IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER™ II FEATURES: • • • • • • • • • • • • IDT5T93GL10 DESCRIPTION: Guaranteed Low Skew < 25ps (max) Very low duty cycle distortion < 100ps (max) High speed propagation delay < 2ns (max) Up to 650MHz operation Glitchless input clock switching Selectable inputs Hot insertable and over-voltage tolerant inputs 3.3V / 2.5V LVTTL, HSTL, eHSTL, LVEPECL (2.5V), LVPECL (3.3V), CML, or LVDS input interface Selectable differential inputs to ten LVDS outputs Power-down mode 2.5V VDD Available in VFQFPN package The IDT5T93GL10 2.5V differential clock buffer is a user-selectable differential input to ten LVDS outputs . The fanout from a differential input to ten LVDS outputs reduces loading on the preceding driver and provides an efficient clock distribution network. The IDT5T93GL10 can act as a translator from a differential HSTL, eHSTL, LVEPECL (2.5V), LVPECL (3.3V), CML, or LVDS input to LVDS outputs. A single-ended 3.3V / 2.5V LVTTL input can also be used to translate to LVDS outputs. The redundant input capability allows for a glitchless change-over from a primary clock source to a secondary clock source. Selectable inputs are controlled by SEL. During the switchover, the output will disable low for up to three clock cycles of the previously-selected input clock. The outputs will remain low for up to three clock cycles of the newly-selected clock, after which the outputs will start from the newly-selected input. A FSEL pin has been implemented to control the switchover in cases where a clock source is absent or is driven to DC levels below the minimum specifications. The IDT5T93GL10 outputs can be asynchronously enabled/disabled. When disabled, the outputs will drive to the value selected by the GL pin. Multiple power and grounds reduce noise. APPLICATIONS: • Clock distribution FUNCTIONAL BLOCK DIAGRAM GL G1 PD A1 OUTPUT CONTROL Q1 OUTPUT CONTROL Q2 OUTPUT CONTROL Q3 OUTPUT CONTROL Q4 OUTPUT CONTROL Q5 OUTPUT CONTROL Q6 OUTPUT CONTROL Q7 OUTPUT CONTROL Q8 OUTPUT CONTROL Q9 OUTPUT CONTROL Q10 Q1 Q2 1 A1 A2 0 A2 SEL FSEL G2 The IDT logo is a registered trademark of Integrated Device Technology, Inc. INDUSTRIAL TEMPERATURE RANGE Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q10 JANUARY 2007 1 © 2007 Integrated Device Technology, Inc. DSC 6184/15 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE FSEL VDD Q8 Q8 Q9 Q9 Q10 Q10 VDD SEL PIN CONFIGURATION 40 39 38 37 36 35 34 33 32 31 G1 1 30 G2 VDD 2 29 PD GND 3 28 VDD Q1 4 27 Q7 Q1 5 26 Q7 Q2 6 25 Q6 Q2 7 24 Q6 VDD 8 23 VDD A1 9 22 A2 A1 10 21 A2 GND VFQFPN TOP VIEW 2 GND VDD Q5 Q5 Q4 Q4 Q3 Q3 VDD GL 11 12 13 14 15 16 17 18 19 20 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE CAPACITANCE(1) (TA = +25°C, F = 1.0MHz) ABSOLUTE MAXIMUM RATINGS(1) Max Unit VDD Symbol Power Supply Voltage Description –0.5 to +3.6 V VI Input Voltage –0.5 to +3.6 V VO Output Voltage(2) –0.5 to VDD +0.5 V TSTG Storage Temperature –65 to +150 °C TJ Junction Temperature 150 °C Symbol CIN Parameter Min Typ. Max. Unit Input Capacitance — — 3 pF NOTE: 1. This parameter is measured at characterization but not tested NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Not to exceed 3.6V. RECOMMENDED OPERATING RANGE Symbol TA VDD Description Ambient Operating Temperature Internal Power Supply Voltage Min. –40 2.3 Typ. +25 2.5 Max. +85 2.7 Unit °C V PIN DESCRIPTION Symbol A[1:2] A[1:2] I/O I I Type Adjustable(1,4) Adjustable(1,4) G1 I LVTTL G2 I LVTTL GL I LVTTL Qn Qn SEL PD O O I I LVDS LVDS LVTTL LVTTL FSEL VDD I LVTTL PWR Description Clock input. A[1:2] is the "true" side of the differential clock input. Complementary clock inputs. A[1:2] is the complementary side of A[1:2]. For LVTTL single-ended operation, A[1:2] should be set to the desired toggle voltage for A[1:2]: 3.3V LVTTL VREF = 1650mV 2.5V LVTTL VREF = 1250mV Gate control for differential outputs Q1 and Q1 through Q5 and Q5. When G1 is LOW, the differential outputs are active. When G1 is HIGH, the differential outputs are asynchronously driven to the level designated by GL(2). Gate control for differential outputs Q6 and