Samsung K4H560438D-NC/LA2 256mb stsopii Datasheet

256Mb sTSOPII
DDR SDRAM
Key Features
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe(DQS)
• Four banks operation
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• MRS cycle with address key programs
-. Read latency 2, 2.5 (clock)
-. Burst length (2, 4, 8)
-. Burst type (sequential & interleave)
• All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
• Data I/O transactions on both edges of data strobe
• Edge aligned data output, center aligned data input
• DM for write masking only
• Auto & Self refresh
• 7.8us refresh interval(8K/64ms refresh)
• Maximum burst refresh cycle : 8
• 54pin sTSOP II package
ORDERING INFORMATION
Part No.
Org.
K4H560438D-NC/LB3
Max Freq.
Interface
Package
SSTL2
54pin sTSOP II
SSTL2
54pin sTSOP II
B3(DDR333@CL=2.5)
K4H560438D-NC/LA2
64M x 4
K4H560438D-NC/LB0
A2(DDR266@CL=2)
B0(DDR266@CL=2.5)
K4H560438D-NC/LA0
A0(DDR200@CL=2)
K4H560838D-NC/LB3
B3(DDR333@CL=2.5)
K4H560838D-NC/LA2
32M x 8
K4H560838D-NC/LB0
A2(DDR266@CL=2)
B0(DDR266@CL=2.5)
K4H560838D-NC/LA0
A0(DDR200@CL=2)
Operating Frequencies
- B3(DDR333)
- A2(DDR266A)
- B0(DDR266B)
- A0(DDR200)
Speed @CL2
133MHz
133MHz
100MHz
100MHz
Speed @CL2.5
166MHz
133MHz
133MHz
-
DLL jitter
±0.7ns
±0.75ns
±0.75ns
±0.8ns
*CL : Cas Latency
- 1 -
Rev.0.0 May. ’02
256Mb sTSOPII
DDR SDRAM
Package Pinout
54pin sTSOP II
32Mb x 8
64Mb x 4
VDD
VDD
1
54
VSS
VSS
DQ0
NC
2
53
NC
DQ7
VDDQ
VDDQ
3
52
VSSQ
VSSQ
DQ1
DQ0
4
51
DQ3
DQ6
VSSQ
VSSQ
5
50
VDDQ
VDDQ
DQ2
NC
6
49
NC
DQ5
VDDQ
VDDQ
7
48
VSSQ
VSSQ
DQ3
DQ1
8
47
DQ2
DQ4
VSSQ
VSSQ
9
46
VDDQ
VDDQ
NC
NC
10
45
NC
NC
VDDQ
VDDQ
11
44
VSSQ
VSSQ
NC
NC
12
43
DQS
DQS
NC
NC
13
42
VREF
VREF
VDD
VDD
14
41
VSS
VSS
WE
WE
15
40
DM
DM
CAS
CAS
16
39
CK
CK
RAS
RAS
17
38
CK
CK
CS
CS
18
37
CKE
CKE
NC
NC
19
36
A12
A12
BA0
BA0
20
35
A11
A11
BA1
BA1
21
34
A9
A9
AP/A10
AP/A10
22
33
A8
A8
A0
A0
23
32
A7
A7
A1
A1
24
31
A6
A6
A2
A2
25
30
A5
A5
A3
A3
26
29
A4
A4
VDD
VDD
27
28
VSS
VSS
54 PIN sTSOP(II)
300mil x 551mil
(7.62mm x 14.00mm)
(0.5 mm PIN PITCH)
Bank Address
BA0-BA1
Row Address
A0-A12
Auto Precharge
A10
256Mb package Pinout
Organization
Column Address
64Mx4
A0-A9, A11
32Mx8
A0-A9
DM is internally loaded to match DQ and DQS identically.
Column address configuration
- 2 -
Rev.0.0 May. ’02
256Mb sTSOPII
DDR SDRAM
Block Diagram (16Mbit x 4 I/O x 4 Banks)
CK, CK
WE
I/O Control
4
Data Input Register
DM
Serial to parallel
Bank Select
8
8Mx8
4
Output Buffer
8Mx8
8
2-bit prefetch
Sense AMP
Row Decoder
Refresh Counter
Row Buffer
ADD
Address Register
CK, CK
8Mx8
x4
DQi
8Mx8
Column Decoder
Col. Buffer
LCBR
LRAS
Latency & Burst Length
Strobe
Gen.
DLL
Programming Register
Data Strobe
LCKE
LRAS
LCBR
LWE
LCAS
LWCBR
CK, CK
DM
Timing Register
CK, CK
CKE
CS
RAS
CAS
- 3 -
WE
DM
Rev.0.0 May. ’02
256Mb sTSOPII
DDR SDRAM
Block Diagram (8Mbit x 8 I/O x 4 Banks)
CK, CK
WE
I/O Control
8
Data Input Register
DM
Serial to parallel
Bank Select
16
4Mx16
8
Output Buffer
4Mx16
16
2-bit prefetch
Sense AMP
Row Decoder
Refresh Counter
Row Buffer
ADD
Address Register
CK, CK
4Mx16
x8
DQi
4Mx16
Column Decoder
Col. Buffer
LCBR
LRAS
Latency & Burst Length
Strobe
Gen.
