EGP50A THRU EGP50G GLASS PASSIVATED FAST EFFICIENT RECTIFIER E D * Reverse Voltage - 50 to 400 Volts P A T E N T Case Style GP20 1.0 (25.4) MIN. 0.210 (5.3) 0.190 (4.8) DIA. ® 0.375 (9.5) 0.285 (7.2) Forward Current - 5.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratories Flammability Classification 94V-0 ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Low leakage current ♦ High surge current capability ♦ High temperature metallurgically bonded construction ♦ High temperature soldering guaranteed: 300°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension 1.0 (25.4) MIN. MECHANICAL DATA 0.042 (1.07) 0.037 (0.94) DIA. Dimensions in inches and (millimeters) * Glass-plastic encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 Case: Molded plastic over solid glass body Terminals: Axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.03 ounce, 0.8 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS EGP 50A EGP 50B EGP 50C EGP 50D EGP 50F EGP 50G UNITS Maximum recurrent peak reverse voltage VRRM 50 100 150 200 300 400 Volts Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts Maximum DC blocking voltage VDC 50 100 150 200 300 400 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=55°C I(AV) 5.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load IFSM 150.0 Amps Maximum instantaneous forward voltage at 5.0A Maximum DC reverse current at rated DC blocking voltage TA=25°C TA=125°C Maximum reverse recovery time (NOTE 1) Typical thermal resistance (NOTE 2) Typical junction capacitance (NOTE 3) Operating junction and storage temperature range VF 1.25 Volts 5.0 50.0 µA trr 50.0 ns RΘJA RΘJL 20.0 5.0 °C\W IR CJ TJ, TSTG NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Thermal resistance from junction to ambient and from junction of lead at 0.375” (9.5mm) lead length, both leads measured attached to heat sinks (3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts 4/98 0.95 95 75 -65 to +150 pF °C RATINGS AND CHARACTERISTIC CURVES EGP50A THRU EGP50G FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT FIG. 1 - MAXIMUM FORWARD CURRENT DERATING CURVE 175 RESISTIVE OR INDUCTIVE LOAD PEAK FORWARD SURGE CURRENT, AMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES 6.0 5.0 4.0 COPPER HEATSINKS 3.0 2.0 L TL 0.375" (9.5mm) 1.0 0 0 25 50 75 100 125 150 175 TJ=TJ max. 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 150 125 100 75 50 25 LEAD TEMPERATURE, °C 0 1 10 100 NUMBER OF CYCLES AT 60 HZ FIG. 4 - TYPICAL REVERSE LEAKAGE CHARACTERISTICS FIG. 3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS PULSE WIDTH=300µs 1% DUTY CYCLE INSTANTANEOUS REVERSE LEAKAGE CURRENT, MICROAMPERES INSTANTANEOUS FORWARD CURRENT, AMPERES 50 100 10 TJ=150°C 1 TJ=25°C 0.1 TJ=150°C 10 TJ=125°C 1 TJ=75°C 0.1 0.01 EGP50A - EGP50D EGP50F & EGP50G 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TJ=25°C 1.8 0.001 0 INSTANTANEOUS FORWARD VOLTAGE, VOLTS 120 90 60 0 0.1 EGP50A-EGP50D EGP50F & EGP50G 1 10 100 REVERSE VOLTAGE, VOLTS 1,000 TRANSIENT THERMAL IMPEDANCE, °CW JUNCTION CAPACITANCE, pF 150 30 60 80 100 FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE TJ=25°C f=1.0 MHZ Vsig=50mVp-p 180 40 PERCENT OF RATED PEAK REVERSE VOLTAGE, % FIG. 5 - TYPICAL JUNCTION CAPACITANCE 210 20 100 10 1 1.0 0.1 0.01 0.1 1 10 t, PULSE DURATION, sec. 100