Q6 through Q10 and Q10. When G2 is LOW, the differential outputs are active. When G2 is HIGH, the differential outputs are asynchronously driven to the level designated by GL(2). Specifies output disable level. If HIGH, "true" outputs disable HIGH and "complementary" outputs disable LOW. If LOW, "true" outputs disable LOW and "complementary" outputs disable HIGH. Clock outputs Complementary clock outputs Reference clock select. When LOW, selects A2 and A2. When HIGH, selects A1 and A1. Power-down control. Shuts off entire chip. If LOW, the device goes into low power mode. Inputs and outputs are disabled. Both "true" and "complementary" outputs will pull to VDD. Set HIGH for normal operation.(3) At a rising edge, FSEL forces select to the input designated by SEL. Set LOW for normal operation. Power supply for the device core and inputs PWR Ground GND NOTES: 1. Inputs are capable of translating the following interface standards: Single-ended 3.3V and 2.5V LVTTL levels Differential HSTL and eHSTL levels Differential LVEPECL (2.5V) and LVPECL (3.3V) levels Differential LVDS levels Differential CML levels 2. Because the gate controls are asynchronous, runt pulses are possible. It is the user's responsibility to either time the gate control signals to minimize the possibility of runt pulses or be able to tolerate them in down stream circuitry. 3. It is recommended that the outputs be disabled before entering power-down mode. It is also recommended that the outputs remain disabled until the device completes powerup after asserting PD. 4. The user must take precautions with any differential input interface standard being used in order to prevent instability when there is no input signal. 3 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE DC ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING RANGE FOR LVTTL(1) Symbol Parameter Input Characteristics IIH Input HIGH Current IIL Input LOW Current VIK Clamp Diode Voltage VIN DC Input Voltage VIH DC Input HIGH VIL DC Input LOW VTHI DC Input Threshold Crossing Voltage Single-Ended Reference Voltage(3) VREF Test Conditions VDD = 2.7V VDD = 2.7V VDD = 2.3V, IIN = -18mA 3.3V LVTTL 2.5V LVTTL Min. Typ.(2) Max Unit — — — - 0.3 1.7 — — — — — — - 0.7 ±5 ±5 - 1.2 +3.6 — 0.7 — — — μA VDD /2 1.65 1.25 V V V V V V NOTES: 1. See RECOMMENDED OPERATING RANGE table. 2. Typical values are at VDD = 2.5V, +25°C ambient. 3. For A[1:2] single-ended operation, A[1:2] is tied to a DC reference voltage. DC ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING RANGE FOR DIFFERENTIAL INPUTS(1) Symbol Parameter Input Characteristics IIH Input HIGH Current IIL Input LOW Current VIK Clamp Diode Voltage VIN DC Input Voltage VDIF DC Differential Voltage(2) VCM DC Common Mode Input Voltage(3) Test Conditions VDD = 2.7V VDD = 2.7V VDD = 2.3V, IIN = -18mA Min. Typ.(4) Max Unit — — — - 0.3 0.1 0.05 — — - 0.7 ±5 ±5 - 1.2 +3.6 — VDD μA V V V V NOTES: 1. See RECOMMENDED OPERATING RANGE table. 2. VDIF specifies the minimum input differential voltage (VTR - VCP) required for switching where VTR is the "true" input level and VCP is the "complement" input level. The DC differential voltage must be maintained to guarantee retaining the existing HIGH or LOW input. The AC differential voltage must be achieved to guarantee switching to a new state. 3. VCM specifies the maximum allowable range of (VTR + VCP) /2. 4. Typical values are at VDD = 2.5V, +25°C ambient. DC ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING RANGE FOR LVDS(1) Symbol Parameter Output Characteristics VOT(+) Differential Output Voltage for the True Binary State VOT(-) Differential Output Voltage for the False Binary State ΔVOT Change in VOT Between Complementary Output States VOS Output Common Mode Voltage (Offset Voltage) ΔVOS Change in VOS Between Complementary Output States IOS Outputs Short Circuit Current Differential Outputs Short Circuit Current IOSD Test Conditions Min. Typ.(2) Max Unit VOUT + and VOUT - = 0V VOUT + = VOUT - 247 247 — 1.125 — — — — — — 1.2 — 12 6 454 454 50 1.375 50 24 12 mV mV mV V mV mA mA NOTES: 1. See RECOMMENDED OPERATING RANGE table. 