DLL
Programming Register
Data Strobe
LCKE
LRAS
LCBR
LWE
LCAS
LWCBR
CK, CK
DM
Timing Register
CK, CK
CKE
CS
RAS
CAS
- 4 -
WE
DM
Rev.0.0 May. ’02
256Mb sTSOPII
DDR SDRAM
Input/Output Function Description
SYMBOL
TYPE
DESCRIPTION
CK, CK
Input
Clock : CK and CK are differential clock inputs. All address and control input signals are sampled on the positive edge of CK and negative edge of CK. Output (read) data is referenced to
both edges of CK. Internal clock signals are derived from CK/CK.
CKE
Input
Clock Enable : CKE HIGH activates, and CKE LOW deactivates internal clock signals, and
device input buffers and output drivers. Deactivating the clock provides PRECHARGE
POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER-DOWN
(row ACTIVE in any bank). CKE is synchronous for all functions except for disabling outputs,
which is achieved asynchronously. Input buffers, excluding CK, CK and CKE are disabled
during power-down and self refresh modes, providing low standby power. CKE will recognize
an LVCMOS LOW level prior to VREF being stable on power-up.
CS
Input
Chip Select : CS enables(registered LOW) and disables(registered HIGH) the command
decoder. All commands are masked when CS is registered HIGH. CS provides for external
bank selection on systems with multiple banks. CS is considered part of the command code.
RAS, CAS , WE
Input
Command Inputs : RAS , CAS and WE (along with CS) define the command being entered.
LDM,(U)DM
Input
Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled on both
edges of DQS. DM pins include dummy loading internally, to matches the DQ and DQS loading. For the x16, LDM corresponds to the data on DQ0-DQ7 ; UDM correspons to the data on
DQ8-DQ15.
BA0, BA1
Input
Bank Addres Inputs : BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRECHARGE command is being applied.
A [n : 0]
Input
Address Inputs : Provide the row address for ACTIVE commands, and the column address
and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the
memory array in the respective bank. A10 is sampled during a PRECHARGE command to
determine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10
HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address
inputs also provide the op-code during a MODE REGISTER SET command. BA0 and BA1
define which mode register is loaded during the MODE REGISTER SET command (MRS or
EMRS).
DQ
I/O
Data Input/Output : Data bus
LDQS,(U)DQS
I/O
Data Strobe : Output with read data, input with write data. Edge-aligned with read data, centered in write data. Used to capture write data. For the x16, LDQS corresponds to the data on
DQ0-DQ7 ; UDQS corresponds to the data on DQ8-DQ15.
NC
-
No Connect : No internal electrical connection is present.
VD DQ
Supply
DQ Power Supply : +2.5V ± 0.2V.
VSS Q
Supply
DQ Ground.
VD D
Supply
Power Supply : +2.5V ± 0.2V (device specific).
VSS
Supply
Ground.
VR E F
Input
SSTL_2 reference voltage.
- 5 -
Rev.0.0 May. ’02
256Mb sTSOPII
DDR SDRAM
Command Truth Table
(V=Valid, X=Don′t Care, H=Logic High, L=Logic Low)
COMMAND
CKEn-1
CKEn
CS
RAS
CAS
WE
BA0,1
A 10/AP
A11, A12
A9 ~ A0
Note
Register
Extended MRS
H
X
L
L
L
L
OP CODE
1, 2
Register
Mode Register Set
H
X
L
L
L
L
OP CODE
1, 2
L
L
L
H
X
Auto Refresh
Refresh
Entry
Self
Refresh
H
H
L
L
H
H
H
H
X
X
X
X
L
L
H
H
V
H
X
L
H
L
H
V
H
X
L
H
L
L
V
H
X
L
H
H
L
H
X
L
L
H
L
Entry
H
L
H
X
X
X
L
V
V
V
Exit
L
H
X
X
X
X
Entry
H
L
H
X
X
X
L
H
H
H
Exit
L
H
H
X
X
X
L
V
V
V
Exit
L
H
Bank Active & Row Address
H
Read &
Column Address
Auto Precharge Disable
Write &
Column Address
Auto Precharge Disable
Auto Precharge Enable
Auto Precharge Enable
Burst Stop
Precharge
Bank Selection
All Banks
Active Power Down
DM
H
No operation (NOP) : Not defined
H
X
X
3
3
X
3
Row Address
L
Column
Address
H
L
Precharge Power Down Mode
3
Column
Address
H
X
V
L
X
H
X
X
X
L
H
H
H
4
4
4, 6
7
X
5
X
X
X
H
4
X
8
9
9
1. OP Code : Operand Code. A 0 ~ A12 & BA 0 ~ BA 1 : Program keys. (@EMRS/MRS)
2.EMRS/ MRS can be issued only at all banks precharge state.
