mode
sload
sclear
(LAB Wide) (LAB Wide)
aload
(LAB Wide)
Register chain
connection
addnsub (LAB Wide)
(1)
data1
data2
data3
cin (from cout
of previous LE)
4-Input
LUT
ALD/PRE
ADATA Q
D
Row, column, and
DirectLink routing
ENA
CLRN
Row, column, and
DirectLink routing
clock (LAB Wide)
ena (LAB Wide)
data4
aclr (LAB Wide)
Register Feedback
Local routing
LUT chain
connection
Register
chain output
Note to Figure 2–7:
(1) This signal is only allowed in normal mode if the LE is at the end of an adder/subtractor chain.
Dynamic Arithmetic Mode
The dynamic arithmetic mode is ideal for implementing adders, counters,
accumulators, wide parity functions, and comparators. An LE in dynamic arithmetic
mode uses four 2-input LUTs configurable as a dynamic adder/subtractor. The first
two 2-input LUTs compute two summations based on a possible carry-in of 1 or 0; the
other two LUTs generate carry outputs for the two chains of the carry-select circuitry.
As shown in Figure 2–8, the LAB carry-in signal selects either the carry-in0 or
carry-in1 chain. The selected chain’s logic level in turn determines which parallel sum
is generated as a combinational or registered output. For example, when
implementing an adder, the sum output is the selection of two possible calculated
sums:
data1 + data2 + carry in0
or
data1 + data2 + carry-in1
© October 2008
Altera Corporation
MAX II Device Handbook
2–10
Chapter 2: MAX II Architecture
Logic Elements
The other two LUTs use the data1 and data2 signals to generate two possible carry-out
signals: one for a carry of 1 and the other for a carry of 0. The carry-in0 signal acts
as the carry-select for the carry-out0 output and carry-in1 acts as the carryselect for the carry-out1 output. LEs in arithmetic mode can drive out registered
and unregistered versions of the LUT output.
The dynamic arithmetic mode also offers clock enable, counter enable, synchronous
up/down control, synchronous clear, synchronous load, and dynamic
adder/subtractor options. The LAB local interconnect data inputs generate the
counter enable and synchronous up/down control signals. The synchronous clear
and synchronous load options are LAB-wide signals that affect all registers in the
LAB. The Quartus II software automatically places any registers that are not used by
the counter into other LABs. The addnsub LAB-wide signal controls whether the LE
acts as an adder or subtractor.
Figure 2–8. LE in Dynamic Arithmetic Mode
LAB Carry-In
sload
sclear
(LAB Wide) (LAB Wide)
Register chain
connection
Carry-In0
Carry-In1
addnsub
(LAB Wide)
(1)
data1
data2
data3
LUT
LUT
LUT
aload
(LAB Wide)
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
clock (LAB Wide)
ena (LAB Wide)
Local routing
aclr (LAB Wide)
LUT chain
connection
LUT
Register
chain output
Register Feedback
Carry-Out0 Carry-Out1
Note to Figure 2–8:
(1) The addnsub signal is tied to the carry input for the first LE of a carry chain only.
Carry-Select Chain
The carry-select chain provides a very fast carry-select function between LEs in
dynamic arithmetic mode. The carry-select chain uses the redundant carry calculation
to increase the speed of carry functions. The LE is configured to calculate outputs for a
possible carry-in of 0 and carry-in of 1 in parallel. The carry-in0 and carry-in1
signals from a lower-order bit feed forward into the higher-order bit via the parallel
carry chain and feed into both the LUT and the next portion of the carry chain. Carryselect chains can begin in any LE within an LAB.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Logic Elements
2–11
The speed advantage of the carry-select chain is in the parallel precomputation of
carry chains. Since the LAB carry-in selects the precomputed carry chain, not every LE
is in the critical path. Only the propagation delays between LAB carry-in generation
(LE 5 and LE 10) are now part of the critical path. This feature allows the MAX II
architecture to implement high-speed counters, adders, multipliers, parity functions,
and comparators of arbitrary width.
Figure 2–9 shows the carry-select circuitry in an LAB for a 10-bit full adder. One
portion of the LUT generates the sum of two bits using the input signals and the
appropriate carry-in bit; the sum is routed to the output of the LE. The register can be
bypassed for simple adders or used for accumulator functions. Another portion of the
LUT generates carry-out bits. An LAB-wide carry-in bit selects which chain is used for
the addition of given inputs. The carry-in signal for each chain, carry-in0 or
carry-in1, selects the carry-out to carry forward to the carry-in signal of the nexthigher-order bit. The final carry-out signal is routed to an LE, where it is fed to local,
row, or column interconnects.
Figure 2–9. Carry-Select Chain
LAB Carry-In
0
1
A1
B1
LE0
A2
B2
LE1
LAB Carry-In
Sum1
Carry-In0
Carry-In1
A3
B3
LE2
A4
B4
LE3
A5
B5
LE4
0
Sum2
LUT
data1
data2
Sum3
Sum
LUT
Sum4
LUT
Sum5
LUT
1
A6
B6
LE5
A7
B7
LE6
A8
B8
LE7
A9
B9
LE8
A10
B10
LE9
Carry-Out0
Sum6
Carry-Out1
Sum7
Sum8
Sum9
Sum10
To top of adjacent LAB
LAB Carry-Out
© October 2008
Altera Corporation
MAX II Device Handbook
2–12
Chapter 2: MAX II Architecture
MultiTrack Interconnect
The Quartus II software automatically creates carry chain logic during design
processing, or you can create it manually during design entry. Parameterized
functions such as LPM functions automatically take advantage of carry chains for the
appropriate functions. The Quartus II software creates carry chains longer than 10 LEs
by linking adjacent LABs within the same row together automatically. A carry chain
can extend horizontally up to one full LAB row, but does not extend between LAB
rows.
Clear and Preset Logic Control
LAB-wide signals control the logic for the register’s clear and preset signals. The LE
directly supports an asynchronous clear and preset function. The register preset is
achieved through the asynchronous load of a logic high. MAX II devices support
simultaneous preset/asynchronous load and clear signals. An asynchronous clear
signal takes precedence if both signals are asserted simultaneously. Each LAB
supports up to two clears and one preset signal.
In addition to the clear and preset ports, MAX II devices provide a chip-wide reset pin
(DEV_CLRn) that resets all registers in the device. An option set before compilation in
the Quartus II software controls this pin. This chip-wide reset overrides all other
control signals and uses its own dedicated routing resources (that is, it does not use
any of the four global resources). Driving this signal low before or during power-up
prevents user mode from releasing clears within the design. This allows you to control
when clear is released on a device that has just been powered-up. If not set for its chipwide reset function, the DEV_CLRn pin is a regular I/O pin.
By default, all registers in MAX II devices are set to power-up low. However, this
power-up state can be set to high on individual registers during design entry using
the Quartus II software.
MultiTrack Interconnect
In the MAX II architecture, connections between LEs, the UFM, and device I/O pins
are provided by the MultiTrack interconnect structure. The MultiTrack interconnect
consists of continuous, performance-optimized routing lines used for inter- and intradesign block connectivity. The Quartus II Compiler automatically places critical
design paths on faster interconnects to improve design performance.
The MultiTrack interconnect consists of row and column interconnects that span fixed
distances. A routing structure with fixed length resources for all devices allows
predictable and short delays between logic levels instead of large delays associated
with global or long routing lines. Dedicated row interconnects route signals to and
from LABs within the same row. These row resources include:
■
DirectLink interconnects between LABs
■
R4 interconnects traversing four LABs to the right or left
The DirectLink interconnect allows an LAB to drive into the local interconnect of its
left and right neighbors. The DirectLink interconnect provides fast communication
between adjacent LABs and/or blocks without using row interconnect resources.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
MultiTrack Interconnect
2–13
The R4 interconnects span four LABs and are used for fast row connections in a fourLAB region. Every LAB has its own set of R4 interconnects to drive either left or right.
Figure 2–10 shows R4 interconnect connections from an LAB. R4 interconnects can
drive and be driven by row IOEs. For LAB interfacing, a primary LAB or horizontal
LAB neighbor can drive a given R4 interconnect. For R4 interconnects that drive to the
right, the primary LAB and right neighbor can drive on to the interconnect. For R4
interconnects that drive to the left, the primary LAB and its left neighbor can drive on
to the interconnect. R4 interconnects can drive other R4 interconnects to extend the
range of LABs they can drive. R4 interconnects can also drive C4 interconnects for
connections from one row to another.
Figure 2–10. R4 Interconnect Connections
Adjacent LAB can
drive onto another
LAB’s R4 Interconnect
C4 Column Interconnects (1)
R4 Interconnect
Driving Right
R4 Interconnect
Driving Left
LAB
Neighbor
Primary
LAB (2)
LAB
Neighbor
Notes to Figure 2–10:
(1) C4 interconnects can drive R4 interconnects.
(2) This pattern is repeated for every LAB in the LAB row.
The column interconnect operates similarly to the row interconnect. Each column of
LABs is served by a dedicated column interconnect, which vertically routes signals to
and from LABs and row and column IOEs. These column resources include:
■
LUT chain interconnects within an LAB
■
Register chain interconnects within an LAB
■
C4 interconnects traversing a distance of four LABs in an up and down direction
MAX II devices include an enhanced interconnect structure within LABs for routing
LE output to LE input connections faster using LUT chain connections and register
chain connections. The LUT chain connection allows the combinational output of an
LE to directly drive the fast input of the LE right below it, bypassing the local
interconnect. These resources can be used as a high-speed connection for wide fan-in
© October 2008
Altera Corporation
MAX II Device Handbook
2–14
Chapter 2: MAX II Architecture
MultiTrack Interconnect
functions from LE 1 to LE 10 in the same LAB. The register chain connection allows
the register output of one LE to connect directly to the register input of the next LE in
the LAB for fast shift registers. The Quartus II Compiler automatically takes
advantage of these resources to improve utilization and performance. Figure 2–11
shows the LUT chain and register chain interconnects.
Figure 2–11. LUT Chain and Register Chain Interconnects
Local Interconnect
Routing Among LEs
in the LAB
LUT Chain
Routing to
Adjacent LE
LE0
Register Chain
Routing to Adjacent
LE's Register Input
LE1
Local
Interconnect
LE2
LE3
LE4
LE5
LE6
LE7
LE8
LE9
The C4 interconnects span four LABs up or down from a source LAB. Every LAB has
its own set of C4 interconnects to drive either up or down. Figure 2–12 shows the C4
interconnect connections from an LAB in a column. The C4 interconnects can drive
and be driven by column and row IOEs. For LAB interconnection, a primary LAB or
its vertical LAB neighbor can drive a given C4 interconnect. C4 interconnects can
drive each other to extend their range as well as drive row interconnects for columnto-column connections.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
MultiTrack Interconnect
2–15
Figure 2–12. C4 Interconnect Connections (Note 1)
C4 Interconnect
Drives Local and R4
Interconnects
Up to Four Rows
C4 Interconnect
Driving Up
LAB
Row
Interconnect
Adjacent LAB can
drive onto neighboring
LAB's C4 interconnect
Local
Interconnect
C4 Interconnect
Driving Down
Note to Figure 2–12:
(1) Each C4 interconnect can drive either up or down four rows.
© October 2008
Altera Corporation
MAX II Device Handbook
2–16
Chapter 2: MAX II Architecture
Global Signals
The UFM block communicates with the logic array similar to LAB-to-LAB interfaces.
The UFM block connects to row and column interconnects and has local interconnect
regions driven by row and column interconnects. This block also has DirectLink
interconnects for fast connections to and from a neighboring LAB. For more
information about the UFM interface to the logic array, see “User Flash Memory
Block” on page 2–18.
Table 2–2 shows the MAX II device routing scheme.
Table 2–2. MAX II Device Routing Scheme
Destination
LUT
Chain
Register
Chain
Local
(1)
DirectLink
(1)
R4 (1)
C4 (1)
LE
UFM
Block
Column
IOE
Row
IOE
Fast I/O
(1)
LUT Chain
—
—
—
—
—
—
v
—
—
—
—
Register Chain
—
—
—
—
—
—
v
—
—
—
—
Local
Interconnect
—
—
—
—
—
—
v
v
v
v
—
DirectLink
Interconnect
—
—
v
—
—
—
—
—
—
—
—
R4 Interconnect
—
—
v
—
v
v
—
—
—
—
—
C4 Interconnect
—
—
v
—
v
v
—
—
—
—
—
LE
v
v
v
v
v
v
—
—
v
v
v
Source
UFM Block
—
—
v
v
v
v
—
—
—
—
—
Column IOE
—
—
—
—
—
v
—
—
—
—
—
Row IOE
—
—
—
v
v
v
—
—
—
—
—
Note to Table 2–2:
(1) These categories are interconnects.
Global Signals
Each MAX II device has four dual-purpose dedicated clock pins (GCLK[3..0], two
pins on the left side and two pins on the right side) that drive the global clock network
for clocking, as shown in Figure 2–13. These four pins can also be used as generalpurpose I/O if they are not used to drive the global clock network.
The four global clock lines in the global clock network drive throughout the entire
device. The global clock network can provide clocks for all resources within the
device including LEs, LAB local interconnect, IOEs, and the UFM block. The global
clock lines can also be used for global control signals, such as clock enables,
synchronous or asynchronous clears, presets, output enables, or protocol control
signals such as TRDY and IRDY for PCI. Internal logic can drive the global clock
network for internally-generated global clocks and control signals. Figure 2–13 shows
the various sources that drive the global clock network.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Global Signals
2–17
Figure 2–13. Global Clock Generation
GCLK0
GCLK1
GCLK2
GCLK3
Logic Array(1)
4
4
Global Clock
Network
Note to Figure 2–13:
(1) Any I/O pin can use a MultiTrack interconnect to route as a logic array-generated global clock signal.
The global clock network drives to individual LAB column signals, LAB column
clocks [3..0], that span an entire LAB column from the top to the bottom of the device.
Unused global clocks or control signals in a LAB column are turned off at the LAB
column clock buffers shown in Figure 2–14. The LAB column clocks [3..0] are
multiplexed down to two LAB clock signals and one LAB clear signal. Other control
signal types route from the global clock network into the LAB local interconnect. See
“LAB Control Signals” on page 2–5 for more information.
© October 2008
Altera Corporation
MAX II Device Handbook
2–18
Chapter 2: MAX II Architecture
User Flash Memory Block
Figure 2–14. Global Clock Network (Note 1)
LAB Column
clock[3..0]
I/O Block Region
4
4
4
4
4
4
4
4
LAB Column
clock[3..0]
I/O Block Region
UFM Block (2)
I/O Block Region
CFM Block
Notes to Figure 2–14:
(1) LAB column clocks in I/O block regions provide high fan-out output enable signals.
(2) LAB column clocks drive to the UFM block.
