AIC AIC1085 3a low dropout positive regulator Datasheet

AIC1085
3A Low Dropout Positive Regulator
 FEATURES
 DESCRIPTION

Dropout Voltage 1.3V at 3A Output Current.
The AIC1085 is a low dropout three terminal

Fast Transient Response.
regulator with 3A output current capability. The

Extremely Tight Line and Load Regulation.
output voltage is adjustable with the use of a

Current Limiting and Thermal Protection.
resistor divider or fixed 1.8V, 2.5V and 3.3V.

Adjustable Output Voltage or Fixed 1.8V, 2.5V
Dropout voltage is guaranteed to be at a maximum
and 3.3V.
of 1.4V with the maximum output current. Its low
Standard 3-Pin Power Packages.
dropout voltage and fast transient response make

 APPLICATIONS
it ideal for low voltage microprocessor applications.

Mother Board I/O Power Supplies.

Microprocessor Power Supplies.

High Current Regulator.

Post Regulator for Switching Supply.
Current limiting and thermal protection provides
protection against any overload condition that
would create excessive junction temperatures.
 TYPICAL APPLICATION CIRCUIT
3
VIN
5V
AIC1085
2
1 ADJ
C1 +
10F
VOUT
3.3V
RF1
125
+
1%
C2
RF2
10F
205
(Note1)
1%
VREF
VREF  VOUT  VADJ  1.25V (typ.)
RF2 

VOUT  VREF  1 
  I ADJ  RF2
RF1 

I ADJ  55 A (typ.)
(1) C1 needed if device is far away from
filter capacitors.
(2) C2 required for stability.
Adjustable Voltage Regulator
3
VIN
5V
AIC1085-33
2
VOUT
3.3V
1
+
C2
10F
C1 +
10F
GND
(Note1)
Fixed Voltage Regulator
Analog Integrations Corporation
Si-Soft Research Center
DS-1085G-02 130802
st
3A1, 1 Li-Hsin 1 Rd., Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1085

ORDERING INFORMATION
AIC1085-XXXXXX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
TO-252 (CE&PE&GE)
TOP VIEW
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
PACKAGING TYPE
E: TO-252
M: TO-263
T: TO-220
C: COMMERCIAL
P: LEAD FREE COMMERCIAL
G: GREEN PACKAGE
OUTPUT VOLTAGE
DEFAULT: ADJUSTABLE
18: 1.8V
25: 2.5V
33: 3.3V
Example: AIC1085-18GETR
 1.8V version in TO-252 Green
Package & Taping & Reel Packing
1
2
3
2
3
TO-263 (CM&PM&GM)
TOP VIEW
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
1
TO-220 (CT&PT&GT)
FRONT VIEW
1: ADJ (GND)
2: VOUT (TAB)
3: VIN
1 2 3
Type
AIC1085-18GMTR

1.8V version in TO-263 Green
Package & Taping & Reel Packing
 ABSOLUTE MAXIMUM RATINGS
VIN pin to ADJ/ GND pin
7V
-40C to 85C
Operating Temperature Range
-65C to 150C
Storage Temperature Range
Maximum Junction Temperature
125C
Lead Temperature (Soldering, 10 sec)
260C
Thermal Resistance Junction to Case
TO-252
TO-263, TO-220
12.5C/W
3C /W
TO-252
100C/W
(Assume no ambient airflow, no heatsink) TO-263
60C /W
TO-220
50C /W
Thermal Resistance Junction to Ambient
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
2
AIC1085
 TEST CIRCUIT
Refer to TYPICAL APPLICATION CIRCUIT.

