ON MC14526BDWR2 Presettable 4-bit down counter Datasheet

MC14526B
Presettable 4-Bit Down
Counters
The MC14526B binary counter is constructed with MOS P–channel
and N–channel enhancement mode devices in a monolithic structure.
This device is presettable, cascadable, synchronous down counter
with a decoded “0” state output for divide–by–N applications. In
single stage applications the “0” output is applied to the Preset Enable
input. The Cascade Feedback input allows cascade divide–by–N
operation with no additional gates required. The Inhibit input allows
disabling of the pulse counting function. Inhibit may also be used as a
negative edge clock.
This complementary MOS counter can be used in frequency
synthesizers, phase–locked loops, and other frequency division
applications requiring low power dissipation and/or high noise
immunity.
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MARKING
DIAGRAMS
16
PDIP–16
P SUFFIX
CASE 648
MC14526BCP
AWLYYWW
1
16
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Logic Edge–Clocked Design — Incremented on Positive Transition
14526B
SOIC–16
DW SUFFIX
CASE 751G
of Clock or Negative Transition of Inhibit
• Asynchronous Preset Enable
• Capable of Driving Two Low–power TTL Loads or One Low–power
AWLYYWW
1
Schottky TTL Load Over the Rated Temperature Range
16
SOEIAJ–16
F SUFFIX
CASE 966
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Parameter
1
Value
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
±10
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Operating Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
Symbol
VDD
Vin, Vout
Iin, Iout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
ORDERING INFORMATION
Package
Shipping
MC14526BCP
PDIP–16
2000/Box
MC14526BDW
SOIC–16
47/Rail
MC14526BDWR2
SOIC–16
1000/Tape & Reel
SOEIAJ–16
See Note 1.
MC14526BF
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
v
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
Device
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
v
MC14526B
AWLYWW
1
Publication Order Number:
MC14526B/D
MC14526B
PIN ASSIGNMENT
Q3
1
16
VDD
P3
2
15
Q2
PE
3
14
P2
INHIBIT
4
13
CF
P0
5
12
“0”
CLOCK
6
11
P1
7
10
RESET
8
9
VSS
Q1
FUNCTION TABLE
Inputs
Output
Resulting
Function
Clock
Reset
Inhibit
Preset
Enable
Cascade
Feedback
“0”
X
X
X
H
H
H
X
X
X
L
H
X
L
L
H
L
H
H
Asynchronous
y
reset*
Asynchronous reset
A
Asynchronous
h
reset
X
L
X
H
X
L
Asynchronous preset
L
L
H
L
L
L
X
X
L
L
Decrement inhibited
Decrement inhibited
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
No change**
g
(inactive
(
edge)
g )
No change** (inactive edge)
D
Decrement**
**
Decrement**
H
H
L
X = Don’t Care
NOTES:
** Output “0” is low when reset goes high only it PE and CF are low.
** Output “0” is high when reset is low, only if CF is high and count is 0000.
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2
MC14526B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
– 55_C
VDD
25_C
125_C
Symbol
Vdc
Min
Max
Min
Typ (4.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Characteristic
Output Voltage
Vin = VDD or 0
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (1.7 µA/kHz) f + IDD
IT = (3.4 µA/kHz) f + IDD
IT = (5.1 µA/kHz) f + IDD
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
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3
µAdc
MC14526B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
Characteristic
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
Propagation Delay Time (Inhibit Used as Negative
Edge Clock)
Clock or Inhibit to Q
tPLH, tPHL = (1.7 ns/pF) CL + 465 ns
tPLH, tPHL = (0.66 ns/pF) CL + 197 ns