User Flash Memory Block
MAX II devices feature a single UFM block, which can be used like a serial EEPROM
for storing non-volatile information up to 8,192 bits. The UFM block connects to the
logic array through the MultiTrack interconnect, allowing any LE to interface to the
UFM block. Figure 2–15 shows the UFM block and interface signals. The logic array is
used to create customer interface or protocol logic to interface the UFM block data
outside of the device. The UFM block offers the following features:
MAX II Device Handbook
■
Non-volatile storage up to 16-bit wide and 8,192 total bits
■
Two sectors for partitioned sector erase
■
Built-in internal oscillator that optionally drives logic array
■
Program, erase, and busy signals
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
User Flash Memory Block
2–19
■
Auto-increment addressing
■
Serial interface to logic array with programmable interface
Figure 2–15. UFM Block and Interface Signals
UFM Block
PROGRAM
Program
Erase
Control
ERASE
_: 4
OSC
OSC_ENA
9
RTP_BUSY
BUSY
OSC
UFM Sector 1
ARCLK
UFM Sector 0
Address
Register
16
16
ARSHFT
ARDin
Data Register
DRDin
DRDout
DRCLK
DRSHFT
UFM Storage
Each device stores up to 8,192 bits of data in the UFM block. Table 2–3 shows the data
size, sector, and address sizes for the UFM block.
Table 2–3. UFM Array Size
Device
EPM240
EPM570
Total Bits
Sectors
Address Bits
Data Width
8,192
2
(4,096 bits/sector)
9
16
EPM1270
EPM2210
There are 512 locations with 9-bit addressing ranging from 000h to 1FFh. Sector 0
address space is 000h to 0FFh and Sector 1 address space is from 100h to 1FFh. The
data width is up to 16 bits of data. The Quartus II software automatically creates logic
to accommodate smaller read or program data widths. Erasure of the UFM involves
individual sector erasing (that is, one erase of sector 0 and one erase of sector 1 is
required to erase the entire UFM block). Since sector erase is required before a
program or write, having two sectors enables a sector size of data to be left untouched
while the other sector is erased and programmed with new data.
© October 2008
Altera Corporation
MAX II Device Handbook
2–20
Chapter 2: MAX II Architecture
User Flash Memory Block
Internal Oscillator
As shown in Figure 2–15, the dedicated circuitry within the UFM block contains an
oscillator. The dedicated circuitry uses this internally for its read and program
operations. This oscillator's divide by 4 output can drive out of the UFM block as a
logic interface clock source or for general-purpose logic clocking. The typical OSC
output signal frequency ranges from 3.3 to 5.5 MHz, and its exact frequency of
operation is not programmable.
Program, Erase, and Busy Signals
The UFM block’s dedicated circuitry automatically generates the necessary internal
program and erase algorithm once the PROGRAM or ERASE input signals have been
asserted. The PROGRAM or ERASE signal must be asserted until the busy signal
deasserts, indicating the UFM internal program or erase operation has completed. The
UFM block also supports JTAG as the interface for programming and/or reading.
f
For more information about programming and erasing the UFM block, refer to the
Using User Flash Memory in MAX II Devices chapter in the MAX II Device Handbook.
Auto-Increment Addressing
The UFM block supports standard read or stream read operations. The stream read is
supported with an auto-increment address feature. Deasserting the ARSHIFT signal
while clocking the ARCLK signal increments the address register value to read
consecutive locations from the UFM array.
Serial Interface
The UFM block supports a serial interface with serial address and data signals. The
internal shift registers within the UFM block for address and data are 9 bits and 16 bits
wide, respectively. The Quartus II software automatically generates interface logic in
LEs for a parallel address and data interface to the UFM block. Other standard
protocol interfaces such as SPI are also automatically generated in LE logic by the
Quartus II software.
f
For more information about the UFM interface signals and the Quartus II LE-based
alternate interfaces, refer to the Using User Flash Memory in MAX II Devices chapter in
the MAX II Device Handbook.
UFM Block to Logic Array Interface
The UFM block is a small partition of the flash memory that contains the CFM block,
as shown in Figure 2–1 and Figure 2–2. The UFM block for the EPM240 device is
located on the left side of the device adjacent to the left most LAB column. The UFM
block for the EPM570, EPM1270, and EPM2210 devices is located at the bottom left of
the device. The UFM input and output signals interface to all types of interconnects
(R4 interconnect, C4 interconnect, and DirectLink interconnect to/from adjacent LAB
rows). The UFM signals can also be driven from global clocks, GCLK[3..0]. The
interface region for the EPM240 device is shown in Figure 2–16. The interface regions
for EPM570, EPM1270, and EPM2210 devices are shown in Figure 2–17.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
User Flash Memory Block
2–21
Figure 2–16. EPM240 UFM Block LAB Row Interface (Note 1)
CFM Block
UFM Block
LAB
PROGRAM
ERASE
OSC_ENA
LAB
RTP_BUSY
DRDin
DRCLK
DRSHFT
ARin
ARCLK
ARSHFT
DRDout
OSC
BUSY
LAB
Note to Figure 2–16:
(1) The UFM block inputs and outputs can drive to/from all types of interconnects, not only DirectLink interconnects from adjacent row LABs.
© October 2008
Altera Corporation
MAX II Device Handbook
2–22
Chapter 2: MAX II Architecture
MultiVolt Core
Figure 2–17. EPM570, EPM1270, and EPM2210 UFM Block LAB Row Interface
CFM Block
RTP_BUSY
BUSY
OSC
DRDout
DRDin
DRDCLK
DRDSHFT
ARDin
PROGRAM
ERASE
OSC_ENA
ARCLK
ARSHFT
LAB
LAB
UFM Block
LAB
MultiVolt Core
The MAX II architecture supports the MultiVolt core feature, which allows MAX II
devices to support multiple VCC levels on the VCCINT supply. An internal linear voltage
regulator provides the necessary 1.8-V internal voltage supply to the device. The
voltage regulator supports 3.3-V or 2.5-V supplies on its inputs to supply the 1.8-V
internal voltage to the device, as shown in Figure 2–18. The voltage regulator is not
guaranteed for voltages that are between the maximum recommended 2.5-V
operating voltage and the minimum recommended 3.3-V operating voltage.
The MAX IIG and MAX IIZ devices use external 1.8-V supply. The 1.8-V VCC external
supply powers the device core directly.
Figure 2–18. MultiVolt Core Feature in MAX II Devices
3.3-V or 2.5-V on
VCCINT Pins
Voltage
Regulator
1.8-V on
VCCINT Pins
1.8-V Core
Voltage
1.8-V Core
Voltage
MAX II Device
MAX II Device Handbook
MAX IIG or MAX IIZ Device
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
I/O Structure
2–23
I/O Structure
IOEs support many features, including:
■
LVTTL and LVCMOS I/O standards
■
3.3-V, 32-bit, 66-MHz PCI compliance
■
Joint Test Action Group (JTAG) boundary-scan test (BST) support
■
Programmable drive strength control
■
Weak pull-up resistors during power-up and in system programming
■
Slew-rate control
■
Tri-state buffers with individual output enable control
■
Bus-hold circuitry
■
Programmable pull-up resistors in user mode
■
Unique output enable per pin
■
Open-drain outputs
■
Schmitt trigger inputs
■
Fast I/O connection
■
Programmable input delay
MAX II device IOEs contain a bidirectional I/O buffer. Figure 2–19 shows the MAX II
IOE structure. Registers from adjacent LABs can drive to or be driven from the IOE’s
bidirectional I/O buffers. The Quartus II software automatically attempts to place
registers in the adjacent LAB with fast I/O connection to achieve the fastest possible
clock-to-output and registered output enable timing. For input registers, the
Quartus II software automatically routes the register to guarantee zero hold time.
You can set timing assignments in the Quartus II software to achieve desired I/O
timing.
Fast I/O Connection
A dedicated fast I/O connection from the adjacent LAB to the IOEs within an I/O
block provides faster output delays for clock-to-output and tPD propagation delays.
This connection exists for data output signals, not output enable signals or input
signals. Figure 2–20, Figure 2–21, and Figure 2–22 illustrate the fast I/O connection.
© October 2008
Altera Corporation
MAX II Device Handbook
2–24
Chapter 2: MAX II Architecture
I/O Structure
Figure 2–19. MAX II IOE Structure
Data_in Fast_out
Data_out
OE
DEV_OE
Optional
PCI Clamp (1)
VCCIO
VCCIO
Programmable
Pull-Up
I/O Pin
Optional Bus-Hold
Circuit
Drive Strength Control
Open-Drain Output
Slew Control
Programmable
Input Delay
Optional Schmitt
Trigger Input
Note to Figure 2–19:
(1) Available in EPM1270 and EPM2210 devices only.
I/O Blocks
The IOEs are located in I/O blocks around the periphery of the MAX II device. There
are up to seven IOEs per row I/O block (5 maximum in the EPM240 device) and up to
four IOEs per column I/O block. Each column or row I/O block interfaces with its
adjacent LAB and MultiTrack interconnect to distribute signals throughout the device.
The row I/O blocks drive row, column, or DirectLink interconnects. The column I/O
blocks drive column interconnects.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
I/O Structure
2–25
Figure 2–20 shows how a row I/O block connects to the logic array.
Figure 2–20. Row I/O Block Connection to the Interconnect (Note 1)
R4 Interconnects
C4 Interconnects
I/O Block Local
Interconnect
data_out
[6..0]
7
7
OE
[6..0]
LAB
fast_out
[6..0]
7
7
data_in[6..0]
Direct Link
Interconnect
to Adjacent LAB
LAB Local
Interconnect
Row
I/O Block
Direct Link
Interconnect
from Adjacent LAB
LAB Column
clock [3..0]
Row I/O Block
Contains up to
Seven IOEs
Note to Figure 2–20:
(1) Each of the seven IOEs in the row I/O block can have one data_out or fast_out output, one OE output, and one data_in input.
© October 2008
Altera Corporation
MAX II Device Handbook
2–26
Chapter 2: MAX II Architecture
I/O Structure
Figure 2–21 shows how a column I/O block connects to the logic array.
Figure 2–21. Column I/O Block Connection to the Interconnect (Note 1)
Column I/O
Block Contains
Up To 4 IOEs
Column I/O Block
data_out
[3..0]
OE
[3..0]
4
data_in
[3..0]
fast_out
[3..0]
4
4
4
I/O Block
Local Interconnect
Fast I/O
Interconnect LAB Column
Path Clock [3..0]
R4 Interconnects
LAB
LAB Local
Interconnect
LAB
LAB
LAB Local
Interconnect
LAB Local
Interconnect
C4 Interconnects
C4 Interconnects
Note to Figure 2–21:
(1) Each of the four IOEs in the column I/O block can have one data_out or fast_out output, one OE output, and one data_in input.
I/O Standards and Banks
MAX II device IOEs support the following I/O standards:
MAX II Device Handbook
■
3.3-V LVTTL/LVCMOS
■
2.5-V LVTTL/LVCMOS
■
1.8-V LVTTL/LVCMOS
■
1.5-V LVCMOS
■
3.3-V PCI
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
I/O Structure
2–27
Table 2–4 describes the I/O standards supported by MAX II devices.
Table 2–4. MAX II I/O Standards
Type
Output Supply Voltage
(VCCIO) (V)
3.3-V LVTTL/LVCMOS
Single-ended
3.3
2.5-V LVTTL/LVCMOS
Single-ended
2.5
1.8-V LVTTL/LVCMOS
Single-ended
1.8
1.5-V LVCMOS
Single-ended
1.5
3.3-V PCI (1)
Single-ended
3.3
I/O Standard
Note to Table 2–4:
(1) The 3.3-V PCI compliant I/O is supported in Bank 3 of the EPM1270 and EPM2210
devices.
The EPM240 and EPM570 devices support two I/O banks, as shown in Figure 2–22.
Each of these banks support all the LVTTL and LVCMOS standards shown in
Table 2–4. PCI compliant I/O is not supported in these devices and banks.
Figure 2–22. MAX II I/O Banks for EPM240 and EPM570 (Note 1), (2)
I/O Bank 1
I/O Bank 2
All I/O Banks Support
■ 3.3-V LVTTL/LVCMOS
■ 2.5-V LVTTL/LVCMOS
■ 1.8-V LVTTL/LVCMOS
■ 1.5-V LVCMOS
Notes to Figure 2–22:
(1) Figure 2–22 is a top view of the silicon die.
(2) Figure 2–22 is a graphical representation only. Refer to the pin list and the Quartus II software for exact pin locations.
The EPM1270 and EPM2210 devices support four I/O banks, as shown in Figure 2–23.
Each of these banks support all of the LVTTL and LVCMOS standards shown in
Table 2–4. PCI compliant I/O is supported in Bank 3. Bank 3 supports the PCI
clamping diode on inputs and PCI drive compliance on outputs. You must use Bank 3
for designs requiring PCI compliant I/O pins. The Quartus II software automatically
places I/O pins in this bank if assigned with the PCI I/O standard.
© October 2008
Altera Corporation
MAX II Device Handbook
2–28
Chapter 2: MAX II Architecture
I/O Structure
Figure 2–23. MAX II I/O Banks for EPM1270 and EPM2210 (Note 1), (2)
I/O Bank 2
All I/O Banks Support
■ 3.3-V LVTTL/LVCMOS
■ 2.5-V LVTTL/LVCMOS
■ 1.8-V LVTTL/LVCMOS
■ 1.5-V LVCMOS
I/O Bank 1
Also Supports
the 3.3-V PCI
I/O Standard
I/O Bank 3
I/O Bank 4
Notes to Figure 2–23:
(1) Figure 2–23 is a top view of the silicon die.
(2) Figure 2–23 is a graphical representation only. Refer to the pin list and the Quartus II software for exact pin locations.
Each I/O bank has dedicated VCCIO pins that determine the voltage standard support
in that bank. A single device can support 1.5-V, 1.8-V, 2.5-V, and 3.3-V interfaces; each
individual bank can support a different standard. Each I/O bank can support
multiple standards with the same VCCIO for input and output pins. For example, when
VCCIO is 3.3 V, Bank 3 can support LVTTL, LVCMOS, and 3.3-V PCI. VCCIO powers both
the input and output buffers in MAX II devices.
The JTAG pins for MAX II devices are dedicated pins that cannot be used as regular
I/O pins. The pins TMS, TDI, TDO, and TCK support all the I/O standards shown in
Table 2–4 on page 2–27 except for PCI. These pins reside in Bank 1 for all MAX II
devices and their I/O standard support is controlled by the VCCIO setting for Bank 1.
PCI Compliance
The MAX II EPM1270 and EPM2210 devices are compliant with PCI applications as
well as all 3.3-V electrical specifications in the PCI Local Bus Specification Revision 2.2.
These devices are also large enough to support PCI intellectual property (IP) cores.
Table 2–5 shows the MAX II device speed grades that meet the PCI timing
specifications.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
I/O Structure
2–29
Table 2–5. MAX II Devices and Speed Grades that Support 3.3-V PCI Electrical Specifications and
Meet PCI Timing
Device
33-MHz PCI
66-MHz PCI
EPM1270
All Speed Grades
–3 Speed Grade
EPM2210
All Speed Grades
–3 Speed Grade
Schmitt Trigger
The input buffer for each MAX II device I/O pin has an optional Schmitt trigger
setting for the 3.3-V and 2.5-V standards. The Schmitt trigger allows input buffers to
respond to slow input edge rates with a fast output edge rate. Most importantly,
Schmitt triggers provide hysteresis on the input buffer, preventing slow-rising noisy
input signals from ringing or oscillating on the input signal driven into the logic array.
This provides system noise tolerance on MAX II inputs, but adds a small, nominal
input delay.
The JTAG input pins (TMS, TCK, and TDI) have Schmitt trigger buffers that are always
enabled.
1
The TCK input is susceptible to high pulse glitches when the input signal fall time is
greater than 200 ns for all I/O standards.
Output Enable Signals
Each MAX II IOE output buffer supports output enable signals for tri-state control.