A new command can be issued 2 clock cycles after EMRS or MRS.
3. Auto refresh functions are same as the CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA0 ~ BA 1 : Bank select addresses.
If both BA0 and BA 1 are "Low" at read, write, row active and precharge, bank A is selected.
If BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank B is selected.
If BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank C is selected.
If both BA0 and BA 1 are "High" at read, write, row active and precharge, bank D is selected.
5. If A10 /AP is "High" at row precharge, BA 0 and BA1 are ignored and all banks are selected.
6. During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tR P after the end of burst.
7. Burst stop command is valid at every burst length.
8. DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).
9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM.
- 6 -
Rev.0.0 May. ’02
K4H560438D
DDR SDRAM
16M x 4Bit x 4 Banks Double Data Rate SDRAM
GENERAL DESCRIPTION
The K4H560438D is 268,435,456 bits of double data rate synchronous DRAM organized as 4 x 16,777,216 words by 4 bits, fabricated
with SAMSUNG ′s high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to
333Mb/s per pin. I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable burst length a nd
programmable latencies allow the device to be useful for a variety of high performance memory system applications.
Absolute Maximum Rating
Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD & VDDQ supply relative to VSS
VDD, VDDQ
-1.0 ~ 3.6
V
Storage temperature
TSTG
-55 ~ +150
°C
Power dissipation
PD
1.5
W
Short circuit current
IOS
50
mA
Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommend operation condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability
DC Operating Conditions
Recommended operating conditions(Voltage referenced to VSS =0V, TA =0 to 70°C)
Parameter
Symbol
Min
Max
Supply voltage(for device with a nominal VD D of 2.5V)
VD D
2.3
2.7
I/O Supply voltage
VDDQ
2.3
2.7
V
I/O Reference voltage
VREF
VDDQ/2-50mV
VDDQ/2+50mV
V
1
I/O Termination voltage(system)
V TT
V R E F-0.04
VREF +0.04
V
2
Input logic high voltage
V I H(DC)
V REF+0.15
V DDQ+0.3
V
4
Input logic low voltage
V IL (DC)
-0.3
V REF -0.15
V
4
Input Voltage Level, CK and CK inputs
V I N(DC)
-0.3
V DDQ+0.3
V
Input Differential Voltage, CK and CK inputs
V I D(DC)
0.3
V DDQ+0.6
V
3
Input crossing point voltage, CK and CK inputs
V IX(DC)
1.15
1.35
V
5
II
-2
2
uA
Output leakage current
IO Z
-5
5
uA
Output High Current(Normal strengh driver)
;VOUT = VTT + 0.84V
IO H
-16.8
mA
Output High Current(Normal strengh driver)
;V OUT = VTT - 0.84V
IOL
16.8
mA
Output High Current(Half strengh driver)
;VOUT = VTT + 0.45V
IO H
-9
mA
Output High Current(Half strengh driver)
;V OUT = VTT - 0.45V
IOL
9
mA
Input leakage current
- 7 -
Unit
Note
Rev.0.0 May. ’02
K4H560438D
DDR SDRAM
Notes 1. Includes ± 25mV margin for DC offset on VREF , and a combined total of ± 50mV margin for all AC noise and DC offset on
VR E F, bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise
coupled TO VREF , both of which may result in V REF noise. V REF should be de-coupled with an inductance of ≤ 3nH.
2. VTT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to
V R E F, and must track variations in the DC level of VR E F
3. VID is the magnitude of the difference between the input level on CK and the input level on CK.
4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.
5. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the dc level of the same.
DDR SDRAM IDD spec table
(V DD=2.7V, T = 10 °C)
64Mx4
Symbol
IDD6
K4H560438D-NC/LB3
(DDR333)
K4H560438D-NC/LA2,B0
(DDR266A/B)
K4H560438D-NC/LA0
(DDR200)
Unit
IDD0
90
80
75
mA
IDD1
110
100
90
mA
IDD2P
3
3
3
mA
IDD2F
25
20
18
mA
IDD2Q
20
18
16
mA
IDD3P
35
30
25
mA
IDD3N
55
45
40
mA
IDD4R
150
120
100
mA
IDD4W
160
135
110
mA
IDD5
180
165
150
mA
3
3
3
mA
Normal
Low power
IDD7A
1.5
1.5
1.5
mA
290
250
220
mA
Notes
Optional
AC Operating Conditions
Parameter/Condition
Symbol
Min
Input High (Logic 1) Voltage, DQ, DQS and DM signals
VIH(AC)
VREF + 0.31
Input Low (Logic 0) Voltage, DQ, DQS and DM signals.
