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FAN2500 100 mA CMOS LDO Regulator Features Description • • • • • • • The FAN2500 micropower low-dropout voltage regulator utilizes CMOS technology to offer a new level of costeffective performance in mobile handsets, laptop and notebook portable computers, and other portable devices. Features include extremely low power consumption, low shutdown current, low dropout voltage, exceptional loop stability able to accommodate a wide variety of external capacitors, and a compact SOT23-5 surfacemount package. The FAN2500 offers significant improvements over older BiCMOS designs and is pin-compatible with many popular devices. The output is thermally protected against overload. FAN2500: pin 4 – ADJ, allows the user to adjust the output voltage over a wide range using an external voltage divider. FAN2500-XX: pin 4 – BYP, to which a bypass capacitor may be connected for optimal noise performance. Output voltage is fixed, indicated by the suffix XX. Ultra-Low Power Consumption 100 mV Dropout Voltage at 100 mA 25 μA Ground Current at 100 mA Enable / Shutdown Control SOT23-5 package Thermal Limiting 300 mA Peak Current Applications • Mobile Phones and Accessories • Portable Cameras and Video Recorders • Laptop, Notebook, and Palmtop Computers The standard fixed output voltages available are 2.5 V, 3.0 V, and 3.3 V. Ordering Information Part Number VOUT Pin 4 Function Top Mark Package Packing Method FAN2500S25X 2.5 Bypass ACE SOT-23 5L Tape and Reel FAN2500S30X 3.0 Bypass ACW SOT-23 5L Tape and Reel FAN2500S33X 3.3 Bypass AC3 SOT-23 5L Tape and Reel FAN2500SX Adj. Adjust ACA SOT-23 5L Tape and Reel Tape and Reel Information Quantity Reel Size Width 3000 7 inches 8 mm © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 1 FAN2500 — 100 mA CMOS LDO Regulator May 2013 FAN2500 — 100 mA CMOS LDO Regulator Block Diagram FAN2500 Figure 1. Block Diagram Pin Configuration Figure 2. Pin Configuration Pin No. FAN2500 FAN2500-XX 1. VIN VIN 2. GND GND 3. EN EN 4. ADJ BYP 5. VOUT VOUT Pin Descriptions Pin Name Pin No. Type ADJ 4 Input BYP 4 EN 3 VIN 1 Power In VOUT 5 Power Out GND 2 Power Functional Description FAN2500 Adjust Ratio of potential divider from VOUT to ADJ determines output voltage FAN2500-XX Bypass Connect a 470 pF capacitor for noise reduction Enable Digital Input 0: Shutdown VOUT 1: Enable VOUT Passive Voltage Input Supply voltage input Voltage Output Regulated output voltage Ground © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Parameter Min. Max. Unit 0 7 V 0 7 V Power Supply Voltages VIN (Measured to GND) Enable Input (EN) Applied Voltage (Measured to GND)(2) Power Dissipation(3) Temperature Internally Limited Junction -65 Lead Soldering (5 s) Storage -65 150 °C 260 °C 150 °C (4) 4 kV Electrostatic Discharge Notes: 1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Recommended Operating Conditions are not exceeded. 2. Applied voltage must be current limited to specified range. 3. Based upon thermally limited junction temperature: T J ( max ) – T A P D = ------------------------------Θ JA 4. Human Body Model is 4 kV minimum using Mil Std. 883E, method 3015.7. Machine Model is 400 V minimum using JEDEC method A115-A. Recommended Operating Conditions The recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Nom. 2.7 Max. Unit 6.5 V VIN Input Voltage Range VEN Enable Input Voltage 0 VIN V TJ Junction Temperature -40 +125 °C θJA Thermal Resistance, Junction to Air 220 °C/W θJC Thermal Resistance, Junction to Case 130 °C/W © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 3 FAN2500 — 100 mA CMOS LDO Regulator Absolute Maximum Ratings(1) Symbol Parameter Conditions Min. Typ. Max. Units 2.5 4.0 mV Regulator IOUT = 100 μA VDO ∆VO Drop-Out Voltage 50 75 mV IOUT = 100 mA 100 140 mV 2 % 1.32 1.40 6 V % 50 μA 1 μA Output Voltage Accuracy -2 ∆VREF Reference Voltage Accuracy, Adjustable Mode ∆VO(7) Output Voltage Accuracy, Adjustable Mode IGND IOUT = 50 mA 1.24 -6 Ground Pin Current IOUT = 100 mA Protection Current Limit Thermally Protected IGSD Shutdown Current TSH Thermal Protection Shutdown Temperature EN = 0 V 150 °C Enable Input 0.4 V Input