The output enable signal can originate from the GCLK[3..0] global signals or from
the MultiTrack interconnect. The MultiTrack interconnect routes output enable signals
and allows for a unique output enable for each output or bidirectional pin.
MAX II devices also provide a chip-wide output enable pin (DEV_OE) to control the
output enable for every output pin in the design. An option set before compilation in
the Quartus II software controls this pin. This chip-wide output enable uses its own
routing resources and does not use any of the four global resources. If this option is
turned on, all outputs on the chip operate normally when DEV_OE is asserted. When
the pin is deasserted, all outputs are tri-stated. If this option is turned off, the DEV_OE
pin is disabled when the device operates in user mode and is available as a user I/O
pin.
Programmable Drive Strength
The output buffer for each MAX II device I/O pin has two levels of programmable
drive strength control for each of the LVTTL and LVCMOS I/O standards.
Programmable drive strength provides system noise reduction control for high
performance I/O designs. Although a separate slew-rate control feature exists, using
the lower drive strength setting provides signal slew-rate control to reduce system
noise and signal overshoot without the large delay adder associated with the
slew-rate control feature. Table 2–6 shows the possible settings for the I/O standards
with drive strength control. The Quartus II software uses the maximum current
strength as the default setting. The PCI I/O standard is always set at 20 mA with no
alternate setting.
© October 2008
Altera Corporation
MAX II Device Handbook
2–30
Chapter 2: MAX II Architecture
I/O Structure
Table 2–6. Programmable Drive Strength (Note 1)
I/O Standard
3.3-V LVTTL
IOH/IOL Current Strength Setting (mA)
16
8
3.3-V LVCMOS
8
4
2.5-V LVTTL/LVCMOS
14
7
1.8-V LVTTL/LVCMOS
6
3
1.5-V LVCMOS
4
2
Note to Table 2–6:
(1) The IOH current strength numbers shown are for a condition of a VOUT = VOH minimum, where the VOH minimum
is specified by the I/O standard. The IOL current strength numbers shown are for a condition of a VOUT = VOL
maximum, where the VOL maximum is specified by the I/O standard. For 2.5-V LVTTL/LVCMOS, the IOH
condition is VOUT = 1.7 V and the IOL condition is VOUT = 0.7 V.
Slew-Rate Control
The output buffer for each MAX II device I/O pin has a programmable output slewrate control that can be configured for low noise or high-speed performance. A faster
slew rate provides high-speed transitions for high-performance systems. However,
these fast transitions may introduce noise transients into the system. A slow slew rate
reduces system noise, but adds a nominal output delay to rising and falling edges.
The lower the voltage standard (for example, 1.8-V LVTTL) the larger the output
delay when slow slew is enabled. Each I/O pin has an individual slew-rate control,
allowing the designer to specify the slew rate on a pin-by-pin basis. The slew-rate
control affects both the rising and falling edges.
Open-Drain Output
MAX II devices provide an optional open-drain (equivalent to open-collector) output
for each I/O pin. This open-drain output enables the device to provide system-level
control signals (for example, interrupt and write enable signals) that can be asserted
by any of several devices. This output can also provide an additional wired-OR plane.
Programmable Ground Pins
Each unused I/O pin on MAX II devices can be used as an additional ground pin.
This programmable ground feature does not require the use of the associated LEs in
the device. In the Quartus II software, unused pins can be set as programmable GND
on a global default basis or they can be individually assigned. Unused pins also have
the option of being set as tri-stated input pins.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
I/O Structure
2–31
Bus Hold
Each MAX II device I/O pin provides an optional bus-hold feature. The bus-hold
circuitry can hold the signal on an I/O pin at its last-driven state. Since the bus-hold
feature holds the last-driven state of the pin until the next input signal is present, an
external pull-up or pull-down resistor is not necessary to hold a signal level when the
bus is tri-stated.
The bus-hold circuitry also pulls undriven pins away from the input threshold
voltage where noise can cause unintended high-frequency switching. The designer
can select this feature individually for each I/O pin. The bus-hold output will drive
no higher than VCCIO to prevent overdriving signals. If the bus-hold feature is enabled,
the device cannot use the programmable pull-up option.
The bus-hold circuitry uses a resistor to pull the signal level to the last driven state.
The DC and Switching Characteristics chapter in the MAX II Device Handbook gives the
specific sustaining current for each VCCIO voltage level driven through this resistor and
overdrive current used to identify the next-driven input level.
The bus-hold circuitry is only active after the device has fully initialized. The bus-hold
circuit captures the value on the pin present at the moment user mode is entered.
Programmable Pull-Up Resistor
Each MAX II device I/O pin provides an optional programmable pull-up resistor
during user mode. If the designer enables this feature for an I/O pin, the pull-up
resistor holds the output to the VCCIO level of the output pin’s bank.
1
The programmable pull-up resistor feature should not be used at the same time as the
bus-hold feature on a given I/O pin.
Programmable Input Delay
The MAX II IOE includes a programmable input delay that is activated to ensure zero
hold times. A path where a pin directly drives a register, with minimal routing
between the two, may require the delay to ensure zero hold time. However, a path
where a pin drives a register through long routing or through combinational logic
may not require the delay to achieve a zero hold time. The Quartus II software uses
this delay to ensure zero hold times when needed.
MultiVolt I/O Interface
The MAX II architecture supports the MultiVolt I/O interface feature, which allows
MAX II devices in all packages to interface with systems of different supply voltages.
The devices have one set of VCC pins for internal operation (VCCINT), and up to four
sets for input buffers and I/O output driver buffers (VCCIO), depending on the number
of I/O banks available in the devices where each set of VCC pins powers one I/O
bank. The EPM240 and EPM570 devices have two I/O banks respectively while the
EPM1270 and EPM2210 devices have four I/O banks respectively.
© October 2008
Altera Corporation
MAX II Device Handbook
2–32
Chapter 2: MAX II Architecture
Referenced Documents
Connect VCCIO pins to either a 1.5-V, 1.8 V, 2.5-V, or 3.3-V power supply, depending
on the output requirements. The output levels are compatible with systems of the
same voltage as the power supply (that is, when VCCIO pins are connected to a 1.5-V
power supply, the output levels are compatible with 1.5-V systems). When VCCIO
pins are connected to a 3.3-V power supply, the output high is 3.3 V and is compatible
with 3.3-V or 5.0-V systems. Table 2–7 summarizes MAX II MultiVolt I/O support.
Table 2–7. MAX II MultiVolt I/O Support (Note 1)
Input Signal
Output Signal
VCCIO (V)
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
1.5
v
v
v
v
—
v
—
—
—
—
1.8
v
v
v
v
—
v (2)
v
—
—
—
2.5
—
—
v
v
—
v (3)
v (3)
v
—
—
3.3
—
—
v (4)
v
v (5)
v (6)
v (6)
v (6)
v
v (7)
Notes to Table 2–7:
(1) To drive inputs higher than VCCIO but less than 4.0 V including the overshoot, disable the I/O clamp diode. However, to drive 5.0-V inputs to the
device, enable the I/O clamp diode to prevent VI from rising above 4.0 V.
(2) When VCCIO = 1.8 V, a MAX II device can drive a 1.5-V device with 1.8-V tolerant inputs.
(3) When VCCIO = 2.5 V, a MAX II device can drive a 1.5-V or 1.8-V device with 2.5-V tolerant inputs.
(4) When VCCIO = 3.3 V and a 2.5-V input signal feeds an input pin, the VCCIO supply current will be slightly larger than expected.
(5) MAX II devices can be 5.0-V tolerant with the use of an external resistor and the internal I/O clamp diode on the EPM1270 and EPM2210
devices.
(6) When VCCIO = 3.3 V, a MAX II device can drive a 1.5-V, 1.8-V, or 2.5-V device with 3.3-V tolerant inputs.
(7) When VCCIO = 3.3 V, a MAX II device can drive a device with 5.0-V TTL inputs but not 5.0-V CMOS inputs. In the case of 5.0-V CMOS, opendrain setting with internal I/O clamp diode (available only on EPM1270 and EPM2210 devices) and external resistor is required.
f
For information about output pin source and sink current guidelines, refer to the AN
428: MAX II CPLD Design Guidelines.
Referenced Documents
This chapter referenced the following documents:
MAX II Device Handbook
■
AN 428: MAX II CPLD Design Guidelines
■
DC and Switching Characteristics chapter in the MAX II Device Handbook
■
Hot Socketing and Power-On Reset in MAX II Devices chapter in the MAX II Device
Handbook
■
Using User Flash Memory in MAX II Devices chapter in the MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 2: MAX II Architecture
Document Revision History
2–33
Document Revision History
Table 2–8 shows the revision history for this chapter.
Table 2–8. Document Revision History
Date and Revision
Changes Made
Summary of Changes
October 2008,
version 2.2
■
Updated Table 2–4 and Table 2–6.
■
Updated “I/O Standards and Banks” section.
■
Updated New Document Format.
March 2008,
version 2.1
■
Updated “Schmitt Trigger” section.
December 2007,
version 2.0
■
Updated “Clear and Preset Logic Control” section.
■
Updated “MultiVolt Core” section.
■
Updated “MultiVolt I/O Interface” section.
■
Updated Table 2–7.
■
Added “Referenced Documents” section.
December 2006,
version 1.7
■
Minor update in “Internal Oscillator” section. Added document
revision history.
—
August 2006,
version 1.6
■
Updated functional description and I/O structure sections.
—
July 2006,
vervion 1.5
■
Minor content and table updates.
—
February 2006,
version 1.4
■
Updated “LAB Control Signals” section.
—
■
Updated “Clear and Preset Logic Control” section.
■
Updated “Internal Oscillator” section.
■
Updated Table 2–5.
August 2005,
version 1.3
■
Removed Note 2 from Table 2-7.
—
December 2004,
version 1.2
■
Added a paragraph to page 2-15.
—
June 2004,
version 1.1
■
Added CFM acronym. Corrected Figure 2-19.
—
© October 2008
Altera Corporation
—
—
Updated document with
MAX IIZ information.
MAX II Device Handbook
2–34
MAX II Device Handbook
Chapter 2: MAX II Architecture
Document Revision History
© October 2008 Altera Corporation
3. JTAG and In-System Programmability
MII51003-1.6
Introduction
This chapter discusses how to use the IEEE Standard 1149.1 Boundary-Scan Test (BST)
circuitry in MAX II devices and includes the following sections:
■
“IEEE Std. 1149.1 (JTAG) Boundary-Scan Support” on page 3–1
■
“In System Programmability” on page 3–4
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
All MAX® II devices provide Joint Test Action Group (JTAG) boundary-scan test (BST)
circuitry that complies with the IEEE Std. 1149.1-2001 specification. JTAG boundaryscan testing can only be performed at any time after VCCINT and all VCCIO banks have
been fully powered and a tCONFIG amount of time has passed. MAX II devices can also
use the JTAG port for in-system programming together with either the Quartus® II
software or hardware using Programming Object Files (.pof), JamTM Standard Test
and Programming Language (STAPL) Files (.jam), or Jam Byte-Code Files (.jbc).
The JTAG pins support 1.5-V, 1.8-V, 2.5-V, or 3.3-V I/O standards. The supported
voltage level and standard are determined by the VCCIO of the bank where it resides.
The dedicated JTAG pins reside in Bank 1 of all MAX II devices.
MAX II devices support the JTAG instructions shown in Table 3–1.
Table 3–1. MAX II JTAG Instructions (Part 1 of 2)
JTAG Instruction
Instruction Code
Description
SAMPLE/PRELOAD
00 0000 0101
Allows a snapshot of signals at the device pins to be captured and
examined during normal device operation, and permits an initial data
pattern to be output at the device pins.
EXTEST (1)
00 0000 1111
Allows the external circuitry and board-level interconnects to be
tested by forcing a test pattern at the output pins and capturing test
results at the input pins.
BYPASS
11 1111 1111
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation.
USERCODE
00 0000 0111
Selects the 32-bit USERCODE register and places it between the
TDI and TDO pins, allowing the USERCODE to be serially shifted
out of TDO. This register defaults to all 1’s if not specified in the
Quartus II software.
IDCODE
00 0000 0110
Selects the IDCODE register and places it between TDI and TDO,
allowing the IDCODE to be serially shifted out of TDO.
HIGHZ (1)
00 0000 1011
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the boundary scan test data to pass synchronously
through selected devices to adjacent devices during normal device
operation, while tri-stating all of the I/O pins.
© October 2008
Altera Corporation
MAX II Device Handbook
3–2
Chapter 3: JTAG and In-System Programmability
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
Table 3–1. MAX II JTAG Instructions (Part 2 of 2)
JTAG Instruction
Instruction Code
Description
CLAMP (1)
00 0000 1010
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the boundary scan test data to pass synchronously
through selected devices to adjacent devices during normal device
operation, while holding I/O pins to a state defined by the data in the
boundary-scan register.
USER0
00 0000 1100
This instruction allows you to define the scan chain between TDI
and TDO in the MAX II logic array. This instruction is also used for
custom logic and JTAG interfaces.
USER1
00 0000 1110
This instruction allows you to define the scan chain between TDI
and TDO in the MAX II logic array. This instruction is also used for
custom logic and JTAG interfaces.
(2)
IEEE 1532
instructions
IEEE 1532 ISC instructions used when programming a MAX II device
via the JTAG port.
Notes to Table 3–1:
(1) HIGHZ, CLAMP, and EXTEST instructions do not disable weak pull-up resistors or bus hold features.
(2) These instructions are shown in the 1532 BSDL files, which will be posted on the Altera® website at www.altera.com when they are available.
w
Unsupported JTAG instructions should not be issued to the MAX II device as this may
put the device into an unknown state, requiring a power cycle to recover device
operation.
The MAX II device instruction register length is 10 bits and the USERCODE register
length is 32 bits. Table 3–2 and Table 3–3 show the boundary-scan register length and
device IDCODE information for MAX II devices.
Table 3–2. MAX II Boundary-Scan Register Length
Device
Boundary-Scan Register Length
EPM240
240
EPM570
480
EPM1270
636
EPM2210
816
Table 3–3. 32-Bit MAX II Device IDCODE (Part 1 of 2)
Binary IDCODE (32 Bits) (1)
Device
EPM240
Version
(4 Bits)
Part Number
Manufacturer
Identity (11 Bits)
LSB
(1 Bit) (2)
HEX IDCODE
0000
0010 0000 1010 0001
000 0110 1110
1
0x020A10DD
0000
0010 0000 1010 0010
000 0110 1110
1
0x020A20DD
0000
0010 0000 1010 0011
000 0110 1110
1
0x020A30DD
0000
0010 0000 1010 0100
000 0110 1110
1
0x020A40DD
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 3: JTAG and In-System Programmability
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
3–3
Table 3–3. 32-Bit MAX II Device IDCODE (Part 2 of 2)
Binary IDCODE (32 Bits) (1)
Version
(4 Bits)
Part Number
Manufacturer
Identity (11 Bits)
LSB
(1 Bit) (2)
HEX IDCODE
EPM240Z
0000
0010 0000 1010 0101
000 0110 1110
1
0x020A50DD
EPM570Z
0000
0010 0000 1010 0110
000 0110 1110
1
0x020A60DD
Device
Notes to Table 3–2:
(1) The most significant bit (MSB) is on the left.