ELECTRICAL CHARACTERISTICS
(VIN=5V, TJ=25C, IO=10mA, unless otherwise specified) (Note2)
PARAMETER
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Reference Voltage (VOUT -VADJ)
AIC1085 (ADJ)
1.238
1.25
1.262
V
Output Voltage
AIC1085-18, VIN=5V
AIC1085-25, VIN=5V
AIC1085-33, VIN=5V
1.78
2.47
3.26
1.80
2.50
3.30
1.82
2.53
3.34
V
0.015
0.2
%
0.6
%
1.4
V
Line Regulation
ADJ: 2.65V VIN 7V,
VOUT=1.25V
Fix : VOUT+1.4V VIN 7V
Load Regulation
Dropout Voltage
10mA < IO < 3A
VOUT, VREF=1%
1.3
10mA  IO 3A
Current Limit
3
4
A
GND Current (Fix)
2.65V  VIN  7V
11.5
14
mA
Adjusted Pin Current (IADJ)
2.65V  VIN  7V
55
120
A
Adjusted Pin Current Change
(IADJ)
2.65V  VIN  7V
0.2
5
A
Temperature Stability
IO=0.5A
0.5
Minimum Load Current
5
RMS Output Noise (% of VOUT)
10Hz  f  10KHz
Ripple Rejection Ratio
120Hz input ripple
COUT=25F
(VIN-VOUT)=3V
Thermal Shutdown Temperature
Note 3
60
%
10
mA
0.003
%
72
dB
165
C
Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic
capacitor is not suggested.
Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note 3: Guarantee by design.
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AIC1085
 TYPICAL PERFORMANCE CHARACTERISTICS
Output Voltage
(mV, AC)
Output Voltage
(V, AC)
0.1
0.05
0
-0.05
VIN=5V
CIN=1F
COUT=10F (Tantalum)
VOUT=3.3V
0.1A
40
80
120
--50
--100
1.5A
0
0
160
CIN=1V (Tantalum)
COUT=10F (Tantalum)
Input Voltage (V)
Load Current
-0.1
50
VOUT=3.3V
7.0
6.0
0
200
10
Time (S)
30
40
50
Time (S)
Fig. 2 Line Transient Response
Fig. 1 Load Transient Response
1.22
5
Minimum Operating Current (mA)
Minimum Differential Voltage (V)
20
1.20
1.18
1.16
1.14
1.12
1.10
1.08
1.06
0.0
0.5
1.0
1.5
2.0
2.5
4
3
2
1
0
3.0
Output Current (A)
1
2
3
4
5
6
7
8
9
Differential Voltage (V)
Fig. 4 Minimum Operating Current
Fig. 3 Dropout Voltage (VOUT=3.3V)
-20
Ripple Rejection Ratio (dB)
COUT=3.3F
-30
-40
COUT=10F
-50
-60
-70
COUT=25F
-80
1
10
2
10
3
10
4
10
5
10
6
10
7
10
Frequency (Hz)
Fig. 5
AIC1085 (ADJ.) Ripple Rejection
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AIC1085
 BLOCK DIAGRAM
VIN
+
GM
VREF +
1.25V
Current Amp.
-
Thermal
Limit
Current
Limit
55A
VOUT
For fixed voltage
device
ADJ
GND
 PIN DESCRIPTIONS
ADJ PIN
-
Providing VREF=1.25V (typ.) for adjustable VOUT. VREF=VOUT-VADJ and IADJ=55A (typ.)
(GND PIN - Power Ground.)
VOUT PIN -
Adjustable output voltage.
VIN PIN
Power Input.
-
5
AIC1085
 APPLICATION INFORMATION
mounting pad configuration on the PCB, the
board material, and the ambient temperature.
When the IC mounting with good thermal
conductivity is used, the junction temperature
will be low even when large power dissipation
applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
(T
- TA )
PMAX  J-max
Rθ JA
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability. Input capacitor at
10F with a 10F aluminum electrolytic output
capacitor is recommended.
POWER DISSIPATION
The AIC1085 obtains thermal-limiting circuitry,
which is designed to protect the device against
overload condition. For continuous load
condition, maximum rating of junction
temperature must not be exceeded. It is
important to pay more attention in thermal
resistance. It includes junction to case, junction
to ambient. The maximum power dissipation of
AIC1085 depends on the thermal resistance of
its case and circuit board, the temperature
difference between the die junction and ambient
air, and the rate of airflow. The rate of
temperature rise is greatly affected by the
Where TJ-max is the maximum allowable junction
temperature (125C), and TA is the ambient
temperature suitable in application.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
 APPLICATION EXAMPLES
3
Vin
5V
AIC1085
+ C1
MMBT2222A
R4
1k
+
3
Vin
5V
Vout
3.3V
R1
125
1 ADJ
10uF
R3
1k
TTL
2
+
C2
10uF
2
AIC1085
R1
125
1 ADJ
C1
10uF
+
C2
100uF
R2
205
Cadj
R2
205
Vout
3.3V
* Cadj can improve ripple rejection
Fig. 5 VOUT=3.3V with Shutdown
3
Vin
5V
+
C1
10uF
AIC1085
1 ADJ
2
R1
125
Fig. 6 Improving Ripple Rejection
Vout
1.25V
T1
D1
3
Vin
+ C2
10uF
+
C1
10uF
AIC1085-33
2
1
FLOATING INPUT
Fig. 7 VOUT=1.25V Application Circuit
+
C2
100uF
Vout
-3.3V
Fig. 8 Low Dropout Negative Supply
6
AIC1085
 PHYSICAL DIMENSIONS