Current High 1 μA Input Current Low 1 μA VIL Logic Low Voltage VIH Logic High Voltage IIH II 1.2 2.0 1.4 V Switching Characteristics(5, 6) Parameter Enable Max. Unit 500 μsec Input(8) Response Time Performance Characteristics(5, 6) Symbol ∆VOUT/ ∆VIN ∆VOUT/ VOUT eN PSRR Parameter Conditions Typ. Line Regulation VIN = (VOUT+ 1) to 6.5 V 0.3 Load Regulation IOUT = 0.1 to 100 mA 1.0 Output Noise Power Supply Rejection f = 10 Hz to 1 kHz at VIN, COUT = 10 μF, CBYP = 0.01 μF < 7.00 f > 10 kHz at VIN, COUT = 10 μF, CBYP = 0.01 μF < 0.01 f = 120 Hz at VIN, COUT = 10 μF, CBYP = 0.01 μF 43 Max. Unit %/V 2.0 % μV / Hz dB Notes: 5. Unless otherwise stated; TA = 25°C, VIN = VOUT + 1 V, IOUT = 100 μA, and VIH > 2.0 V. 6. Bold values indicate -40 ≤ TJ ≤ 125°C. 7. The adjustable version has a band-gap voltage range of 1.24 V to 1.40 V with a nominal value of 1.32 V. 8. When using repeated cycling. © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 4 FAN2500 — 100 mA CMOS LDO Regulator Electrical Characteristics(5, 6) Figure 3. Power Supply Rejection Ratio Figure 4. Power Supply Rejection Ratio Figure 5. Power Supply Rejection Ratio Figure 6. Power Supply Rejection Ratio Figure 7. Power Supply Rejection Ratio Figure 8. Power Supply Rejection Ratio © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 5 FAN2500 — 100 mA CMOS LDO Regulator Typical Performance Characteristics Figure 9. PSRR vs. Voltage Drop Figure 10. PSRR vs. Voltage Drop Figure 11. Noise Performance Figure 12. Ground Pin Current Figure 13. Ground Pin Current Figure 14. Ground Pin Current © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 6 FAN2500 — 100 mA CMOS LDO Regulator Typical Performance Characteristics (Countinued) Figure 15. Ground Pin Current Figure 16. Ground Pin Current Figure 17. Dropout Voltage Figure 18. Dropout Characteristics Figure 19. Dropout Voltage Figure 20. Dropout Voltage © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 7 FAN2500 — 100 mA CMOS LDO Regulator Typical Performance Characteristics (Countinued) FAN2500 — 100 mA CMOS LDO Regulator Typical Performance Characteristics (Countinued) Figure 22. Enable Pin Delay Figure 21. Output Voltage vs. Temperature Figure 23. Shutdown Delay © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 8 Designed utilizing CMOS process technology, the FAN2500 is carefully optimized for use in compact battery-powered devices. The FAN2500 offers a unique combination of low power consumption, extremely low dropout voltages, high tolerance for a variety of output capacitors, and the ability to disable the output to less than 1 μA under user control. In the circuit, a difference amplifier controls the current through a series-pass Pchannel MOSFET, comparing the load voltage at the output with an onboard low-drift band-gap reference. The series resistance of the pass P-channel MOSFET is approximately 1 Ω, resulting in an unusually low dropout voltage under load compared to older bipolar pass-transistor designs. Input Capacitor An input capacitor of 2.2 μF (nominal value) or greater, connected between the Input pin and ground, located in close proximity to the device, improves transient response and noise rejection. Higher values offer superior input ripple rejection and transient response. An input capacitor is recommended when the input source, either a battery or a regulated AC voltage, is located far from the device. Any good-quality ceramic, tantalum, or metal film capacitor gives acceptable performance; however, tantalum capacitors with a surge current rating appropriate to the application must be selected to avoid catastrophic failure. Protection circuitry is provided onboard for overload conditions. If the device reaches temperatures exceeding the specified maximums, an onboard circuit shuts down the output and it remains suspended until it has cooled before re-enabling. The user can shut down the device using the Enable control pin at any time. Output Capacitor An output capacitor is required to maintain regulator loop stability. Unlike many other LDO regulators, the FAN2500 is nearly insensitive to output capacitor ESR. Stable operation is achieved with a wide variety of