(2) The IDCODE’s least significant bit (LSB) is always 1.
f
For JTAG AC characteristics, refer to the DC and Switching Characteristics chapter in
the MAX II Device Handbook.
f
For more information about JTAG BST, refer to the IEEE 1149.1 (JTAG) Boundary-Scan
Testing for MAX II Devices chapter in the MAX II Device Handbook.
JTAG Block
The MAX II JTAG block feature allows you to access the JTAG TAP and state signals
when either the USER0 or USER1 instruction is issued to the JTAG TAP. The USER0
and USER1 instructions bring the JTAG boundary-scan chain (TDI) through the user
logic instead of the MAX II device’s boundary-scan cells. Each USER instruction
allows for one unique user-defined JTAG chain into the logic array.
Parallel Flash Loader
The JTAG block ability to interface JTAG to non-JTAG devices is ideal for generalpurpose flash memory devices (such as Intel- or Fujitsu-based devices) that require
programming during in-circuit test. The flash memory devices can be used for FPGA
configuration or be part of system memory. In many cases, the MAX II device is
already connected to these devices as the configuration control logic between the
FPGA and the flash device. Unlike ISP-capable CPLD devices, bulk flash devices do
not have JTAG TAP pins or connections. For small flash devices, it is common to use
the serial JTAG scan chain of a connected device to program the non-JTAG flash
device. This is slow and inefficient in most cases and impractical for large parallel
flash devices. Using the MAX II device’s JTAG block as a parallel flash loader, with
the Quartus II software, to program and verify flash contents provides a fast and costeffective means of in-circuit programming during test. Figure 3–1 shows MAX II
being used as a parallel flash loader.
© October 2008
Altera Corporation
MAX II Device Handbook
3–4
Chapter 3: JTAG and In-System Programmability
In System Programmability
Figure 3–1. MAX II Parallel Flash Loader
MAX II Device
Flash
Memory Device
Altera FPGA
DQ[7..0]
A[20..0]
OE
WE
CE
RY/BY
DQ[7..0]
A[20..0]
OE
WE
CE
RY/BY
TDI
TMS
TCK
TDO
TDO_U
TDI_U
TMS_U
TCK_U
SHIFT_U
CLKDR_U
UPDATE_U
RUNIDLE_U
USER1_U
Parallel
Flash Loader
Configuration
Logic
CONF_DONE
nSTATUS
nCE
DATA0
nCONFIG
DCLK
(1), (2)
Notes to Figure 3–1:
(1) This block is implemented in LEs.
(2) This function is supported in the Quartus II software.
In System Programmability
MAX II devices can be programmed in-system via the industry standard 4-pin IEEE
Std. 1149.1 (JTAG) interface. In-system programmability (ISP) offers quick, efficient
iterations during design development and debugging cycles. The logic, circuitry, and
interconnects in the MAX II architecture are configured with flash-based SRAM
configuration elements. These SRAM elements require configuration data to be
loaded each time the device is powered. The process of loading the SRAM data is
called configuration. The on-chip configuration flash memory (CFM) block stores the
SRAM element’s configuration data. The CFM block stores the design’s configuration
pattern in a reprogrammable flash array. During ISP, the MAX II JTAG and ISP
circuitry programs the design pattern into the CFM block’s non-volatile flash array.
The MAX II JTAG and ISP controller internally generate the high programming
voltages required to program the CFM cells, allowing in-system programming with
any of the recommended operating external voltage supplies (that is, 3.3 V/2.5 V or
1.8 V for the MAX IIG and MAX IIZ devices). ISP can be performed anytime after
VCCINT and all VCCIO banks have been fully powered and the device has completed the
configuration power-up time. By default, during in-system programming, the I/O
pins are tri-stated and weakly pulled-up to VCCIO to eliminate board conflicts. The insystem programming clamp and real-time ISP feature allow user control of I/O state
or behavior during ISP.
For more information, refer to “In-System Programming Clamp” on page 3–6 and
“Real-Time ISP” on page 3–7.
These devices also offer an ISP_DONE bit that provides safe operation when insystem programming is interrupted. This ISP_DONE bit, which is the last bit
programmed, prevents all I/O pins from driving until the bit is programmed.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 3: JTAG and In-System Programmability
In System Programmability
3–5
IEEE 1532 Support
The JTAG circuitry and ISP instruction set in MAX II devices is compliant to the IEEE
1532-2002 programming specification. This provides industry-standard hardware and
software for in-system programming among multiple vendor programmable logic
devices (PLDs) in a JTAG chain.
The MAX II 1532 BSDL files will be released on the Altera website when available.
Jam Standard Test and Programming Language (STAPL)
The Jam STAPL JEDEC standard, JESD71, can be used to program MAX II devices
with in-circuit testers, PCs, or embedded processors. The Jam byte code is also
supported for MAX II devices. These software programming protocols provide a
compact embedded solution for programming MAX II devices.
f
For more information, refer to the Using Jam STAPL for ISP via an Embedded Processor
chapter in the MAX II Device Handbook.
Programming Sequence
During in-system programming, 1532 instructions, addresses, and data are shifted
into the MAX II device through the TDI input pin. Data is shifted out through the TDO
output pin and compared against the expected data. Programming a pattern into the
device requires the following six ISP steps. A stand-alone verification of a
programmed pattern involves only stages 1, 2, 5, and 6. These steps are automatically
executed by third-party programmers, the Quartus II software, or the Jam STAPL and
Jam Byte-Code Players.
1. Enter ISP—The enter ISP stage ensures that the I/O pins transition smoothly from
user mode to ISP mode.
2. Check ID—Before any program or verify process, the silicon ID is checked. The
time required to read this silicon ID is relatively small compared to the overall
programming time.
3. Sector Erase—Erasing the device in-system involves shifting in the instruction to
erase the device and applying an erase pulse(s). The erase pulse is automatically
generated internally by waiting in the run/test/idle state for the specified erase
pulse time of 500 ms for the CFM block and 500 ms for each sector of the UFM
block.
4. Program—Programming the device in-system involves shifting in the address,
data, and program instruction and generating the program pulse to program the
flash cells. The program pulse is automatically generated internally by waiting in
the run/test/idle state for the specified program pulse time of 75 µs. This process
is repeated for each address in the CFM and UFM blocks.
5. Verify—Verifying a MAX II device in-system involves shifting in addresses,
applying the verify instruction to generate the read pulse, and shifting out the data
for comparison. This process is repeated for each CFM and UFM address.
6. Exit ISP—An exit ISP stage ensures that the I/O pins transition smoothly from ISP
mode to user mode.
© October 2008
Altera Corporation
MAX II Device Handbook
3–6
Chapter 3: JTAG and In-System Programmability
In System Programmability
Table 3–4 shows the programming times for MAX II devices using in-circuit testers to
execute the algorithm vectors in hardware. Software-based programming tools used
with download cables are slightly slower because of data processing and transfer
limitations.
Table 3–4. MAX II Device Family Programming Times
EPM240
EPM240G
EPM240Z
EPM570
EPM570G
EPM570Z
EPM1270
EPM1270G
EPM2210
EPM2210G
Unit
Erase + Program (1 MHz)
1.72
2.16
2.90
3.92
sec
Erase + Program (10 MHz)
1.65
1.99
2.58
3.40
sec
Verify (1 MHz)
0.09
0.17
0.30
0.49
sec
Verify (10 MHz)
0.01
0.02
0.03
0.05
sec
Complete Program Cycle (1 MHz)
1.81
2.33
3.20
4.41
sec
Complete Program Cycle (10 MHz)
1.66
2.01
2.61
3.45
sec
Description
UFM Programming
The Quartus II software, with the use of POF, Jam, or JBC files, supports
programming of the user flash memory (UFM) block independent of the logic array
design pattern stored in the CFM block. This allows updating or reading UFM
contents through ISP without altering the current logic array design, or vice versa. By
default, these programming files and methods will program the entire flash memory
contents, which includes the CFM block and UFM contents. The stand-alone
embedded Jam STAPL player and Jam Byte-Code Player provides action commands
for programming or reading the entire flash memory (UFM and CFM together) or
each independently.
f
For more information, refer to the Using Jam STAPL for ISP via an Embedded Processor
chapter in the MAX II Device Handbook.
In-System Programming Clamp
By default, the IEEE 1532 instruction used for entering ISP automatically tri-states all
I/O pins with weak pull-up resistors for the duration of the ISP sequence. However,
some systems may require certain pins on MAX II devices to maintain a specific DC
logic level during an in-field update. For these systems, an optional in-system
programming clamp instruction exists in MAX II circuitry to control I/O behavior
during the ISP sequence. The in-system programming clamp instruction enables the
device to sample and sustain the value on an output pin (an input pin would remain
tri-stated if sampled) or to explicitly set a logic high, logic low, or tri-state value on
any pin. Setting these options is controlled on an individual pin basis using the
Quartus II software.
f
MAX II Device Handbook
For more information, refer to the Real-Time ISP and ISP Clamp for MAX II Devices
chapter in the MAX II Device Handbook.
© October 2008 Altera Corporation
Chapter 3: JTAG and In-System Programmability
Referenced Documents
3–7
Real-Time ISP
For systems that require more than DC logic level control of I/O pins, the real-time
ISP feature allows you to update the CFM block with a new design image while the
current design continues to operate in the SRAM logic array and I/O pins. A new
programming file is updated into the MAX II device without halting the original
design’s operation, saving down-time costs for remote or field upgrades. The updated
CFM block configures the new design into the SRAM upon the next power cycle. It is
also possible to execute an immediate configuration of the SRAM without a power
cycle by using a specific sequence of ISP commands. The configuration of SRAM
without a power cycle takes a specific amount of time (tCONFIG). During this time, the
I/O pins are tri-stated and weakly pulled-up to VCCIO.
Design Security
All MAX II devices contain a programmable security bit that controls access to the
data programmed into the CFM block. When this bit is programmed, design
programming information, stored in the CFM block, cannot be copied or retrieved.
This feature provides a high level of design security because programmed data within
flash memory cells is invisible. The security bit that controls this function, as well as
all other programmed data, is reset only when the device is erased. The SRAM is also
invisible and cannot be accessed regardless of the security bit setting. The UFM block
data is not protected by the security bit and is accessible through JTAG or logic array
connections.
Programming with External Hardware
MAX II devices can be programmed by downloading the information via in-circuit
testers, embedded processors, the Altera® ByteblasterMV™, MasterBlaster™,
ByteBlaster™ II, and USB-Blaster cables.
BP Microsystems, System General, and other programming hardware manufacturers
provide programming support for Altera devices. Check their websites for device
support information.
Referenced Documents
This chapter references the following documents:
© October 2008
■
DC and Switching Characteristics chapter in the MAX II Device Handbook
■
IEEE 1149.1 (JTAG) Boundary-Scan Testing for MAX II Devices chapter in the MAX II
Device Handbook
■
Real-Time ISP and ISP Clamp for MAX II Devices chapter in the MAX II Device
Handbook
■
Using Jam STAPL for ISP via an Embedded Processor chapter in the MAX II Device
Handbook
Altera Corporation
MAX II Device Handbook
3–8
Chapter 3: JTAG and In-System Programmability
Document Revision History
Document Revision History
Table 3–5 shows the revision history for this chapter.
Table 3–5. Document Revision History
Date and Revision
Changes Made
October 2008,
version 1.6
■
Updated New Document Format.
—
December 2007,
version 1.5
■
Added warning note after Table 3–1.
—
■
Updated Table 3–3 and Table 3–4.
■
Added “Referenced Documents” section.
December 2006,
version 1.4
■
Added document revision history.
—
June 2005,
version 1.3
■
Added text and Table 3-4.
—
June 2005,
version 1.3
■
Updated text on pages 3-5 to 3-8.
—
June 2004,
version 1.1
■
Corrected Figure 3-1. Added CFM acronym.
—
MAX II Device Handbook
Summary of Changes
© October 2008 Altera Corporation
4. Hot Socketing and Power-On Reset in
MAX II Devices
MII51004-2.1
Introduction
MAX® II devices offer hot socketing, also known as hot plug-in or hot swap, and
power sequencing support. Designers can insert or remove a MAX II board in a
system during operation without undesirable effects to the system bus. The hot
socketing feature removes some of the difficulties designers face when using
components on printed circuit boards (PCBs) that contain a mixture of 3.3-, 2.5-, 1.8-,
and 1.5-V devices.
The MAX II device hot socketing feature provides:
■
Board or device insertion and removal
■
Support for any power-up sequence
■
Non-intrusive I/O buffers to system buses during hot insertion
This chapter contains the following sections:
■
“MAX II Hot-Socketing Specifications” on page 4–1
■
“Power-On Reset Circuitry” on page 4–5
MAX II Hot-Socketing Specifications
MAX II devices offer all three of the features required for the hot-socketing capability
listed above without any external components or special design requirements. The
following are hot-socketing specifications:
1
■
The device can be driven before and during power-up or power-down without
any damage to the device itself.
■
I/O pins remain tri-stated during power-up. The device does not drive out before
or during power-up, thereby affecting other buses in operation.
■
Signal pins do not drive the VCCIO or VCCINT power supplies. External input signals
to device I/O pins do not power the device VCCIO or VCCINT power supplies via
internal paths. This is true if the VCCINT and the VCCIO supplies are held at GND.
Altera uses GND as reference for the hot-socketing and I/O buffers circuitry designs.
You must connect the GND between boards before connecting the VCCINT and the VCCIO
power supplies to ensure device reliability and compliance to the hot-socketing
specifications.
Devices Can Be Driven before Power-Up
Signals can be driven into the MAX II device I/O pins and GCLK[3..0] pins before
or during power-up or power-down without damaging the device. MAX II devices
support any power-up or power-down sequence (VCCIO1, VCCIO2, VCCIO3, VCCIO4, VCCINT),
simplifying the system-level design.
© October 2008
Altera Corporation
MAX II Device Handbook
4–2
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Hot Socketing Feature Implementation in MAX II Devices
I/O Pins Remain Tri-Stated during Power-Up
A device that does not support hot-socketing may interrupt system operation or cause
contention by driving out before or during power-up. In a hot socketing situation, the
MAX II device’s output buffers are turned off during system power-up. MAX II
devices do not drive out until the device attains proper operating conditions and is
fully configured. Refer to “Power-On Reset Circuitry” on page 4–5 for information
about turn-on voltages.
Signal Pins Do Not Drive the VCCIO or VCCINT Power Supplies
MAX II devices do not have a current path from I/O pins or GCLK[3..0] pins to the
VCCIO or VCCINT pins before or during power-up. A MAX II device may be inserted into
(or removed from) a system board that was powered up without damaging or
interfering with system-board operation. When hot socketing, MAX II devices may
have a minimal effect on the signal integrity of the backplane.
AC and DC Specifications
You can power up or power down the VCCIO and VCCINT pins in any sequence. During
hot socketing, the I/O pin capacitance is less than 8 pF. MAX II devices meet the
following hot socketing specifications:
1
■
The hot socketing DC specification is: | IIOPIN | < 300 μA.
■
The hot socketing AC specification is: | IIOPIN | < 8 mA for 10 ns or less.
MAX II devices are immune to latch-up when hot socketing. If the TCK JTAG input
pin is driven high during hot socketing, the current on that pin might exceed the
specifications above.
IIOPIN is the current at any user I/O pin on the device. The AC specification applies
when the device is being powered up or powered down. This specification takes into
account the pin capacitance but not board trace and external loading capacitance.
