Video Camera LSI MN31121SA CCD Image Sensor Vertical Driver IC ■ Overview The MN31121SA is a 2D interline CCD image sensor vertical driver IC that integrates four vertical driver channels and one SUB drive channel on a single chip. This IC can reduce power consumption and the number of external parts. The MN31121SA consists of a vertical driver block that includes both level shifter circuits and 2-value and 3-value output driver circuits, and a SUB driver block that includes level shifter and 2-value output driver circuits. ■ Features • Level shifter circuits Input (VDC, ground) → output (VHH , VL) • 2-value output driver circuits (vertical driver block) Outputs: VM24 and VL • 3-value output driver circuits (vertical driver block) Outputs: VH, VM13, and VL • 2-value output driver circuits (SUB driver block) Outputs: VHH and VL OSUB VL OV2 VM13 OV1 VDC IV1 CH1 IV2 ISUB 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VHH VM24 OV4 OV3 VH N.C. IV3 CH2 IV4 N.C. (TOP VIEW) ■ Applications • Video cameras, surveillance cameras, digital still cameras, CCD camera systems Publication date: April 2003 SDB00054CEM 1 MN31121SA ■ Block Diagram OSUB VL OV2 VM13 OV1 VDC IV1 CH1 IV2 ISUB 1 20 2 19 3 18 4 5 3-value driver 16 3-value driver 6 15 7 Level shifter Level shifter 14 8 Level shifter Level shifter 13 9 Level shifter Level shifter 12 10 Level shifter 11 Note) VDC , VL: Common power supply VM13 , VM24: Vertical driver block 2-value and 3-value independent power supply VHH , VH: SUB driver block and vertical driver block 3-value independent power supply 2 17 SDB00054CEM VHH VM24 OV4 OV3 VH N.C. IV3 CH2 IV4 N.C. MN31121SA ■ Pin Descriptions Pin No. Pin name I/O Description 1 OSUB O SUB pulse output 2 VL I Low-level power supply 3 OV2 O 2-value transfer pulse output 4 VM13 I Mid-level power supply 5 OV1 O 3-value transfer pulse output 6 VDC I Input block high-level power supply 7 IV1 I Transfer pulse input 8 CH1 I Charge pulse input 9 IV2 I Transfer pulse input 10 ISUB I SUB pulse input 11 N.C. 12 IV4 I Transfer pulse input 13 CH2 I Charge pulse input 14 IV3 I Transfer pulse input 15 N.C. 16 VH I High-level power supply of vertical driver block 17 OV3 O 3-value transfer pulse output 18 OV4 O 2-value transfer pulse output 19 VM24 I Mid-level power supply 20 VHH I High-level power supply of SUB driver block Unused Unused ■ Electrical Characteristics 1. Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage 1 VHH-VL 32 V Supply voltage 2 VH-VL 30 V Supply voltage 3 VM13 , VM24 VL to 6 V Supply voltage 4 VDC 0 to 7 V Negative supply voltage VL −12 to 0 V Input voltage VI VL− 0.3 to VDC+0.3 V IIC , IOC ±10 mA Maximum DC load current IODC ±3 mA Maximum load capacitance CL 5 500 pF/PIN Power dissipation PD 180 mW Operating temperature Topr −10 to +70 °C Storage temperature Tstg −50 to +125 °C Input and output clamp diode currents Note) The absolute maximum ratings are stress ratings only, and do not guarantee operation. Stress in excess of the maximum rating may destroy the device. SDB00054CEM 3 MN31121SA ■ Electrical Characteristics (continued) 2. Operating Conditions at Ta = −10°C to +70°C Parameter Symbol Conditions