Multilayer Ceramic Chip Capacitors FEATURES • CRACK RESISTANT TERMINATION • SOFT TERMINATION, OPEN MODE FAILURE • WIDE VOLTAGE RANGE (16V TO 5KV) • HIGH CAPACITANCE (UP TO 10µF) • RoHS COMPLIANT • SAC SOLDER COMPATIBLE** NMC-P Series RoHS Compliant includes all homogeneous materials *See Part Number System for Details Temperature Coefficient Capacitance Range NPO X7R 2.2pF ~ 0.22µF 180pF ~ 10µF For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F) Capacitance Tolerance ±10% (K) & ±20% (M) Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K) Operating Temperature Range -55°C ~ +125°C Temperature Characteristics ±30ppm/°C ±15% ∆ Cap. Rated Voltages 16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc Q = > 1000 (more then 30pF)* 2.5% max. @ 1KHz, 1.0V ± 0.2Vrms Q or Dissipation Factor Q = > 400 + 20 x C in pF (30pF and below)* insulation Resistance 10,000Megohm or 500Megohm/µF whichever is less @ +25°C 200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V) Dielectric Withstanding Voltage 150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V) 120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV) *Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms **Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods. PART NUMBER SYSTEM NMC-P 1206 X7R 105 K 50 TRP or TRPLP F RoHS Compliant Tape & Reel (Plastic Carrier) Tape & Reel (Paper Carrier) Voltage (Vdc) Capacitance Tolerance Code (see chart) Capacitance Code, expressed in pF, first 2 digits are significant, 3rd digit is no. of zeros Temperature Characteristic (NPO or X7R) Size Code (see chart) Series CONSTRUCTION Base layer (Cu 50V ~ 250V) (Ag 500V ~ up) Flexible layer (Polymer) Barrier layer (Ni) Finish layer (Sn) OPEN MODE FAILURE AS A RESULT OF BENDING STRESS Termination Separation (Open Failure Mode) ® NIC COMPONENTS CORP. NMC-P rev. 1 05302007 www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 15 Multilayer Ceramic Chip Capacitors NMC-P Series NPO VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 0603 1.60 ± 0.1 0.80 ± 0.1 0.90 max. 0.15 min. 200V 0805 2.00 ± 0.2 1.25 ± 0.25 1.45 max. 0.20 min. 16 25 1206 3.20 ± 0.3 1.60 ± 0.2 1.80 max. 0.30 min. Working Voltage (Vdc) 50 200 250 500 16 25 50 200 250 500 1KV 2KV 3KV 1210 3.20 ± 0.30 2.50 ± 0.20 2.60 max. 0.30 min. 16 25 50 200 250 500 2.0pF 3.3 3.9 5.0 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 0.001µF 0.0012 0.0015 0.0018 0.0022 0.0027 0.0033 0.0039 0.0047 0.0056 0.0068 0.0082 0.01µF 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.1 ® 16 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors NMC-P Series NPO VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 1808 4.60 ± 0.3 2.00 ±0.2 2.20 max. 0.30 min. 1812 1825 4.60 ± 0.3 4.60 ± 0.3 3.20 ±0.3 6.35 ±0.4 3.00 max. 2.60 max. 0.30 min. 0.30 min. Working Voltage (Vdc) 1KV 2KV 3KV 5KV 16 25 50 1KV 2KV 3KV 250 500 1KV 2220 5.70 ± 0.4 5.00 ±0.4 3.00 max. 0.30 min. 1KV 5KV 2225 5.70 ± 0.4 6.35 ± 0.4 3.00 max. 0.30 min. 250 500 1KV 2.0pF 3.3 3.9 5.0 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 0.001µF 0.0012 0.0015 0.0018 0.0022 0.0027 0.0033 0.0039 0.0047 0.0056 0.0068 0.0082 0.01µF 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.1 0.12 0.15 0.22 ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 17 Multilayer Ceramic Chip Capacitors NMC-P Series X7R LOW VOLTAGE VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 0805 2.00 ± 0.2 1.25 ± 0.25 1.45 max. 0.20 min. 1206 3.20 ± 0.3 1.60 ± 0.2 1.80 max. 0.30 min. 1210 3.20 ± 0.3 2.50 ± 0.2 2.60 max. 0.30 min. 2220 5.70 ± 0.4 5.00 ± 0.4 3.00 max. 0.30 min. 2225 5.70 ± 0.4 6.35 ± 0.4 3.00 max. 0.30 min 50 50 50 50 50 100 100 1812 1825 4.60 ± 0.3 4.60 ± 0.3 3.20 ± 0.3 6.35 ± 0.4 3.00 max. 2.60 max. 0.30 min. 0.30 min. Working Voltage (Vdc) 100 50 100 50 100 100 100 0.1µF 0.15 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 X7R HIGH V0LTAGE VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 0805 2.00 ± 0.2 1.25 ± 0.25 1.45 max. 0.20 min. 200 250 500 200 1206 3.20 ± 0.3 1.60 ± 0.2 1.80 max. 0.30 min. Working Voltage (Vdc) 250 500 630 1K 1210 3.20 ± 0.3 2.50 ± 0.2 2.60 max. 0.30 min. 200 250 500 1K 180pF 220 270 330 390 470 560 680 0.001µF 0.0015µF 0.0022µF 0.0027µF 0.0033µF 0.0039µF 0.0047µF 0.0056µF 0.0068µF 0.01µF 0.012µF 0.015µF 0.018µF 0.022µF 0.027µF 0.033µF 0.039µF 0.047µF 0.056µF 0.068µF 0.1µF 0.12µF 0.15µF 0.18µF 0.22µF ® 18 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors NMC-P Series X7R HIGH V0LTAGE VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 1808 4.60 ± 0.3 2.0 ± 0.2 2.20 max. 0.30 min. 500 1K 2K 1812 4.60 ± 0.3 3.2 ± 0.3 3.00 max. 0.30 min. 3K 200 250 500 1825 4.60 ± 0.3 6.35 ± 0.4 2.60 max. 0.30 min. Working Voltage (Vdc) 2K 3K 250 500 1K 1K 2220 5.70 ± 0.4 5.00 ± 0.4 3.00 max. 0.30 min. 250 500 1K 2225 5.70 ± 0.4 6.35 ± 0.4 3.00 max. 0.30 min. 2K 250 500 1K 150pF 180 220 270 330 390 470 560 680 0.001µF 0.0015 0.0018 0.0022 0.0027 0.0033 0.0039 0.0047 0.0056 0.0068 0.01 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.1 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 1.0 1.5 2.2 W H P P L ® NIC COMPONENTS CORP. 100% Sn over Ni barrier www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 19