Additional capacitance for trace, connector, and loading must be taken into
consideration separately. The peak current duration due to power-up transients is
10 ns or less.
The DC specification applies when all VCC supplies to the device are stable in the
powered-up or powered-down conditions.
Hot Socketing Feature Implementation in MAX II Devices
The hot socketing feature turns off (tri-states) the output buffer during the power-up
event (either VCCINT or VCCIO supplies) or power-down event. The hot-socket circuit
generates an internal HOTSCKT signal when either VCCINT or VCCIO is below the
threshold voltage during power-up or power-down. The HOTSCKT signal cuts off the
output buffer to make sure that no DC current (except for weak pull-up leaking) leaks
through the pin. When VCC ramps up very slowly during power-up, VCC may still be
relatively low even after the power-on reset (POR) signal is released and device
configuration is complete.
MAX II Device Handbook
© October 2008 Altera Corporation
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Hot Socketing Feature Implementation in MAX II Devices
1
4–3
Make sure that the VCCINT is within the recommended operating range even though
SRAM download has completed.
Each I/O and clock pin has the circuitry shown in Figure 4–1.
Figure 4–1. Hot Socketing Circuit Block Diagram for MAX II Devices
Power On
Reset
Monitor
VCCIO
Weak
Pull-Up
Resistor
PAD
Output Enable
Voltage
Tolerance
Control
Hot Socket
Input Buffer
to Logic Array
The POR circuit monitors VCCINT and VCCIO voltage levels and keeps I/O pins tri-stated
until the device has completed its flash memory configuration of the SRAM logic. The
weak pull-up resistor (R) from the I/O pin to VCCIO is enabled during download to
keep the I/O pins from floating. The 3.3-V tolerance control circuit permits the I/O
pins to be driven by 3.3 V before VCCIO and/or VCCINT are powered, and it prevents the
I/O pins from driving out when the device is not fully powered or operational. The
hot socket circuit prevents I/O pins from internally powering VCCIO and VCCINT when
driven by external signals before the device is powered.
f
For information about 5.0-V tolerance, refer to the Using MAX II Devices in MultiVoltage Systems chapter in the MAX II Device Handbook.
Figure 4–2 shows a transistor-level cross section of the MAX II device I/O buffers.
This design ensures that the output buffers do not drive when VCCIO is powered before
VCCINT or if the I/O pad voltage is higher than VCCIO. This also applies for sudden
voltage spikes during hot insertion. The VPAD leakage current charges the 3.3-V
tolerant circuit capacitance.
© October 2008
Altera Corporation
MAX II Device Handbook
4–4
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Hot Socketing Feature Implementation in MAX II Devices
Figure 4–2. Transistor-Level Diagram of MAX II Device I/O Buffers
VPAD
IOE Signal or the
Larger of VCCIO or VPAD
IOE Signal
The Larger of
VCCIO or VPAD
Ensures 3.3-V
Tolerance and
Hot-Socket
Protection
VCCIO
p+
n+
n+
n+
p+
n - well
p - well
p - substrate
The CMOS output drivers in the I/O pins intrinsically provide electrostatic discharge
(ESD) protection. There are two cases to consider for ESD voltage strikes: positive
voltage zap and negative voltage zap.
A positive ESD voltage zap occurs when a positive voltage is present on an I/O pin
due to an ESD charge event. This can cause the N+ (Drain)/ P-Substrate junction of
the N-channel drain to break down and the N+ (Drain)/P-Substrate/N+ (Source)
intrinsic bipolar transistor turn on to discharge ESD current from I/O pin to GND.
The dashed line (see Figure 4–3) shows the ESD current discharge path during a
positive ESD zap.
Figure 4–3. ESD Protection During Positive Voltage Zap
I/O
Source
PMOS
Gate
N+
D
Drain
G
P-Substrate
I/O
Drain
NMOS
Gate
N+
S
Source
GND
MAX II Device Handbook
GND
© October 2008 Altera Corporation
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Power-On Reset Circuitry
4–5
When the I/O pin receives a negative ESD zap at the pin that is less than –0.7 V (0.7 V
is the voltage drop across a diode), the intrinsic
P-Substrate/N+ drain diode is forward biased. Therefore, the discharge ESD current
path is from GND to the I/O pin, as shown in Figure 4–4.
Figure 4–4. ESD Protection During Negative Voltage Zap
I/O
Source
PMOS
Gate
N+
D
Drain
G
P-Substrate
I/O
Drain
NMOS
Gate
N+
S
Source
GND
GND
Power-On Reset Circuitry
MAX II devices have POR circuits to monitor VCCINT and VCCIO voltage levels during
power-up. The POR circuit monitors these voltages, triggering download from the
non-volatile configuration flash memory (CFM) block to the SRAM logic, maintaining
tri-state of the I/O pins (with weak pull-up resistors enabled) before and during this
process. When the MAX II device enters user mode, the POR circuit releases the I/O
pins to user functionality. The POR circuit of the MAX II (except MAX IIZ) device
continues to monitor the VCCINT voltage level to detect a brown-out condition. The
POR circuit of the MAX IIZ device does not monitor the VCCINT voltage level after the
device enters into user mode. More details are provided in the following sub-sections.
© October 2008
Altera Corporation
MAX II Device Handbook
4–6
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Power-On Reset Circuitry
Power-Up Characteristics
When power is applied to a MAX II device, the POR circuit monitors VCCINT and
begins SRAM download at an approximate voltage of 1.7 V or 1.55 V for MAX IIG and
MAX IIZ devices. From this voltage reference, SRAM download and entry into user
mode takes 200 to 450 µs maximum, depending on device density. This period of time
is specified as tCONFIG in the power-up timing section of the DC and Switching
Characteristics chapter in the MAX II Device Handbook.
Entry into user mode is gated by whether all VCCIO banks are powered with sufficient
operating voltage. If VCCINT and VCCIO are powered simultaneously, the device enters
user mode within the tCONFIG specifications. If VCCIO is powered more than tCONFIG after
VCCINT, the device does not enter user mode until 2 µs after all VCCIO banks are powered.
For MAX II and MAX IIG devices, when in user mode, the POR circuitry continues to
monitor the VCCINT (but not VCCIO) voltage level to detect a brown-out condition. If
there is a VCCINT voltage sag at or below 1.4 V during user mode, the POR circuit resets
the SRAM and tri-states the I/O pins. Once VCCINT rises back to approximately 1.7 V
(or 1.55 V for MAX IIG devices), the SRAM download restarts and the device begins
to operate after tCONFIG time has passed.
For MAX IIZ devices, the POR circuitry does not monitor the VCCINT and VCCIO voltage
levels after the device enters user mode. If there is a VCCINT voltage sag below 1.4 V
during user mode, the functionality of the device will not be guaranteed and you
must power down the VCCINT to 0 V for a minimum of 10 µs before powering the VCCINT
and VCCIO up again. Once VCCINT rises from 0 V back to approximately 1.55 V, the
SRAM download restarts and the device begins to operate after tCONFIG time has
passed.
Figure 4–5 shows the voltages for POR of MAX II, MAX IIG, and MAX IIZ devices
during power-up into user mode and from user mode to power-down or brown-out.
1
MAX II Device Handbook
All VCCINT and VCCIO pins of all banks must be powered on MAX II devices before
entering user mode.
© October 2008 Altera Corporation
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Power-On Reset Circuitry
4–7
Figure 4–5. Power-Up Characteristics for MAX II, MAX IIG, and MAX IIZ Devices (Note 1), (2)
MAX II Device
VCCINT
Approximate Voltage
for SRAM Download Start
3.3 V
2.5 V
Device Resets
the SRAM and
Tri-States I/O Pins
1.7 V
1.4 V
tCONFIG
0V
User Mode
Operation
Tri-State
Tri-State
MAX IIG Device
VCCINT
3.3 V
Approximate Voltage
for SRAM Download Start
Device Resets
the SRAM and
Tri-States I/O Pins
1.8 V
1.55 V
1.4 V
tCONFIG
0V
User Mode
Operation
Tri-State
Tri-State
MAX IIZ Device
VCCINT
3.3 V
Approximate Voltage
for SRAM Download Start
VCCINT must be powered down
to 0 V if the VCCINT
dips below this level
1.8 V
1.55 V
1.4 V
minimum 10 µs
tCONFIG
0V
Tri-State
User Mode
Operation
tCONFIG
Tri-State
User Mode
Operation
Notes to Figure 4–5:
(1) Time scale is relative.
(2) Figure 4–5 assumes all VCCIO banks power up simultaneously with the VCCINT profile shown. If not, tCONFIG stretches out until all VCCIO banks are powered.
1
© October 2008
After SRAM configuration, all registers in the device are cleared and released into
user function before I/O tri-states are released. To release clears after tri-states are
released, use the DEV_CLRn pin option. To hold the tri-states beyond the power-up
configuration time, use the DEV_OE pin option.
Altera Corporation
MAX II Device Handbook
4–8
Chapter 4: Hot Socketing and Power-On Reset in MAX II Devices
Referenced Documents
Referenced Documents
This chapter refereces the following documents:
■
DC and Switching Characteristics chapter in the MAX II Device Handbook
■
Using MAX II Devices in Multi-Voltage Systems chapter in the MAX II Device
Handbook
Document Revision History
Table 4–1 shows the revision history for this chapter.
Table 4–1. Document Revision History
Date and Revision
Changes Made
October 2008,
■
Updated “MAX II Hot-Socketing Specifications” and “Power-On
Reset Circuitry” sections.
■
Updated New Document Format.
■
Updated “Hot Socketing Feature Implementation in MAX II
Devices” section.
■
Updated “Power-On Reset Circuitry” section.
■
Updated Figure 4–5.
■
Added “Referenced Documents” section.
December 2006,
version 1.5
■
Added document revision history.
—
February 2006,
version 1.4
■
Updated “MAX II Hot-Socketing Specifications” section.
—
■
Updated “AC and DC Specifications” section.
■
Updated “Power-On Reset Circuitry” section.
June 2005,
version 1.3
■
Updated AC and DC specifications on page 4-2.
—
December 2004,
version 1.2
■
Added content to Power-Up Characteristics section.
—
■
Updated Figure 4-5.
June 2004,
version 1.1
■
Corrected Figure 4-2.
version2.1
December 2007,
version 2.0
MAX II Device Handbook
Summary of Changes
—
Updated document with
MAX IIZ information.
—
© October 2008 Altera Corporation
5. DC and Switching Characteristics
MII51005-2.4
Introduction
System designers must consider the recommended DC and switching conditions
discussed in this chapter to maintain the highest possible performance and reliability
of the MAX® II devices. This chapter contains the following sections:
■
“Operating Conditions” on page 5–1
■
“Power Consumption” on page 5–8
■
“Timing Model and Specifications” on page 5–8
Operating Conditions
Table 5–1 through Table 5–12 provide information about absolute maximum ratings,
recommended operating conditions, DC electrical characteristics, and other
specifications for MAX II devices.
Absolute Maximum Ratings
Table 5–1 shows the absolute maximum ratings for the MAX II device family.
Table 5–1. MAX II Device Absolute Maximum Ratings (Note 1), (2)
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
–0.5
4.6
V
V
VCCINT
Internal supply voltage (3)
VCCIO
I/O supply voltage
—
–0.5
4.6
VI
DC input voltage
—
–0.5
4.6
V
IOUT
DC output current, per pin (4)
—
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
°C
TAMB
Ambient temperature
Under bias (5)
–65
135
°C
TJ
Junction temperature
TQFP and BGA packages
under bias
—
135
°C
With respect to ground
Notes to Table 5–1:
(1) Refer to the Operating Requirements for Altera Devices Data Sheet.
(2) Conditions beyond those listed in Table 5–1 may cause permanent damage to a device. Additionally, device operation at the absolute maximum
ratings for extended periods of time may have adverse affects on the device.
(3) Maximum VCCINT for MAX II devices is 4.6 V. For MAX IIG and MAX IIZ devices, it is 2.4 V.
(4) Refer to AN 286: Implementing LED Drivers in MAX & MAX II Devices for more information about the maximum source and sink current for
MAX II devices.
(5) Refer to Table 5–2 for information about “under bias” conditions.
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–2
Chapter 5: DC and Switching Characteristics
Operating Conditions
Recommended Operating Conditions
Table 5–2 shows the MAX II device family recommended operating conditions.
Table 5–2. MAX II Device Recommended Operating Conditions
Symbol
VCCINT (1)
VCCIO (1)
Parameter
Conditions
Minimum
Maximum
Unit
3.3-V supply voltage for internal logic and
ISP
MAX II devices
3.00
3.60
V
2.5-V supply voltage for internal logic and
ISP
MAX II devices
2.375
2.625
V
1.8-V supply voltage for internal logic and
ISP
MAX IIG and MAX IIZ
devices
1.71
1.89
V
Supply voltage for I/O buffers, 3.3-V
operation
—
3.00
3.60
V
Supply voltage for I/O buffers, 2.5-V
operation
—
2.375
2.625
V
Supply voltage for I/O buffers, 1.8-V
operation
—
1.71
1.89
V
Supply voltage for I/O buffers, 1.5-V
operation
—
1.425
1.575
V
(2), (3), (4)
–0.5
4.0
V
—
0
VCCIO
V
0
85
°C
Industrial range
–40
100
°C
Extended range (6)
–40
125
°C
VI
Input voltage
VO
Output voltage
TJ
Operating junction temperature
Commercial range (5)
Notes to Table 5–2:
(1) MAX II device in-system programming and/or user flash memory (UFM) programming via JTAG or logic array is not guaranteed outside the
recommended operating conditions (for example, if brown-out occurs in the system during a potential write/program sequence to the UFM,
users are recommended to read back UFM contents and verify against the intended write data).
(2) Minimum DC input is –0.5 V. During transitions, the inputs may undershoot to –2.0 V for input currents less than 100 mA and periods shorter
than 20 ns.
(3) During transitions, the inputs may overshoot to the voltages shown in the following table based upon input duty cycle. The DC case is equivalent
to 100% duty cycle. For more information about 5.0-V tolerance, refer to the Using MAX II Devices in Multi-Voltage Systems chapter in the MAX
II Device Handbook.
VIN
Max. Duty Cycle
4.0 V 100% (DC)
4.1
90%
4.2
50%
4.3
30%
4.4
17%
4.5
10%
(4) All pins, including clock, I/O, and JTAG pins, may be driven before VCCINT and VCCIO are powered.
(5) MAX IIZ devices are only available in the commercial temperature range.
(6) For the extended temperature range of 100 to 125º C, MAX II UFM programming (erase/write) is only supported via the JTAG interface. UFM
programming via the logic array interface is not guaranteed in this range.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Operating Conditions
5–3
Programming/Erasure Specifications
Table 5–3 shows the MAX II device family programming/erasure specifications.
Table 5–3. MAX II Device Programming/Erasure Specifications
Parameter
Minimum
Typical
Maximum
Unit
Erase and reprogram cycles
—
—
100 (1)
Cycles
Note to Table 5–3:
(1) This specification applies to the UFM and configuration flash memory (CFM) blocks.
DC Electrical Characteristics
Table 5–4 shows the MAX II device family DC electrical characteristics.
