AUTOMOTIVE GRADE
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
HEXFET® POWER MOSFET
VDSS
AUIRFN8405
PQFN 5mm x 6mm
1.6m
max
Applications
Electric Power Steering (EPS)
Battery Switch
Start/Stop Micro Hybrid
Heavy Loads
DC-DC Converter
Package Type
40V
RDS(on) typ.
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a 175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These features
combine to make this product an extremely efficient and
reliable device for use in Automotive and wide variety of
other applications.
Base Part Number
AUIRFN8405
ID (Silicon Limited)
2.0m
187A
ID (Package Limited)
95A
PQFN 5X6 mm
G
D
S
Gate
Drain
Source
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number
AUIRFN8405TR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
ID @ TC(Bottom) = 25°C
ID @ TC(Bottom) = 100°C
ID @ TC = 25°C
IDM
PD @TA = 25°C
PD @TC(Bottom) = 25°C
VGS
TJ
TSTG
Parameter
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Operating Junction and
Storage Temperature Range
Max.
187
132
95
670
3.3
136
0.022
± 20
-55 to + 175
Units
A
W
W/°C
V
°C
Avalanche Characteristics
EAS(Thermally Limited)
Single Pulse Avalanche Energy
190
EAS (Tested)
IAR
EAR
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
365
mJ
See Fig. 14, 15, 22a, 22b
A
mJ
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
1
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AUIRFN8405
Thermal Resistance
Symbol
Junction-to-Case
RJC (Bottom)
Junction-to-Case
RJC (Top)
Junction-to-Ambient
RJA
Junction-to-Ambient
RJA (<10s)
Parameter
Typ.
–––
–––
–––
–––
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max.
V(BR)DSS
Drain-to-Source Breakdown Voltage
40
–––
–––
Breakdown
Voltage
Temp.
Coefficient
–––
37
–––
V(BR)DSS/TJ
–––
1.6
2.0
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
2.2
–––
3.9
–––
–––
1.0
Drain-to-Source Leakage Current
IDSS
–––
–––
150
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
Gate-to-Source Reverse Leakage
–––
––– -100
RG
Internal Gate Resistance
–––
2.4
–––
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max.
gfs
Forward Transconductance
145
–––
–––
Qg
Total Gate Charge
–––
78
117
Qgs
Gate-to-Source Charge
–––
21
–––
Qgd
Gate-to-Drain ("Miller") Charge
–––
25
–––
Qsync
Total Gate Charge Sync. (Qg - Qgd)
–––
53
–––
td(on)
Turn-On Delay Time
–––
9.5
–––
tr
Rise Time
–––
30
–––
td(off)
Turn-Off Delay Time
–––
58
–––
Fall Time
–––
33
–––
tf
Ciss
Input Capacitance
––– 5142 –––
Coss
Output Capacitance
–––
758
–––
Crss
Reverse Transfer Capacitance
–––
501
–––
Coss eff. (ER) Effective Output Capacitance (Energy Related)
–––
900
–––
Coss eff. (TR) Effective Output Capacitance (Time Related)
––– 1094 –––
Diode Characteristics
Symbol
Parameter
Min. Typ. Max.
Continuous Source Current
–––
––– 187
IS
(Body Diode)
Pulsed Source Current
–––
––– 670
ISM
(Body Diode)
VSD
Diode Forward Voltage
–––
0.9
1.3
dv/dt
Peak Diode Recovery
–––
5.2
–––
–––
27
–––
trr
Reverse Recovery Time
–––
28
–––
–––
16
–––
Qrr
Reverse Recovery Charge
–––
18
–––
IRRM
Reverse Recovery Current
––– 0.92 –––
2
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Units
V
mV/°C
m
V
µA
Max.
1.1
30
44
28
Units
°C/W
Conditions
VGS = 0V, ID = 250µA
Reference to 25°C, ID = 1.0mA
VGS = 10V, ID = 50A
VDS = VGS, ID = 100µA
VDS = 40V, VGS = 0V
VDS = 40V, VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
Units
Conditions
S VDS = 10V, ID = 50A
ID = 50A
VDS = 20V
nC
VGS = 10V
ns
pF
VDD = 20V
ID = 50A
RG = 2.7
VGS = 10V
VGS = 0V
VDS = 25V
ƒ = 1.0 MHz
VGS = 0V, VDS = 0V to 32V
VGS = 0V, VDS = 0V to 32V
Units
Conditions
MOSFET symbol
A
showing the
integral reverse
A
p-n junction diode.