VIL(AC)
Input Differential Voltage, CK and CK inputs
VID(AC)
Input Crossing Point Voltage, CK and CK inputs
VIX(AC)
Max
Unit
Note
V
3
VREF - 0.31
V
3
0.7
VDDQ+0.6
V
1
0.5*VDDQ-0.2
0.5*VDDQ+0.2
V
2
Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK.
2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same.
3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simu
lation. the AC and DC input specificatims are refation to a Vref envelope that has been bandwidth limited 20MHz.
Overshoot/Undershoot specification
Specification
Parameter
Address &
Control pins
Data pins
Maximum peak amplitude allowed for overshoot
1.6 V
1.2V
Maximum peak amplitude allowed for undershoot
1.6 V
1.2V
The area between the overshoot signal and VDD must be less than or equal to
4.5 V-ns
2.5 V-ns
The area between the undershoot signal and GND must be less than or equal to
4.5 V-ns
2.5 V-ns
- 8 -
Rev.0.0 May. ’02
K4H560438D
DDR SDRAM
AC Timming Parameters & Specifications
Parameter
Symbol
-NC/LB3
(DDR333)
Min
Row cycle time
Max
-NC/LA2
(DDR266A)
-NC/LB0
(DDR266B)
Min
Min
Max
-NC/LA0
(DDR200)
Max
Min
Unit Note
Max
tRC
60
65
65
70
ns
Refresh row cycle time
tRFC
72
75
75
80
ns
Row active time
tRAS
42
RAS to CAS delay
tRCD
18
20
20
20
ns
tRP
18
20
20
20
ns
Row active to Row active delay
tRRD
12
15
15
15
ns
Write recovery time
tWR
15
15
15
15
ns
Last data in to Read command
tWTR
1
1
1
1
tCK
Col. address to Col. address delay
tCCD
1
1
1
1
tCK
Row precharge time
Clock cycle time
CL=2.0
CL=2.5
Clock high level width
Clock low level width
70K
45
120K
45
120K
48
7.5
12
7.5
12
10
12
6
12
7.5
12
7.5
12
tCH
0.45
0.55
0.45
0.55
0.45
0.55
0.45
tCK
10
120K
12
ns
ns
5
ns
5
0.55
tCK
tCL
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
tDQSCK
-0.6
+0.6
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
ns
Output data access time from CK/CK
tAC
-0.7
+0.7
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
ns
Data strobe edge to ouput data edge
tDQSQ
-
0.45
-
0.5
-
0.5
-
0.6
ns
Read Preamble
tRPRE
0.9
1.1
0.9
1.1
0.9
1.1
0.9
1.1
tCK
Read Postamble
tRPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
CK to valid DQS-in
tDQSS
0.75
1.25
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS-in setup time
tWPRES
0
0
0
0
ns
tWPRE
0.25
0.25
0.25
0.25
tCK
DQS falling edge to CK rising-setup time
tDSS
0.2
0.2
0.2
0.2
tCK
DQS falling edge from CK rising-hold time
tDSH
0.2
0.2
0.2
0.2
tCK
DQS-in high level width
tDQSH
0.35
0.35
0.35
0.35
tCK
DQS-in low level width
tDQSL
0.35
DQS-in cycle time
tDSC
0.9
Address and Control Input setup time(fast)
tIS
0.75
0.9
0.9
1.1
ns
6
Address and Control Input hold time(fast)
tIH
0.75
0.9
0.9
1.1
ns
6
Address and Control Input setup time(slow)
tIS
0.8
1.0
1.0
1.1
ns
6
Address and Control Input hold time(slow)
tIH
0.8
1.0
1.0
1.1
ns
6
Data-out high impedence time from CK/ CK
tHZ
-0.7
+0.7
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
Data-out low impedence time from CK/CK
tLZ
-0.7
+0.7
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
tSL(I)
0.5
Input Slew Rate(for I/O pins)
tSL(IO)
0.5
Output Slew Rate(x4,x8)
tSL(O)
1.0
4.5
1.0
4.5
1.0
4.5
1.0
4.5
Output Slew Rate Matching Ratio(rise to fall)
tSLMR
0.67
1.5
0.67
1.5
0.67
1.5
0.67
1.5
DQS-out access time from CK/CK
DQS-in hold time
Input Slew Rate(for input only pins)
0.35
1.1
0.9
0.35
1.1
0.5
0.35
1.1
0.5
0.5
- 9 -
0.9
0.9
2
tCK
1.1
0.5
0.5
5
tCK
ns
ns
V/ns
0.5
6
V/ns
7
V/ns
10
Rev.0.0 May. ’02
K4H560438D
Parameter
DDR SDRAM
-NC/LB3
(DDR333)
Symbol
Min
Max
-NC/LA2
(DDR266A)
-NC/LB0
(DDR266B)
Min
Min
Max
Max
-NC/LA0
(DDR200)
Min
Unit Note
Max
Mode register set cycle time
tMRD
12
15
15
16
ns
DQ & DM setup time to DQS
tDS
0.45
0.5
0.5
0.6
ns
7,8,9
DQ & DM hold time to DQS
tDH
0.45
0.5
0.5
0.6
ns
7,8,9
Control & Address input pulse width
tIPW
2.2
2.2
2.2
2.5
ns
DQ & DM input pulse width
tDIPW
1.75
1.75
1.75
2
ns
Power down exit time
tPDEX
6
7.5
7.5
10
ns
Exit self refresh to non-Read command
tXSNR
75
75
75
80
ns
Exit self refresh to read command
tXSRD
200
200
200
200
tCK
Refresh interval time
tREFI
7.8
7.8
7.8
7.8
us
1
Output DQS valid window
tQH
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
ns
5
Clock half period
tHP
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
ns
Data hold skew factor
tQHS
DQS write postamble time
tWPST
0.4
tRAP
18
20
20
20
tDAL
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
Active to Read with Auto precharge
command
Autoprecharge write recovery +
Precharge time
0.55
0.75
0.6
0.4
0.6
0.75
0.4
0.6
0.4
4
0.8
ns
0.6
tCK
3
tCK
11
1. Maximum burst refresh cycle : 8
2. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from
High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress,
DQS could be High at this time, depending on tDQSS.