Table 5–4. MAX II Device DC Electrical Characteristics (Note 1) (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
II
Input pin leakage
current
VI = VCCIOmax to 0 V (2)
–10
—
10
µA
IOZ
Tri-stated I/O pin
leakage current
VO = VCCIOmax to 0 V (2)
–10
—
10
µA
ICCSTANDBY
VCCINT supply current
(standby) (3)
MAX II devices
—
12
—
mA
MAX IIG devices
—
2
—
mA
EPM240Z
—
29
150
µA
EPM570Z
—
32
210
µA
VCCIO = 3.3 V
—
400
—
mV
VCCIO = 2.5 V
—
190
—
mV
VSCHMITT (4)
ICCPOWERUP
RPULLUP
Hysteresis for Schmitt
trigger input (5)
VCCINT supply current
during power-up (6)
MAX II devices
—
55
—
mA
MAX IIG and MAX IIZ
devices
—
40
—
mA
Value of I/O pin pull-up
resistor during user
mode and in-system
programming
VCCIO = 3.3 V (7)
5
—
25
kΩ
VCCIO = 2.5 V (7)
10
—
40
kΩ
VCCIO = 1.8 V (7)
25
—
60
kΩ
VCCIO = 1.5 V (7)
45
—
95
kΩ
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–4
Chapter 5: DC and Switching Characteristics
Operating Conditions
Table 5–4. MAX II Device DC Electrical Characteristics (Note 1) (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
IPULLUP
I/O pin pull-up resistor
current when I/O is
unprogrammed
—
—
—
300
µA
CIO
Input capacitance for
user I/O pin
—
—
—
8
pF
CGCLK
Input capacitance for
dual-purpose
GCLK/user I/O pin
—
—
—
8
pF
Notes to Table 5–4:
(1) Typical values are for TA = 25 °C, VCCINT = 3.3 or 2.5 V, and VCCIO = 1.5 V, 1.8 V, 2.5 V, or 3.3 V.
(2) This value is specified for normal device operation. The value may vary during power-up. This applies for all VCCIO settings (3.3, 2.5,
1.8, and 1.5 V).
(3) VI = ground, no load, no toggling inputs.
(4) This value applies to commercial and industrial range devices. For extended temperature range devices, the VSCHMITT typical value is
300 mV for VCCIO = 3.3 V and 120 mV for VCCIO = 2.5 V.
(5) The TCK input is susceptible to high pulse glitches when the input signal fall time is greater than 200 ns for all I/O standards.
(6) This is a peak current value with a maximum duration of tCONFIG time.
(7) Pin pull-up resistance values will lower if an external source drives the pin higher than VCCIO.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Operating Conditions
5–5
Output Drive Characteristics
Figure 5–1 shows the typical drive strength characteristics of MAX II devices.
Figure 5–1. Output Drive Characteristics of MAX II Devices
MAX II Output Drive IOH Characteristics
(Maximum Drive Strength)
MAX II Output Drive IOL Characteristics
(Maximum Drive Strength)
60
70
3.3-V VCCIO
3.3-V VCCIO
Typical IO Output Current (mA)
Typical I O Output Current (mA)
60
50
2.5-V VCCIO
40
30
1.8-V VCCIO
20
1.5-V VCCIO
10
50
40
2.5-V VCCIO
30
1.8-V VCCIO
20
1.5-V VCCIO
10
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
3.5
0.5
1.0
1.5
2.0
2.5
30
3.3-V VCCIO
Typical IO Output Current (mA)
Typical IO Output Current (mA)
3.3-V VCCIO
30
25
2.5-V VCCIO
15
1.8-V VCCIO
10
1.5-V VCCIO
5
3.5
MAX II Output Drive IOL Characteristics
(Minimum Drive Strength)
MAX II Output Drive IOH Characteristics
(Minimum Drive Strength)
35
20
3.0
Voltage (V)
Voltage (V)
0
25
20
2.5-V VCCIO
15
1.8-V VCCIO
10
1.5-V VCCIO
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
Voltage (V)
1.0
1.5
2.0
2.5
3.0
3.5
Voltage (V)
Note to Figure 5–1:
(1) The DC output current per pin is subject to the absolute maximum rating of Table 5–1.
I/O Standard Specifications
Table 5–5 through Table 5–10 show the MAX II device family I/O standard
specifications.
Table 5–5. 3.3-V LVTTL Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
VCCIO
I/O supply voltage
—
3.0
3.6
V
VIH
High-level input voltage
—
1.7
4.0
V
VIL
Low-level input voltage
—
–0.5
0.8
V
VOH
High-level output voltage
IOH = –4 mA (1)
2.4
—
V
VOL
Low-level output voltage
IOL = 4 mA (1)
—
0.45
V
Table 5–6. 3.3-V LVCMOS Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
VCCIO
I/O supply voltage
—
3.0
3.6
V
VIH
High-level input voltage
—
1.7
4.0
V
VIL
Low-level input voltage
—
–0.5
0.8
V
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–6
Chapter 5: DC and Switching Characteristics
Operating Conditions
Table 5–6. 3.3-V LVCMOS Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
VOH
High-level output voltage
VCCIO = 3.0,
IOH = –0.1 mA (1)
VCCIO – 0.2
—
V
VOL
Low-level output voltage
VCCIO = 3.0,
IOL = 0.1 mA (1)
—
0.2
V
Table 5–7. 2.5-V I/O Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
VCCIO
I/O supply voltage
—
2.375
2.625
V
VIH
High-level input voltage
—
1.7
4.0
V
VIL
Low-level input voltage
—
–0.5
0.7
V
VOH
High-level output voltage
IOH = –0.1 mA (1)
2.1
—
V
IOH = –1 mA (1)
2.0
—
V
IOH = –2 mA (1)
1.7
—
V
IOL = 0.1 mA (1)
—
0.2
V
IOL = 1 mA (1)
—
0.4
V
IOL = 2 mA (1)
—
0.7
V
VOL
Low-level output voltage
Table 5–8. 1.8-V I/O Specifications
Symbol
Parameter
VCCIO
I/O supply voltage
Conditions
Minimum
Maximum
Unit
—
1.71
1.89
V
VIH
High-level input voltage
—
0.65 × VCCIO
2.25 (2)
V
VIL
Low-level input voltage
—
–0.3
0.35 × VCCIO
V
VOH
High-level output voltage
IOH = –2 mA (1)
VCCIO – 0.45
—
V
VOL
Low-level output voltage
IOL = 2 mA (1)
—
0.45
V
Conditions
Minimum
Maximum
Unit
Table 5–9. 1.5-V I/O Specifications
Symbol
Parameter
VCCIO
I/O supply voltage
—
1.425
1.575
V
VIH
High-level input voltage
—
0.65 × VCCIO
VCCIO + 0.3 (2)
V
VIL
Low-level input voltage
—
–0.3
0.35 × VCCIO
V
VOH
High-level output voltage
IOH = –2 mA (1)
0.75 × VCCIO
—
V
VOL
Low-level output voltage
IOL = 2 mA (1)
—
0.25 × VCCIO
V
Notes to Table 5–5 through Table 5–9:
(1) This specification is supported across all the programmable drive strength settings available for this I/O standard, as shown
in the MAX II Architecture chapter (I/O Structure section) in the MAX II Device Handbook.
(2) This maximum VIH reflects the JEDEC specification. The MAX II input buffer can tolerate a VIH maximum of 4.0, as specified
by the VI parameter in Table 5–2.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Operating Conditions
5–7
Table 5–10. 3.3-V PCI Specifications (Note 1)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
I/O supply
voltage
—
3.0
3.3
3.6
V
VIH
High-level input
voltage
—
0.5 × VCCIO
—
VCCIO + 0.5
V
VIL
Low-level input
voltage
—
–0.5
—
0.3 × VCCIO
V
VOH
High-level
output voltage
IOH = –500 µA
0.9 × VCCIO
—
—
V
VOL
Low-level
output voltage
IOL = 1.5 mA
—
—
0.1 × VCCIO
V
Note to Table 5–10:
(1) 3.3-V PCI I/O standard is only supported in Bank 3 of the EPM1270 and EPM2210 devices.
Bus Hold Specifications
Table 5–11 shows the MAX II device family bus hold specifications.
Table 5–11. Bus Hold Specifications
VCCIO Level
1.5 V
1.8 V
2.5 V
3.3 V
Conditions
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Low sustaining
current
VIN > VIL (maximum)
20
—
30
—
50
—
70
—
µA
High sustaining
current
VIN < VIH (minimum)
–20
—
–30
—
–50
—
–70
—
µA
Low overdrive
current
0 V < VIN < VCCIO
—
160
—
200
—
300
—
500
µA
High overdrive
current
0 V < VIN < VCCIO
—
–160
—
–200
—
–300
—
–500
µA
Parameter
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–8
Chapter 5: DC and Switching Characteristics
Power Consumption
Power-Up Timing
Table 5–12 shows the power-up timing characteristics for MAX II devices.
Table 5–12. MAX II Power-Up Timing
Symbol
tCONFIG (1)
Parameter
The amount of time from when
minimum VCCINT is reached until
the device enters user mode (2)
Device
Min
Typ
Max
Unit
EPM240
—
—
200
µs
EPM570
—
—
300
µs
EPM1270
—
—
300
µs
EPM2210
—
—
450
µs
Notes to Table 5–12:
(1) Table 5–12 values apply to commercial and industrial range devices. For extended temperature range devices, the tCONFIG maximum values are
as follows:
Device
Maximum
EPM240
300 µs
EPM570
400 µs
EPM1270
400 µs
EPM2210
500 µs
(2) For more information about POR trigger voltage, refer to the Hot Socketing and Power-On Reset in MAX II Devices chapter in the MAX II Device
Handbook.
Power Consumption
Designers can use the Altera® PowerPlay Early Power Estimator and PowerPlay
Power Analyzer to estimate the device power.
f
For more information about these power analysis tools, refer to the Understanding and
Evaluating Power in MAX II Devices chapter in the MAX II Device Handbook and the
PowerPlay Power Analysis chapter in volume 3 of the Quartus II Handbook.
Timing Model and Specifications
MAX II devices timing can be analyzed with the Altera Quartus® II software, a variety
of popular industry-standard EDA simulators and timing analyzers, or with the
timing model shown in Figure 5–2.
MAX II devices have predictable internal delays that enable the designer to determine
the worst-case timing of any design. The software provides timing simulation, pointto-point delay prediction, and detailed timing analysis for device-wide performance
evaluation.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–9
Figure 5–2. MAX II Device Timing Model
Output and Output Enable
Data Delay
t R4
tIODR
tIOE
Data-In/LUT Chain
User
Flash
Memory
I/O Pin
INPUT
t LOCAL
I/O Input Delay
t IN
Input Routing
Delay
tDL
Logic Element
t LUT
tCOMB
Register Control
Delay
tC
t FASTIO
tCO
tSU
tH
tPRE
tCLR
Output
Delay
t OD
t XZ
t ZX
I/O Pin
From Adjacent LE
t GLOB
Global Input Delay
Output Routing
Delay
t C4
LUT Delay
Combinational Path Delay
To Adjacent LE
Register Delays
Data-Out
The timing characteristics of any signal path can be derived from the timing model
and parameters of a particular device. External timing parameters, which represent
pin-to-pin timing delays, can be calculated as the sum of internal parameters.
f
Refer to the Understanding Timing in MAX II Devices chapter in the MAX II Device
Handbook for more information.
This section describes and specifies the performance, internal, external, and UFM
timing specifications. All specifications are representative of the worst-case supply
voltage and junction temperature conditions.
Preliminary and Final Timing
Timing models can have either preliminary or final status. The Quartus® II software
issues an informational message during the design compilation if the timing models
are preliminary. Table 5–13 shows the status of the MAX II device timing models.
Preliminary status means the timing model is subject to change. Initially, timing
numbers are created using simulation results, process data, and other known
parameters. These tests are used to make the preliminary numbers as close to the
actual timing parameters as possible.
Final timing numbers are based on actual device operation and testing. These
numbers reflect the actual performance of the device under the worst-case voltage
and junction temperature conditions.
Table 5–13. MAX II Device Timing Model Status
Device
Preliminary
Final
EPM240
—
v
EPM240Z (1)
v
—
EPM570
—
v
EPM570Z (1)
v
—
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–10
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Table 5–13. MAX II Device Timing Model Status
Device
Preliminary
Final
EPM1270
—
v
EPM2210
—
v
Note to Table 5–13:
(1) The MAX IIZ device timing models are only available in the Quartus II software version
8.0 and later.
Performance
Table 5–14 shows the MAX II device performance for some common designs. All
performance values were obtained with the Quartus II software compilation of
megafunctions. Performance values for –3, –4, and –5 speed grades are based on an
EPM1270 device target while –6 and –7 speed grades are based on an EPM570Z device
target.
Table 5–14. MAX II Device Performance
Resources Used
Resource
Used
LE
UFM
Design Size and
Function
Performance
–3
Speed
Grade
–4
Speed
Grade
–5
Speed
Grade
–6
Speed
Grade
–7
Speed
Grade
Unit
184.1
123.5
MHz
Mode
LEs
UFM
Blocks
16-bit counter (1)
—
16
0
304.0
247.5
201.1
64-bit counter (1)
—
64
0
201.5
154.8
125.8
83.2
83.2
MHz
16-to-1 multiplexer
—
11
0
6.0
8.0
9.3
17.4
17.3
ns
32-to-1 multiplexer
—
24
0
7.1
9.0
11.4
12.5
22.8
ns
16-bit XOR function
—
5
0
5.1
6.6
8.2
9.0
15.0
ns
16-bit decoder with
single address line
—
5
0
5.2
6.6
8.2
9.2
15.0
ns
512 × 16
None
3
1
10.0
10.0
10.0
10.0
10.0
MHz
512 × 16
SPI (2)
37
1
8.0
8.0
8.0
9.7
9.7
MHz
512 × 8
Parallel (3)
73
1
(4)
(4)
(4)
(4)
(4)
MHz
512 × 16
I2C (3)
142
1
100 (5)
100 (5)
100 (5)
100 (5)
100 (5)
kHz
Notes to Table 5–14:
(1) This design is a binary loadable up counter.
(2) This design is configured for read-only operation in Extended mode. Read and write ability increases the number of LEs used.
(3) This design is configured for read-only operation. Read and write ability increases the number of LEs used.
(4) This design is asynchronous.
(5) The I2C megafunction is verified in hardware up to 100-kHz serial clock line (SCL) rate.
Internal Timing Parameters
Internal timing parameters are specified on a speed grade basis independent of device
density. Table 5–15 through Table 5–22 describe the MAX II device internal timing
microparameters for logic elements (LEs), input/output elements (IOEs), UFM
structures, and MultiTrack interconnects. The timing values for –3, –4, and –5 speed
grades shown in Table 5–15 through Table 5–22 are based on an EPM1270 device
target, while –6 and –7 speed grade values are based on an EPM570Z device target.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
f
5–11
For more explanations and descriptions about each internal timing microparameters
symbol, refer to the Understanding Timing in MAX II Devices chapter in the MAX II
Device Handbook.