2. Typical values are at VDD = 2.5V, +25°C ambient. 4 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE DIFFERENTIAL INPUT AC TEST CONDITIONS FOR HSTL Symbol Parameter VDIF Input Signal Swing(1) Value Units 1 V VX Differential Input Signal Crossing Point 750 mV DH Duty Cycle 50 % VTHI Input Timing Measurement Reference Level tR, tF Input Signal Edge Rate(4) (2) (3) Crossing Point V 2 V/ns NOTES: 1. The 1V peak-to-peak input pulse level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VDIF (AC) specification under actual use conditions. 2. A 750mV crossing point level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VX specification under actual use conditions. 3. In all cases, input waveform timing is marked at the differential cross-point of the input signals. 4. The input signal edge rate of 2V/ns or greater is to be maintained in the 20% to 80% range of the input waveform. DIFFERENTIAL INPUT AC TEST CONDITIONS FOR eHSTL Symbol Parameter VDIF Input Signal Swing(1) Value Units 1 V VX Differential Input Signal Crossing Point 900 mV DH Duty Cycle 50 % VTHI Input Timing Measurement Reference Level tR, tF Input Signal Edge Rate(4) (2) (3) Crossing Point V 2 V/ns NOTES: 1. The 1V peak-to-peak input pulse level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VDIF (AC) specification under actual use conditions. 2. A 900mV crossing point level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VX specification under actual use conditions. 3. In all cases, input waveform timing is marked at the differential cross-point of the input signals. 4. The input signal edge rate of 2V/ns or greater is to be maintained in the 20% to 80% range of the input waveform. DIFFERENTIAL INPUT AC TEST CONDITIONS FOR LVEPECL (2.5V) AND LVPECL (3.3V) Symbol Parameter VDIF Input Signal Swing(1) VX Differential Input Signal Crossing Point (2) DH Duty Cycle VTHI Input Timing Measurement Reference Level(3) tR, tF Input Signal Edge Rate Value Units 732 mV LVEPECL 1082 mV LVPECL 1880 (4) 50 % Crossing Point V 2 V/ns NOTES: 1. The 732mV peak-to-peak input pulse level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VDIF (AC) specification under actual use conditions. 2. 1082mV LVEPECL (2.5V) and 1880mV LVPECL (3.3V) crossing point levels are specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VX specification under actual use conditions. 3. In all cases, input waveform timing is marked at the differential cross-point of the input signals. 4. The input signal edge rate of 2V/ns or greater is to be maintained in the 20% to 80% range of the input waveform. 5 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE DIFFERENTIAL INPUT AC TEST CONDITIONS FOR LVDS Symbol Parameter VDIF Input Signal Swing(1) Value Units 400 mV VX Differential Input Signal Crossing Point 1.2 V DH Duty Cycle 50 % VTHI Input Timing Measurement Reference Level(3) tR, tF Input Signal Edge Rate(4) (2) Crossing Point V 2 V/ns NOTES: 1. The 400mV peak-to-peak input pulse level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VDIF (AC) specification under actual use conditions. 2. A 1.2V crossing point level is specified to allow consistent, repeatable results in an automatic test equipment (ATE) environment. This device meets the VX specification under actual use conditions. 3. In all cases, input waveform timing is marked at the differential cross-point of the input signals. 4. The input signal edge rate of 2V/ns or greater is to be maintained in the 20% to 80% range of the input waveform. AC DIFFERENTIAL INPUT SPECIFICATIONS(1) Symbol Parameter Min. Typ. Max Unit VDIF AC Differential Voltage(2) 0.1 — 3.6 V VIX VCM Differential Input Crosspoint Voltage Common Mode Input Voltage Range(3) 0.05 0.05 — — VDD VDD V V VIN Input Voltage - 0.3 +3.6 V NOTES: 1. The output will not change state until the inputs have crossed and the minimum differential voltage defined by VDIF has been met or exceeded. 2. VDIF specifies the minimum input voltage (VTR - VCP) required for switching where VTR is the "true" input level and VCP is the "complement" input level. The AC differential voltage must be achieved to guarantee switching to a new state. 