HOTTECH C2012F100J250NT Hottech chip ceramic capacitor Datasheet

HOTTECH CHIP CERAMIC CAPACITORS
1.PART NUMBER
e.g.: C2012N680J101NT
C
2012
N
680
J
101
N
T
Code:
Size:
Capacitance:
Tolerance
Terminal:
Packing:
MLCC
0603(0201)
0R5=0.5pF
T: in Tape
100=10 pF
N:
B: in Box
1608(0603)
680=68 pF
2012(0805)
104=100nF
3216(1206)
106=10uF
B=±0.1pF
C=±0.25PF
D=±0. 5PF
F=±1%
G=±2%
J =±5%
K=±10%
M=±20%
Z=-20%+80%
S: in silver
1005(0402)
3225(1210)
4532(1812)
Dielectric:
N=COG/NPO
B=X7R
A=X5R
F=Y5V
E=Z5U
Three
Layers
Rated Voltage:
100=10V
250=25V
101=100V
102=1000V
2.STRUCTURE
介质:Dielectric 电极:Electrode 端头:Terminal 银:Silver 镍:Nickel 锡:Tin
Inner Structure
Three Electrode layers
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Page:P11-P1
HOTTECH CHIP CERAMIC CAPACITORS
3.SIZE AND ELECTRICAL PARAMETERS
SIZE (mm)
DIMENSION (mm)
INCH
METRIC
0201
0603
0.6±0.03
0402
1005
1.00±0.05
0603
1608
1.60±0.10
L
W
T
E
0.3±0.03
0.15±0.05
0.50±0.05
0.50±0.05
0.25±0.10
0.80±0.10
0.80±0.10
0.30±0.10
0.3±0.03
0.70±0.20
0805
2012
2.00±0.20
1.25±0.20
1.00±0.20
0.50±0.20
1.25±0.20
0.70±0.20
1206
3216
3.20±0.30
1.60±0.2
1210
3225
3.20±0.30
2.50±0.30
1812
4532
4.50±0.40
3.20±0.30
1.00±0.20
0.50±0.25
1.25±0.20
1.25±0.30
1.50±0.30
≤2.5
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0.75±0.25
0.75±0.20
Page:P11-P2
HOTTECH CHIP CERAMIC CAPACITORS
4.
DIELECTRIC CHARACTERISTIC INTRODUCTION AND TEST METHOD
ITEM
STANDARD
TEST METHOD
Capacitance
0.5PF-47uF
COG:
Tolerance
B=±0.1PF
C=±0.25PF
D=±0.5.PF
C≤1000PF :1MHz±10%
F=±1%
G=±2%
J=±5%
1.0±0.2Vrms
K=±10%
M=±20%
C>1000PF:1KHz±10%
1.0±0.2Vrms
Rated Voltage
16、25、50、100、200、500、1000、2000
V(DC)
Dissipation
COG/NPO
DF≤0.15%
Factor
X7R/X5R
DF ≤ 2.5%( ≥ 50V) , ≤ 3.0%(25V) , ≤
X7R/X5R:
Y5V/Z5U:
3.5%(16V)
Y5V/Z5U
≤
DF
7%(C ≥
100nF)
.
≤
3.5%(C<100nF)
COG/NPO
1KHz±10% 1.0±0.2Vrms
1KHz±10% 1.0±0.2Vrms ≤10uF
120Hz 0.5±0.2Vrms
C≤10NF IR>50000MΩ;
Test voltage: rated
C>10NF IR>5000ΩF
Time: 1 minute
C≤25NF IR>10000MΩ;
Temperature: 18-25℃
Insulation
C>25NF RXC>100ΩF
Humidity: <80%
Resistance(IR) Y5V/Z5U
C≤25NF IR>4000MΩ;
X7R/X5R
>10uF
C>25NF RXC>100ΩF
Apply 2.5x rated voltage to both terminations
Dielectric
No damage after test
for 5 seconds, charge and discharge current are
withstanding
less than 50mA. (This test doesn’t apply to
voltage
high-voltage MLCC)
Termination
No damage after test
Test Condition: 5N 10±1S
Adhesion
No damage after test and capacitance tolerance shall not be
After soldering capacitor on the PCB, 1mm per
more than 10%
1 second of bending for this PCB shall be
Bending
Strength
applied.