tPLH, tPHL = (0.5 ns/pF) CL + 135 ns
Symbol
tTLH,
tTHL
(Figures 4, 5)
VDD
Min
Typ (8.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
ns
tPLH,
tPHL
(Figures 4, 5, 6)
Clock or Inhibit to “0”
tPLH, tPHL = (1.7 ns/pF) CL + 155 ns
tPLH, tPHL = (0.66 ns/pF) CL + 87 ns
tPLH, tPHL = (0.5 ns/pF) CL + 65 ns
Unit
ns
5.0
10
15
—
—
—
550
225
160
1100
450
320
5.0
10
15
—
—
—
240
130
100
480
260
200
Propagation Delay Time
Pn to Q
tPLH,
tPHL
(Figures 4, 7)
5.0
10
15
—
—
—
260
120
100
520
240
200
ns
Propagation Delay Time
Reset to Q
tPHL
—
—
—
250
110
80
500
220
160
ns
(Figure 8)
5.0
10
15
tPHL,
tPLH
(Figures 4, 9)
5.0
10
15
—
—
—
220
100
80
440
200
160
ns
tw
5.0
10
15
250
100
80
125
50
40
—
—
—
ns
—
—
—
2.0
5.0
6.6
1.5
3.0
4.0
MHz
(Figures 4, 5, 6)
5.0
10
15
tr,
tf
(Figures 5, 6)
5.0
10
15
—
—
—
—
—
—
15
5
4
µs
tsu
5.0
10
15
90
50
40
40
15
10
—
—
—
ns
5.0
10
15
30
30
30
– 15
–5
0
—
—
—
ns
5.0
10
15
250
100
80
125
50
40
—
—
—
ns
5.0
10
15
350
250
200
175
125
100
—
—
—
ns
5.0
10
15
10
20
30
– 110
– 30
– 20
—
—
—
ns
Propagation Delay Time
Preset Enable to “0”
Clock or Inhibit Pulse Width
(Figures 5, 6)
Clock Pulse Frequency (with PE = low)
Clock or Inhibit Rise and Fall Time
Setup Time
Pn to Preset Enable
fmax
(Figure 10)
Hold Time
Preset Enable to Pn
th
(Figure 10)
Preset Enable Pulse Width
tw
(Figure 10)
Reset Pulse Width
tw
(Figure 8)
Reset Removal Time
trem
(Figure 8)
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
MC14526B
VOL
VOH
VDD = VGS
VDD = –VGS
CF
PE
P0
P1
P2
P3
RESET
INHIBIT
CLOCK
CF
PE
P0
P1
P2
P3
RESET
INHIBIT
CLOCK
Q0
Q1
Q2
IOH
Q3
“0”
EXTERNAL
POWER
SUPPLY
VSS
Q0
Q1
Q2
IOL
Q3
“0”
EXTERNAL
POWER
SUPPLY
VSS
Figure 1. Typical Output Source
Characteristics Test Circuit
Figure 2. Typical Output Sink
Characteristics Test Circuit
VDD
CF
PE
P0
P1
P2
P3
RESET
INHIBIT
CLOCK
Q0
Q1
Q2
20 ns
CLOCK
TEST POINT
CL
CL
“0”
VSS
PULSE
GENERATOR
CL
Q3
Q or “0”
CL
DEVICE
UNDER
TEST
CL
20 ns
VDD
90%
50%
10%
VSS
VARIABLE
50%
DUTY
CYCLE
WIDTH
CL*
* Includes all probe and jig capacitance.
Figure 3. Power Dissipation
Figure 4. Test Circuit
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5
MC14526B
SWITCHING WAVEFORMS
tr
CLOCK
tf
tf
VDD
90%
50%
10%
tr
VDD
90%
50%
10%
INHIBIT
VSS
VSS
tw
tw
1/fmax
tPHL
tPLH
ANY Q
OR “0”
1/fmax
tPLH
90%
50%
10%
ANY Q
OR “0”
tTLH
tPHL
90%
50%
10%
tTHL
tTLH
Figure 5.
tTHL
Figure 6.
tw
VDD
RESET
50%
VSS
tr
ANY P
tf
tPHL
VDD
90%
50%
10%
ANY Q
VSS
tPLH
50%
tPHL
trem
ANY Q
VDD
50%
CLOCK
50%
VSS
Figure 7.
Figure 8.
VALID
tr
PRESET
ENABLE
tf
VDD
VDD
90%
50%
10%
ANY P
50%
VSS
GND
tPHL
th
tsu
tPLH
VDD
PRESET
ENABLE
“0”
50%
50%
VSS
tw
Figure 9.
Figure 10.
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6
MC14526B
PIN DESCRIPTIONS
other than all zeroes, the “0” output is valid after the rising
edge of Preset Enable (when Cascade Feedback is high). See
the Function Table.
Cascade Feedback (Pin 13) — If the Cascade Feedback
input is high, a high level is generated at the “0” output when
the count is all zeroes. If Cascade Feedback is low, the “0”
output depends on the Preset Enable input level. See the
Function Table.
P0, P1, P2, P3 (Pins 5, 11, 14, 2) — These are the preset
data inputs. P0 is the LSB.
Q0, Q1, Q2, Q3 (Pins 7, 9, 15, 1) — These are the
synchronous counter outputs. Q0 is the LSB.
VSS (Pin 8) — The most negative power supply potential.
This pin is usually ground.
VDD (Pin 16) — The most positive power supply
potential. VDD may range from 3 to 18 V with respect to VSS.
Preset Enable (Pin 3) — If Reset is low, a high level on
the Preset Enable input asynchronously loads the counter
with the programmed values on P0, P1, P2, and P3.