3. VCM specifies the maximum allowable range of (VTR + VCP) /2. POWER SUPPLY CHARACTERISTICS FOR LVDS OUTPUTS(1) Symbol IDDQ ITOT IPD Parameter Quiescent VDD Power Supply Current Total Power VDD Supply Current Total Power Down Supply Current Test Conditions VDD = Max., All Input Clocks = LOW(2) Outputs enabled VDD = 2.7V., FREFERENCE CLOCK = 650MHz PD = LOW NOTES: 1. These power consumption characteristics are for all the valid input interfaces and cover the worst case conditions. 2. The true input is held LOW and the complementary input is held HIGH. 6 Typ. — Max 295 Unit mA — — 305 5 mA mA IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE AC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE(1,5) Symbol Skew Parameters tSK(O) tSK(P) Parameter Min. Typ. Max Unit Same Device Output Pin-to-Pin Skew(2) Pulse Skew(3) — — — — 25 100 ps ps tSK(PP) Propagation Delay tPLH tPHL Part-to-Part Skew(4) — — 300 ps Propagation Delay A, A Crosspoint to Qn, Qn Crosspoint — 1.5 2 ns — — 650 MHz Output Gate Enable Crossing VTHI to Qn/Qn Crosspoint — — 3.5 ns Output Gate Disable Crossing VTHI to Qn/Qn Crosspoint Driven to GL Designated Level — — 3.5 ns PD Crossing VTHI to Qn = VDD, Qn = VDD Output Gate Disable Crossing VTHI to Qn/Qn Driven to GL Designated Level — — — — 100 100 μS μS fO Frequency Range(6) Output Gate Enable/Disable Delay tPGE tPGD Power Down Timing tPWRDN tPWRUP NOTES: 1. AC propagation measurements should not be taken within the first 100 cycles of startup. 2. Skew measured between crosspoints of all differential output pairs under identical input and output interfaces, transitions and load conditions on any one device. 3. Skew measured is the difference between propagation delay times tPHL and tPLH of any single differential output pair under identical input and output interfaces, transitions and load conditions on any one device. 4. Skew measured is the magnitude of the difference in propagation times between any single differential output pair of two devices, given identical transitions and load conditions at identical VDD levels and temperature. 5. All parameters are tested with a 50% input duty cycle. 6. Guaranteed by design but not production tested. 7 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE DIFFERENTIAL AC TIMING WAVEFORMS 1/fo + VDIF VDIF = 0 - VDIF A[1:2] - A[1:2] tPHL tPLH + VDIF VDIF = 0 - VDIF Qn - Qn tSK(O) tSK(O) Qm - Qm Output Propagation and Skew Waveforms NOTES: 1. Pulse skew is calculated using the following expression: tSK(P) = | tPHL - tPLH | Note that the tPHL and tPLH shown above are not valid measurements for this calculation because they are not taken from the same pulse. 2. AC propagation measurements should not be taken within the first 100 cycles of startup. 8 + VDIF VDIF = 0 - VDIF IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE + VDIF VDIF = 0 - VDIF A[1:2] - A[1:2] VIH VTHI VIL GL tPLH VIH VTHI VIL Gx tPGE tPGD + VDIF VDIF = 0 - VDIF Qn - Qn Differential Gate Disable/Enable Showing Runt Pulse Generation NOTE: 1. As shown, it is possible to generate runt pulses on gate disable and enable of the outputs. It is the user's responsibility to time their Gx signals to avoid this problem. A1 - A1 + VDIF VDIF = 0 - VDIF A2 - A2 + VDIF VDIF = 0 - VDIF VIH VTHI VIL SEL + VDIF VDIF = 0 - VDIF Qn - Qn Glitchless Output Operation with Switching Input Clock Selection NOTES: 1. When SEL changes, the output clock goes LOW on the falling edge of the output clock up to three cycles later. The output then stays LOW for up to three clock cycles of the new input clock. After this, the output starts with the rising edge of the new input clock. 2. AC propagation measurements should not be taken within the first 100 cycles of startup. 9 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE FSEL Operation for When Current Clock Dies NOTES: 1. When the differential on the selected clock goes below the minimum DC differential, the outputs clock goes to an unknown state. When this happens, the SEL pin should be toggled and FSEL asserted in order to force selection of the new input clock. The output clock will start up after a number of cycles of the newly-selected input clock. 