235±5℃
Temperature
Solderability
Time
1±1S
molthen rosin for 2s and then put it in the
Cover
≥95
10mm molthen solder with a temperature of
to
soldering Heat
Time
pick it up, clean the solvent and inspect it
1±1S
under 10x or more microscope.
Cover
≥95
△C/C
≤0.5% or 0.5PF
Dielectric
COG/NPO
X7R/X5R
Y5V/Z5U
Temperature:
△C/C
≤1%
≤±10%
≤±30%
COG/X7R
Temperature
Cycling
235±5℃(265±5℃)for 2(5)s. after that
265±5℃
Tempertaure
Resistance
Completely immerse the capacitor in the
No damage after test
-55 ± 3 ℃ ~125 ± 3 ℃
-25±3℃~85±3℃
Y5V
-10±3℃~85±3℃
Z5U
Cycle times: 5 times per 30s
Resume time: 24h
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Page:P11-P3
HOTTECH CHIP CERAMIC CAPACITORS
Dielectric
COG/NPO
X7R/X5R
Y5V/Z5U
Permanent Moisture
Humidity and
△C/C
≤2%
≤10%
≤20%
T=40±2℃
Moisture
DF
0.03
0.05
0.07
T=21D
Resistance
IR
RXC>25S
RXC>25S
RXC>25S
Relative Humidity: 93+2~3%
Resume Time: 1-2h
No damage after test
T.C.
characteristics
dielectric
△C/C
COG/NPO
±30PPM
+20℃
-55℃
+20℃
+125℃
X7R/X5R
±15℃
+20℃
-55℃
+20℃
+125℃
Z5U
±22%~56%
+20℃
+10℃
+20℃
+85℃
Y5V
±22%~82%
+20℃
-25℃
+20℃
+85℃
T.C.
f=10-500Hz
Vibration
No damage after test
Bump
Life test
0.75MM/2S
No damage after test
4000 times
dielectric
COG/NPO
X7R/X5R
Y5V/Z5U
Temperature: +125℃
NPO/X7R
△C/C
≤2%
≤±12.5%
≤±30%
+85℃
Y5V/Z5U
DF
0.003
0.003
0. 05
T=100 h
IR
RXC>25S
RXC>25S
RXC>25S
Resume time: 24h
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Page:P11-P4
HOTTECH CHIP CERAMIC CAPACITORS
5.
T.C.CHARACTERISTICS
Dielectric
NPO(COG)
X7R(X5R)
Y5V
Operating Temperature
-55~125℃
-55~125(85)℃
-30~85℃
T.C.Characteristics
±30PPM/℃
±15%
-20~+80%
COG8/NPO Typical Characteristics
X7R/X5R Typical Characteristics
Y5V Typical Characteristics
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Page:P11-P5
HOTTECH CHIP CERAMIC CAPACITORS
6. VOLTAGE AND CAPACITANCE
( COG/NPO)
Size
0201
0402
0603
0805
1206
1210
1812
Voltage
Capacitance
25V
0.5 PF -1000PF
50V
0.5 PF -680PF
25V
0.5 PF -2200PF
50V
0.5 PF -2200PF
25V
0.5 PF -10000PF
50V
0.5 PF -10000PF
25V
0.5 PF -68000PF
50V
0.5 PF -47000PF
16V
0.5 PF -100000PF
25V
0.5 PF -100000PF
50V
0.5 PF -68000PF
25V
470 PF -47000PF
50V
560 PF -56000PF
25V
1000 PF -100000PF
50V
1000 PF -47000PF
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Page:P11-P6
HOTTECH CHIP CERAMIC CAPACITORS
(X7R/X5R)
Size
0402
0603
0805
1206
1210
1812
Voltage
Capacitance
6.3V
100 PF -1.0 uF
10V
100 PF -680nF
16V
100 PF -220nF
6.3V
100 PF -4.7 uF
10V
100 PF -4.7 uF