V TJ = 25°C, IS = 50A, VGS = 0V
V/ns TJ = 175°C, IS= 50A, VDS = 40V
TJ = 25°C
VR = 34V,
ns
TJ = 125°C
IF = 50A
TJ = 25°C
di/dt = 100A/µs
nC
TJ = 125°C
A TJ = 25°C
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1000
1000
VGS
15V
10V
7.0V
6.0V
5.5V
5.25V
5.0V
4.5V
100
BOTTOM
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
4.5V
10
100
BOTTOM
4.5V
10
60µs PULSE WIDTH
60µs PULSE WIDTH
Tj = 25°C
Tj = 175°C
1
1
0.1
1
10
100
0.1
VDS, Drain-to-Source Voltage (V)
100
2.0
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID, Drain-to-Source Current(A)
10
Fig. 2 Typical Output Characteristics
1000
100
TJ = 175°C
TJ = 25°C
10
VDS = 10V
60µs PULSE WIDTH
ID = 50A
VGS = 10V
1.6
1.2
0.8
0.4
1
2
3
4
5
6
7
8
-60 -40 -20 0 20 40 60 80 100120140160180
9
TJ , Junction Temperature (°C)
VGS, Gate-to-Source Voltage (V)
Fig. 4 Normalized On-Resistance vs. Temperature
Fig. 3 Typical Transfer Characteristics
100000
14.0
VGS, Gate-to-Source Voltage (V)
VGS = 0V,
f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
C, Capacitance (pF)
1
VDS, Drain-to-Source Voltage (V)
Fig. 1 Typical Output Characteristics
10000
Ciss
Coss
Crss
1000
100
ID= 50A
12.0
VDS = 32V
VDS = 20V
10.0
8.0
6.0
4.0
2.0
0.0
0.1
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs. Drain-to-Source Voltage
3
VGS
15V
10V
7.0V
6.0V
5.5V
5.25V
5.0V
4.5V
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0
20
40
60
80
100
120
QG, Total Gate Charge (nC)
Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage
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ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
1000
TJ = 175°C
100
TJ = 25°C
10
1
1000
VGS = 0V
0.4
0.7
1.0
1.3
100µsec
100
Limited by Package
10
0.1
1.6
200
Limited By Package
ID, Drain Current (A)
150
125
100
75
50
25
0
50
75
100
125
150
1
50
Id = 1.0mA
48
46
44
42
40
38
-60 -40 -20 0 20 40 60 80 100120140160180
175
TJ , Temperature ( °C )
TC , Case Temperature (°C)
Fig 9. Maximum Drain Current vs. Case Temperature
0.60
Energy (µJ)
0.50
0.40
0.30
0.20
0.10
0.00
0
5
10 15 20 25 30 35 40 45
VDS, Drain-to-Source Voltage (V)
Fig 11. Typical COSS Stored Energy
4
Fig 10. Drain-to-Source Breakdown Voltage
RDS (on), Drain-to -Source On Resistance (m)
0.70
-5
10
Fig 8. Maximum Safe Operating Area
V(BR)DSS, Drain-to-Source Breakdown Voltage (V)
Fig. 7 Typical Source-to-Drain Diode
Forward Voltage
25
DC
VDS , Drain-to-Source Voltage (V)
VSD , Source-to-Drain Voltage (V)
175
10msec
Tc = 25°C
Tj = 175°C
Single Pulse
1
1msec
0.1
0.1
0.1
OPERATION IN THIS AREA
LIMITED BY R
(on)
DS
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20
VGS = 5.0V
VGS = 6.0V
VGS = 7.0V
VGS = 8.0V
VGS = 10V
15
10
5
0
0
20
40
60
80 100 120 140 160 180
ID, Drain Current (A)
Fig 12. Typical On-Resistance vs. Drain Current
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Thermal Response ( Z thJC ) °C/W
10
1
D = 0.50
0.20
0.10
0.1
0.05
0.02
0.01
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 13. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Avalanche Current (A)
1000
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming Tj = 150°C and
Tstart =25°C (Single Pulse)
100
10
1
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming j = 25°C and
Tstart = 150°C.
