NCN6004A Dual SAM/SIM Interface Integrated Circuit The NCN6004A is an interface IC dedicated for Secured Access Module reader/writer applications. It allows the management of two external ISO/EMV cards thanks to a simple and flexible microcontroller interface. Several NCN6004A interfaces can share a single data bus, assuming the external MPU provides the right Chip Select signals to identify each IC connected on the bus. A built in accurate protection system guarantees timely and controlled shutdown in the case of external error conditions. On top of that, the NCN6004A can independently handle the power supply, in the range 2.7 V to 5.0 V input voltage, provided to each external Smart Card. The interface monitors the current flowing into each Smart Card, a flag being set in the case of overload. http://onsemi.com TQFP48 CASE 932F PLASTIC Features • Separated, Built-in DC/DC Converters Supply VCC Power to • • • • • • • • • • • External Cards 100% Compatible with ISO 7816-3, EMV and GIE-CB Standards Fully GSM Compliant Individually Programmable ISO/EMV Clock Generator Built-in Programmable CRD_CLK Stop Function Handles Run or High/Low State Programmable CRD_CLK Slopes to Cope with Wide Operating Frequency Range Programmable Independent VCC Supply for Each Smart Card Support up to 65 mA VCC Supply to Each ISO/EMV Card Multiple NCN6004A Parallel Operation on a Shared Bus 8 kV/Human Model ESD Protection on Each Interface Pin Provides C4/C8 Channels Provides 1.80 V, 3.0 V or 5.0 V Card Supply Voltages MARKING DIAGRAM NCN6004A AWLYYWW 48 1 A WL YY WW = Assembly Location = Wafer Lot = Year = Work Week Typical Applications • • • • • • ORDERING INFORMATION Set Top Box Decoder ATM Multi Systems, POS, Handheld Terminals Internet E-commerce PC Interface Multiple Self Serve Automatic Machines Wireless Phone Payment Interface Automotive Operating Time Controller Semiconductor Components Industries, LLC, 2003 June, 2003 - Rev. 2 Device NCN6004AFTBR2 1 Package Shipping TQFP48 2000 Tape & Reel Publication Order Number: NCN6004A/D ANLG_GND INT STATUS EN_RPU MUX_MODE ANLG_GND ANLG_VCC CRD_DET_B CRD_C8_B CRD_C4_B CRD_RST_B CRD_IO_B NCN6004A 48 47 46 45 44 43 42 41 40 39 38 37 A0 1 36 PWR_GND A1 2 35 L2b A2 3 34 L1b A3 4 33 PWR_VCC_B CARD_SEL 5 32 CRD_VCC_B PGM 6 31 CRD_CLK_B CS 7 30 CRD_CLK_A PWR_ON 8 29 CRD_VCC_A I/O_A 9 28 PWR_VCC_A MPU BUS IRQ GND 9 10 11 12 13 GND 14 20 21 22 23 24 CRD_RST_A CRD_IO_A PWR_VCC_A I/O_A RESET_A C4_A C8_A CLK_IN_A NCN6004A PWR_GND PWR_GND CRD_DET_A ANLG_GND CRD_VCC_A CRD_RST_A 42 VCC C4 ANLG_GND CLK_IN_B C8_B C4_B RESET_B I/O_B SMARTCARD # A J1 27 22 H 26 34 22 H 35 L2a L1a L1b L2b A0 CRD_DET_B A1 CRD_VCC_B A2 A3 CRD_RST_B CARD_SEL CRD_CLK_B PGM CRD_C4_B CS PWR_ON CRD_C8_B MUX_MODE EN_RPU CRD_IO_B STATUS PWR_VCC_B INT ANLG_GND 15 16 17 18 19 19 L2 ANLG_VCC DATA PORT#B DATA PORT#A MICRO CONTROLLER VCC 1 2 3 4 5 6 7 8 44 45 46 47 18 Figure 1. Pin Diagram L1 CHIP SELECT 17 CRD_C4_A 16 CRD_C8_A 15 CRD_DET_A 14 C8_B 13 I/O_B 25 PWR_GND RESET_B C8_A 12 C4_B 26 L2a CLOCK_IN_B C4_A 11 ANLG_GND 27 L1a CLOCK_IN_A RESET_A 10 CRD_CLK_A CRD_C4_A CRD_C8_A CRD_IO_A 17 C3 41 10 F 32 1 V CC 2 RST 3 CLK 4 C4 38 31 39 DET 18 GND VPP I/O C8 5 GND 6 7 8 40 37 33 28 C1 10 F 36 25 20 29 VCC GND J2 SMARTCARD # B 17 C2 10 F DET DET 1 V CC GND 23 2 30 3 22 4 21 24 GND 100 nF Figure 2. Typical Application http://onsemi.com 18 GND 43 48 2 DET GND RST VPP CLK I/O C4 C8 5 6 7 8 GND NCN6004A AGND 43 INPUT VOLTAGE MONITOR GND INT STATUS 47 46 50 k 50 k INTERRUPT BLOCK DET#B VCC PWR_ON 8 A0 1 A1 2 A2 A3 CARD#A SEQUENCER 7 DIGITAL BLOCK 100 k VCC CS IO_A 3 RST_A CNTL 4 C4A C8A PGM CLK_INA 5 CONTROL CARD_SEL 6 27 26 L2a L1a 29 CRD_VCCA 25 PWR_GND GND C8A C4A CLK_A RESET_A 21 CRD_C8A 22 CRD_C4A 30 CRD_CLKA 24 CRD_IOA 23 CRD_RSTA I/O#A CLK#A CLOCK#A DIVIDER 13 28 PWR_VCCA DET#A VCC CARD#A DC/DC CONVERTER 42 CARD #A PINS DRIVERS ANLG_VCC DET#A CARD#A DETECTION 20 CRD_DETA DET#B CARD#B DETECTION 41 CRD_DETB CLK#A CLK_INB CLOCK#B DIVIDER 15 C4A 10 11 C8A 12 I/O_B RESET_B C4B 19 18 17 IO_B 100 k 100 k 100 k 26 k 100 k 100 k 100 k RST_B CNTL C4B C8B IO_A CLK#B RST_A C4A C8A IO_B C4B CLK_B RESET_A CARD#B PINS DRIVERS RESET_A 9 ANALOG & DIGITAL MULTIPLEX I/O_A 40 CRD_C8B C8B 39 CRD_C4B CARD#B DC/DC CONVERTER 26 k CARD#B SEQUENCER CLK#B 32 CRD_VCCB 38 CRD_RSTB 37 CRD_IOB 31 CRD_CLKB I/O#B 36 PWR_GND GND RST_B 16 EN_RPU 45 MUX_MODE 44 35 L2b L1b 33 PWR_VCCB C4B C8B 34 C8B NOTE: An internal active pull down device forces all the smart card pins to zero when the chip is deactivated. Figure 3. Block Diagram http://onsemi.com 3 NCN6004A PIN DESCRIPTION Pin Symbol Type Description 1 A0 INPUT This pin is combined with CS, A1, A2, A3, CARD_SEL and PGM to program the chip mode of operation, the CRD_VCC voltage value, and to read the data provided by the internal STATUS register (Table 1). 2 A1 INPUT This pin is combined with CS, A0, A2, A3, CARD_SEL and PGM to program the chip mode of operation, the CRD_VCC voltage value, and to read the data provided by the internal STATUS register (Table 1). 3 A2 INPUT This pin is combined with CS, A0, A1, A3, CARD_SEL and PGM to program the chip mode of operation, the CRD_VCC voltage value, and to read the data provided by the internal STATUS register (Table 1). 4 A3 INPUT This pin is combined with CS, A0, A1, A2, CARD_SEL and PGM to program the chip mode of operation, the CRD_VCC voltage value, and to read the data provided by the internal STATUS register (Table 1). 5 CARD_SEL INPUT This pin provides logic identification of the Card #A/Card #B external smart card. The logic signal is set up by the external microcontroller. CARD_SEL = High → selection of the Smart Card A connected to pins 20, 21, 22, 23, 24, 29 and 30 (respectively CRD_DET_A, CRD_C8_A, CRD_C4_A, CRD_RST_A, CRD_IO_A, CRD_VCC_A and CRD_CLK_A). CARD_SEL = Low → selection of the Smart Card B connected to pins 41, 39, 40, 31, 38, 37, and 32 (respectively CRD_DET_B, CRD_C4_B, CRD_C8_B, CRD_CLK_B, CRD_RST_B, CRD_IO_B, and CRD_VCC_B). 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PGM = H→ the NCN6004A is under normal operation and all the data with the external card can be exchanged using any of the Smart Card A or Smart Card B Lines PGM = Low → the NCN6004A runs the programming mode and related parameters can be re programmed according to a given need. In this case, the related card side logic signals are latched in their previous states and no transaction can occurs. The programmed states are latched upon the PGM rising slope (Figure 4). 7 CS DIGITAL INPUT This pin provides the Chip Select Function for the NCN6004A device. CS = High → Pins A0, A1, A2, A3, CARD_SEL, PGM, PWR_ON, RESET_A, RESET_B, C4_A, C4_B, C8_A, C8_B, I/O_A and I/O_B are disabled, the pre activated CRD_VCC maintains it’s currently programmed value. CS = Low → Pins A0, A1, A2, A3, CARD_SEL, PGM, PWR_ON, RESET_A, RESET_B, C4_A, C4_B, C8_A, C8_B, I/O_A and I/O_B are activated, all the functions being available.An internal pull up resistor, connected to VCC, provides a logic bias when the external P is in the high impedance state. 8 PWR_ON DIGITAL INPUT This pin activates or deactivates the DC/DC converter selected by CARD_SEL upon positive/negative going transient. PWR_ON = Positive going High → DC/DC Activated PWR_ON = Negative going L → DC/DC switched Off, no power is applied to the associated output CRD_VCC pin. Since uncontrolled action could take place during the rise voltage of the related CRD_VCC_x output, care must be observed to avoid a PWR_ON negative going transient during this period of time. To avoid any logical latch up, using a minimum 1.0 ms delay is recommended prior to power down the related DC/DC converter following a power up command (Figure 12). 9 I/O_A INPUT/OUTPUT This pin carries the data transmission between an external microcontroller and the external smart card #A. A built-in bi-directional level translator adapts the signal flowing between the card and the MCU. The level translator is enabled when CS = Low. Since a dedicated line is used to communicate the data between the MPU and the smart card, the user can activate the two channels simultaneously, assuming the P provides a pair of I/O lines. When MUX_MODE = High, this pin provides an access to either card A or B I/O by means of CARD_SEL selection bit. On the other hand, the internal pull up resistor is automatically disconnected when MUX_MODE = High, avoiding a current overload on the I/O line, regardless of the EN_RPU logic level. This pull up resistor is under the EN_RPU control when MUX_MODE = Low. http://onsemi.com 4 NCN6004A PIN DESCRIPTION (continued) Pin Symbol Type Description 10 RESET_A INPUT The signal present on this pin is translated to the RST pin of the external smart card #A. The CS signal must be Low to validate the RESET function, regardless of the selected card. Assuming the P provides two independent lines to control the RESET pins, the NCN6004A can control two cards simultaneously. When MUX_MODE = High, this pin provides an access to either card A or B Reset by means of CARD_SEL selection bit. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 11 C4_A INPUT This pin controls the card #A C4 contact The signal can be either de-multiplexed, at MPU level, or is multiplexed with C4_B, depending upon the MUX_MODE logic state. When MUX_MODE = High, this pin provides an access to either card A or B C4 channel by means of CARD_SEL selection bit. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 12 C8_A INPUT This pin controls the card #A C8 contact. The signal can be either de-multiplexed, at MPU level, or is multiplexed with C8_B, depending upon the MUX_MODE logic state. When MUX_MODE = High, this pin provides an access to either card A or B C8 channel by means of CARD_SEL selection bit. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 13 CLOCK_IN_A Clock Input, High Impedance The signal present on this pin comes from either the MCU master clock, or from any signal fulfilling the logic level and frequency specifications. This signal is fed to the internal clock selection circuit prior to be connected to the external smart card #A. Each of the external card can have different division ratio, depending upon the state of the CRD_SEL pin and associated programming bits. The built-in circuit can be programmed to 1/1, 1/2, 1/4 or 1/8 frequency division ratio. This input is valid and routed to either CRD_CLK_A _DIVIDER or CRD_CLK_B_DIVIDER regardless of the MUX_MODE state, depending upon the CLK_D_A/ CRD_D_B and CARD_SEL programmed states (Table 1). Although this input supports the signal coming from a crystal oscillator, care must be observed to avoid digital levels outside the specified VIH/VIL range. Similarly, the input clock signal shall have rise and fall times compatible with the operating frequency. 