16V
100 PF -2.2 uF
25V
100 PF -2.2 uF
50V
100 PF -1.0 uF
6.3V
220 PF -10 uF
10V
220 PF -10 uF
16V
220 PF -10 uF
25V
220 PF -4.7 uF
50V
220 PF -2.2 uF
6.3V
220 PF -10 uF
10V
220 PF -10uF
16V
220 PF -10 uF
25V
220 PF -10 uF
50V
220 PF -10 uF
6.3V
1000 PF -47 uF
10V
1000 PF -22 uF
16V
1000 PF -22 uF
25V
1000 PF -22 uF
50V
1000 PF -10 uF
25V
10000 PF -47 uF
50V
10000 PF -22 uF
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Page:P11-P7
HOTTECH CHIP CERAMIC CAPACITORS
(Y5V)
Size
0402
0603
0805
1206
1210
1812
Voltage
Capacitance
6.3V
100nF -1 uF
10V
100nF -1 uF
16V
22nF -680nF
50V
22nF -680nF
6.3V
680nF-4.7 uF
10V
22nF -4.7 uF
16V
22nF -4.7 uF
25V
22nF -2.2 uF
50V
22nF -1 uF
6.3V
4.7 uF -10 uF
10V
2.2 uF -10 uF
16V
22nF -4.7 uF
25V
22nF -2.2 uF
50V
22nF -1 uF
6.3V
/
10V
2.2uF -22 uF
16V
1uF -10 uF
25V
22nF -10 uF
50V
22nF -10 uF
6.3V
22nF-47 uF
10V
10uF-22 uF
16V
2.2uF-10 uF
25V
220nF-2.2 uF
50V
22nF -10 uF
25V
10uF-47 uF
50V
22nF-22uF
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HOTTECH CHIP CERAMIC CAPACITORS
7.Packing Information
Reel
Dimension
0201
A
B
C
F
W
mm
178±2.0
60.0±1.0
13.5±0.5
11.4±0.1
9.00±0.3
Inch
7.008±0.079
2.362±0.039
0.531±0.020
0.449±0.039
0.354±0.012
mm
178±2.0
60.0±1.0
13.5±0.5
15.4±1.0
13.0±0.3
Inch
7.008±0.079
2.362±0.039
0.531±0.020
0.606±0.039
0.512±0.012
0402
0603
0805
1206
1210
1812
Packing Quantity
Paper Tape
Plastic Tape
0201
0402
0603
0805
1206
10K/15K
10K
4K
4K
4K
2K
2K
1210
1812
1K/2K
500PCS
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Page:P11-P9
HOTTECH CHIP CERAMIC CAPACITORS
Tape
Unit: mm
TYPE
A
B
W
P0
P1
P2
0201
0.38±0.05
0.68±0.05
8.00±0.20
4.00±0.10
2.00±0.10
2.00±0.05
0402
0.65±0.10
1.15±0.10
8.00±0.20
4.00±0.10
2.00±0.10
2.00±0.05
0603
1.10±0.10
1.90±0.10
8.00±0.20
4.00±0.10
4.00±0.10
2.00±0.05
0805
1.65±0.20
2.40±0.20
8.00±0.20
4.00±0.10
4.00±0.10
2.00±0.05
1206
2.00±0.20
3.60±0.20
8.00±0.20
4.00±0.10
4.00±0.10
2.00±0.05
1210
2.80±0.10
3.50±0.10
8.00±0.20
4.00±0.10
4.00±0.10
2.00±0.05
1812
3.60±0.20
4.90±0.20
12.00±0.10
4.00±0.10
4.00±0.10
2.00±0.05
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Page:P11-P10
HOTTECH CHIP CERAMIC CAPACITORS
8.WELDING TEMPERATURE
Suitable reflow temperature
1-2℃/Sec ramp
Preheat 150-183℃:2-3 minutes
Time above 183℃:60-100 seconds
Peak Temperature:230±10℃
Module should only be in oven for 5.5-6 minute
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Page:P11-P11
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