NL17SZ07 Single Non−Inverting Buffer with Open Drain Output The NL17SZ07 is a high performance single inverter with open drain outputs operating from a 1.65 to 5.5 V supply. The Output stage is open drain with Over Voltage Tolerance. This allows the NL17SZ07 to be used to interface 5.0 V circuits to circuits of any voltage between 0 and +7.0 V. • • • • • • • • • • Tiny SOT−353 and SOT−553 Packages Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation, CMOS Compatible Over Voltage Tolerant Inputs VIN may be Between 0 and 7.0 V for VCC Between 0.5 and 5.4 V TTL Compatible − Interface Capability with 5.0 V TTL Logic with VCC = 2.7 V to 3.6 V LVCMOS Compatible 24 mA Output Sink Capability, Pullup may be between 0 and 7.0 V Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 20 Pb−Free Packages are Available NC 5 1 http://onsemi.com MARKING DIAGRAM VX M G G SC−88A / SOT−353 / SC−70 DF SUFFIX CASE 419A L7 D G G SOT−553 XV5 SUFFIX CASE 463B M = Date Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) VCC OVT IN A GND 2 PIN ASSIGNMENT 4 3 OUT Y Figure 1. Pinout IN A 1 Pin Function 1 NC 2 IN A 3 GND 4 OUT Y 5 VCC FUNCTION TABLE OUT Y Figure 2. Logic Symbol A Input Y Output L L H Z ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev. 5 1 Publication Order Number: NL17SZ07/D NL17SZ07 MAXIMUM RATINGS Symbol Characteristics Value Unit *0.5 to )7.0 V *0.5 ≤ VI ≤ )7.0 V *0.5 ≤ VO ≤ 7.0 V VI < GND *50 mA VO < GND *50 mA DC Output Sink Current $50 mA DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C PD Power Dissipation in Still Air SOT−353 SOT−553 186 135 mW qJA Thermal Resistance SOT−353 SOT−553 350 496 °C/W TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias )150 °C ILatch−Up Latch−Up Performance $500 mA MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO ICC Output in Z or LOW State (Note 1) Above VCC and Below GND at 85°C (Note 5) Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Class IC Class A N/A Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Δt/ΔV Input Transition Rise or Fall Rate Operating Data Retention Only (Z or LOW State) VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V −55 )125 °C 0 0 0 20 10 5 ns/V NL17SZ07 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition TA = 25°C VCC (V) Min 0.7 VCC 0.7 VCC *55°C ≤TA ≤ 125°C Typ Max Min Max 0.7 VCC 0.7 VCC Unit VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 V VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 0.3 VCC 0.3 VCC 0.3VCC 0.3 VCC V ILKG Z−State Output Leakage Current VIN = VIH VOUT = VCC or GND 2.3 to 5.5 $5.0 $10.0 mA VOL Low−Level Output Voltage VIN = VIL IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 V IOL = 4 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN or VOUT = VCC or GND 0 to 5.5 $0.1 $1.0 mA VOUT = 5.5 V 0 1 10 mA IIN Input Leakage Current IOFF Power Off−Output Leakage Current ICC Quiescent Supply Current VIN = VCC or GND 5.5 1 10 mA ICCT Quiescent Supply Current VIN = 3.0 V 3.6 10 100 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎ ÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W TA = 25°C Symbol tPZL tPLZ Condition VCC (V) Min Typ Max Min Max Unit RL = R1= 500 W, CL = 50 pF 1.8 $ 0.15 0.8 5.3 11.6 0.8 12.0 ns 2.5 $ 0.2 1.2 3.7 5.8 1.2 6.4 3.3 $ 0.3 0.8 2.9 4.4 0.8 4.8 Parameter Propagation Delay (Figure 3 and 4) Propagation Delay (Figure 3 and 4) *55°C ≤TA ≤ 125°C RL = R1= 500 W, CL = 50 pF 5.0 $ 0.5 0.5 2.3 3.5 0.5 3.9 1.8 $ 0.15 0.8 5.3 11.6 0.8 1.20 2.5 $ 0.2 1.2 2.8 5.8 1.2 6.4 3.3 $ 0.3 0.8 2.1 4.4 0.8 4.8 5.0 $ 0.5 0.5 1.4 3.5 0.5 3.9 ns CAPACITIVE CHARACTERISTICS Condition Typical Unit CIN Symbol Input Capacitance Parameter VCC = 5.5 V, VI = 0 V or VCC u2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL17SZ07 A VCC 50% tPZL Y GND tPLZ 50% VCC HIGH IMPEDANCE VOL )0.3 V Figure 3. Switching Waveforms VCC R1 PULSE GENERATOR DUT RT CL VCC 2 RL RT = ZOUT of pulse generator (typically 50 Ω) Figure 4. Test Circuit DEVICE ORDERING INFORMATION Package Shipping† NL17SZ07DFT2 SOT−353/SC70−5/SC−88A 3000 / Tape & Reel NL17SZ07DFT2G SOT−353/SC70−5/SC−88A (Pb−Free) 3000 / Tape & Reel NL17SZ07XV5T2 SOT−553 4000 / Tape & Reel NL17SZ07XV5T2G SOT−553 (Pb−Free) 4000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL17SZ07 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.65 0.025 0.65 0.025 1.9 0.075 0.9 0.035 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ07 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B D −X− 5 A 4 1 e 2 E −Y− 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L HE c 5 PL 0.08 (0.003) M MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 DIM A b c D E e L HE X Y MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.008 0.004 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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