14 ANLG_GND POWER This pin is the ground reference for both analog and digital signals and must be connected to the system Ground. Care must be observed to provide a copper PCB layout designed to avoid small signals and power transients sharing the same track. Good high frequency techniques are strongly recommended. 15 CLOCK_IN_B Clock Input, High Impedance The signal present on this pin comes from either the MCU master clock, or from any signal fulfilling the logic level and frequency specifications. This signal is fed to the internal clock selection circuit prior to be connected to the external smart card #B. Each of the external card can have different division ratio, depending upon the state of the CRD_SEL pin and associated programming bits. The built-in circuit can be programmed to 1/1, 1/2, 1/4, or 1/8 frequency division ratio. This input is valid and routed to either CRD_CLK_B_DIVIDER or CRD_CLK_A_DIVIDER regardless of the MUX_MODE state, depending upon the CRD_D_B/CRD_D_A and CARD_SEL programmed states (Table 1). Although this input supports the signal coming from a crystal oscillator, care must be observed to avoid digital levels outside the specified VIH/VIL range. Similarly, the input clock signal shall have rise and fall times compatible with the operating frequency. 16 C8_B INPUT This pin controls the card #B C8 contact. The signal can be either de -multiplexed, at MPU level, or is multiplexed with C8_A, depending upon the MUX_MODE logic state. When MUX_MODE = High, this pin is internally disable, a pull up resistor is connected to VCC (regardless of the logic state of EN_RPU is), and the access to card B takes place by C8_A associated with CARD_SEL selection bit. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. http://onsemi.com 5 NCN6004A PIN DESCRIPTION (continued) Pin Symbol Type Description 17 C4_B INPUT This pin controls the card #B C4 contact. The signal can be either de -multiplexed, at MPU level, or is multiplexed with C8_A, depending upon the MUX_MODE logic state. When MUX_MODE = High, this pin is internally disable, a pull up resistor is connected to VCC, (regardless of the logic state of EN_RPU), and the access to card B takes place by C4_A associated with CARD_SEL selection bit. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 18 RESET_B INPUT The signal present on this pin is translated to the RST pin of the external smart card #B. The CS signal must be Low to valid the RESET function, regardless of the selected card. Assuming the P provides two independent lines to control the RESET pins, and MUX_MODE = Low, the NCN6004A can control two cards simultaneously. When MUX_MODE = High, this pin is internally disable, a pull up resistor is connected to VCC, (regardless of the logic state of EN_RPU), and the access to card B takes place by RESET_A associated with CARD_SEL selection bit. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 19 I/O_B INPUT/OUTPUT This pin carries the data transmission between an external microcontroller and the external smart card #B. A built-in bi-directional level translator adapts the signal flowing between the card and the MCU. The level translator is enabled when CS = Low. The signal present on this pin is latched when CS = High. Since a dedicated line is used to communicate the data between the P and the smart card, (assuming MUX_MODE = Low) the user can activate the two channels simultaneously, assuming the P provides a pair of I/O lines. When MUX_MODE = High, this pin is internally disable, the pull up resistor is connected to VCC, (regardless of the logic state of EN_RPU), and the access to card B takes place by I/O_A associated with CARD_SEL selection bit. 20 CRD_DET_A INPUT 21 CRD_C8_A OUTPUT This pin controls the card #A C8 contact, according to the ISO7816 specifications. A built-in level shifter is used to adapt the card and the C, regardless of the power supply voltage of each signals. The signal present at this pin is latched upon either CARD_SEL =L, or CS = H or PGM = L, and resume to a transparent mode when card #A is selected and operates in the transfer mode.The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_A start-up time. 22 CRD_C4_A OUTPUT This pin controls the card #A C4 contact, according to the ISO7816 specifications. A built-in level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. The signal present at this pin is latched upon either CARD_SEL = L, or CS = H, or PGM = L, and resume to a transparent mode when card #A is selected and operates in the transfer mode. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_A start-up time. 23 CRD_RST_A OUTPUT This pin is connected to the external smart card #A to support the RESET signal. A built-in level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. The signal present at this pin is latched upon either CARD_SEL = Low, or when CS or PGM returns to a High, and resume to a transparent mode when card #A is selected. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_A start-up time. This pin senses the signal coming from the external smart card connector to detect the presence of card #A. The polarity of the signal is programmable as Normally Open or Normally Close switch. The logic signal will be activated when the level is either Low or High, with respect to the polarity defined previously. By default, the input is Normally Open. A built-in circuit prevents uncontrolled short pulses to generate an INT signal. The digital filter eliminates pulse width below 50s (see spec). http://onsemi.com 6 NCN6004A PIN DESCRIPTION (continued) Pin Symbol Type Description 24 CRD_IO_A INPUT/OUTPUT This pin carries the data serial connection between the external smart card #A and the microcontroller. A built-in bidirectional level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. This pin is biased by a pull up resistor connected to CRD_VCC_A. When CS = High, the CRD_IO_A holds the previous I/O logic state and resume to a normal operation when this pin is reactivated. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_A start-up time. 25 PWR_GND POWER This pin carries the power current flow coming from the built in DC/DC converters. It is associated with the external card # A. It must be connected to the system Ground and care must be observed at PCB layout level to avoid the risk of spike voltages on the logic lines. 26 L2_A POWER Connects one side of the external DC/DC converter inductor #A (Note 1) 27 L1_A POWER Connects one side of the external DC/DC converter inductor #A (Note 1). 28 PWR_VCC_A POWER This pin is connected to the positive external power supply. The device sustains any voltage from +2.7 V to +5.5 V. This voltage supplies the NCN6004A internal circuits and is regulated by the internal DC/DC converter to provide the DC voltage to the external card. A high quality capacitor must be connected across pin 28 and PWR_GND, 10 F/6.0 V ceramic X7R or X5R type is recommended. Note: The voltage present at pin 28 and 33 must be equal to the voltage present at pin 42. 29 CRD_VCC_A POWER This pin provides the power supply to the external smart card #A. The VCC voltage is defined by programming the NCN6004A accordingly. Since the cards have independent DC/DC converter, the output voltage can have any value independently from CARD_B. A high quality, low ESR capacitor is mandatory to achieve the VCC specifications. Using two 4.7 F/6.0 V ceramic X7R or X5R capacitors in parallel is recommended. 30 CRD_CLK_A OUTPUT This pin is connected to the CLK external smart card #A pin. The signal comes from the built- in frequency divider dedicated to the #A card. The clock is selected and controlled by setting the logic inputs according to Table 1. The slope of the output clock can be selected between one of the two programmable mode: SLOW or FAST (Table 8). The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_A start- up time. 31 CRD_CLK_B OUTPUT This pin is connected to the CLK external smart card #B pin. The signal comes from the built- in frequency divider dedicated to the #B card. The clock is selected and controlled by setting the logic inputs according to Table 1. The slope of the output clock can be selected between one of the two programmable mode: SLOW or FAST (Table 8). The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_B start- up time. 32 CRD_VCC_B POWER This pin provides the power supply to the external smart card #B. The VCC voltage is defined by programming the NCN6004A accordingly. Since the cards have independent DC/DC converter, the output voltage can have any value independently from CARD_A. A high quality, low ESR capacitor is mandatory to achieve the VCC specifications. Using two 4.7 F/6.0 V ceramic X7R or X5R capacitors in parallel is recommended. 33 PWR_VCC_B POWER This pin is connected to the positive external power supply. The device sustains any voltage from +2.7 V to +6.0 V. This voltage supplies the NCN6004A internal circuits and is regulated by the internal DC/DC converter to provide the DC voltage to the external card. A high quality capacitor must be connected across pin 33 and PWR_GND, 10 F/6.0 V ceramic X7R type is recommended. Note: The voltage present on pin 28 and 33 must be equal to the voltage present on pin 42 34 L2b POWER Connects one side of the external DC/DC converter inductor #B (Note 1). 35 L1b POWER Connects one side of the external DC/DC converter inductor #B (Note 1). 36 PWR_GND POWER This pin carries the power current flow coming from the built in DC/DC converters. It is associated with the external card # B. It must be connected to the system Ground and care must be observed at PCB layout level to avoid the risk of spike voltages on the logic lines. ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 1. The external inductors shall preferably have the same values. Depending upon the power absorbed by the load, the inductor can range from 10 H to 47 H. To achieve the highest yield, the inductor shall have an ESR < 1.0 . http://onsemi.com 7 NCN6004A PIN DESCRIPTION (continued) Pin Symbol Type Description 37 CRD_IO_B INPUT/OUTPUT This pin carries the data serial connection between the external smart card #B and the microcontroller. A built-in bi-directional level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. This pin is biased by a pull up resistor connected to CRD_VCC_A. When CS = High, the CRD_IO_A holds the previous I/O logic state and resume to a normal operation when this pin is reactivated. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_B start-up time. 38 CRD_RST_B OUTPUT This pin is connected to the external smart card #B to support the RESET signal. A built-in level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. The signal present at this pin is latched upon either CARD_SEL or CS or PGM positive going transient and resume to a transparent mode when card #B is selected. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_B start-up time. 39 CRD_C4_B OUTPUT This pin controls the card #B C4 contact, according to the ISO specification. A builtin level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. The signal present at this pin is latched upon either CARD_SEL or CS or PGM positive going transient and resume to a transparent mode when card #B is selected. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_B start-up time. 40 CRD_C8_B OUTPUT This pin controls the card #B C8 contact, according to the ISO specification. A builtin level shifter is used to adapt the card and the MCU, regardless of the power supply voltage of each signals. The signal present at this pin is latched upon either CARD_SEL or CS or PGM positive going transient and resume to a transparent mode when card #B is selected. The pin is hardwired to zero, the bias being provided by the VCC supply, when either the VCC voltage drops below 2.7 V, or during the CRD_VCC_B start-up time. 41 CRD_DET_B INPUT This pin senses the signal coming from the external smart card connector to detect the presence of card #B. The polarity of the signal is programmable as Normally Open or Normally Close switch. The logic signal will be activated when the level is either Low or High, with respect to the polarity defined previously. By default, the input is Normally Open. A built-in circuit prevents uncontrolled short pulses to generate an INT signal. The digital filter eliminates pulse width below 50 s. 42 ANLG_VCC POWER This pin is connected to the positive external power supply. The device sustains any voltage from +2.7 V to +5.5 V. This voltage supplies the NCN6004A internal Analog and Logic circuits. A high quality capacitor must be connected across this pin and ANLG_GND, 10 F/6 V is recommended. A set of extra pins (28 and 33) are provided to connect the power supply to the internal DC/DC converter. Note: The voltage present at pin 28 and 33 must be equal to the voltage present at pin 42 43 ANLG_GND GROUND This pin is the ground reference for both analog and digital signals and must be connected to the system Ground. Care must be observed to provide a copper PCB layout designed to avoid small signals and power transients sharing the same track. Good high frequency techniques are strongly recommended. 44 MUX_MODE INPUT This pin selects the mode of operation of the card signals from the MPU side. When MUX_MODE = Low, all the card signals are fully de-multiplexed and data transfers can take place with both cards simultaneously. On top of that, both cards can be accessed during the programming sequence, assuming the external microcontroller is capable to run multi tasks software. When MUX_MODE = High, all the card signals are multiplexed and the communications with the cards shall take place in a sequential mode. The card is selected by setting CARD_SEL high or Low. The internal logic will disable the CARD_B inputs and use CARD_SEL inputs as a single channel to controls both output smart cards sequentially when MUX_MODE = H. Moreover, when MUX_MODE = High, all the B channel P dedicated pins, except CLOCK_IN_B, pin 15, are forced to a high level by means of internal pull up resistors. It is not necessary to connect these pins (16, 17, 18 and 19) to an external bias voltage, but it is mandatory to avoid any connections to ground. On the other hand, in this case the internal pull up resistor connected across I/O_A, pin 9 and V CC is automatically disconnected to avoid a current overload on the I/O line. http://onsemi.com 8 NCN6004A PIN DESCRIPTION (continued) Pin Symbol Type Description 45 EN_RPU INPUT This pin provides a logic input to valid or not the internal pull up resistors connected across each I/O, RESET, C4 and C8 lines and ANLG_VCC. When EN_RPU = High, the pull up resistors are connected When EN_RPU = Low, the pull up resistors are disconnected and it is up to the designer to set up the external resistor to cope with the ISO/EMV specifications. The logic signal must be set up prior to apply the ANLG_VCC supply. Once the logic mode has been acknowledged by the internal Power On reset, it cannot be changed until a new start-up sequence is launched. 46 STATUS OUTPUT This pin provides a logic state related to the card [A or B] insertion, the VCC_OK, the CRD_VCC value and the current overflow powered to either card [A or B]. The internal register can be read when PGM = High. The logic level is forced to High when the input voltage drops below the Vbat min (2.0 V), thus reducing the stand by current, assuming the STATUS pin is not pulled down externally. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 47 INT OUTPUT This pin is activated LOW when a card has been inserted and detected in either of the external ports. The signal is reset by either a positive going transition on pin CS, or by a High level on pin PWR_ON combined with CS = Low. Similarly, an interrupt is generated when either one of the CRD_VCC output is overloaded. On the other hand, the pin is forced to a logic High when the input voltage VCC drops below 2.0 V min. The associated pull up resistor is either connected to VCC (EN_RPU = H) or disconnected when EN_RPU = Low. 48 ANLG_GND GROUND This pin is the ground reference for both analog and digital signals and must be connected to the system Ground. Care must be observed to provide a copper PCB layout designed to avoid small signals and power transients sharing the same track. Good high frequency techniques are strongly recommended. MAXIMUM RATINGS (Note 2) Rating Power Supply Input Supply Voltage Vin Power Supply Input Current Symbol Value Unit VCC 6 V Digital Input Pins -0.5 V < Vin< VCC +0.5 V, but < 6.0 V V IVCC 500 mA Digital Input Pins Vin In -0.5 < VCC or VCC < 5.5 5 V mA Digital Output Pins Vout Iout -0.5 < VCC or VCC < 5.5 10 V mA Card Interface Pins Vcard Icard -0.5V < Vcard < CRD_VCC +0.5V 15 mA (internally limited) V mA ESD Capability, Human Body Model (Note 3) Standard Pins Card Interface Pins (Card A or B) VESD 2 8 kV kV PD RJA 800 50 mW °C/W Operating Ambient Temperature Range TA -40 to +85 °C Operating Junction Temperature Range TJ -40 to +125 °C TJmax +150 °C Tag -65 to +150 °C TQFP48 Power Dissipation @ Tab = +85°C Thermal Resistance Junction-to-Air Maximum Junction Temperature (Note 4) Storage Temperature Range 2. Maximum Electrical Ratings are defined as those values beyond which damage(s) to the device may occur at TA = +25°C. 3. Human Body Model, R = 1500 , C = 100 pF. 4. Absolute Maximum Rating beyond which damage(s) to the device may occur. http://onsemi.com 9 NCN6004A POWER SUPPLY SECTION General test conditions, unless otherwise specified: Operating temperature: -25°C < TA < +85°C, VCC = +3.0 V, CRD_VCC_A = CRD_VCC_B = +5.0 V. Rating Symbol Pin Iout = 2 x 65 mA (both external cards running simultaneously) @ 3.0 V < VCC < 5.5 V CRD_VCC 29, 32 Iout = 2 x 55 mA per pin (both external cards running) Vout defined @ CRD_VCC = 3.0 V @ 3.0 V < VCC < 5.5 V CRD_VCC Iout = 2 x 35 mA per pin (both external cards running) Vout defined @ CRD_VCC = 1.80 V @ 3.0 V < VCC < 5.5 V CRD_VCC Output Card Supply Voltage Ripple (per CRD_VCC outputs) @ : Lout = 22 H, LESR < 2.0 , Cout = 10 F per CRD_VCC (Note 5) Iout = 35 mA, Vout = 1.80 V Iout = 55 mA, Vout = 3.0 V Iout = 65 mA, Vout = 5.0 V Min Typ Max 4.6 - 5.4 2.7 - 3.3 1.65 - 1.95 Unit V 29, 32 V 29, 32 V mV VORA VORB 29 32 DC/DC Dynamic Inductor Peak Current @ Vbat = 5.0 V, Lout = 22 H, Cout = 10 F CRD_VCC = 1.8 V CRD_VCC = 3.0 V CRD_VCC = 5.0 V Iccov 29, 32 Standby Supply Current Conditions (Note 5): ANLG_VCC = PWR_VCC = 3.0 V PWR_ON = H, STATUS = H, CS = H Card A and Card B CLOCK_IN = H, I/O = H, RESET = H All Logic Inputs = H, Temperature range = 0°C to +50°C IDD 50 50 50 200 280 430 A 42, 28, 33 ANLG_VCC = PWR_VCC = 1.8 V Temperature range –25°C to +50°C All other test conditions identical Note: This parameter is guaranteed by design, not production tested. IDDop - mA - ANLG_VCC = PWR_VCC = 5.0 V Temperature range –25°C to +85°C All other test conditions identical Operating Supply Current ANLG_VCC = PWR_VCC = 5.5 V @ CRD_VCC_A/B = 5.0 V @ CRD_VCC_ A/B = 3.0 V @ CRD_VCC_ A/B = 1.85 V - - 20 - - 50 - - 5.0 - 42, 28, 33 mA 0.7 0.7 0.7 ANLG_VCC = PWR_VCC = 3.3 V @ CRD_VCC_A/B = 5.0 V @ CRD_VCC_ A/B = 3.0 V @ CRD_VCC_ A/B = 1.85 V PWR_ON = H, CS = H, CLK_A = CLK_B = Low, all card pins unloaded 0.2 0.2 0.2 Vbat Under Voltage Detection Positive Going Slope Vbat Under Voltage Detection Negative Going Slope Vbat Under Voltage Detection Hysteresis Note: The voltage present in pins 28 and 33 must be equal to or Note: lower than the voltage present in pin 42. VbatLH VbatLL VbatHY 42 Output Continuous Current Card A or Card B (both cards can be operating simultaneously) @ 3.0 < VCC < 5.5 V Output Voltage = 1.85 V Output Voltage = 3.0 V Output Voltage = 5.0 V Iccp 31, 42 Output Over Current Limit (A or B) Vbat = 3.3 V, CRD_VCC = 1.8 V, 3.0 V or 5.0 V Vbat = 5.0 V, CRD_VCC = 1.8 V, 3.0 V or 5.0 V Iccov Output Over Current Time Out Per Card Itdoff 31, 42 VCCTON 31, 42 2.1 2.0 - 100 2.7 2.6 - V V mV mA 35 55 65 Output Card Supply Turn On Time @ Lout = 22 F, Cout = 10 F Ceramic. VCC = 2.7 V, CRD_VCC = 5.0 V (A or B) 31, 42 100 150 mA 4.0 ms s 500 5. Assuming ANLG_VCC and PWR_VCC pins are connected to the same power supply. http://onsemi.com 10 NCN6004A POWER SUPPLY SECTION General test conditions, unless otherwise specified: Operating temperature: -25°C < TA < +85°C, VCC = +3.0 V, CRD_VCC_A = CRD_VCC_B = +5.0 V. (continued) Rating Output Card Supply Shut Off Time @ Cout = 10 