3. The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter,
but system performance (bus turnaround) will degrade accordingly.
4. A write command can be applied with tR C D satisfied after this command.
5. For registered DIMMs, tCL and tC H are ≥ 45% of the period including both the half period jitter (tJIT(HP)) of the PLL and the half period
jitter due to crosstalk (tJIT (crosstalk)) on the DIMM.
6. Input Setup/Hold Slew Rate Derating
Input Setup/Hold Slew Rate
∆tIS
∆tIH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+50
+50
0.3
+100
+100
This derating table is used to increase t IS/t IH in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate
based on the lesser of AC-AC slew rate and DC-DC slew rate.
7. I/O Setup/Hold Slew Rate Derating
I/O Setup/Hold Slew Rate
∆tDS
∆tDH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+75
+75
0.3
+150
+150
This derating table is used to increase tDS/t DH in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate
based on the lesser of AC-AC slew rate and DC-DC slew rate.
- 10 -
Rev.0.0 May. ’02
K4H560438D
DDR SDRAM
8. I/O Setup/Hold Plateau Derating
I/O Input Level
∆tDS
∆tDH
(mV)
(ps)
(ps)
± 280
+50
+50
This derating table is used to increase tDS/tDH in the case where the input level is flat below VREF ± 310mV for a duration of
up to 2ns.
9. I/O Delta Rise/Fall Rate(1/slew-rate) Derating
Delta Rise/Fall Rate
∆tDS
∆tDH
(ns/V)
(ps)
(ps)
0
0
0
±0.25
+50
+50
±0.5
+100
+100
This derating table is used to increase tDS /tD H in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate
is calated as 1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall
Rate =-0/5ns/V. Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall rate.
10. This parameter is fir system simulation purpose. It is guranteed by design.
11. For each of the terms, if not already an integer, round to the next highest integer. tCK is actual to the system clock cycle time.
<Reference>
The following table specifies derating values for the specifications listed if the single-ended clock skew rate is less than 1.0 V/ns.
CK slew rate
(Single ended)
∆tIH/tIS
(ps)
∆tDSS/tDSH
(ps)
∆tAC/tDQSCK
(ps)
∆tLZ(min)
(ps)
∆tHZ(max)
(ps)
1.0V/ns
0
0
0
0
0
0.75V/ns
+50
+50
+50
-50
+50
0.5V/ns
+100
+100
+100
-100
+100
- 11 -
Rev.0.0 May. ’02
K4H560438D
DDR SDRAM
(V DD=2.5V, VDDQ =2.5V, TA= 0 to 70°C)
AC Operating Test Conditions
Parameter
Value
Unit
Input reference voltage for Clock
0.5 * VDDQ
V
Input signal maximum peak swing
1.5
V
Input signal minimum slew rate (for imput only)
0.5
V/ns
Input slew rate (I/O pins)
0.5
V/ns
V REF+0.31/VREF -0.31
V
VREF
V
V tt
V
Input Levels(V IH/VIL)
Input timing measurement reference level
Output timing measurement reference level
Output load condition
Note
See Load Circuit
Vtt=0.5*VDDQ
RT=50Ω
Output
Z0=50 Ω
C LOAD =30pF
V REF
=0.5*VDDQ
Output Load Circuit (SSTL_2)
Input/Output Capacitance
(VDD=2.5, VDDQ=2.5V, TA= 25 °C, f=1MHz)
Symbol
Min
Max
Delta Cap(max)
Unit
Input capacitance
(A0 ~ A11, BA0 ~ BA1, CKE, CS, RAS,CAS, WE)
Parameter
CIN1
2
3.0
0.5
pF
Input capacitance( CK, CK )
CIN2
2
3.0
0.25
pF
Data & DQS input/output capacitance
COUT
4.0
5.0
Input capacitance(DM)
CIN3
- 12 -
4.0
5.0
pF
0.5
pF
Rev.0.0 May. ’02
K4H560838D
DDR SDRAM
8M x 8Bit x 4 Banks Double Data Rate SDRAM
GENERAL DESCRIPTION
The K4H560838D is 268,435,456 bits of double data rate synchronous DRAM organized as 4 x 8,388,608 words by 8 bits, fabricated
with SAMSUNG′s high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up
to 333Mb/s per pin. I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable burst length
and programmable latencies allow the device to be useful for a variety of high performance memory system applications.
