MAX2531EGI Rev. A RELIABILITY REPORT FOR MAX2531EGI PLASTIC ENCAPSULATED DEVICES April 3, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX2531 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments I. Device Description A. General The MAX2531 multiband LNA/Mixer IC is optimized for CDMA, GSM, and TDMA applications in cellular band. The MAX2531 IC features a GPS LNA/mixer signal path for E911 and Traveler Assistance applications. The cellular signal can be routed to either IF port. For example, one IF port can be connected to an IF filter with 30kHz band-width, while the other port can drive an IF filter with a wider bandwidth. The GPS band has its own IF port. To optimize dynamic range at minimum current, the MAX2531 implements multiple LNA and mixer states, including high gain/high linearity, high gain/low linearity, mid gain, low gain, and ultra low gain. In high-gain/highlinearity mode, the high-intercept LNA minimizes desensitization in the presence of a large interfering signal. For the other gain states, the LNA current is reduced to improve standby time. Each band is implemented with a separate mixer to optimize performance for the specific band, and each mixer provides multiple linearity modes to optimize linearity and current consumption. The ultra-low gain mode operates with very little current, which results in significant power savings because the handset typically spends most of its time in this mode. B. Absolute Maximum Ratings Item VCC to GND Digital Input Voltage to Gnd LNA Inout (Low-Gain Mode) Level LO Input Level Digital Input Current Junction Temperature Operating Temperature Range Storage Temp. Lead Temp. (soldering 10 sec.) Continuous Power Dissipation (TA = +70°C) 28-Pin QFN Derates above +70°C 28-Pin QFN Rating -0.3V to +4.3V -0.3V to (VCC + 0.3V) 15dBm 5dBM 10mA +150°C -40°C to +85°C -65°C to +150°C +300°C 1.6W 21mW/°C II. Manufacturing Information A. Description/Function: Quadruple-Mode PCS/Cellular/GPS LNA/Mixers B. Process: MB20 Bi-CMOS Process C. Number of Device Transistors: 2538 D. Fabrication Location: Oregon, USA E. Assembly Location: Korea F. Date of Initial Production: April, 2002 III. Packaging Information A. Package Type: 28-Pin QFN B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-Filled Epoxy E. Bondwire: Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # 05-9000-0247 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: 89 x 87 mils B. Passivation: Si3N4 (Silicon nitride) C. Interconnect: Au D. Backside Metallization: None E. Minimum Metal Width: 1.2 microns (as drawn) Metal 1, 2 & 3 5.6 microns (as drawn) Metal 4 F. Minimum Metal Spacing: 1.6 microns (as drawn) Metal 1, 2 & 3, 4.2 microns (as drawn) Metal 4 G. Bondpad Dimensions: 3.4 mil. Octagonal H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 150°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 9823 x 90 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV λ = 5.39 x 10-9 λ = 5.39 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The attached Burn-In Schematic #06-7030 shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The WC19-3 die type has been found to have all pins able to withstand a transient pulse of ±800V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA. Table 1 Reliability Evaluation Test Results MAX2531EGI TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 150°C Biased Time = 192 hrs. FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 90 0 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality 77 0 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 0 DC Parameters 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic DIP qualification packages. Note 2: Generic package/process data. 0 Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B Mil Std 883D Method 3015.7 Notice 8 TERMINAL D R = 1.5kΩ C = 100pf CURRENT PROBE (NOTE 6) 28 27 26 100 pF ONCE PER BOARD 50 OHM 50 OHM 50 OHM 100 pF ONCE PER SOCKET 25 24 23 22 50 OHM 2 20 3 19 4 18 5 17 6 16 100 pF 100 pF 50 OHM 7 15 28 - QFN 9 10 11 12 100 pF 13 14 50 OHM 50 OHM 8 50 OHM 50 OHM 21 21 K 50 OHM 1 100 pF 50 OHM 50 OHM 27 OHM 3.6V 100 nF DEVICES: MAX 2530/2531/2538/2539/2351/2358 DRAWN BY: HAK TAN MAX. EXPECTED CURRENT = 40mA NOTES: DOCUMENT I.D. 06-7030 REVISION B MAXIM TITLE: BI Circuit (MAX2530/2531/2538/2539/2351/2358) WC19Z PAGE 2