capacitors with ESR values ranging from 10 mΩ to 10 Ω or more. Tantalum, aluminum electrolytic, or multilayer ceramic can be used. A nominal value of at least 1 μF is recommended. Careful design of the output regulator amplifier assures loop stability over a wide range of ESR values in the external output capacitor. A wide range of values and types can be accommodated, allowing the user to select a capacitor meeting space, cost, and performance requirements; and still enjoy reliable operation over temperature, load, and tolerance variations. Depending on the model selected, a number of control and status functions are available to enhance the operation of the LDO regulator. An Enable pin, available on all devices, allows the user to shut down the regulator output to conserve power, reducing supply current to less than 1 μA. The adjustable-voltage versions of the device utilize pin 4 to connect to an external voltage divider that feeds back to the regulator error amplifier, thereby setting the voltage as desired. Two other functions are available at pin 4 in the fixed-voltage versions: in noisesensitive applications, an external bypass capacitor connection is provided that allows the user to achieve optimal noise performance at the output, while the error output functions as a diagnostic flag to indicate that the output voltage has dropped more than 5% below the nominal fixed voltage. Bypass Capacitor (FAN2500 Only) In the fixed-voltage configuration, connecting a capacitor between the Bypass pin and ground can significantly reduce noise on the output. Values ranging from 470 pF to 10 nF can be used, depending on the sensitivity to output noise in the application. At the high-impedance Bypass pin, care must be taken in the circuit layout to minimize noise pickup and capacitors must be selected to minimize current loading (leakage). Noise pickup from external sources can be considerable. Leakage currents into the Bypass pin directly affect regulator accuracy and should be kept as low as possible; high-quality ceramic and film types are recommended for their low leakage characteristics. Cost-sensitive applications not concerned with noise can omit this capacitor. Control Functions Applications Information Enable Pin Applying a voltage of 0.4 V or less at the Enable pin disables the output, reducing the quiescent output current to less than 1 μA; while a voltage of 2.0 V or greater enables the device. If this shutdown function is not needed, the pin can be connected to the VIN pin. Allowing this pin to float causes erratic operation. External Capacitors – Selection FAN2500 supports a wide variety of capacitors compared to other LDO products. An innovative design approach offers significantly reduced sensitivity to ESR (Equivalent Series Resistance), which degrades regulator loop stability in older designs. While the improvements greatly simplify the design task, capacitor quality still must be considered to achieve optimal circuit performance. © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 9 FAN2500 — 100 mA CMOS LDO Regulator In general, ceramic capacitors offer superior ESR performance at a lower cost and a smaller case size than tantalum. Those with X7R or Y5V dielectric offer the best temperature coefficient characteristics. The combination of tolerance and variation over temperature in some capacitor types can result in significant variations, resulting in unstable performance over rated conditions. Functional Description FAN2500 can supply high peak output currents of up to 1 A for brief periods. However, this output load causes the device temperature to exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 150°C, onboard thermal protection disables the output until the temperature drops below this limit, at which point the output is re-enabled. During a thermal shutdown situation, the user may assert the power-down function at the Enable pin, reducing power consumption to the minimum level IGND· VIN. If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition. Operational of Adjustable Version The adjustable version of the FAN2500 includes an input pin, ADJ, which allows the user to