Absolute Maximum Rating
Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VIN, VOUT
-0.5 ~ 3.6
V
Voltage on VDD & VDDQ supply relative to VSS
VDD, VDDQ
-1.0 ~ 3.6
V
Storage temperature
TSTG
-55 ~ +150
°C
Power dissipation
PD
1.5
W
Short circuit current
IOS
50
mA
Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommend operation condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability
DC Operating Conditions
Recommended operating conditions(Voltage referenced to VSS =0V, TA = 0 to 70°C)
Parameter
Symbol
Min
Max
Supply voltage(for device with a nominal V D D of 2.5V)
VD D
2.3
2.7
I/O Supply voltage
VDDQ
2.3
2.7
V
I/O Reference voltage
VREF
VDDQ/2-50mV
VDDQ/2+50mV
V
1
I/O Termination voltage(system)
V TT
V R E F-0.04
VREF +0.04
V
2
Input logic high voltage
V I H(DC)
V REF+0.15
VDDQ +0.3
V
4
Input logic low voltage
VIL (DC)
-0.3
V REF-0.15
V
4
Input Voltage Level, CK and CK inputs
V I N(DC)
-0.3
VDDQ +0.3
V
Input Differential Voltage, CK and CK inputs
V I D(DC)
0.3
VDDQ +0.6
V
3
Input crossing point voltage, CK and CK inputs
V IX(DC)
1.15
1.35
V
5
II
-2
2
uA
Output leakage current
IO Z
-5
5
uA
Output High Current(Normal strengh driver)
;V OUT = VTT + 0.84V
IO H
-16.8
mA
Output High Current(Normal strengh driver)
;V OUT = VTT - 0.84V
IOL
16.8
mA
Output High Current(Half strengh driver)
;V OUT = VTT + 0.45V
IO H
-9
mA
Output High Current(Half strengh driver)
;V OUT = VTT - 0.45V
IOL
9
mA
Input leakage current
- 13 -
Unit
Note
Rev.0.0 May. ’02
K4H560838D
DDR SDRAM
Notes 1. Includes ± 25mV margin for DC offset on VREF , and a combined total of ± 50mV margin for all AC noise and DC offset on
VR E F, bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise
coupled TO VREF , both of which may result in V REF noise. V REF should be de-coupled with an inductance of ≤ 3nH.
2. VTT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to
V R E F, and must track variations in the DC level of VR E F
3. VID is the magnitude of the difference between the input level on CK and the input level on CK.
4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.
5. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the dc level of the same.
(V DD=2.7V, T = 10°C)
DDR SDRAM IDD spec table
32Mx8
Symbol
IDD6
K4H560838D-NC/LB3
(DDR333)
K4H560838D-NC/LA2,B0
(DDR266A/B)
K4H560838D-NC/LA0
(DDR200)
Unit
IDD0
90
80
75
mA
IDD1
120
110
100
mA
IDD2P
3
3
3
mA
IDD2F
25
20
18
mA
IDD2Q
20
18
16
mA
IDD3P
35
30
25
mA
IDD3N
55
45
40
mA
IDD4R
170
140
120
mA
IDD4W
170
140
115
mA
IDD5
180
165
150
mA
3
3
3
mA
Normal
Low power
IDD7A
1.5
1.5
1.5
mA
325
280
235
mA
Notes
Optional
AC Operating Conditions
Parameter/Condition
Symbol
Min
Input High (Logic 1) Voltage, DQ, DQS and DM signals
VIH(AC)
VREF + 0.31
Input Low (Logic 0) Voltage, DQ, DQS and DM signals.
VIL(AC)
Input Differential Voltage, CK and CK inputs
VID(AC)
Input Crossing Point Voltage, CK and CK inputs
VIX(AC)
Max
Unit
Note
V
3
VREF - 0.31
V
3
0.7
VDDQ+0.6
V
1
0.5*VDDQ-0.2
0.5*VDDQ+0.2
V
2
Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK.
2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same.
3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simu
lation. the AC and DC input specificatims are refation to a Vref envelope that has been bandwidth limited 20MHz.