F, ceramic. VCC = 2.7 V, CRD_VCC = 5.0 V, VCCOFF < 0.4 V (A or B) Symbol Pin VCCTOFF 31, 42 DC/DC Converter Operating Frequency (A or B) FSW Min Typ Max 100 250 Unit s 31, 42 600 kHz 5. Assuming ANLG_VCC and PWR_VCC pins are connected to the same power supply. DIGITAL INPUT/OUTPUT SECTION 2.70 < VCC < 5.50 V, Normal Operating Mode (-25°C to +85°C ambient temperature, unless otherwise noted) Symbol Pin A0, A1, A2, A3, CARD_SEL, PWR_ON, PGM, CS, MUX_MODE, EN_RPU, RESET_A, RESET_B, C4_A, C8_A, C4_B, C8_B High Level Input Voltage Low Level Input Voltage Input Capacitance VIH VIL Cin 1, 2, 3, 4, 5, 6, 7, 8, 44, 45, 10, 18, 11, 12, 16, 17 STATUS, INT Output High Voltage @ IOH = -10 A Output Low Voltage @ IOH = 200 A VOH VOL Rating Min Typ 0.7 * Vbat Max Unit Vbat 0.3 * Vbat 10 V V pF 46, 47 STATUS, INT Output Rise Time @ Cout = 30 pF Output Fall Time @ Cout = 30 pF trsta, trint tfsta, tfint CLOCK_A Asynchronous Input Clock @ DC = 50% 1% FCLKINA CLOCK_B Asynchronous Input Clock @ DC = 50% 1% I/O_A, I/O_B, both directions @ Cout = 30 pF I/O Rise Time I/O Fall Time V Vbat –1.0 V 0.40 5 100 s ns 13 40 MHz FCLKINB 15 40 MHz trioA, trioB tfioA, tfioB 9, 19 0.8 0.8 STATUS Pull Up Resistance RSTA 46 35 50 k INT Pull Up Resistance RINT 47 35 50 k I/O_A Pull Up Resistance RIOA 9 14 20 35 k I/O_B Pull Up Resistance RIOB 19 14 20 35 k RESET_A Pull Up Resistance RRSTA 10 60 100 k RESET_B Pull Up Resistance RRSTB 18 60 100 k C4_A Pull Up Resistance RC4A 11 60 100 k C8_A Pull Up Resistance RC8A 12 60 100 k C4_B Pull Up Resistance RC4B 17 60 100 k C8_B Pull Up Resistance RC8B 16 60 100 k CS Pull Up Resistance RCS 7 60 100 k RDETA RDETB 20 41 500 500 k k s CRD_DET_A and CRD_DET_B Pull Up Resistance http://onsemi.com 11 NCN6004A CARD INTERFACE SECTION @ 2.70 < VCC < 5.50 V, Normal Operating Mode (-25°C to +85°C ambient temperature, unless otherwise noted) CRD_VCC_A = CRD_VCC_B = 1.8 V or 3.0 V or 5.0 V Rating Symbol Pin Min CRD_RST_A, CRD_RST_B Output Voltage Output RST High Level @ Irst = -200 A Output RST Low Level @ Irst = 200 A VOH VOL 23, 38 23, 38 CRD_VCC-0.5 0 CRD_RST_A, CRD_RST_B Rise and Fall time RST Rise Time @ Cout = 30 pF RST Fall Time @ Cout = 30 pF trrst tfrst 23, 38 23, 38 CRD_CLK_A, CRD_CLK_B Output Clock Output Operating Clock Card A and Card B Output Operating Clock DC, Card A and Card B (Input DC = 50%, 1%) Note: This parameter is guaranteed by design, functionality 100% tested at production. Output Operating Clock Rise Time SLOW Mode Card A and Card B Output Operating Clock Fall Time SLOW Mode Card A and Card B Output Operating Clock Rise Time FAST Mode Card A and Card B Output Operating Clock Fall Time FAST Mode Card A and Card B Output Clock High Level, Card A and Card B, @ Iclk = -200A Output Clock Low Level, Card A and Card B, @ Iclkc = 200A Typ Max Unit CRD_VCC 0.4 V V 100 100 ns ns 20 55 MHz % trclka, trclkb 16 ns tfclka, tfclkb 16 ns trclka, trclkb 4 ns tfclka, tfclkb 4 ns CRD_VCC 0.4 V V 0.8 0.8 CRD_VCC 0.4 kHz s s V V 30, 31 FclkA, FclkB 45 CRD_VCC-0.5 0 VOH VOL CRD_IO_A, CRD_IO_B Data Transfer Data Transfer Frequency, Card A and Card B Data Rise Time, Card A and Card B, @ Cout = 30 pF Data Fall Time, Card A and Card B, @ Cout = 30 pF Data Output High Level, Card A and Card B @ Icrd_io = -20 A Data Output Low Level, Card A and Card B @ Icrd_io = 20 A 24, 37 FIOA, FIOB trioa, triob tfioa, tfiob VOH VOL CRD_IO_A and CRD_IO_B Output Voltages I/O_A = I/O_B = 0, IOL = 500 A 400 CRD_VCC-0.5 0 24, 37 V VOL CRD_C4_A, CRD_C4_B Output Voltages Output C4 High Level @ Irst = -200 A Output C4 Low Level @ Irst = 200 A CRD_C4_A, CRD_C4_B Rise and Fall time C4 Rise Time @ Cout = 30 pF C4 Fall Time @ Cout = 30 pF 0.40 22, 39 VOH VOL CRD_VCC-0.5 0 trc4 tfc4 CRD_C8_A, CRD_C8_B Output Voltages Output C4 High Level @ Irst = -200 A Output C4 Low Level @ Irst = 200 A CRD_C8_A, CRD_C8_B Rise and Fall Time C8 Rise Time @ Cout = 30 pF C8 RST Fall Time @ Cout = 30 pF CRD_VCC 0.4 V V 100 100 ns ns CRD_VCC 0.4 V V 100 100 ns 21, 40 VOH VOL CRD_VCC-0.5 0 trc8 tfc8 Pull Up resistance, CS = Low, PWR_ON = High CRD_IO_A CRD_IO_B ROLA ROLB 24 37 k Card Detection Bias Pull Up Current, Card A or Card B CRD_DET_A, CRD_DET_B IDETA IDETB 20 41 VILDETA VILDETB 20 41 tdcina tdcinb 20 41 Card Insertion/Extraction Negative Going Input Low Voltage 14 14 20 20 35 35 A 15 15 0 0 0.30 * Vbat 0.30 * Vbat V s Card Detection Insertion/Extraction Digital Filtering Delay CRD_DET_A CRD_DET_B CARD_A or CARD_B short circuit current: CRD_IO, CRD_RST, CRD_C4, CRD_C8 CRD_CLK (According to ISO and EMV specifications) 50 50 mA Ishort Ishortclk http://onsemi.com 12 15 70 NCN6004A DIGITAL DYNAMIC SECTION NORMAL OPERATING MODE Rating Symbol Pin Card Signal Sequence Interval, CRD_VCC_A and CRD_VCC_B: CRD_IO_A, CRD_RST_A, CRD_CLK_A, CRD_C4_A, CRD_C8_A CRD_IO_B, CRD_RST_B, CRD_CLK_B, CRD_C4_B, CRD_C8_B tdseq 24, 23, 30, 37, 38, 31 Internal RESET Delay tdreset Internal STATUS Delay Time tdready 46 PWR_ON Low State Pulse Width (Figure 11), Assuming CRD_VCC reservoir capacitor = 10 F. tpwrlow 8 Min Typ Max 0.5 0.5 2 2 Unit s 1.0 s 1.0 s s 5 PWR_ON High State Pulse Width (Figure 11) tpwrset 8 200 ns PWR_ON Preset Delay (Figure 11) tpwrpre 5, 7, 8 300 ns PWR_ON Programming Hold Time (Figure 11) tpwrhold 5, 7, 8 100 ns PWR_ON to CARD_SEL Change Delay Time (Figure 12) tcseldly 5, 6, 8 100 ns tpgmdly 5, 6, 8 300 ns tpwrp 8 Rating Symbol Pin Min Data Set-up Time, Time Reference = PGM, A0, A1, A2, A3, CARD_SEL, and CS. Data Signal Rise and Fall Time tsmod 8, 46, 1, 2, 3, 4, 5, 6 100 tsmodtr Data Hold Time, Time Reference = PGM, A0, A1, A2, A3, CARD_SEL, and CS. tsmod tsmodtr 8, 46, 1, 2, 3, 4, 5, 6 100 twcs trfcs 7 300 PGM to PWR_ON Delay Time (Figure 12) PWR_ON internal Set/Reset Pulses Width (Figure 12) 20 ns DIGITAL DYNAMIC SECTION PROGRAMMING MODE Chip Select CS Low State Pulse Width CS Signal Rise and Fall Time http://onsemi.com 13 Typ Max Unit ns 50 ns 50 ns ns 50 ns ns NCN6004A PROGRAMMING AND STATUS FUNCTIONS The NCN6004A includes a programming interface and a status interface. Figure 4 illustrates the sequence one must follow to enter and exit the programming mode. Table 1 and Table 2 provide the logical functions associated with the ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ ÉÉÉÉÉÉ input and output signals. The parameters are latched upon the rising edge of the PGM signal, the CS pin being held low. Any number of programming sequences can be performed while the CS pin is Low, but the minimum timings must be observed. ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ Example: Set CRD_VCC_A = 3.0 V A0 A1 A2 A3 CARD_SEL ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ ÉÉÉÉÉ Example: Set CRD_CLK_B = 1/8 Parameters are latched upon PGM rise slope PGM CS tsprg twcs thprg Figure 4. Programming Sequence make sure that no data will be present to a card not ready for such a function. As a matter of fact, all the card signals are routed to the selected card immediately after a CARD_SEL change, the NCN6004A taking no further logic control prior to activate the swap. To avoid any risk, one can run a sequence with the selected card, return CS to High, change the CARD_SEL according to the expected card selection, and pull CS to Low to activate the selected card. On the other hand, since the programming data are latched upon the rising edge of the PGM signal, the most up to date selected card (using CARD_SEL = H or L) is used to activate the associated card. Consequently, when both cards must be updated with the same programmed content, a dual PGM sequence must be carried out, changing the CARD_SEL signal during the High level state of the PGM pin. Although selecting a card in possible during the same Chip Select sequence (as depicted here above), the user must Table 1. Programming and Reading Basic Functions Pin Name Select #A #B Select VCC ON/OFF Program CLOCK_IN Poll Card Status #A or #B Poll ICC Overload #A or #B ANLG_VCC Input Voltage OK 7 CS 0 0 0 0 0 0 46 STATUS - - - READ READ READ 1 A0 0/1 0/1 0/1 1 0 0 2 A1 0/1 0/1 0/1 1 1 0 3 A2 0/1 0/1 0/1 X X X 4 A3 0/1 0/1 0/1 X X X 5 CARD_SEL 0/1 0/1 0/1 0/1 0/1 0/1 6 PGM 0/1 0/1 0/1 1 1 1 http://onsemi.com 14 NCN6004A Table 2. Programming Functions (Conditions at start-up are in Bold) (HEX) PGM A3 A2 A1 A0 CARD_SEL CRD_VCC #A CRD_VCC #B CRD_CLK CRD_CLK #A #B CRD_DET #A CRD_DET #B CLOCK SLOPE 00 0 0 0 0 0 1 1.80 V - - - - - - 01 0 0 0 0 1 1 3.0 V - - - - - - 02 0 0 0 1 0 1 5.0 V - - - - - 03 0 0 0 1 1 1 - - - - - 00 0 0 0 0 0 0 - 1.80 V - - - - - 01 0 0 0 0 1 0 - 3.0 V - - - - - 02 0 0 0 1 0 0 - 5.0 V - - - - 03 0 0 0 1 1 0 - - - - - SLOW 04 0 0 1 0 0 1 - - 1/1 - - - 05 0 0 1 0 1 1 - - 1/2 - - - - 06 0 0 1 1 0 1 - - 1/4 - - - - 07 0 0 1 1 1 1 - - 1/8 - - - 04 0 0 1 0 0 0 - - - 1/1 - - - 05 0 0 1 0 1 0 - - - 1/2 - - - 06 0 0 1 1 0 0 - - - 1/4 - - - 07 0 0 1 1 1 0 - - - 1/8 - - - 08 0 1 0 0 0 1 - - START - - - - 09 0 1 0 0 1 1 - - STOPL - - - - 0A 0 1 0 1 0 1 - - STOPH - - - - 0B 0 1 0 1 1 1 - - - - - - FAST 08 0 1 0 0 0 0 - - - START - - - 09 0 1 0 0 1 0 - - - STOPL - - - 0A 0 1 0 1 0 0 - - - STOPH - - - 0B 0 1 0 1 1 0 - - - - - - FAST 0C 0 1 1 0 0 1 - - - - NO - - OD 0 1 1 0 1 1 - - - - NC 0C 0 1 1 0 0 0 - - - - - 0D 0 1 1 0 1 0 0E 0 1 1 1 0 1 - - CLK_D_A - 0F 0 1 1 1 1 1 - - CLK_D_B 0E 0 1 1 1 0 0 - - 0F 0 1 1 1 1 0 - - http://onsemi.com 15 - SLOW NO - NC - - - - - - - - - CLK_D_B - - - - CLK_D_A - - - NCN6004A Table 3. Status Pins Data STATE (HEX) PGM A3 A2 A1 A0 CARD_SEL 00 1 X X 0 0 X Vcc_Vbat_OK Pass = Low VCC_OK Fail = High 01 1 X X 0 1 1 CRD_VCC_A In Range Pass = High Fail =Low 02 1 X X 1 0 1 CRD_VCCA Overloaded Pass = High Fail = Low 03 1 X X 1 1 1 CRD_DET_A Card Present = High 00 1 X X 0 0 X VCC_OK Pass = Low VCC_OK Fail = High 01 1 X X 0 1 0 CRD_VCC_B In Range Pass = High Fail =Low 02 1 X X 1 0 0 CRD_VCC_B Overloaded Pass = High Fail = Low 03 1 X X 1 1 0 CRD_DET_A Card Present = High STATUS #A STATUS #B *The STATUS register is not affected when the NCN6004A operates in any of the programming mode. Initialized conditions upon start-up are depicted by bold characters in Table 2 and Table 4. Typical ANLG_VCC Operating Voltage Min. ANLG_VCC Under Voltage Max. ANLG_VCC Under Voltage 3.30 V 2.70 V 2.10 V 2.00 V Vbat Vbat_OK Vbat STATUS The input power supply voltage monitoring applies to the card selected. Figure 5. Reading ANLG_VCC Status (monitoring ANLG_VCC input voltage) SYSTEM STATES UPON UPON START-UP Depending upon the logic state at turn on