select an output voltage ranging from 1.8 V to near VIN, using an external resistor divider. The voltage VADJ presented to the ADJ pin is fed to the onboard error amplifier, which adjusts the output voltage until VADJ is equal to the onboard bandgap reference voltage of 1.32 V (typ). The equation is: Thermal Characteristics FAN2500 can supply 100 mA at the specified output voltage with an operating die (junction) temperature of up to 125°C. Once the power dissipation and thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the thermal resistance is a result of the thermal characteristics of the compact SOT23-5 surface-mount package and the surrounding PC board copper to which it is mounted. The total value of the resistor chain should not exceed The power dissipation is equal to the product of the input to output voltage differential and the output current, plus the ground current multiplied by the input voltage, or: 250 kΩ total to keep the error amplifier biased during noload conditions. Programming output voltages very near VIN need to allow for the magnitude and variation of the dropout voltage VDO over load, supply, and temperature P D = ( V IN – V OUT )I OUT + V IN I GND variations. Note that the low-leakage MOSFET input to the CMOS error amplifier induces no bias current error to the calculation. The ground pin current, IGND, can be found in the charts provided in the Electrical Characteristics section. General PCB Layout Considerations The relationship describing the thermal behavior of the package is: To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establishing a small local ground, to which the GND pin, the output, and bypass capacitors are connected; is recommended. The input capacitor should be grounded to the main ground plane. The quiet local ground is routed back to the main ground plane using feed-through vias. In general, the high-frequency compensation components (input, bypass, and output capacitors) should be located as close to the device as possible. The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground provides the heat sinking discussed above when high power dissipation significantly increases the temperature of the device. ⎧ T J ( max ) – T A ⎫ P D ( max ) = ⎨ ------------------------------- ⎬ θ JA ⎩ ⎭ where TJ(max) is the maximum allowable junction temperature of the die, which is 125°C, and TA is the ambient operating temperature. θJA is dependent on the surrounding PC board layout and can be empirically obtained. While the θJC (junction-to-case) of the SOT235 package is specified at 130°C /W, the θJA of the minimum PWB footprint is at least 235°C/W. This can be improved by providing a heat sink of surrounding copper ground on the PCB. Depending on the size of the copper area, the resulting θJA can range from approximately 180°C/W for one square inch to nearly 130°C/W for four square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can reduce this value. The heat contributed by the dissipation of other devices nearby must be included in design considerations. Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside. © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 10 FAN2500 — 100 mA CMOS LDO Regulator Once the limiting parameters in these two relationships have been determined, the design can be modified to ensure that the device remains within specified operating conditions at all times. Thermal Protection FAN2500 — 100 mA CMOS LDO Regulator Physical Dimensions SOT-23 3.00 2.80 5 SYMM CL 0.95 0.95 A 4 B 3.00 2.60 1.70 1.50 1 2 2.60 3 (0.30) 1.00 0.50 0.30 0.95 1.90 0.20 C A B 0.70 TOP VIEW LAND PATTERN RECOMMENDATION SEE DETAIL A 1.30 0.90 1.45 MAX 0.15 0.05 0.22 0.08 C 0.10 C NOTES: UNLESS OTHEWISE SPECIFIED GAGE PLANE A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) MA05Brev5 0.25 8° 0° 0.55 0.35 0.60 REF SEATING PLANE Figure 24. 5-LEAD, SOT-23, JEDEC MO-178, 1.6 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packaging/tr/SOT23-5L_tr.pdf. © 2010 Fairchild Semiconductor Corporation FAN2500 Rev. 1.1.0 www.fairchildsemi.com 11 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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