Table 5–15. LE Internal Timing Microparameters
–3 Speed
Grade
Symbol
Parameter
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tLUT
LE combinational LUT
delay
—
571
—
742
—
914
—
1,215
—
2,247
ps
tCOMB
Combinational path delay
—
147
—
192
—
236
—
243
—
305
ps
tCLR
LE register clear delay
238
—
309
—
381
—
401
—
541
—
ps
tPRE
LE register preset delay
238
—
309
—
381
—
401
—
541
—
ps
tSU
LE register setup time
before clock
208
—
271
—
333
—
260
—
319
—
ps
tH
LE register hold time after
clock
0
—
0
—
0
—
0
—
0
—
ps
tCO
LE register clock-to-output
delay
—
235
—
305
—
376
—
380
—
489
ps
tCLKHL
Minimum clock high or low
time
166
—
216
—
266
—
253
—
335
—
ps
tC
Register control delay
—
857
—
1,114
—
1,372
—
1,356
—
1,722
ps
Table 5–16. IOE Internal Timing Microparameters (Part 1 of 2)
–3 Speed
Grade
Symbol
Parameter
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tFASTIO
Data output delay from
adjacent LE to I/O block
—
159
—
207
—
254
—
170
—
348
ps
tIN
I/O input pad and buffer
delay
—
708
—
920
—
1,132
—
907
—
970
ps
tGLOB (1)
I/O input pad and buffer
delay used as global signal
pin
—
1,519
—
1,974
—
2,430
—
2,261
—
2,670
ps
tIOE
Internally generated output
enable delay
—
354
—
374
—
460
—
530
—
966
ps
tDL
Input routing delay
—
224
—
291
—
358
—
318
—
410
ps
tOD (2)
Output delay buffer and pad
delay
—
1,064
—
1,383
—
1,702
—
1,319
—
1,526
ps
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–12
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Table 5–16. IOE Internal Timing Microparameters (Part 2 of 2)
–3 Speed
Grade
Symbol
Parameter
tXZ (3)
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
—
756
—
982
—
1,209
—
1,045
—
1,264
ps
—
1,003
—
1,303
—
1,604
—
1,160
—
1,325
ps
Output buffer disable
delay
tZX (4)
Output buffer enable
delay
Notes to Table 5–16:
(1) Delay numbers for tGLOB differ for each device density and speed grade. The delay numbers for tGLOB, shown in Table 5–16, are based on an
EPM240 device target.
(2) Refer to Table 5–29 and 5–21 for delay adders associated with different I/O standards, drive strengths, and slew rates.
(3) Refer to Table 5–19 and 5–13 for tXZ delay adders associated with different I/O standards, drive strengths, and slew rates.
(4) Refer to Table 5–17 and 5–12 for tZX delay adders associated with different I/O standards, drive strengths, and slew rates.
Table 5–17 through Table 5–20 show the adder delays for tZX and tXZ microparameters
when using an I/O standard other than 3.3-V LVTTL with 16 mA drive strength.
Table 5–17. tZX IOE Microparameter Adders for Fast Slew Rate
–3 Speed
Grade
Standard
–4 Speed
Grade
–5 Speed Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
8 mA
—
0
—
0
—
0
—
0
—
0
ps
4 mA
—
28
—
37
—
45
—
72
—
71
ps
16 mA
—
0
—
0
—
0
—
0
—
0
ps
8 mA
—
28
—
37
—
45
—
72
—
71
ps
2.5-V LVTTL
14 mA
—
14
—
19
—
23
—
75
—
87
ps
7 mA
—
314
—
409
—
503
—
162
—
174
ps
1.8-V LVTTL
6 mA
—
450
—
585
—
720
—
279
—
289
ps
3 mA
—
1,443
—
1,876
—
2,309
—
499
—
508
ps
4 mA
—
1,118
—
1,454
—
1,789
—
580
—
588
ps
2 mA
—
2,410
—
3,133
—
3,856
—
915
—
923
ps
20 mA
—
19
—
25
—
31
—
72
—
71
ps
3.3-V LVCMOS
3.3-V LVTTL
1.5-V LVTTL
3.3-V PCI
Table 5–18. tZX IOE Microparameter Adders for Slow Slew Rate
–3 Speed
Grade
Standard
3.3-V LVCMOS
3.3-V LVTTL
MAX II Device Handbook
–4 Speed Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
8 mA
—
6,350
—
6,050
—
5,749
—
5,951
—
5,952
ps
4 mA
—
9,383
—
9,083
—
8,782
—
6,534
—
6,533
ps
16 mA
—
6,350
—
6,050
—
5,749
—
5,951
—
5,952
ps
8 mA
—
9,383
—
9,083
—
8,782
—
6,534
—
6,533
ps
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–13
Table 5–18. tZX IOE Microparameter Adders for Slow Slew Rate
–3 Speed
Grade
Standard
2.5-V LVTTL
3.3-V PCI
–5 Speed
Grade
–4 Speed Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
14 mA
—
10,412
—
10,112
—
9,811
—
9,110
—
9,105
ps
7 mA
—
13,613
—
13,313
—
13,012
—
9,830
—
9,835
ps
20 mA
—
–75
—
–97
—
–120
—
6,534
—
6,533
ps
Table 5–19. tXZ IOE Microparameter Adders for Fast Slew Rate
–3 Speed
Grade
Standard
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
8 mA
—
0
—
0
—
0
—
0
—
0
ps
4 mA
—
–56
—
–72
—
–89
—
–69
—
–69
ps
16 mA
—
0
—
0
—
0
—
0
—
0
ps
8 mA
—
–56
—
–72
—
–89
—
–69
—
–69
ps
2.5-V LVTTL
14 mA
—
–3
—
–4
—
–5
—
–7
—
–11
ps
7 mA
—
–47
—
–61
—
–75
—
–66
—
–70
ps
1.8-V LVTTL
6 mA
—
119
—
155
—
191
—
45
—
34
ps
3 mA
—
207
—
269
—
331
—
34
—
22
ps
4 mA
—
606
—
788
—
970
—
166
—
154
ps
2 mA
—
673
—
875
—
1,077
—
190
—
177
ps
20 mA
—
71
—
93
—
114
—
–69
—
–69
ps
3.3-V LVCMOS
3.3-V LVTTL
1.5-V LVTTL
3.3-V PCI
Table 5–20. tXZ IOE Microparameter Adders for Slow Slew Rate
–3 Speed
Grade
Standard
3.3-V LVCMOS
3.3-V LVTTL
2.5-V LVTTL
3.3-V PCI
1
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
8 mA
—
206
—
–20
—
–247
—
1,433
—
1,446
ps
4 mA
—
891
—
665
—
438
—
1,332
—
1,345
ps
16 mA
—
206
—
–20
—
–247
—
1,433
—
1,446
ps
8 mA
—
891
—
665
—
438
—
1,332
—
1,345
ps
14 mA
—
222
—
–4
—
–231
—
213
—
208
ps
7 mA
—
943
—
717
—
490
—
166
—
161
ps
20 mA
—
161
—
210
—
258
—
1,332
—
1,345
ps
The default slew rate setting for MAX II device in the Quartus® II design software is
“fast”.
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–14
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Table 5–21. UFM Block Internal Timing Microparameters (Part 1 of 2)
Symbol
Parameter
–3 Speed
Grade
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min Max Min
Max Unit
tACLK
Address register clock period
100
—
100
—
100
—
100
—
100
—
ns
tASU
Address register shift signal setup
to address register clock
20
—
20
—
20
—
20
—
20
—
ns
tAH
Address register shift signal hold to
address register clock
20
—
20
—
20
—
20
—
20
—
ns
tADS
Address register data in setup to
address register clock
20
—
20
—
20
—
20
—
20
—
ns
tADH
Address register data in hold from
address register clock
20
—
20
—
20
—
20
—
20
—
ns
tDCLK
Data register clock period
100
—
100
—
100
—
100
—
100
—
ns
tDSS
Data register shift signal setup to
data register clock
60
—
60
—
60
—
60
—
60
—
ns
tDSH
Data register shift signal hold from
data register clock
20
—
20
—
20
—
20
—
20
—
ns
tDDS
Data register data in setup to data
register clock
20
—
20
—
20
—
20
—
20
—
ns
tDDH
Data register data in hold from data
register clock
20
—
20
—
20
—
20
—
20
—
ns
tDP
Program signal to data clock hold
time
0
—
0
—
0
—
0
—
0
—
ns
tPB
Maximum delay between program
rising edge to UFM busy signal
rising edge
—
960
—
960
—
960
—
960
—
960
ns
tBP
Minimum delay allowed from UFM
busy signal going low to program
signal going low
20
—
20
—
20
—
20
—
20
—
ns
tPPMX
Maximum length of busy pulse
during a program
—
100
—
100
—
100
—
100
—
100
µs
tAE
Minimum erase signal to address
clock hold time
0
—
0
—
0
—
0
—
0
—
ns
tEB
Maximum delay between the erase
rising edge to the UFM busy signal
rising edge
—
960
—
960
—
960
—
960
—
960
ns
tBE
Minimum delay allowed from the
UFM busy signal going low to erase
signal going low
20
—
20
—
20
—
20
—
20
—
ns
tEPMX
Maximum length of busy pulse
during an erase
—
500
—
500
—
500
—
500
—
500
ms
tDCO
Delay from data register clock to
data register output
—
5
—
5
—
5
—
5
—
5
ns
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–15
Table 5–21. UFM Block Internal Timing Microparameters (Part 2 of 2)
Symbol
Parameter
–3 Speed
Grade
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min Max Min
Max Unit
tOE
Delay from data register clock to
data register output
180
—
180
—
180
—
180
—
180
—
ns
tRA
Maximum read access time
—
65
—
65
—
65
—
65
—
65
ns
tOSCS
Maximum delay between the
OSC_ENA rising edge to the
erase/program signal rising edge
250
—
250
—
250
—
250
—
250
—
ns
tOSCH
Minimum delay allowed from the
erase/program signal going low to
OSC_ENA signal going low
250
—
250
—
250
—
250
—
250
—
ns
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–16
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Figure 5–3 through Figure 5–5 show the read, program, and erase waveforms for
UFM block timing parameters shown in Table 5–21.
Figure 5–3. UFM Read Waveforms
ARShft
tASU
tACLK
9 Address Bits tAH
ARClk
tADH
ARDin
DRShft
tADS
tDSS
DRClk
tDCLK 16 Data Bits
tDSH
tDCO
DRDin
DRDout
OSC_ENA
Program
Erase
Busy
Figure 5–4. UFM Program Waveforms
ARShft
tASU
ARClk
9 Address Bits
tACLK
tAH
tADH
ARDin
DRShft
tADS
tDSS
16 Data Bits
tDCLK
tDSH
DRClk
DRDin
DRDout
tDDS
tDDH
tOSCS
tOSCH
OSC_ENA
Program
Erase
tPB
tBP
Busy
tPPMX
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–17
Figure 5–5. UFM Erase Waveform
ARShft
tASU
tACLK
9 Address Bits
ARClk
tAH
tADH
ARDin
tADS
DRShft
DRClk
DRDin
DRDout
OSC_ENA
tOSCS
Program
tOSCH
Erase
tEB
Busy
tBE
tEPMX
Table 5–22. Routing Delay Internal Timing Microparameters
–3 Speed
Grade
Routing
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tC4
—
429
—
556
—
687
—
(1)
—
(1)
ps
tR4
—
326
—
423
—
521
—
(1)
—
(1)
ps
tLOCAL
—
330
—
429
—
529
—
(1)
—
(1)
ps
Note to Table 5–22:
(1) The numbers will only be available in a later revision.
External Timing Parameters
External timing parameters are specified by device density and speed grade. All
external I/O timing parameters shown are for the 3.3-V LVTTL I/O standard with the
maximum drive strength and fast slew rate. For external I/O timing using standards
other than LVTTL or for different drive strengths, use the I/O standard input and
output delay adders in Table 5–27 through Table 5–28.
f
For more information about each external timing parameters symbol, refer to the
Understanding Timing in MAX II Devices chapter in the MAX II Device Handbook.
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–18
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Table 5–23 shows the external I/O timing parameters for EPM240 devices.
Table 5–23. EPM240 Global Clock External I/O Timing Parameters
–3 Speed
Grade
Symbol
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Parameter
Condition
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tPD1
Worst case
pin-to-pin
delay through
1 look-up
table (LUT)
10 pF
—
4.7
—
6.1
—
7.5
—
7.9
—
12.0
ns
tPD2
Best case pinto-pin delay
through
1 LUT
10 pF
—
3.7
—
4.8
—
5.9
—
5.8
—
7.8
ns
tSU
Global clock
setup time
—
1.7
—
2.2
—
2.7
—
2.8
—
4.7
—
ns
tH
Global clock
hold time
—
0.0
—
0.0
—
0.0
—
0
—
0
—
ns
tCO
Global clock
to output
delay
10 pF
2.0
4.3
2.0
5.6
2.0
6.9
2.0
7.7
2.0
10.5
ns
tCH
Global clock
high time
—
166
—
216
—
266
—
253
—
335
—
ps
tCL
Global clock
low time
—
166
—
216
—
266
—
253
—
335
—
ps
tCNT
Minimum
global clock
period for
16-bit counter
—
3.3
—
4.0
—
5.0
—
5.4
—
8.1
—
ns
fCNT
Maximum
global clock
frequency for
16-bit counter
—
—
304.0
(1)
—
247.5
—
201.1
—
184.1
—
123.5
MHz
Note to Table 5–23:
(1) The maximum frequency is limited by the I/O standard on the clock input pin. The 16-bit counter critical delay performs faster than this global
clock input pin maximum frequency.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–19
Table 5–24 shows the external I/O timing parameters for EPM570 devices.
Table 5–24. EPM570 Global Clock External I/O Timing Parameters
–3 Speed
Grade
Symbol
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Parameter
Condition
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tPD1
Worst case pin-to-pin
delay through 1 lookup table (LUT)
10 pF
—
5.4
—
7.0
—
8.7
—
9.5
—
15.1
ns
tPD2
Best case pin-to-pin
delay through 1 LUT
10 pF
—
3.7
—
4.8
—
5.9
—
5.7
—
7.7
ns
tSU
Global clock setup
time
—
1.2
—
1.5
—
1.9
—
2.6
—
4.5
—
ns
tH
Global clock hold
time
—
0.0
—
0.0
—
0.0
—
0
—
0
—
ns
tCO
Global clock to
output delay
10 pF
2.0
4.5
2.0
5.8
2.0
7.1
2.0
6.1
2.0
7.6
ns
tCH
Global clock high
time
—
166
—
216
—
266
—
253
—
335
—
ps
tCL
Global clock low time
—
166
—
216
—
266
—
253
—
335
—
ps
tCNT
Minimum global
clock period for
16-bit counter
—
3.3
—
4.0
—
5.0
—
5.4
—
8.1
—
ns
fCNT
Maximum global
clock frequency for
16-bit counter
—
—
304.0
(1)
—
247.5
—
201.1
—
184.1
—
123.5
MHz
Note to Table 5–24:
(1) The maximum frequency is limited by the I/O standard on the clock input pin. The 16-bit counter critical delay performs faster than this global clock
input pin maximum frequency.
Table 5–25 shows the external I/O timing parameters for EPM1270 devices.