present on pin 44, the system will run into a parallel mode (MUX_MODE = L) or a multiplexed mode (MUX_MODE = H). It is not possible to change the logic state once the system is running. Similarly, depending upon the logic state present pin 45, the internal pull up resistors (I/O_A and I/O_B line) will be either connected to ANLG_VCC voltage (EN_RPU = H) or disconnected (EN_RPU = L). It is not possible to change this operating condition once the system is running. Table 4. Operating Conditions Upon Start-up CRD_VCC_A 3.0 V CRD_VCC_B 3.0 V CRD_CLK_A 1/1 Ratio CRD_CLK_B 1/1 Ratio CRD_CLK_A START (clock is valid) CRD_CLK_B START (clock is valid) CRD_CLK_A Low Speed Slope CRD_CLK_B Low Speed Slope CLOCK Route Direct (CLK_A → A, CLK_B → B) http://onsemi.com 16 NCN6004A PARALLEL/MULITPLEXED OPERATION MODES The logic input MUX_MODE, pin 44, provides a way to select the operation mode of the NCN6004A. Depending upon the logic level, the device operates either in a parallel mode (all the card pins, on the P side, are fully independent) 10 11 12 9 Q4 I/O_B 19 BUFFERS CARD_A I/O_A GATING CARD_A RESET_A C4_A C8_A or in multiplexed mode (all the logic card pins, on the P side, share a common bus). Figure 6 shows a simplified schematic of the multiplex circuit built in the NCN6004A chip. 23 22 21 I/O_A BUFFER 24 I/O_B BUFFER 37 Q1 18 C4_B 17 C8_B 16 MUX_MODE 15 CARD_SEL 15 CLK_IN_A 13 B A B Q2 A BUFFERS CARD_B REST_B GATING CARD_B A 38 39 40 Q3 MULTIPLEXER B CLK_A BUFFER 30 CLK_B BUFFER 31 CLOCK DIVIDERS & MULTIPLEXER CLK_IN_B 15 Figure 6. Simplified MUX_MODE Logic and Multiplex Circuit transaction can take place at the same time and processed independently. Of course, the microcontroller must have the right data bus available to handle this process. However, it is not possible to change the operating mode once the system has been started. If such a function is needed, one must pull down the related NCN6004A power supply, change the MUX_MODE logic level, and re-start the interface. In both case, the device is programmed by means of the common logic controls pins (A0, A1, A2, A3, PGM, PWR_ON, CARD_SEL and CS). On the other hand, the logic status returned by the interface (STATUS pin 46) is shared by the two channels and can be read independently by setting CARD_SEL accordingly. The card related signals connected on the C side are multiplexed or independent, depending upon the MUX_MODE state as described here below. MUX_MODE = High MULTIPLEXED MODE MUX_MODE = Low PARALLEL MODE When pin 44 is High, the device operates in a multiplexed mode and all the card signals are shared between CARD_A and CARD_B, except the input clocks which are independent at any time. The RST_B, C4_B and C8_B pins are preferably left open at PCB level. The I/O_B pin must be left open and cannot be connected to any external signal or bias voltages. The transfer gate Q4 is switched ON and, depending upon the CARD_SEL logic level, the I/O data will be transferred When pin 44 is low, the device operates in the parallel mode. The transfer gate Q4 and the multiplexer circuit are disconnected and all the data will be carried out through their respective paths. The switches Q1, Q2 and Q3 are flipped to the B position, thus providing a direct connection from port B control signals to CARD_B All the CARD_A and CARD_B signals are independent and both cards can operate simultaneously, the data http://onsemi.com 17 NCN6004A CARD POWER SUPPLY TIMING When the PWR_ON signal is high, the associated CRD_VCC_A or CRD_VCC_B power supply rise time depends upon the current capability of the DC/DC converter together with the external inductors L1/L2 and the reservoir capacitor connected across each card power supply pin and GROUND. On the other hand, at turn off, the CRD_VCC_A and CRD_VCC_B fall times depend upon the external reservoir capacitor and the peak current absorbed by the internal NMOS device built across each CRD_VCC_A/ CRD_VCC_B and GROUND. These behaviors are depicted by Figure 7, assuming a 10 F output capacitor. Since none of these parameters can have infinite values, the designer must take care of these limits if the tON or the tOFF provided by the data sheets does not meet his requirement. to either CARD_A or CARD_B. It is neither possible to connect directly I/O_A to I/O_B nor to connect the I/O_B pin to ground or voltage supply. The multiplexer is activated and the CARD_SEL signal is used to select the card in use for a given transaction. The switches Q1, Q2 and Q3 and swapped to the A position, thus providing a path for the control signals applied to the CARD_A side. When the CARD_SEL signal flips from one card to the other, the previous logic states of the on going card are latched in the chip and the related output card pin are maintained at the appropriate levels. When the system resumes to the previous card, the latches return to the transparent operation and the signals presented by the P take priority over the previously latched states. On the other hand, the input clocks (CLK_IN_A and CLK_IN_B) are maintained independent and can be routed to either CARD_A or CARD_B according to the programming functions given in Table 2. V CRD_VCC = 5 V CRD_VCC = 4.75 V CRD_VCC = 0.40 V 500 s Max 250 s Max Shut OFF Turn ON t Figure 7. Card Power Supply Turn ON and Shut OFF Typical Timings POWER DOWN OPERATION The power down mode can be initiated by either the external MPU or by the internal error condition. The communication session is terminated immediately, according to the ISO7816-3 sequence. On the other hand, the MPU can run the Stand By mode by forcing CS = H, leaving the chip in the previous operating mode. When the card is extracted, the interface will detect the operation and will automatically run the Power Down Sequence of the related card as described by the ISO/CEI 7816-3 sequence depicted in Figure 8 and illustrated by the oscillogram in Figure 9. CARD EXTRACTION DETECTED CRD_DET CRD_RST Force RST to Low Force CLK to Low, unless it is already in this state Force C4 and C8 to Low Force CRD_IO to Low Shut Off the CRD_VCC Supply CRD_CLK CRD_C4 CRD_C8 CRD_IO CRD_VCC T Internal Delay 400 ns typ. Figure 8. Card Power Down Sequence http://onsemi.com 18 NCN6004A On the other hand, the Power Down sequence is automatically activated when the Vbat voltage drops below the VCC_OK level, regardless of the logic conditions present on the control pins, or when the related CRD_VCC_x output voltage reaches the overload condition. Figure 9. Power Down Sequence Figure 10. Power Down Sequence: Timing Details http://onsemi.com 19 NCN6004A CARD DETECTION The card detector circuit provides a constant low current to bias the CRD_DET_A and CRD_DET_B pins, yielding a logic High when no card is present and the external switch is Normally Open type. The internal logic associated with pins 20 and 41 provides a programmable selection of the slope card detection. The transition is filtered out by the internal digital filter circuit, avoiding false interrupt. In addition to the typical 50 s delay, the MPU shall provide an additional delay to cope with the mechanical stabilization of the card interface (typically 1 ms), prior to valid the CRD_VCC_A or CRD_VCC_B supply. INTERRUPT ACKNOWLEDGE When a card is inserted, the detector circuit asserts INT = Low as depicted before, the external P being responsible to clear the interrupt signal, taking the necessaries actions. When the NCN6004A detects a card extraction, the power down sequence is automatically activated for the related interface section, regardless of the PWR_ON state, and the INT pin is asserted Low. It is up to the external MPU to clear this interrupt by pulsing the CS pin. CARD IDENTIFICATION & PROCESSING CARD EXTRACTED 50 s < T < 150 s 50 s < T < 150 s CRD_DET_A INT CS High PGM High A0 High A1 IRRELEVANT A2 A3 CARD_SEL IRRELEVANT High = Card A STATUS CLEAR INTERRUPT CARD PRESENT: STATUS = 1 CLEAR INTERRUPT CARD NOT PRESENT: STATUS = 0 Figure 11. Typical Interrupt Sequence The polarity of the card detection switch can be either Normally Open or Normally Close and is software controlled as defined here below and in Table 2. The interrupt signal can be cleared either by a positive going slope on the Chip Select pin as depicted in Figure 11, or by forcing the PWR_ON signal High (keeping CS = Low) for the related card. Table 5. Card Detection Polarity CS PGM A3 A2 A1 A0 CARD_SEL CRD_DET_A CRD_DET_B 1 X X X X X X Qn -1 Qn -1 0 1 X X X X X Qn -1 Qn -1 0 0 1 1 0 0 1 Normally Open Qn -1 0 0 1 1 0 1 1 Normally Close Qn -1 0 0 1 1 0 0 0 Qn -1 Normally Open 0 0 1 1 0 1 0 Bn -1 Normally Close *The polarity change is validated upon the next positive PGM transient. http://onsemi.com 20 NCN6004A POWER MANAGEMENT The main purpose of the power management is to provides the necessary output voltages to drive the 1.80 V, 3.0 V or 5.0 V smart card types. On top of that, the DC/DC converter efficiency must absorb a minimum current on the Vbat supply. Beside the power conversion, in the Stand by mode (PWR_ON = L), the power management provides energy to the card detection circuit only. All the card interface pins are forced to ground potential, saving as much current as possible out of the battery supply. In the event of a power up request coming from the external MPU (CARD_SEL =H/L, PWR_ON = H, CS = L), the power manager starts the DC/DC converter related to the selected interface section. When the selected section (either CRD_VCC_A or CRD_VCC_B) voltage reaches the programmed value (1.8 V, 3.0 V or 5.0 V), the circuit activates the card signals according to the following sequence: CRD_VCC_x → CRD_IO_x → CRD_C4_x → CRD_C8_x → CRD_CLK_x → CRD_RST_x The logic level of the data lines are asserted High or Low, depending upon the state forced by the external MPU, when the start-up sequence is completed. Under no situation the NCN6004A shall automatically launch a smart card ATR sequence. At the end of the transaction, asserted by the MPU (CARD_SEL = H/L, PWR_ON = L, CS = L), or under a card extraction, the ISO7816-3 power down sequence takes place: CRD_RST_x → CRD_CLK_x → CRD_C4_x → CRD_C8_x → CRD_IO_x → CRD_VCC_x When CS = H, the bi-directional I/O lines (pins 9 and 19) are forced into the High impedance mode to avoid signal collision with any data coming from the external MPU. OUTPUT VOLTAGE PROGRAMMING The internal logic provides a reliable circuit to activate any of the DC/DC