TO-252 (unit: mm)
A
E
c2
E1
THERMAL PAD
L4
H
D
D1
L3
b3
A
A
e
SEE VIEW B
S
Y
M
B
O
L
b
c
WITH PLATING
BASE METAL
SECTION A-A

GAUGE PLANE
SEATING PLANE
L1
VIEW B
A1
L2
L
TO-252-3L
MILLIMETERS
MIN.
MAX.
A
2.19
2.38
A1
0.00
0.13
b
0.64
0.89
b3
4.95
5.46
c
0.46
0.61
c2
0.46
0.89
D
5.33
6.22
D1
4.60
6.00
E
6.35
6.73
E1
3.90
e
5.46
2.28 BSC
H
9.40
L
1.40
L1
10.41
1.78
2.67 REF
0.51 BSC
L2
L3
0.89
2.03
L4
--
1.02

0°
8°
Note: 1. Refer to JEDEC TO-252AA and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
7
AIC1085

TO-263 (unit: mm)
A
c2
E1
THERMAL PAD
L2
H
D
D1
L1
E
A
b2
A
e
SEE VIEW B
b
c
WITH PLATING
BASE METAL
SECTION A-A

L
VIEW B
SEATING PLANE
A1
L3
GAUGE PLANE
Note: 1. Refer to JEDEC TO-263AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
TO-263-3L
MILLIMETERS
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
b2
1.14
1.78
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
D1
6.86
--
E
9.65
10.67
E1
6.23
e
-2.54 BSC
H
14.61
15.88
L
1.78
2.79
L1
--
1.68
L2
--
θ
1.78
0.25 BSC
L3
0°
8°
8
AIC1085

TO-2220 (unit: mm)
A
A1
E1
THERMAL PAD
H1
Q
E
L
L1
D1
D
D2
P
A
b2
A
e
S
Y
M
B
O
L
A2
b
c
WITH PLATING
BASE METAL
SECTION A-A
Note: 1. Refer to JEDEC TO-220AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-220
MILLIMETERS
MIN.
MAX.
A
3.56
4.82
A1
0.51
1.39
A2
2.04
2.92
b
0.38
1.01
b2
1.15
1.77
c
0.35
0.61
D
14.23
16.51
D1
8.38
9.02
D2
11.75
12.88
E
9.66
10.66
E1
6.86
e
H1
L
8.90
2.54 BSC
5.85
6.85
12.70
14.73
L1
--
6.35
P
3.54
4.08
Q
2.54
3.42
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than
circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We
reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are
devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
9