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14. Typical Avalanche Current vs. Pulse Width
EAR , Avalanche Energy (mJ)
200
Notes on Repetitive Avalanche Curves , Figures 14, 15:
(For further info, see AN-1005 at www.irf.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 16a, 16b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 14, 15).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
TOP
Single Pulse
BOTTOM 1.0% Duty Cycle
ID = 50A
150
100
50
0
25
50
75
100
125
150
175
Starting TJ , Junction Temperature (°C)
Fig 15. Maximum Avalanche Energy vs. Temperature
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PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
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4.5
ID = 50A
VGS(th), Gate threshold Voltage (V)
RDS(on), Drain-to -Source On Resistance (m)
AUIRFN8405
6
4
TJ = 125°C
2
TJ = 25°C
0
2
4
6
8
10
12
14
16
18
4.0
3.5
3.0
2.5
ID = 100µA
ID = 1.0mA
ID = 1.0A
2.0
1.5
1.0
20
-75 -50 -25
VGS, Gate -to -Source Voltage (V)
10
IF = 30A
VR = 34V
200
TJ = 25°C
TJ = 125°C
QRR (nC)
IRRM (A)
250
IF = 30A
VR = 34V
6
4
2
TJ = 25°C
TJ = 125°C
150
100
50
0
0
100 200 300 400 500 600 700 800 900 1000
100 200 300 400 500 600 700 800 900 1000
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 18 - Typical Recovery Current vs. dif/dt
Fig. 19 - Typical Stored Charge vs. dif/dt
10
250
IF = 50A
VR = 34V
200
TJ = 25°C
TJ = 125°C
6
QRR (nC)
IRRM (A)
8
4
2
IF = 50A
VR = 34V
TJ = 25°C
TJ = 125°C
150
100
50
0
0
100 200 300 400 500 600 700 800 900 1000
100 200 300 400 500 600 700 800 900 1000
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 20 - Typical Recovery Current vs. dif/dt
6
25 50 75 100 125 150 175
Fig 17. Threshold Voltage vs. Temperature
Fig 16. Typical On-Resistance vs. Gate Voltage
8
0
TJ , Temperature ( °C )
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Fig. 21 - Typical Stored Charge vs. dif/dt
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Fig 22. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
Fig 22a. Unclamped Inductive Test Circuit
Fig 23a. Switching Time Test Circuit
Fig 24a. Gate Charge Test Circuit
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Fig 22b. Unclamped Inductive Waveforms
Fig 23b. Switching Time Waveforms
Fig 24b. Gate Charge Waveform
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AUIRFN8405
PQFN 5x6 Outline "E" Package Details
For footprint and stencil design recommendations, please refer to application note AN-1136 at
http://www.irf.com/technical-info/appnotes/an-1136.pdf
For visual inspection recommendations, please refer to application note AN-1154 at
http://www.irf.com/technical-info/appnotes/an-1154.pdf
PQFN 5x6 Outline "E" Part Marking
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRFN8405
PQFN 5x6 Outline "E" Tape and Reel
REEL DIMENSIONS
TAPE DIMENSIONS
CODE
Ao
Bo
Ko
W
P1
DESCRIPTION
Dimension design to accommodate the component width
Dimension design to accommodate the component lenght
Dimension design to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Note: All dimension are nominal
Package
Type
Reel
Diameter
(Inch)
QTY
Reel
Width
W1
(mm)
Ao
(mm)
Bo
(mm)
Ko
(mm)
P1
(mm)
W
(mm)
Pin 1
Quadrant
5 X 6 PQFN
13
4000
12.4
6.300
5.300
1.20
8.00
12
Q1
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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Qualification Information†
Automotive
(per AEC-Q101)
Qualification Level
Moisture Sensitivity Level
Comments: This part number(s) passed Automotive qualification. IR’s
Industrial and Consumer qualification level is granted by extension of the
higher Automotive level.
PQFN 5mm x 6mm
Human Body Model
ESD
Charged Device Model
RoHS Compliant
MSL1
Class H1C (+/- 2000V)††
AEC-Q101-001
Class C5 (+/- 2000V)††
AEC-Q101-005
Yes
† Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/
†† Highest passing voltage.
Notes:
Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 95A.
Note that current limitations arising from heating of the device leads may occur with some lead mounting arrangements.
(Refer to AN-1140)
Repetitive rating; pulse width limited by max. junction temperature.
Limited by TJmax, starting TJ = 25°C, L = 0.152mH, RG = 50, IAS = 50A, VGS =10V.
ISD ≤ 50A, di/dt ≤ 961A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80%VDSS.
Coss eff. (ER) is a fixed capacitance that gives the same
energy as Coss while VDS is rising from 0 to 80% VDSS.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques
refer to application note #AN-994: http://www.irf.com/technical-info/appnotes/an-994.pdf
R is measured at TJ approximately 90°C.
Pulse drain current is limited at 380A by source bonding technology.
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IMPORTANT NOTICE
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve
the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services
at any time and to discontinue any product or services without notice. Part numbers designated with the “AU” prefix follow
automotive industry and / or customer specific requirements with regards to product discontinuance and process change
notification. All products are sold subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR’s
standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
IR assumes no liability for applications assistance or customer product design. Customers are responsible for their products
and applications using IR components. To minimize the risks with customer products and applications, customers should
provide adequate design and operating safeguards.
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alterations is an unfair and deceptive business practice. IR is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that product or
service voids all express and any implied warranties for the associated IR product or service and is an unfair and deceptive
business practice. IR is not responsible or liable for any such statements.
IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or in any other application in which the failure of the IR
product could create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for
any such unintended or unauthorized application, Buyer shall indemnify and hold International Rectifier and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges that IR was negligent regarding the design or manufacture of the product.
Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of Defense, are designed and manufactured to meet DLA military specifications required by certain military, aerospace or other applications.
Buyers acknowledge and agree that any use of IR products not certified by DLA as military-grade, in applications requiring
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regulatory requirements in connection with such use.
IR products are neither designed nor intended for use in automotive applications or environments unless the specific IR
products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, IR will
not be responsible for any failure to meet such requirements.
For technical support, please contact IR’s Technical Assistance Center
http://www.irf.com/technical-info/
WORLD HEADQUARTERS:
101 N. Sepulveda Blvd., El Segundo, California 90245
Tel: (310) 252-7105
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