Overshoot/Undershoot specification
Specification
Parameter
Address &
Control pins
Data pins
Maximum peak amplitude allowed for overshoot
1.6 V
1.2V
Maximum peak amplitude allowed for undershoot
1.6 V
1.2V
The area between the overshoot signal and VDD must be less than or equal to
4.5 V-ns
2.5 V-ns
The area between the undershoot signal and GND must be less than or equal to
4.5 V-ns
2.5 V-ns
- 14 -
Rev.0.0 May. ’02
K4H560838D
DDR SDRAM
AC Timming Parameters & Specifications
Parameter
Symbol
-NC/LB3
(DDR333)
Min
Row cycle time
Max
-NC/LA2
(DDR266A)
-NC/LB0
(DDR266B)
Min
Min
Max
-NC/LA0
(DDR200)
Max
Min
Unit Note
Max
tRC
60
65
65
70
ns
Refresh row cycle time
tRFC
72
75
75
80
ns
Row active time
tRAS
42
RAS to CAS delay
tRCD
18
20
20
20
ns
tRP
18
20
20
20
ns
Row active to Row active delay
tRRD
12
15
15
15
ns
Write recovery time
tWR
15
15
15
15
ns
Last data in to Read command
tWTR
1
1
1
1
tCK
Col. address to Col. address delay
tCCD
1
1
1
1
tCK
Row precharge time
Clock cycle time
CL=2.0
CL=2.5
Clock high level width
Clock low level width
70K
45
120K
45
120K
48
7.5
12
7.5
12
10
12
6
12
7.5
12
7.5
12
tCH
0.45
0.55
0.45
0.55
0.45
0.55
0.45
tCK
10
120K
12
ns
ns
5
ns
5
0.55
tCK
tCL
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
tDQSCK
-0.6
+0.6
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
ns
Output data access time from CK/CK
tAC
-0.7
+0.7
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
ns
Data strobe edge to ouput data edge
tDQSQ
-
0.45
-
0.5
-
0.5
-
0.6
ns
Read Preamble
tRPRE
0.9
1.1
0.9
1.1
0.9
1.1
0.9
1.1
tCK
Read Postamble
tRPST
0.4
0.6
0.4
0.6
0.4
0.6
0.4
0.6
tCK
CK to valid DQS-in
tDQSS
0.75
1.25
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS-in setup time
tWPRES
0
0
0
0
ns
tWPRE
0.25
0.25
0.25
0.25
tCK
DQS falling edge to CK rising-setup time
tDSS
0.2
0.2
0.2
0.2
tCK
DQS falling edge from CK rising-hold time
tDSH
0.2
0.2
0.2
0.2
tCK
DQS-in high level width
tDQSH
0.35
0.35
0.35
0.35
tCK
DQS-in low level width
tDQSL
0.35
DQS-in cycle time
tDSC
0.9
Address and Control Input setup time(fast)
tIS
0.75
0.9
0.9
1.1
ns
6
Address and Control Input hold time(fast)
tIH
0.75
0.9
0.9
1.1
ns
6
Address and Control Input setup time(slow)
tIS
0.8
1.0
1.0
1.1
ns
6
Address and Control Input hold time(slow)
tIH
0.8
1.0
1.0
1.1
ns
6
Data-out high impedence time from CK/ CK
tHZ
-0.7
+0.7
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
Data-out low impedence time from CK/CK
tLZ
-0.7
+0.7
-0.75
+0.75
-0.75
+0.75
-0.8
+0.8
tSL(I)
0.5
Input Slew Rate(for I/O pins)
tSL(IO)
0.5
Output Slew Rate(x4,x8)
tSL(O)
1.0
4.5
1.0
4.5
1.0
4.5
1.0
4.5
Output Slew Rate Matching Ratio(rise to fall)
tSLMR
0.67
1.5
0.67
1.5
0.67
1.5
0.67
1.5
DQS-out access time from CK/CK
DQS-in hold time
Input Slew Rate(for input only pins)
0.35
1.1
0.9
0.35
1.1
0.5
0.35
1.1
0.5
0.5
- 15 -
0.9
0.9
2
tCK
1.1
0.5
0.5
5
tCK
ns
ns
V/ns
0.5
6
V/ns
7
V/ns
10
Rev.0.0 May. ’02
K4H560838D
Parameter
DDR SDRAM
-NC/LB3
(DDR333)
Symbol
Min
Max
-NC/LA2
(DDR266A)
-NC/LB0
(DDR266B)
Min
Min
Max
Max
-NC/LA0
(DDR200)
Min
Unit Note
Max
Mode register set cycle time
tMRD
12
15
15
16
ns
DQ & DM setup time to DQS
tDS
0.45
0.5
0.5
0.6
ns
7,8,9
DQ & DM hold time to DQS
tDH
0.45
0.5
0.5
0.6
ns
7,8,9
Control & Address input pulse width
tIPW
2.2
2.2
2.2
2.5
ns
DQ & DM input pulse width
tDIPW
1.75
1.75
1.75
2
ns
Power down exit time
tPDEX
6
7.5
7.5
10
ns
Exit self refresh to non-Read command
tXSNR
75
75
75
80
ns
Exit self refresh to read command
tXSRD
200
200
200
200
tCK
Refresh interval time
tREFI
7.8
7.8
7.8
7.8
us
1
Output DQS valid window
tQH
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
ns
5
Clock half period
tHP
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
ns
Data hold skew factor
tQHS
DQS write postamble time
tWPST
0.4
tRAP
18
20
20
20
tDAL
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
Active to Read with Auto precharge
command
Autoprecharge write recovery +
Precharge time
0.55
0.75
0.6
0.4
0.6
0.75
0.4
0.6
0.4
4
0.8
ns
0.6
tCK
3
tCK
11
1. Maximum burst refresh cycle : 8
2. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from
High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress,
DQS could be High at this time, depending on tDQSS.