Inhibit (Pin 4) — A high level on the Inhibit input pre–
vents the Clock from decrementing the counter. With Clock
(pin 6) held high, Inhibit may be used as a negative edge
clock input.
Clock (Pin 6) — The counter decrements by one for each
rising edge of Clock. See the Function Table for level
requirements on the other inputs.
Reset (Pin 10) — A high level on Reset asynchronously
forces Q0, Q1, Q2, and Q3 low and, if Cascade Feedback is
high, causes the “0” output to go high.
“0” (Pin 12) — The “0” (Zero) output issues a pulse one
clock period wide when the counter reaches terminal count
(Q0 = Q1 = Q2 = Q3 = low) if Cascade Feedback is high and
Preset Enable is low. When presetting the counter to a value
STATE DIAGRAM
MC14526B
0
1
2
3
4
15
5
14
6
13
7
12
11
10
9
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7
8
MC14526B
MC14526B LOGIC DIAGRAM (Binary Down Counter)
P0
Q0
5
P1
7
Q1
11
Q2
14
P3
15
Q3
2
1
D R
D RQ
D RQ
D RQ
C
C
C
C
T PE Q
T PE Q
T PE Q
T PE Q
VDD
VDD
CF
P2
9
13
PE
3
INHIBIT
4
12
CLOCK
RESET
10
6
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8
“0”
MC14526B
APPLICATIONS INFORMATION
Divide–By–N, Single Stage
Cascaded, Presettable Divide–By–N
Figure 11 shows a single stage divide–by–N application.
To initialize counting a number, N is set on the parallel
inputs (P0, P1, P2, and P3) and reset is taken high
asynchronously. A zero is forced into the master and slave
of each bit and, at the same time, the “0” output goes high.
Because Preset Enable is tied to the “0” output, preset is
enabled. Reset must be released while the Clock is high so
the slaves of each bit may receive N before the Clock goes
low. When the Clock goes low and Reset is low, the “0”
output goes low (if P0 through P3 are unequal to zero).
The counter downcounts with each rising edge of the
Clock. When the counter reaches the zero state, an output
pulse occurs on “0” which presets N. The propagation delays
from the Clock’s rising and falling edges to the “0” output’s
rising and falling edges are about equal, making the “0”
output pulse approximately equal to that of the Clock pulse.
The Inhibit pin may be used to stop pulse counting. When
this pin is taken high, decrementing is inhibited.
Figure 12 shows a three stage cascade application. Taking
Reset high loads N. Only the first stage’s Reset pin (least
significant counter) must be taken high to cause the preset
for all stages, but all pins could be tied together, as shown.
When the first stage’s Reset pin goes high, the “0” output
is latched in a high state. Reset must be released while Clock
is high and time allowed for Preset Enable to load N into all
stages before Clock goes low.
When Preset Enable is high and Clock is low, time must
be allowed for the zero digits to propagate a Cascade
Feedback to the first non–zero stage. Worst case is from the
most significant bit (M.S.B.) to the L.S.B., when the L.S.B.
is equal to one (i.e. N = 1).
After N is loaded, each stage counts down to zero with
each rising edge of Clock. When any stage reaches zero and
the leading stages (more significant bits) are zero, the “0”
output goes high and feeds back to the preceding stage.
When all stages are zero, the Preset Enable automatically
loads N while the Clock is high and the cycle is renewed.
N
VDD
fin
VSS
P0
P1
P2
P3
CF
RESET
INHIBIT
Q0
Q1
Q2
Q3
BUFFER
fin
“0”
N
CLOCK
PE
Figure 11. ÷ N Counter
LSB
N0 N1 N2 N3
P0 P1 P2 P3
fin
P0 P1 P2 P3
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
P0 P1 P2 P3
CLOCK
CLOCK
CLOCK
VSS
MSB
N8 N9 N10 N11
N4 N5 N6 N7
INHIBIT
RESET
CF
“0”
PE
VSS
CF
INHIBIT
RESET
“0”
PE
VSS
INHIBIT
RESET
Q0 Q1 Q2 Q3
VDD
CF
“0”
PE
VDD
LOAD
N
BUFFER
10 KΩ
fin
VSS
Figure 12. 3 Stages Cascaded
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9
N
MC14526B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–03
ISSUE B
A
D
9
1
8
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
h X 45 _
E
0.25
16X
M
T A
S
B
S
14X
e
L
A
0.25
B
B
A1
H
8X
M
B
M
16
q
SEATING
PLANE
T
DIM
A
A1
B
C
D
E
e
H
h
L
q
C
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10
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
10.15
10.45
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC14526B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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11
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
MC14526B
ON Semiconductor and
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MC14526B/D
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