Min Typ Max Unit Supply voltage 1 VHH-VL VH-VL 30.5 V Supply voltage 2 VH-VL 17 28 V Supply voltage 3 VM13 , VM24 −1 4 V Supply voltage 4 VHH-VM13 VHH-VM24 12 V Supply voltage 5 VDC 2.5 3.6 V Negative supply voltage VL −10 −4 V Input frequency fIN 20 kHz 3. DC Characteristics at VHH = 18.0 V, VH = 13.0 V, VM13 = VM24 = 1.0 V, VL = −7.0 V, VDC = 3.00 V, Ta = −10°C to +70°C Parameter Quiescent supply current Operating supply current Input Pins Symbol IDDST IDDDYN Conditions Min Typ Max Unit VI = GND, VDC = 2.6 V 2 mA VI = GND, VDC = 3.0 V 5 Refer to test conditions (Input pulse timing, output load circuit) VI = GND, VDC 7 mA 1.75 VDC V 0.0 0.15 V 2.5 VDC V 0.0 0.3 V −1.0 +1.0 µA IV1 , IV2 , IV3 , IV4 , CH1, CH2, ISUB High-level voltage VIH Low-level voltage VIL High-level voltage VIH Low-level voltage VIL Input leakage current IILK Output Pins 1 (2-value outputs) VDC = 2.6 V VDC = 3.0 V VI = 0 V to VDC OV2 , OV4 Mid-level output voltage VOM1 IOM1 = −1 mA 0.9 VM24 V Low-level output voltage VOL1 IOL1 = 1 mA VL −6.9 V Output on resistance (mid level) RONM1 IOM1 = −50 mA 60 Ω Output on resistance (low level) RONL1 IOL1 = 50 mA 40 Ω Output Pins 2 (3-value outputs) OV1 , OV3 High-level output voltage VOH2 IOH2 = −1 mA 12.9 VH V Mid-level output voltage VOM2 IOM2 = −1 mA 0.9 VM13 V Low-level output voltage VOL2 IOL2 = 1 mA VL −6.9 V Output on resistance (high level) RONH2 IOH2 = −50 mA 70 Ω Output on resistance (mid level) RONM2 IOM2 = ±50 mA 60 Ω Output on resistance (low level) RONL2 IOL2 = 50 mA 60 Ω Output Pins 3 (SUB outputs) OSUB High-level output voltage VOHH3 IOHH3 = −1 mA 17.9 VHH V Low-level output voltage VOL3 IOL3 = 1 mA VL −6.9 V 4 SDB00054CEM MN31121SA ■ Electrical Characteristics (continued) 3. DC Characteristics (continued) at VHH = 18.0 V, VH = 13.0 V, VM13 = VM24 = 1.0 V, VL = −7.0 V, VDC = 3.00 V, Ta = −10°C to +70°C Parameter Symbol Conditions Output Pins 3 (SUB outputs) (continued) Min Typ Max Unit OSUB Output on resistance (high level) RONHH3 IONHH3 = −50 mA 60 Ω Output on resistance (low level) RONL3 IONL3 = 50 mA 50 Ω 4. AC Characteristics at VHH = 18.0 V, VH = 13.0 V, VM13 = VM24 = 1.0 V, VL = −7.0 V, VDC = 3.00 V, Ta = −10°C to +70°C Parameter Symbol Output Pins 1 (2-value outputs) Conditions Min Typ Max Unit OV2 , OV4 Propagation delay time TPLM TPML No load, Low level to mid level 150 250 ns Rise time Fall time TTLM TTML Refer to test conditions (Output load circuit) 300 400 ns Output Pins 2 (3-value outputs) OV1 , OV3 Propagation delay time TPLM TPML No load, Low level to mid level 150 250 ns Propagation delay time TPMH TPHM No load, Mid level to high level 200 400 ns Rise time Fall time TTLM TTML Refer to test conditions (Output load circuit) 300 400 ns Rise time Fall time TTMH TTHM Refer to test conditions (Output load circuit) 350 550 ns Output Pins 3 (SUB output) OSUB Propagation delay time TPLHH TPHHL No load, Low level to high level 150 250 ns Rise time Fall time TTLHH TTHHL Refer to test conditions (Output load circuit) 300 400 ns ■ Test Conditions 1. Output Load Circuit 800 pF 1 000 pF 500 pF OV1 OV4 1 500 pF 500 pF 1 500 pF OV2 OSUB OV3 1 000 pF 2 700 pF 800 pF SDB00054CEM 5 MN31121SA ■ Test Conditions (continued) 2. Input Pulse Timing Charts (NTSC) 63.5 µs 508 µs 63.5 µs 2 µs IV1 IV2 IV3 IV4 CH1 15 µs CH2 1 cycle 60 Hz ISUB ■ Function Tables 1. 