3. The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter,
but system performance (bus turnaround) will degrade accordingly.
4. A write command can be applied with tR C D satisfied after this command.
5. For registered DIMMs, tCL and tC H are ≥ 45% of the period including both the half period jitter (tJIT(HP)) of the PLL and the half period
jitter due to crosstalk (tJIT (crosstalk)) on the DIMM.
6. Input Setup/Hold Slew Rate Derating
Input Setup/Hold Slew Rate
∆tIS
∆tIH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+50
+50
0.3
+100
+100
This derating table is used to increase t IS/t IH in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate
based on the lesser of AC-AC slew rate and DC-DC slew rate.
7. I/O Setup/Hold Slew Rate Derating
I/O Setup/Hold Slew Rate
∆tDS
∆tDH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+75
+75
0.3
+150
+150
This derating table is used to increase tDS/t DH in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate
based on the lesser of AC-AC slew rate and DC-DC slew rate.
- 16 -
Rev.0.0 May. ’02
K4H560838D
DDR SDRAM
8. I/O Setup/Hold Plateau Derating
I/O Input Level
∆tDS
∆tDH
(mV)
(ps)
(ps)
± 280
+50
+50
This derating table is used to increase tDS/tDH in the case where the input level is flat below VREF ± 310mV for a duration of
up to 2ns.
9. I/O Delta Rise/Fall Rate(1/slew-rate) Derating
Delta Rise/Fall Rate
∆tDS
∆tDH
(ns/V)
(ps)
(ps)
0
0
0
±0.25
+50
+50
±0.5
+100
+100
This derating table is used to increase tDS /tD H in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate
is calated as 1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall
Rate =-0/5ns/V. Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall rate.
10. This parameter is fir system simulation purpose. It is guranteed by design.
11. For each of the terms, if not already an integer, round to the next highest integer. tCK is actual to the system clock cycle time.
<Reference>
The following table specifies derating values for the specifications listed if the single-ended clock skew rate is less than 1.0 V/ns.
CK slew rate
(Single ended)
∆tIH/tIS
(ps)
∆tDSS/tDSH
(ps)
∆tAC/tDQSCK
(ps)
∆tLZ(min)
(ps)
∆tHZ(max)
(ps)
1.0V/ns
0
0
0
0
0
0.75V/ns
+50
+50
+50
-50
+50
0.5V/ns
+100
+100
+100
-100
+100
- 17 -
Rev.0.0 May. ’02
K4H560838D
DDR SDRAM
AC Operating Test Conditions
(V DD=2.5V, VDDQ=2.5V, TA= 0 to 70°C)
Parameter
Value
Unit
Input reference voltage for Clock
0.5 * VDDQ
V
Input signal maximum peak swing
1.5
V
Input signal minimum slew rate (for imput only)
0.5
V/ns
Input slew rate (I/O pins)
0.5
V/ns
V REF+0.31/VREF -0.31
V
VREF
V
V tt
V
Input Levels(V IH/VIL)
Input timing measurement reference level
Output timing measurement reference level
Output load condition
Note
See Load Circuit
Vtt=0.5*VDDQ
RT=50Ω
Output
Z0=50 Ω
C LOAD =30pF
V REF
=0.5*VDDQ
Output Load Circuit (SSTL_2)
Input/Output Capacitance
(VDD=2.5, VDDQ=2.5V, TA= 25°C, f=1MHz)
Symbol
Min
Max
Delta Cap(max)
Unit
Input capacitance
(A0 ~ A11, BA0 ~ BA1, CKE, CS, RAS,CAS, WE )
Parameter
CIN1
2
3.0
0.5
pF
Input capacitance( CK, CK )
CIN2
2
3.0
0.25
pF
COUT
4.0
5.0
Data & DQS input/output capacitance
Input capacitance(DM)
CIN3
- 18 -
4.0
5.0
pF
0.5
pF
Rev.0.0 May. ’02