2. The FSEL pin should stay asserted until the problem with the dead clock can be fixed in the system. 3. It is recommended that the FSEL be tied HIGH for systems that use only one input. If this is not possible, the user must guarantee that the unused input have a differential greater than or equal to the minimum DC differential specified in the datasheet. FSEL Operation for When Opposite Clock Dies NOTES: 1. When the differential on the non-selected clock goes below the minimum DC differential, the outputs clock goes to an unknown state. When this happens, the FSEL pin should be asserted in order to force selection of the new input clock. The output clock will start up after a number of cycles of the newly-selected input clock. 2. The FSEL pin should stay asserted until the problem with the dead clock can be fixed in the system. 3. It is recommended that the FSEL be tied HIGH for systems that use only one input. If this is not possible, the user must guarantee that the unused input have a differential greater than or equal to the minimum DC differential specified in the datasheet. 10 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE A1 - A1 +VDIF VDIF=0 -VDIF A2 - A2 +VDIF VDIF=0 -VDIF FSEL VIH VTHI VIL SEL VIH VTHI VIL +VDIF VDIF=0 -VDIF Qn - Qn Selection of Input While Protecting Against When Opposite Clock Dies NOTES: 1. If the user holds FSEL HIGH, the output will not be affected by the deselected input clock. 2. The output will immediately be driven to LOW once FSEL is asserted. This may cause glitching on the output. The output will restart with the input clock selected by the SEL pin. 3. If the user decides to switch input clocks, the user must de-assert FSEL, then assert FSEL after toggling the SEL input pin. The output will be driven LOW and will restart with the input clock selected by the SEL pin. A1 - A1 +VDIF VDIF=0 -VDIF A2 - A2 +VDIF VDIF=0 -VDIF Gx VIH VTHI VIL PD VIH VTHI VIL +VDIF VDIF=0 -VDIF Qn - Qn Power Down Timing NOTES: 1. It is recommended that outputs be disabled before entering power-down mode. It is also recommended that the outputs remain disabled until the device completes power-up after asserting PD. 2. The POWER DOWN TIMING diagram assumes that GL is HIGH. 3. It should be noted that during power-down mode, the outputs are both pulled to VDD. In the POWER DOWN TIMING diagram this is shown when Qn - Qn goes to VDIF = 0. 11 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE TEST CIRCUITS AND CONDITIONS VIN ~50Ω Transmission Line VDD/2 A D.U.T. Pulse Generator VIN A ~50Ω Transmission Line -VDD/2 Scope 50Ω 50Ω Test Circuit for Differential Input DIFFERENTIAL INPUT TEST CONDITIONS Symbol VDD = 2.5V ± 0.2V Unit VTHI Crossing of A and A V 12 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE VDD A Pulse Generator Qn RL A D.U.T. VOS VOD RL Qn Test Circuit for DC Outputs and Power Down Tests VDD/2 SCOPE CL Z = 50Ω Pulse Generator A Qn 50Ω A D.U.T. 50Ω Qn Z = 50Ω CL -VDD/2 Test Circuit for Propagation, Skew, and Gate Enable/Disable Timing LVDS OUTPUT TEST CONDITION Symbol VDD = 2.5V ± 0.2V Unit CL 0(1) 8(1,2) pF RL 50 Ω NOTES: 1. Specifications only apply to "Normal Operations" test condition. The TIA/EIA specification load is for reference only. 2. The scope inputs are assumed to have a 2pF load to ground. TIA/EIA - 644 specifies 5pF between the output pair. With CL = 8pF, this gives the test circuit appropriate 5pF equivalent load. 13 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE RECOMMENDED LANDING PATTERN NL 40 pin NOTE: All dimensions are in millimeters. 14 IDT5T93GL10 2.5V LVDS 1:10 GLITCHLESS CLOCK BUFFER TERABUFFER II INDUSTRIAL TEMPERATURE RANGE ORDERING INFORMATION IDT XXXXX Device Type XX Package X Process I -40°C to +85°C (Industrial) NL Thermally Enhanced Plastic Very Fine Pitch Quad Flat No Lead Package VFQFPN - Green NLG 5T93GL10 CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 2.5V LVDS 1:10 Glitchless Clock Buffer Terabuffer™ II for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 15 for Tech Support: [email protected]