converters safely. In particular, the Turn On/Turn Off of these converters is edge sensitive and controlled by the rising/falling edges of the PWR_ON signal applied with Chip Select pin Low. The CARD_SEL signal is used to select either CRD_VCC_A or CRD_VCC_B as defined by the functions programming in Table 2. CS CARD_SEL PWR_ON SET RESET see note CRD_VCC_A CRD_VCC_B CRD_VCC No Change CRD_VCC Rise Time VCCton VCCtoff VCCton CRD_VCC_A PWR DOWN Note : minimum 1 ms delay before to send a power Off command to the same selected output is recommended. Figure 12. Card Power Supply Controls converters, but two separate sequences must take place. On top of that, since the circuit is edge sensitive, the PWR_ON signal must present such a transient when a given state is expected for the converter. The PWR_ON and CS timings definitions are given in Figure 13. Although it is possible to change the output voltage straightly from 5.0 V to 1.80 V, care must be observed as the stabilization time will be relatively long if no current is absorbed from the related output pin. According to the typical sequence depicted, it is not possible to program simultaneously the two DC/DC http://onsemi.com 21 NCN6004A CS CARD_SEL tpwrset tpwrpre tpwrlow tpwrhold PWR_ON SET RESET tpwrp NOTE: tpwrset: This delay is necessary to latch–up the PWR_ON condition and does not represent the CRD_VCC output voltage rise time. tpwrlow: This delay includes the internal ISO7816-3 power down sequence to make sure the DC/DC converter is fully deactivated. Figure 13. Power On Sequence Timings Chip Selected CS CARD_SEL tcseldly tpwrhold PWR_ON tpwrw tpgmdly Programming Sequence PGM NOTE: tpwrw: This delay represents the minimum pulse width needed to write the PWR_ON status into the associated DC/DC latch Figure 14. Power On and CARD_SEL Sequence Timings DC/DC CONVERTER The power conversion is carried out either in step up or step down mode. The operation is fully automatic and, beside the output voltage programming, does not need any further adjustments. The simplified DC/DC converter, given in Figure 15, is based on a full bridge structure capable to handle either step up or step down power supply using an external inductor. This structure brings the capability to operate from a wide range of input voltage, while providing the accurate 1.80 V, 3.0 V or 5.0 V requested by the smart cards. Beside the accuracy, the major aim of this structure is the high efficiency necessary to save energy taken from the battery. On the other hand, using two independent converters provides a high flexibility and prevent a total system crash in the event of a failure on one of the card connected to the interface. 1. Cycle 1: Q15 and Q4 are switched ON and the inductor L1 is charged by the energy supplied by the external battery. During this phase, the pairs Q1/Q16 and Q2/Q3 are switched OFF. The current flowing into the two MOSFET Q1 and Q4 is internally monitored and will be switched OFF when the Ipeak value (depending upon the programmed output voltage value) is reached. At this point, Cycle 1 is completed and Cycle 2 takes place. The ON time is a function of the battery voltage and the value of the inductor network (L and Zr) connected across pins 26/27 and 34/35. A 4 s time out structure makes sure the system does run in a continuous Cycle 1 loop. 2. Cycle 2: Q1 and Q16 are switched ON and the energy stored into the inductor L1 is dumped into the external load through Q16. During this phase, the pair Q15/Q4 and the pair Q2/Q3 are switched OFF. The current flow period is constant (900 ns typical) and Cycle 1 repeats after this time if the CRD_VCC voltage is below the specified value. OPERATION NOTE: Described operation makes reference to CARD_A and can be applied to CARD_B. The system operates with a two cycles concept: http://onsemi.com 22 NCN6004A The control block gives the logic states according to the bits provided by the external P. These controls bits are applied to the selected DC/DC converter to generate the programmed output voltage. The MOS drive block includes the biases necessaries to drive the NMOS and PMOS devices as depicted in the block diagram given Figure 15. When the output voltage reaches the specified value (1.80 V or 3.0 V or 5.0 V), Q1 and Q16 are switched OFF immediately to avoid over voltage on the output load. In the mean time, the two extra NMOS Q2 and Q3 are switched ON to fully discharge any current stored into the inductor, avoiding ringing and voltage spikes over the system. Figure 16 illustrates the theoretical basic waveforms present in the DC/DC converter. CRD_VCC_A 29 Vcc 28 10 F Q15 Q16 C1 MIXED LOGIC / ANALOG BLOCK PGM V1 CARD_SEL Overload A0 VCC_OK Vout V0 LOGIC CONTROL # A PWR_ON PWR_ON G_Q1 26 22 H Q1 Q3 Q2 Q4 V1 Overload VCC_OK Q7 GND G_Q4 G_Q2 G_Q7 R3 GND Vcc Q6 U1 R4 GND GND CRD_VCC 32 Q17 Q18 C3 V0 GND 25 PWR_GND 33 Vcc 10 F Q12 C4 L2 GND PWR_ON GND R2 G_HIZ 10 F Vref R1 G_Q3 Vref_1.8/3/5 V 5.0 V 5.0 V MIXED LOGIC / ANALOG BLOCK CS Vout A3 27 Voltage Regulation LOGIC CONTROL # A A2 DC/DC MULTIPLEXED CONTROLS A1 C2 L1 GND Vref 10 F Q5 34 G_Q1 Q9 Q8 R5 35 22 H Q10 Q11 GND G_Q3 R6 36 PWR_GND G_HIZ Q14 GND G_Q4 G_Q2 G_Q7 R7 GND Vcc Voltage Regulation Q13 U2 R8 GND Vref_1.8/3/5 V 5.0 V 3.0 V GND Figure 15. Basic DC/DC Converter Diagram http://onsemi.com 23 GND NCN6004A the CRD_VCC_x output pin and the card VCC input. On the other hand, the inductor shall have an ESR below 1.0 to achieve the high efficiency over the full temperature range. However, inductor with 2.0 ESR can be used when a slight decrease of the efficiency is acceptable at system level. Since the output inductor L1 and the reservoir capacitor C1 carry relative high peak current, low ESR devices must be used to prevent the system from poor output voltage ripple and low efficiency. Using ceramic capacitors, X5R or X7R type, are recommended, splitting the 10 F in two separate parts when there is a relative long distance between Charge CRD_VCC CRD_VCC Charged Next CRD_VCC Charge (Time is not to scale) Ton Toff Q1 / Q4 Q2 / Q3 Q5/Q6 Ipeak IL CRD_VCC Voltage Regulated Vripple CRD_VCC Figure 16. Theoretical DC/DC Operating over the temperature range and the combination of standard parts provide an acceptable –20% to +20% tolerance, together with a low cost. Table 6 shows a quick comparison between the most common type of capacitors. Obviously, the capacitor must be SMD type to achieve the extremely low ESR and ESL necessary for this application. Figure 17 illustrates the CRD_VCC ripple observed in the NCN6004A demo board running with X7R ceramic capacitors. When the CRD_VCC is programmed to zero volt, or when the card is extracted from the socket, the active pull down Q5 rapidly discharges the output reservoir capacitor, making sure the output voltage is below 0.40 V when the card slides across the contacts. Based on the experiments carried out during the NCN6004A characterization, the best comprise, at time of printing this document, is to use two 4.7F/10 V/ceramic/X7R capacitor in parallel to achieve the CRD_VCC filtering. The ESR will not extend 50 m Table 6. Ceramic/Electrolytic Capacitors Comparison Manufacturer Type/Series Format MURATA CERAMIC/GRM225 MURATA CERAMIC/GRM225 VISHAY VISHAY Miscellaneous Max Value Tolerance Typ. Z @ 500 kHz 0805 10 F/6.3 V -20% /+20% 30 m 0805 4.7 F/6.3 V -20% /+20% 30 m Tantalum/594C/593C 1206 10 F/16 V Electrolytic/94SV 1812 10 F/10 V -20%/+20% 400 m Electrolytic Low Cost 1812 10 F/10 V -35%/+50% 2.0 http://onsemi.com 24 450 m NCN6004A NOTE: Operating conditions under full output load. Figure 17. Typical CRD_VCC Ripple Voltage Figure 18. Typical Card Voltage Turn ON and Start-up Sequence Figure 19. Typical Card Supply Turn OFF 74 The curves in Figure 20, illustrate the typical behavior under full output current load (35 mA, 60 mA and 65 mA), according to EMV specifications. During the operation, the inductor is subject to high peak current as depicted in Figure 21 and the magnetic core must sustain this level of current without damage. In particular, the ferrite material shall not be saturated to avoid uncontrolled current spike during the charge up cycle. Moreover, since the DC/DC efficiency depends upon the losses developed into the active and passive components, selecting a low ESR inductor is preferred to reduce these losses to a minimum. Vout = 3.0 V 72 Vout = 5.0 V 70 Eff (%) 68 66 Vout = 1.8 V 64 62 Lout = 22 H ESR = 2 60 58 2.5 3.0 3.5 4.0 Vbat (V) 4.5 5.0 5.5 Figure 20. CRD_VCC Efficiency as a Function of the Input Supply Voltage http://onsemi.com 25 NCN6004A Test conditions: Input VCC voltage = 5.0 V, Current = 200 mA /div, Tamb = +20°C Figure 21. Typical Output Voltage Ripple According to the ISO7816-3 and EMV specifications, the interface shall limits the CRD_VCC output current to 200 mA maximum, under short circuit conditions. The NCN6004A supports such a parameter, the limit being depending upon the input and output voltages as depicted in Figure 22. 160 180 Vo = 5.0 V 160 Vo = 3.0 V 140 150 140 120 Vo = 1.8 V 100 Iout (mA) Iout (mA) Vo = 5.0 V 80 60 130 Vo = 3.0 V 120 Vo = 1.8 V 40 110 20 IO(max) = F(Vbat) 0 2 3 4 5 100 -25 6 Vbat (V) Figure 22. Output Current Limit -5.0 15 35 55 75 TEMPERATURE (°C) 95 115 Figure 23. Output Current Limit as a Function of the Temperature environment. As a matter of fact, this pulse does not come solely from the NCN6004A DC/DC converter, but the reservoir capacitor and the associated PCB tracks shall be considered as well. Beside the continuous current capability, the smart card power supply must be capable of providing a 100 mA pulsed current during the data transaction. The ISO7816-3, paragraph 4.3.2, defines this 400 ns pulse as a function of the http://onsemi.com 26 NCN6004A CLOCK DIVIDER The main purpose of the built in clock generator is four folds: 1. Adapts the voltage level shifter to cope with the different voltages that might exist between the MPU and the Smart Card 2. Provides a frequency division to adapt the Smart Card operating frequency from the external clock source. 3. Control the clock state according to the smart card specification. 4. Provides an input clock re-routing to route the CLOCK_IN_A and CLOCK_IN_B signals to either CRD_CLK_A or CRD_CLK_B output pins. In addition, the NCN6004A adjusts the signal coming from the microprocessor to get the Duty Cycle window as defined by the ISO7816-3 specification. The logic input pins CARD_SEL, A0, A1, PGM, I/O and RESET fulfill the programming functions when both PGM and CS are Low. The clock input stage (CLOCK_IN) can handle a 40 MHz frequency maximum, the divider being capable to provide an 1:8 ratio. Of course, the ratio must be defined by the engineer to cope with the Smart Card considered in a given application and, in any case, the output clock (CRD_CLK_A and CRD_CLK_B) shall be limited to 20 MHz maximum when the system is considered to operate over the full temperature range. CLOCK_IN_A CLOCK_IN_B CS 1 3 2 LOGIC CONTROL CRD_VCC_A CLOCK_A DIVIDER PGM MUX_A&B A2 A2 A1 A0 CARD_A DC/DC BLOCK_B CLOCK_AB DIVIDER CARD_B DC/DC BLOCK_A CRD_VCC_A CRD_VCC_B CRD_CLK_A CRD_VCC_B MUX_A&B CARD_SEL LEVEL SHIFTER & CONTROL LEVEL SHIFTER & CONTROL CRD_CLK_B CARD_A & CARD_B CLOCK Figure 24. Simplified Frequency Divider and Programming Functions Consequently, the output CRD_CLK_A or CRD_CLK_B frequency division can be delayed by eight CLOCK_IN pulses and the microcontroller software must take this delay into account prior to launch a new data transaction. In order to avoid any duty cycle out of the frequency smart card ISO7816-3 and EMV specifications, the clock divider is synchronized by the last flip flop, thus yielding a constant 50% duty cycle, regardless of the divider ratio. http://onsemi.com 27 Internal CLOCK divider NCN6004A CLOCK_IN CLOCK : 2 CLOCK : 4 CLOCK : 8 CS PGM CLOCK = 1:1 ratio These bits program CARD_SEL A0 A1 A2 A3 CRD_CLK CLOCK programming is activated by the PGM rising edge. Clock is updated upon CLOCK :8 rising edge Figure 25. Clock Programming Timings CRD_CLK_A or CRD_CLK_B signal has been updated. Generally speaking, such a delay can be derived from the maximum clock frequency provided to the interface. The example given in Figure 25 highlights the delay coming from the internal clock duty cycle re-synchronization. Since the clock signal is asynchronous, it is up to the programmer to make sure the next card transaction is not activated before, respectively, either the Figure 26. Card Clock 1/2 Divider Operation http://onsemi.com 28 NCN6004A Figure 27. Clock Divider: 8 to 1 Operation Figure 28. Clock Divider Timing Details Figure 29. Clock Divider: Run to Stop High Operation http://onsemi.com 29 NCN6004A These clock signals can be multiplexed at any time, but the system must be locked in a safe state prior to make such a change. In particular, the designer must make sure that A and B cards can support such a hot change prior to change the related clocks. The input clock A and B can be re routed to either CRD_CLK_A or CRD_CLK_B output pins by using the programming function as defined in Table 2 and Table 7. The clock signals can have any frequency value necessary to handle a given type of card (asynchronous or synchronous). Table 7. Programming Clock Routing STATE CS PGM A3 A2 A1 A0 CARD_SEL CRD_CLK_A CRD_CLK_B 0E 0 0 1 1 1 0 1 CLK_D_A - Default 0F 0 0 1 1 1 1 1 CLK_D_B - - 0E 0 0 1 1 1 0 0 - CLK_D_B Default 0F 0 0 1 1 1 1 0 - CLK_D_A - On the other hand, the slope of the CRD_CLK_x signal can be set to either FAST or SLOW, depending upon the frequency of the output clock. This selection is achieved by programming the chip according to Table 8. Table 8. Output Clock Slope Selection STATE CS PGM A3 A2 A1 A0 CARD_SEL CLOCK SLOPE $03 0 0 0 0 1 1 1 SLOW Default $0B 0 0 1 0 1 1 1 FAST - $03 0 0 0 0 1 1 0 SLOW Default $0B 0 0 1 0 1 1 0 FAST - PARALLEL OPERATION When two or more NCN6004A parts operate in parallel on a common digital bus, the Chip Select pin allows the selection of one chip from the bank of the paralleled devices. Of course, the external MPU shall provide one unique CS line for each of the NCN6004A considered interface. When a given interface is selected by CS = L, all the logic inputs becomes active, the chip can be programmed or/and the external card can be accessed. When CS = H, all the input logic pins are in the high impedance state, thus leaving the bus available for other purpose. The pull up resistors connected on each logic input lines on the MPU side (see block diagram in Figure 30), can be either activated (connected to VCC) or disconnected, depending upon the logic state present at EN_RPU, pin 45. When these resistors are disconnected, it is the system responsibility to set up the external pull up resistors according to the application’s requirements. When the device operates in the multiplexed mode (MUX_MODE = High), the internal card #B pull up resistors are connected to VCC, regardless of the EN_RPU logic state. On the other hand, when CS = H, the CRD_IO and CRD_RST hold the previous I/O and RESET logic state, the CRD_CLK being either active or stopped and the CRD_VCC output voltage will maintain is previous value, according to the programmed state forced by the MPU. Figure 30. Typical Rise and Fall Time in Fast and Slow Operating Mode http://onsemi.com 30 NCN6004A CLK_IN_A CLOCK GEN. CLK_IN_B PORT A RESET_A C4_A C8_A I/O_A PORT B MICRO CONTROLLER CLOCK GEN. I/O_B C8_B C4_B RESET_B CTL GND MUX_MODE CARD_SEL CLK_A BUFFER 30 15 CLK_B BUFFER 31 10 11 12 9 BUFFERS CARD_A 13 MULTIPLEX & CLOCK DIVIDER CARD LOGIC CONTROL 19 16 17 18 44 5 23 22 21 I/O_A BUFFER 24 I/O_B BUFFER 37 CARD_B BUFFERS 38 39 40 Figure 31. Parallel Operation Wiring MUX_MODE = Low during an operation of the chip. Beside this parameter, the user must select to force or not the internal pull up resistors as defined by the EN_RPU logic state. When the chip operates in the parallel mode, all the logic signals must be independently controlled by the microcontroller as depicted in Figure 31. The MUX_MODE pin must be hardwired to VCC and it cannot be changed CLK_IN_A CLOCK GEN. CLK_IN_B PORT A RESET_A C4_A C8_A I/O_A PORT B I/O_B C8_B C4_B RESET_B CTL MICRO CONTROLLER CLOCK GEN. VCC MUX_MODE CARD_SEL CLK_A BUFFER 30 15 CLK_B BUFFER 31 10 11 12 9 BUFFERS CARD_A 13 MULTIPLEX & CLOCK DIVIDER CARD LOGIC CONTROL 19 16 17 18 44 5 23 22 21 I/O_A BUFFER 24 I/O_B BUFFER 37 CARD_B BUFFERS 38 39 40 Figure 32. Multiplexed Operation Wiring MUX_MODE = High either a multiplexed or parallel mode, provisions have been made to route the I/O_A input pin to either CARD_A or CARD_B. In both case, the I/O pins are driven by an open drain structure with a 20 k pull up resistor as shown Figure 33. To achieve the 0.80 s maximum rise time requested by the EMV specifications, an accelerator circuit is added on both side of each I/O line. These pulsed circuits yield boost current to charge the stray capacitance, thus accelerating the positive going slope of the I/O signal. On the other hand, the active pull down NMOS device Q5 provides a low impedance to ground during the battery up and DC/DC start-up phase, avoiding any uncontrolled voltage spikes on the I/O lines. In the multiplexed mode, the microprocessor CARD_B side pins are not connected, the logic signals and the I/O line being shared with CARD_A associated with the CRD_SEL control bit: Figure 32. A key point is to make sure there is no connection associated with the I/O_B pin since this pin is internally shared with the I/O line transaction. The CLK_IN_A and CLK_IN_B signals are independent and can be routed to any of the card thanks to the built-in clock multiplexer. DATA I/O LEVEL SHIFTER The built in structure provides a level shifter on each card output signals, the I/O line being driven differently as depicted in Figure 33. Since the NCN6004A can operate in http://onsemi.com 31 NCN6004A MUX_MODE = Low PARALLEL OPERATION is routed to the appropriate card by means of the CARD_SEL logic signal. In this mode, the I/O_B pin 19 must be left open since the internal data signal will be present on this pin. Moreover, since R1 and R3 are in parallel, the pull up resistor R1 is automatically disconnected to maintain the I/O line impedance to 20 k (typical), what ever be the EN_RPU logic level. This feature makes sure the current flowing trough the external card is limited to 500 A during a low level state. The bi-directional switch Q9 is OFF and the I/O signals are routed straightforward to their appropriate outputs. The two I/O lines can operate simultaneously, depending upon the P capabilities, regardless of the CARD_SEL signal logic level. The pull up resistors, on the P side of each I/O line, can be connected or not as defined by the EN_RPU signal. MUX_MODE = High MULTIPLEXED OPERATION The bi-directional switch Q9 is ON and the I/O_A pin is used to handle data for CARD_A and CARD_B. The signal ANLG_VCC 42 MUX_MODE 44 Q10 Q1 BI-DIRECTIONNAL DATA TRANSFERT CRD_VCC_A 24 CRD_I/O_A 32 CRD_VCC_B 37 CRD_I/O_B Q2 R2 R1 I/O_A 29 9 Q3 Q4 CONTROL LOGIC & Level Shifter Q5 CRD_VCC_A Q11 Q9 ANLG_VCC Q6 GND BI-DIRECTIONNAL DATA TRANSFERT Q11 R3 I/O_B 19 PGM 6 PWR_ON 8 CS 7 CARD_SEL 5 EN_RPU 45 R4 Q7 Q8 CONTROL LOGIC & Level Shifter Q10 CRD_VCC_B ANLG_VCC GND Figure 33. Dual Bi-directional I/O Line Level Shifter and Multiplex http://onsemi.com 32 NCN6004A NOTE: Both sides of the interface run with open drain load (worst case condition) Figure 34. Typical I/O Rise and Fall Time ESD Protection The NCN6004A includes silicon devices to protect the pins against the ESD spikes voltages. To cope with the different ESD voltages developed across these pins, the built in structures have been designed to handle either 2 kV, when related to the microcontroller side, or 8 kV when connected with the external contacts. Practically, the CRD_RST, CRD_CLK, CRD_IO, CRD_C4 and CRD_C8 (both A and B sections) pins can sustain 8 kV, the maximum short circuit current being limited to 15 mA. The CRD_VCC_A and CRD_VCC_B pins have the same ESD protection, but can source up to 65 mA continuously each, the absolute maximum current being 150 mA per section. which are both limited to 70 mA. No feedback is provided to the external MPU. DC/DC Operation: The internal circuit continuously senses the CRD_VCC_A and CRD_VCC_B voltages and, in the case of either over or under voltage situation, update the STATUS register accordingly. This register can be read out by the MPU but no interrupts are activated. DC/DC Overload: When an overload is sensed across the CRD_VCC_A or CRD_VCC_B output, during either the power on sequence or when the system was previously running, the NCN6004A generates an interrupt by pulling down the INT pin. It is up to the microcontroller to identify the origin of the overload by reading the STATUS pin accordingly. Battery