AOSMD AO3424 N-channel enhancement mode field effect transistor Datasheet

AO3424
N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO3424 uses advanced trench technology to
provide excellent RDS(ON), very low gate charge and
operation with gate voltages as low as 2.5V. This
device is suitable for use as a load switch or in PWM
applications. Standard Product AO3424 is Pb-free
(meets ROHS & Sony 259 specifications). AO3424L
is a Green Product ordering option. AO3424 and
AO3424L are electrically identical.
VDS (V) = 30V
ID = 2 A
(V GS = 10V)
RDS(ON) < 80mΩ (VGS = 10V)
RDS(ON) < 95mΩ (VGS = 4.5V)
RDS(ON) < 157mΩ (VGS = 2.5V)
TO-236
(SOT-23)
Top View
D
G
D
S
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
Current A
F
TA=25°C
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
W
0.9
TJ, TSTG
t ≤ 10s
Steady-State
Steady-State
A
8
-55 to 150
Symbol
A
V
1.4
PD
TA=70°C
A
±12
2
ID
IDM
TA=25°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead C
Units
V
2
TA=70°CF
Pulsed Drain Current B
Power Dissipation A
Maximum
30
RθJA
RθJL
Typ
70
100
63
°C
Max
90
125
80
Units
°C/W
°C/W
°C/W
AO3424
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Conditions
Min
ID=250µA, VGS=0V
30
VDS=24V, VGS=0V
Zero Gate Voltage Drain Current
TJ=55°C
Gate-Body leakage current
VDS=0V, VGS=±12V
Gate Threshold Voltage
VDS=VGS ID=250µA
1
ID(ON)
On state drain current
VGS=4.5V, VDS=5V
8
Static Drain-Source On-Resistance
VGS=4.5V, ID=2A
100
nA
1.8
V
67
80
97
116
76
95
mΩ
157
mΩ
A
121
VDS=5V, ID=2A
11.7
Diode Forward Voltage
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current
0.8
Forward Transconductance
VSD
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
226
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
mΩ
S
1
V
1.8
A
270
pF
VGS=0V, VDS=15V, f=1MHz
39
VGS=0V, VDS=0V, f=1MHz
1.4
1.7
Ω
2.6
3.2
nC
pF
29
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
µA
1.45
VGS=2.5V, ID=1A
gFS
IS
TJ=125°C
Units
V
1
5
VGS(th)
VGS=10V, ID=2A
Max
37
0.001
IGSS
RDS(ON)
Typ
VGS=4.5V, VDS=15V, ID=2A
VGS=10V, VDS=15V, RL=7.5Ω,
RGEN=6Ω
pF
1.3
nC
0.5
nC
2.6
4
3.2
5
ns
ns
14.5
22
ns
2.1
3
ns
trr
Body Diode Reverse Recovery Time
IF=2A, dI/dt=100A/µs
10.2
13
Qrr
Body Diode Reverse Recovery Charge IF=2A, dI/dt=100A/µs
3.8
5
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
curve provides a single pulse rating.
F. The maximum current rating is limited by bond-wires.
Rev 0 : Mar 2006
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO3424
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
15
10V
3.5V
12
VDS=5V
8
4V
6V
3V
6
ID(A)
ID (A)
9
4
6
VGS=2.5V
125°C
3
2
0
0
0
1
2
3
4
VDS (Volts)
Fig 1: On-Region Characteristics
5
200
0
0.5
1
1.5
2
2.5
3
VGS(Volts)
Figure 2: Transfer Characteristics
Normalized On-Resistance
VGS=2.5V
VGS=4.5V
ID=2A
1.6
150
125
1.7
VGS=10V
3.6
ID=2A
1.4
VGS=4.5V
100
75
1.2
50
VGS=10V
25
VGS=2.5
ID=1A
1
0
0
2
4
6
8
10
13
0.8
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1.0E+01
150
ID=2A
140
1.0E+00
130
120
125°C
110
1.0E-01
IS (A)
RDS(ON) (mΩ)
3.5
270
1.8
175
RDS(ON) (mΩ)
25°C
100
125°C
1.0E-02
90
25°C
1.0E-03
80
70
25°C
1.0E-04
60
50
0
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
1.0E-05
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO3424
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
400
5
VDS=15V
ID=2A
350
300
Capacitance (pF)
VGS (Volts)
4
3
2
Ciss
250
200
150
Crss
Coss
100
1
50
0
0
0
1
2
3
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
10
15
20
25
VDS (Volts)
Figure 8: Capacitance Characteristics
30
270
10.0
20
10µs
RDS(ON)
limited
TJ(Max)=150°C
TA=25°C
1.7
100µs
15
Power (W)
ID (Amps)
5
1s
1.0
10s
1ms
3.6
10
10ms
5
DC
TJ(Max)=150°C
TA=25°C
0.1s
0.1
0.1
1
10
100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=90°C/W
0
0.001
13
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
0.01
100
1000
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