Table 5–25. EPM1270 Global Clock External I/O Timing Parameters (Part 1 of 2)
–3 Speed Grade
Symbol
Parameter
–4 Speed Grade
–5 Speed Grade
Condition
Min
Max
Min
Max
Min
Max
Unit
tPD1
Worst case pin-to-pin
delay through 1 look-up
table (LUT)
10 pF
—
6.2
—
8.1
—
10.0
ns
tPD2
Best case pin-to-pin
delay through 1 LUT
10 pF
—
3.7
—
4.8
—
5.9
ns
tSU
Global clock setup time
—
1.2
—
1.5
—
1.9
—
ns
tH
Global clock hold time
—
0.0
—
0.0
—
0.0
—
ns
tCO
Global clock to output
delay
10 pF
2.0
4.6
2.0
5.9
2.0
7.3
ns
tCH
Global clock high time
—
166
—
216
—
266
—
ps
tCL
Global clock low time
—
166
—
216
—
266
—
ps
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–20
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Table 5–25. EPM1270 Global Clock External I/O Timing Parameters (Part 2 of 2)
–3 Speed Grade
Symbol
Parameter
–4 Speed Grade
–5 Speed Grade
Condition
Min
Max
Min
Max
Min
Max
Unit
tCNT
Minimum global clock
period for
16-bit counter
—
3.3
—
4.0
—
5.0
—
ns
fCNT
Maximum global clock
frequency for 16-bit
counter
—
—
304.0 (1)
—
247.5
—
201.1
MHz
Note to Table 5–25:
(1) The maximum frequency is limited by the I/O standard on the clock input pin. The 16-bit counter critical delay performs faster than this global
clock input pin maximum frequency.
Table 5–26 shows the external I/O timing parameters for EPM2210 devices.
Table 5–26. EPM2210 Global Clock External I/O Timing Parameters
–3 Speed Grade
Symbol
–4 Speed Grade
–5 Speed Grade
Parameter
Condition
Min
Max
Min
Max
Min
Max
Unit
tPD1
Worst case pin-to-pin delay
through 1 look-up table
(LUT)
10 pF
—
7.0
—
9.1
—
11.2
ns
tPD2
Best case pin-to-pin delay
through 1 LUT
10 pF
—
3.7
—
4.8
—
5.9
ns
tSU
Global clock setup time
—
1.2
—
1.5
—
1.9
—
ns
tH
Global clock hold time
—
0.0
—
0.0
—
0.0
—
ns
tCO
Global clock to output delay
10 pF
2.0
4.6
2.0
6.0
2.0
7.4
ns
tCH
Global clock high time
—
166
—
216
—
266
—
ps
tCL
Global clock low time
—
166
—
216
—
266
—
ps
tCNT
Minimum global clock
period for
16-bit counter
—
3.3
—
4.0
—
5.0
—
ns
fCNT
Maximum global clock
frequency for 16-bit counter
—
—
304.0
(1)
—
247.5
—
201.1
MHz
Note to Table 5–26:
(1) The maximum frequency is limited by the I/O standard on the clock input pin. The 16-bit counter critical delay performs faster than this global
clock input pin maximum frequency.
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–21
External Timing I/O Delay Adders
The I/O delay timing parameters for I/O standard input and output adders, and
input delays are specified by speed grade independent of device density.
Table 5–27 through Table 5–28 show the adder delays associated with I/O pins for all
packages. The delay numbers for –3, –4, and –5 speed grades shown in Table 5–27
through Table 5–30 are based on an EPM1270 device target, while –6 and –7 speed
grade values are based on an EPM570Z device target. If an I/O standard other than
3.3-V LVTTL is selected, add the input delay adder to the external tSU timing
parameters shown in Table 5–23 through Table 5–26. If an I/O standard other than
3.3-V LVTTL with 16 mA drive strength and fast slew rate is selected, add the output
delay adder to the external tCO and tPD shown in Table 5–23 through Table 5–26.
Table 5–27. External Timing Input Delay Adders
–3 Speed
Grade
Standard
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Without Schmitt
Trigger
—
0
—
0
—
0
—
0
—
0
ps
With
—
334
—
434
—
535
—
387
—
434
ps
Without Schmitt
Trigger
—
0
—
0
—
0
—
0
—
0
ps
With
—
334
—
434
—
535
—
387
—
434
ps
Without Schmitt
Trigger
—
23
—
30
—
37
—
42
—
43
ps
With Schmitt
Trigger
—
339
—
441
—
543
—
429
—
476
ps
1.8-V LVTTL
Without Schmitt
Trigger
—
291
—
378
—
466
—
378
—
373
ps
1.5-V LVTTL
Without Schmitt
Trigger
—
681
—
885
—
1,090
—
681
—
622
ps
3.3-V PCI
Without Schmitt
Trigger
—
0
—
0
—
0
—
0
—
0
ps
3.3-V LVTTL
Schmitt Trigger
3.3-V
LVCMOS
Schmitt Trigger
2.5-V LVTTL
Table 5–28. MAX II IOE Programmable Delays
–3 Speed
Grade
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Parameter
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Unit
Input Delay from Pin to Internal
Cells = 1
—
1,225
—
1,592
—
1,960
—
1,858
—
2,171
ps
Input Delay from Pin to Internal
Cells = 0
—
89
—
115
—
142
—
569
—
609
ps
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–22
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
Maximum Input and Output Clock Rates
Table 5–29 and Table 5–30 show the maximum input and output clock rates for
standard I/O pins in MAX II devices.
Table 5–29. MAX II Maximum Input Clock Rate for I/O
–3 Speed
Grade
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Unit
Without Schmitt
Trigger
304
304
304
304
304
MHz
With Schmitt
Trigger
250
250
250
250
250
MHz
Without Schmitt
Trigger
304
304
304
304
304
MHz
With Schmitt
Trigger
250
250
250
250
250
MHz
Without Schmitt
Trigger
220
220
220
220
220
MHz
With Schmitt
Trigger
188
188
188
188
188
MHz
Without Schmitt
Trigger
220
220
220
220
220
MHz
With Schmitt
Trigger
188
188
188
188
188
MHz
1.8-V LVTTL
Without Schmitt
Trigger
200
200
200
200
200
MHz
1.8-V LVCMOS
Without Schmitt
Trigger
200
200
200
200
200
MHz
1.5-V LVCMOS
Without Schmitt
Trigger
150
150
150
150
150
MHz
3.3-V PCI
Without Schmitt
Trigger
304
304
304
304
304
MHz
Standard
3.3-V LVTTL
3.3-V LVCMOS
2.5-V LVTTL
2.5-V LVCMOS
Table 5–30. MAX II Maximum Output Clock Rate for I/O
Standard
–3 Speed
Grade
–4 Speed
Grade
–5 Speed
Grade
–6 Speed
Grade
–7 Speed
Grade
Unit
3.3-V LVTTL
304
304
304
304
304
MHz
3.3-V LVCMOS
304
304
304
304
304
MHz
2.5-V LVTTL
220
220
220
220
220
MHz
2.5-V LVCMOS
220
220
220
220
220
MHz
1.8-V LVTTL
200
200
200
200
200
MHz
1.8-V LVCMOS
200
200
200
200
200
MHz
1.5-V LVCMOS
150
150
150
150
150
MHz
3.3-V PCI
304
304
304
304
304
MHz
MAX II Device Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Timing Model and Specifications
5–23
JTAG Timing Specifications
Figure 5–6 shows the timing waveforms for the JTAG signals.
Figure 5–6. MAX II JTAG Timing Waveforms
TMS
TDI
tJCP
tJCH
tJPH
tJPSU
tJCL
TCK
tJPZX
tJPCO
tJPXZ
TDO
tJSSU
Signal
to be
Captured
tJSH
tJSZX
tJSCO
tJSXZ
Signal
to be
Driven
Table 5–31 shows the JTAG Timing parameters and values for MAX II devices.
Table 5–31. MAX II JTAG Timing Parameters (Part 1 of 2)
Symbol
Min
Max
Unit
TCK clock period for VCCIO1 = 3.3 V
55.5
—
ns
TCK clock period for VCCIO1 = 2.5 V
62.5
—
ns
TCK clock period for VCCIO1 = 1.8 V
100
—
ns
TCK clock period for VCCIO1 = 1.5 V
143
—
ns
tJCH
TCK clock high time
20
—
ns
tJCL
TCK clock low time
20
—
ns
tJPSU
JTAG port setup time (2)
8
—
ns
tJPH
JTAG port hold time
10
—
ns
tJPCO
JTAG port clock to output (2)
—
15
ns
tJPZX
JTAG port high impedance to valid output (2)
—
15
ns
tJPXZ
JTAG port valid output to high impedance (2)
—
15
ns
tJSSU
Capture register setup time
8
—
ns
tJSH
Capture register hold time
10
—
ns
tJSCO
Update register clock to output
—
25
ns
tJCP (1)
Parameter
© Novermber 2008 Altera Corporation
MAX II Device Handbook
5–24
Chapter 5: DC and Switching Characteristics
Referenced Documents
Table 5–31. MAX II JTAG Timing Parameters (Part 2 of 2)
Symbol
Parameter
Min
Max
Unit
tJSZX
Update register high impedance to valid output
—
25
ns
tJSXZ
Update register valid output to high impedance
—
25
ns
Notes to Table 5–31:
(1) Minimum clock period specified for 10 pF load on the TDO pin. Larger loads on TDO will degrade the maximum TCK
frequency.
(2) This specification is shown for 3.3-V LVTTL/LVCMOS and 2.5-V LVTTL/LVCMOS operation of the JTAG pins. For 1.8-V
LVTTL/LVCMOS and 1.5-V LVCMOS, the tJPSU minimum is 6 ns and tJPCO, tJPZX, and tJPXZ are maximum values at 35 ns.
Referenced Documents
This chapter references the following documents:
MAX II Device Handbook
■
I/O Structure section in the MAX II Architecture chapter in the MAX II Device
Handbook
■
Hot Socketing and Power-On Reset in MAX II Devices chapter in the MAX II Device
Handbook
■
Operating Requirements for Altera Devices Data Sheet
■
PowerPlay Power Analysis chapter in volume 3 of the Quartus II Handbook
■
Understanding and Evaluating Power in MAX II Devices chapter in the MAX II Device
Handbook
■
Understanding Timing in MAX II Devices chapter in the MAX II Device Handbook
■
Using MAX II Devices in Multi-Voltage Systems chapter in the MAX II Device
Handbook
© Novermber 2008 Altera Corporation
Chapter 5: DC and Switching Characteristics
Document Revision History
5–25
Document Revision History
Table 5–32 shows the revision history for this chapter.
Table 5–32. Document Revision History (Part 1 of 2)
Date and Revision
Changes Made
November 2008,
version 2.4
■
Updated Table 5–2.
■
Updated “Internal Timing Parameters” section.
October 2008,
version 2.3
■
Updated New Document Format.
■
Updated Figure 5–1.
July 2008,
version 2.2
■
Updated Table 5–14 , Table 5–23 , and Table 5–24.
—
March 2008,
version 2.1
■
Added (Note 5) to Table 5–4.
—
December 2007,
version 2.0
■
Updated (Note 3) and (4) to Table 5–1.
■
Updated Table 5–2 and added (Note 5).
■
Updated ICCSTANDBY and ICCPOWERUP information and added
IPULLUP information in Table 5–4.
■
Added (Note 1) to Table 5–10.
■
Updated Figure 5–2.
■
Added (Note 1) to Table 5–13.
■
Updated Table 5–13 through Table 5–24, and Table 5–27 through
Table 5–30.
■
Added tCOMB information to Table 5–15.
■
Updated Figure 5–6.
■
Added “Referenced Documents” section.
December 2006,
version 1.8
■
Added note to Table 5–1.
■
Added document revision history.
July 2006,
version 1.7
■
Minor content and table updates.
—
February 2006,
version 1.6
■
Updated “External Timing I/O Delay Adders” section.
—
■
Updated Table 5–29.
■
Updated Table 5–30.
November 2005,
version 1.5
■
Updated Tables 5-2, 5-4, and 5-12.
—
August 2005,
version 1.4
■
Updated Figure 5-1.
—
■
Updated Tables 5-13, 5-16, and 5-26.
■
Removed Note 1 from Table 5-12.
■
Updated the RPULLUP parameter in Table 5-4.
■
Added Note 2 to Tables 5-8 and 5-9.
■
Updated Table 5-13.
■
Added “Output Drive Characteristics” section.
■
Added I2C mode and Notes 5 and 6 to Table 5-14.
■
Updated timing values to Tables 5-14 through 5-33.
June 2005,
version 1.3
© Novermber 2008 Altera Corporation
Summary of Changes
—
—
Updated document with
MAX IIZ information.
—
—
MAX II Device Handbook
5–26
Chapter 5: DC and Switching Characteristics
Document Revision History
Table 5–32. Document Revision History (Part 2 of 2)
Date and Revision
Changes Made
December 2004,
version 1.2
■
Updated timing Tables 5-2, 5-4, 5-12, and Tables 15-14 through 5-34.
■
Table 5-31 is new.
June 2004,
version 1.1
■
Updated timing Tables 5-15 through 5-32.
MAX II Device Handbook
Summary of Changes
—
—
© Novermber 2008 Altera Corporation
6. Reference and Ordering Information
MII51006-1.5
Software
MAX® II devices are supported by the Altera® Quartus® II design software with new,
optional MAX+PLUS® II look and feel, which provides HDL and schematic design
entry, compilation and logic synthesis, full simulation and advanced timing analysis,
and device programming. Refer to the Design Software Selector Guide for more
details about the Quartus II software features.
The Quartus II software supports the Windows XP/2000/NT, Sun Solaris, Linux Red
Hat v8.0, and HP-UX operating systems. It also supports seamless integration with
industry-leading EDA tools through the NativeLink® interface.
Device Pin-Outs
Printed device pin-outs for MAX II devices are available on the Altera website
(www.altera.com).
Ordering Information
Figure 6–1 describes the ordering codes for MAX II devices. For more information
about a specific package, refer to the Package Information chapter in the MAX II Device
Handbook.
Figure 6–1. MAX II Device Packaging Ordering Information
EPM
240
G
T
100
C
3
ES
Family Signature
EPM:
Optional Suffix
MAX II
Indicates specific device
options or shipment method
ES: Engineering sample
N: Lead-free packaging
Device Type
240:
570:
1270:
2210:
240 Logic Elements
570 Logic Elements
1,270 Logic Elements
2,210 Logic Elements
Speed Grade
3, 4, 5, 6, or 7, with 3 being the fastest
Product-Line Suffix
Operating Temperature
Indicates device type
G:
1.8-V VCCINT low-power device
Z:
1.8-V VCCINT zero-power device
Blank (no identifier):
2.5-V or 3.3-V VCCINT device
C:
I:
A:
Commercial temperature (TJ = 0° C to 85° C)
Industrial temperature (TJ = -40° C to 100° C)
Automotive temperature (TJ = -40° C to 125° C)
Package Type
T: Thin quad flat pack (TQFP)
F: FineLine BGA
M: Micro FineLine BGA
Pin Count
Number of pins for a particular package
© October 2008
Altera Corporation
MAX II Device Handbook
6–2
Chapter 6: Reference and Ordering Information
Referenced Documents
Referenced Documents
This chapter references the following document:
■
Package Information chapter in the MAX II Device Handbook
Document Revision History
Table 6–1 shows the revision history for this chapter.
Table 6–1. Document Revision History
Date and Revision
Changes Made
October 2008,
version 1.5
■
Updated New Document Format.
December 2007,
version 1.4
■
Added “Referenced Documents” section.
■
Updated Figure 6–1.
December 2006,
version 1.3
■
Added document revision history.
—
October 2006,
version 1.2
■
Updated Figure 6-1.
—
June 2005,
version 1.1
■
Removed Dual Marking section.
—
MAX II Device Handbook
Summary of Changes
—
Updated document with
MAX IIZ information.
© October 2008 Altera Corporation