Voltage: Both the Positive going and the Negative going voltage are detected by the NCN6004A, a POWER_DOWN sequence and the STATUS register being updated accordingly. The external MPU can read the STATUS pin to take whatever is appropriate to cope with the situation. The NCN6004A does not provide any further internal voltage regulation. Security Features In order to protect both the interface and the external smart card, the NCN6004A provides security features to prevent catastrophic failures as depicted here after. Pin Current Limitation: in case of a short circuit to ground, the current forced by the device is limited to 10 mA for any pins, except CRD_CLK_A and CRD_CLK_B pins http://onsemi.com 33 NCN6004A TEST BOARD SCHEMATIC DIAGRAM C13 D6 + J2 6 GND C10 R15 GND + 14 13 12 11 10 9 + 47 46 45 44 8 7 6 5 4 3 2 1 19 I/O_B 18 RESET_B 17 C4_B 16 C8_B 15 CLK_IN_B L2a VCC CLK_IN_A 27 C8_A 22 H CLK_A L1a ANLG_GND L1 NCN6004 L1b C4_A RESET_A I/O_A INT STATUS EN_RPU MUX_MODE PWR_ON CS PGM CARD_SEL A3 A2 A1 A0 CRD_B_INS CRD_VCC_B 26 RST_A 34 D3 1 24 CRD_IO_A 21 CRD_C8_A 22 CRD_C4_A 30 CRD_CLK_A 23 CRD_RST_A 29 CRD_VCC_A 20 CRD_DET_A GND 25 PWR_GND 36 PWR_GND IO_B 22 H 1 10 F, X7R 28 PWR_VCC_A 33 PWR_VCC_B 37 CRD_IO_B 40 CRD_C8_B 39 CRD_C4_B 31 CRD_CLK_B 38 CRD_RST_B 32 CRD_VCC_B 41 CRD_DET_B D4 R10 1.5 k L2 L2b C8 + R16 VCC 4.7 F, X7R TP1 1 35 1 CARD_A_INS 0R 1 J9 10 F C3 CRD_VCC_B C5 Det_B GND GND J12 7 I/O VPP 6 5 GND 1 Vcc 2 RST 3 CLK 4 8 C4 9 C8 10 Swb Swa SMARTCARD_A 1 D5 1 2N2222 GND GND 4.7uF, X7R 1 R13 CRD_VCC_A J10 2 GND C7 1.5 k 10 k Q1 C9 R17 VCC_B 1 TP2 CLK_B TP6 RST_B R14 10 k GND 2 1 TP3 C4_B C14 C12 4.7 F, X7R IO_A GND 1 TP4 C8_B R11 1.5 k Q2 C_CLK_B GND 220 nF 0R ISO7816 1 TP5 IO_B GND GND VCC_A I/O 7 VPP GND 5 Vcc 1 RST 2 CLK 3 C4 4 C8 8 Swb 9 Swa 10 SMARTCARD_B 4.7 F, X7R 2N2222 R12 CRD_VCC_A 1.5 k ISO7816 VCC C6 Det_A TP12 IO_A TP11 C8_A TP10 C4_A TP9 1 TP8 CLK_A 1 TP7 RST_A U1 48 ANLG_GND 43 ANLG_GND C11 ANLG_VCC 42 GND 100 nF, X7R + 220 nF VCC R3 2 1 8x10k MUX_MODE VCC CLK_IN_B 3 CLK_B J8 1 CLK_IN_A 4 2 1 J6 2 1 R2 4.7 k EN_RPU J4 2 VCC C1 GND 100 nF J14 1 2 GND 1 J7 2 INT I/O_A PWR_ON CS PGM CARD_SEL LED LED D1 1 D2 CLK_IN I/O_B C8_B C4_B RESET_B J5 2 MPU_CLK STATUS E RESET_A C4_A C8_A STATUS R5 R4 1.5k 1.5k J13 1 2 J11 1 2 GROUND GROUND GROUND 1 C2 100 nF 2 CLK_A 1 J3 VCC GND EXT_CLK TP13 I/O_A A3 A2 A1 A0 TP24 1 INT R1 TP23 1 4.7 k Status VCC TP22 1 PWR_ON TP20 1 A0 TP21 1 A1 TP19 1 A2 TP18 A3 TP17 1 Card_Sel TP16 1 PGM TP15 1 CS VCC I/O_B TP14 1 GND EXT_CLK MPU_CLK S1 9 8 7 6 5 4 3 2 SWITCH GND 1 GND 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 J1 CONTROL & I/O Figure 35. Test Board Schematic Diagram http://onsemi.com 34 NCN6004A Figure 36. Demo Board PCB Top Overlay http://onsemi.com 35 NCN6004A Figure 37. Demo Board PCB Top Layer http://onsemi.com 36 NCN6004A Figure 38. Demo Board PCB Bottom Layer NOTE: Note: the demo board is built with a four layers PCB, the internal ones being dedicated to VCC and GND planes. http://onsemi.com 37 NCN6004A POWER SUPPLY SECTION . . . . . . . . . . . . . . . . 10 Figure 17: Typical CRD_VCC Ripple Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DIGITAL INPUT SECTION @ 2.70 < VCC < 5.50V, Normal Operating Mode . . . . . . . . . . . . . . . . . . . 11 Figure 18: Typical Card Voltage Turn ON and Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 CARD INTERFACE SECTION @ 2.70 < VCC < 5.50V, Normal Operating Mode . . . . . . . . . . . . . . . . . . . 12 Figure 19: Typical Card Supply Turn OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DIGITAL DYNAMIC SECTION NORMAL OPERATING MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 20: CRD_VCC Efficiency as a Function of the Input Supply Voltage . . . . . . . . . . . . . . . . . . . . . 25 DIGITAL DYNAMIC SECTION PROGRAMMING MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 21: Typical Output Voltage Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PROGRAMMING AND STATUS FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 22: Output Current Limit . . . . . . . . . . . 26 PIN FUNCTIONS AND DESCRIPTION . . . . . . . 4 SYSTEM STATES UPON START UP . . . . . . . . 16 Figure 23: Output Current Limit as a Function of the Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PARALLEL/MULTIPLEXED OPERATION MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 24: Simplified Frequency Divider and Programming Functions . . . . . . . . . . . . . . . . . . 27 CARD POWER SUPPLY TIMING . . . . . . . . . . . 18 Figure 25: Clock Programming Timings . . . . 28 POWER DOWN OPERATION . . . . . . . . . . . . . . 18 Figure 26: Card Clock ½ Divider Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 CARD DETECTION . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 27: Clock Divider: 8 to 1 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 POWER MANAGEMENT . . . . . . . . . . . . . . . . . . 21 OUTPUT VOLTAGE PROGRAMMING . . . . . . . 21 Figure 28: Clock Divider Timing Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 DC/DC CONVERTER . . . . . . . . . . . . . . . . . . . . . . 22 CLOCK DIVIDER . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 29: Clock Divider: Run to Stop High Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PARALLEL OPERATION . . . . . . . . . . . . . . . . . . 30 Figure 29: Typical Rise and Fall Time in Fast and Slow Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 30 DATA I/O LEVEL SHIFTER . . . . . . . . . . . . . . . . . 31 ESD PROTECTION . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 30: Parallel Operation Wiring MUX_MODE = High . . . . . . . . . . . . . . . . . . . . . . . 30 SECURITY FEATURES . . . . . . . . . . . . . . . . . . . . 33 TEST BOARD SCHEMATIC DIAGRAM . . . . . . 34 Figure 31: Multiplexed Operation Wiring MUX_MODE = Low . . . . . . . . . . . . . . . . . . . . . . . 31 Figures Figure 1: Pin Diagram . . . . . . . . . . . . . . . . . . . . 2 Figure 32: Dual Bi-directional I/O line Level Shifter and Multiplex . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 2: Typical Applications . . . . . . . . . . . . . 2 Figure 3: Block Diagram . . . . . . . . . . . . . . . . . . 3 Figure 33: Typical I/O Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure 4: Programming Sequence . . . . . . . . . 14 Figure 34: Test Board Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 5: Reading ANLG_VCC Status . . . . . . 16 Figure 6: Simplified MUX_MODE Logic and Multiplex CIrcuit . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 35: Demo Board PCB Top Overlay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 7: Card Power Supply Turn ON and Shut OFF Typical Sequence . . . . . . . . . . . . . . . 18 Figure 37: Demo Board PCB Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 8: Card Power Down Sequence . . . . . 18 Figure 38: Demo Board PCB Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 9: Power Down Sequence . . . . . . . . . . 19 Figure 10: Power Down Sequence: Timing Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 1 :Programming and Reading Basic Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 11: Typical Interrupt Sequence . . . . . . 20 Table 2: Programming Functions . . . . . . . . . . 15 Figure 12: Card Power Supply Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 3: Status Pins Data . . . . . . . . . . . . . . . . . 16 Figure 13: Power On Sequence Timing . . . . . 22 Table 4: Operating Conditions Upon Start-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 14: Power On and CARD_SEL Sequence Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 5: Card Detection Polarity . . . . . . . . . . . 20 Table 6: Ceramic/Electrolytic Capacitors Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 15: Basic DC/DC Converter Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 7: Programming Clock Routing . . . . . . 30 Figure 16: Theoretical DC/DC Operating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 8: Output Clock Slope Selection . . . . . 30 http://onsemi.com 38 NCN6004A ABBREVIATIONS L1a and L1b DC/DC external inductor #A CRD_VCC_A Interface IC Card #A Power Supply Line L2a and L2b DC/DC external inductor #B CRD_CLK_A Interface IC Card #A Clock Input Cout Output Capacitor CRD_RST_A Interface IC Card #A RESET Input CRD_VCC Card Power Supply Input CRD_IO_A Interface IC Card #A Data link VCC MPU Power Supply Voltage CRD_C4_A Interface IC Card #A Data Control Icc Current at card VCC pin CRD_C8_A Interface IC Card #A Data Control Class A 5 V Smart Card CRD_DET_A Card insertion/extraction detection CS Chip Select CARD_SEL Card #A/B Selection bit CRD_CLK_B Interface IC Card #B Clock Input CRD_IO_B Interface IC Card #B Data link EN_RPU Enable/Disable internal pull up CRD_IO_B Interface IC Card #B RESET Input PGM Chip Programming Mode EMV Euro Card Master Card Visa ISO International Standards Organization Class B 3 V Smart Card CRD_VCC_B Interface IC Card #B Power Supply Line ANLG_VCC = VCC = Vbat Input Voltage CRD_C4_B Interface IC Card #B Data Control PWR_ON Chip Power On bit CRD_C8_A Interface IC Card #B Data Control MUX_MODE Card Multiplex or Parallel Op. CRD_DET_B Card insertion/extraction detection T0 Smart Card Data transfer procedure by bytes T1 Smart Card Data transfer procedure by strings C Microcontroller http://onsemi.com 39 NCN6004A 48 LEADS, TQFP EP CASE 932F-01 ISSUE A 4 PL 0.200 M AB T−U Z A T NOTE 9 DETAIL Y A1 48 37 1 36 T P U B V B1 12 25 13 AE AE V1 24 Z EXPOSED PAD T, U, Z S1 DETAIL Y S 0.200 M AC T−U Z 4 PL AB G N J 0.080 AC F D AD AC ÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇ ÉÉÉÉ ÇÇÇ 0.080 SEATING PLANE M AC T−U Z SECTION AE-AE M R TOP & BOT 0.250 C E H NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM PLANE AB. 5. DIMENSIONS S AND AB TO BE DETERMINED AT SEATING PLANE AC. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE AB. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350. 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076. 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. DIM A A1 B B1 C D E F G H J K L M N P R S S1 T V V1 W AA MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 0.900 1.100 0.170 0.270 0.950 1.250 0.170 0.230 0.500 BSC 0.050 0.150 0.090 0.200 0.500 0.700 0 7 12 REF 0.090 0.160 0.250 BSC 0.150 0.250 9.000 BSC 4.500 BSC 5.000 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF GAUGE PLANE L W K AA DETAIL AD ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 40 NCN6004A/D