2-Value Transfer Pulse (vertical driver block) 2. 3-Value Transfer Pulse IV2 IV4 OV2 OV4 CH1 CH2 IV1 IV3 OV1 OV3 High Low High High Low Low Mid Low Mid High Low Low High Low Note) IV1, IV2, IV3, IV4, CH1, CH2 High: VDC, Low: Ground OV1, OV2, OV3, OV4 High: VH, Mid: VM13 or VM24, Low: VL 6 SDB00054CEM MN31121SA ■ Function Tables (continued) 3. Unnecessary Charge Sweep-Out Pulse (SUB driver block) ISUB OSUB High Low Low High Note) ISUB High: VDC, Low: Ground OSUB High: VHH, Low: VL ■ Timing Charts 1. 2-value transfer pulse 63.5 µs 508 µs 63.5 µs 2 µs High Low Mid IV2 OV2 Low 2. 2-value transfer pulse High Low Mid IV4 OV4 Low 3. 3-value transfer pulse IV1 15 µs High Low High Low CH1 High Mid OV1 Low 4. 3-value transfer pulse High Low High Low IV3 CH2 High Mid OV3 Low SDB00054CEM 7 MN31121SA ■ Timing Charts (continued) 5. SUB pulse High Low High ISUB OSUB Low ■ Usage Notes 1. If the SUB driver is not used: 1) Connect VHH (pin 20) to VH (pin 16). 2) Connect ISUB (pin 10) to VDC (pin 6). 3) Leave OSUB (pin 1) open. 2. Mount the bypass capacitors for power supply pins VHH (pin 20), VH (pin 16), VM13 (pin 4), VM24 (pin 19), VL (pin 2), and VDC (pin 6) as close as possible to the pin itself. 3. If the overcurrents that occur at power on and power off are limited to under 10 ms and under 100 mA, then the MN31121SA is guaranteed for 10,000 power cycle (power on/power off) operations. 4. Guarantee period after packing is opened The guarantee period after opening the moisture-proof packing is three weeks under environmental conditions of 30°C and 70% RH. 5. The recommended reflow soldering temperature is 230°C. 8 SDB00054CEM SDB00054CEM 10 SUB 12 CH2 14 CH1 2 V4 3 V3 6 V2 8 V1 ISUB 10 IV2 9 CH1 8 IV1 7 VDC 6 Level shifter Level shifter Level shifter Level shifter 3-value driver Level shifter Level shifter Level shifter N.C. 11 N.C. 12 IV4 13 CH2 14 IV3 15 16 VH 17 OV3 VM13 4 OV1 5 18 OV4 OV2 3 3-value driver 19 VM24 VL 2 3.3 µF/5 V VH VM24 VHH 2 200pF 200 kΩ 1 MΩ 47 kΩ 3.3 µF/50 V +16 V SUB 10 φV4 15 φV3 14 φV2 13 φV1 12 Note) Mount the bypass capacitors for the MN31121SA power supply pins (VHH, VH, VM13, VM24, VL, and VDC) as close as possible to the pin itself. CCD drive logic MN6732741 VDC VM13 VL 20 VHH OSUB 1 768H CCD image sensor MN39143FT/39243FT MN31121SA ■ Application Circuit Example 9 MN31121SA ■ Package Dimensions (Unit: mm) • SSOP020-P-0225 6.50±0.20 11 20 +0.10 0.15 –0.05 6.30±0.30 4.30±0.20 1.00±0.20 0° to 8° 0.30 min. 0.65 10 0.25±0.10 0.13 M Seating plane 0.10 0.10±0.10 1.50±0.20 (0.33) 1.90 max. 1 Seating plane Note) The package of this product will be changed to the following lead-free type (SSOP020-P-0225C). ■ New Package Dimensions (Unit: mm) • SSOP020-P-0225C (Lead-free package) 6.50±0.20 20 11 +0.10 0.15-0.05 4.30±0.20 6.30±0.30 1.00±0.20 0° to 8° Seating plane 10 10 0.25±0.10 0.10 0.30 min. 0.13 M 1.80 max. 0.65 0.10±0.10 1.50±0.10 1 (0.325) SDB00054CEM Seating plane Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL