ON MC74ACT240DWR2 Octal buffer/line driver with 3-state output Datasheet

MC74AC240, MC74ACT240
Octal Buffer/Line Driver
with 3−State Outputs
The MC74AC240/74ACT240 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter or receiver which provides improved PC
board density.
http://onsemi.com
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
•
•
Registers
Outputs Source/Sink 24 mA
′ACT240 Has TTL Compatible Inputs
PDIP−20
N SUFFIX
CASE 738
20
1
VCC
OE2
20
19
18
17
16
15
14
13
12
SO−20
DW SUFFIX
CASE 751D
20
11
1
20
1
1
2
3
4
5
6
OE1
7
8
9
EIAJ−20
M SUFFIX
CASE 967
10
20
GND
1
Figure 1. Pinout: 20−Lead Packages Conductors
(Top View)
ORDERING INFORMATION
TRUTH TABLE
Inputs
TSSOP−20
DT SUFFIX
CASE 948E
Outputs
Device
Package
Shipping†
MC74AC240N
PDIP−20
18 Units/Rail
OE1
D
(Pins 12, 14, 16, 18)
MC74ACT240N
PDIP−20
18 Units/Rail
L
L
H
L
H
X
H
L
Z
MC74AC240DW
SOIC−20
38 Units/Rail
MC74AC240DWR2
SOIC−20
1000 Tape & Reel
MC74ACT240DW
SOIC−20
38 Units/Rail
MC74ACT240DWR2
SOIC−20
1000 Tape & Reel
NOTE:
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
TRUTH TABLE
Inputs
TSSOP−20 2500 Tape & Reel
MC74ACT240DTR2
TSSOP−20 2500 Tape & Reel
Outputs
OE2
D
(Pins 3, 5, 7, 9)
L
L
H
L
H
X
H
L
Z
NOTE:
MC74AC240DTR2
July, 2004 − Rev. 6
EIAJ−20
2000 Tape & Reel
MC74ACT240MEL
EIAJ−20
2000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
 Semiconductor Components Industries, LLC, 2004
MC74AC240MEL
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 5 of this data sheet.
1
Publication Order Number:
MC74AC240/D
MC74AC240, MC74ACT240
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
−0.5 to +7.0
V
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
IIN
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
VCC
DC Supply Voltage (Referenced to GND)
VIN
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VIN, VOUT
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Min
Typ
Max
′AC
2.0
5.0
6.0
Unit
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
V
V
ns/V
tr, tf
In ut Rise and Fall Time (Note 2)
Input
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
ns/V
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
http://onsemi.com
2
MC74AC240, MC74ACT240
DC CHARACTERISTICS
74AC
Symbol
y
Parameter
VCC
(V)
74AC
TA = +25°C
Typ
VIH
VIL
VOH
VOL
TA =−40°C to +85°C
Unit
Conditions
Guaranteed Limits
Minimum
u High
g Level
e e
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
Maximum
a
u Low
o Level
e e
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
Minimum
u High
g Level
e e
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
Maximum
a
u Low
o Level
e e
Output Voltage
IOUT = −50 A
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 A
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
IIN
Maximum
a
u Input
u
Leakage Current
55
5.5
−
±0 1
±0.1
±1 0
±1.0
A
VI = VCC, GND
IOZ
Maximum
a
u
3−State
C
Current
5.5
−
±0.5
±5.0
A
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
55
5.5
−
80
8.0
80
A
VIN = VCC or GND
IOLD
IOHD
ICC
†Minimum Dynamic
O t t Current
Output
C
t
Maximum
a
u Quiescent
Qu esce
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
http://onsemi.com
3
MC74AC240, MC74ACT240
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
Data to Output
3.3
5.0
1.5
1.5
6.0
4.5
8.0
6.5
1.0
1.0
9.0
7.0
ns
3−5
tPHL
Propagation Delay
Data to Output
3.3
5.0
1.5
1.5
5.5
4.5
8.0
6.0
1.0
1.0
8.5
6.5
ns
3−5
tPZH
Output Enable Time
3.3
5.0
1.5
1.5
6.0
5.0
10.5
7.0
1.0
1.0
11.0
8.0
ns
3−7
tPZL
Output Enable Time
3.3
5.0
1.5
1.5
7.0
5.5
10.0
8.0
1.0
1.0
11.0
8.5
ns
3−8
tPHZ
Output Disable Time
3.3
5.0
1.5
1.5
7.0
6.5
10.0
9.0
1.0
1.0
10.5
9.5
ns
3−7
tPLZ
Output Disable Time
3.3
5.0
1.5
1.5
7.5
6.5
10.5
9.0
1.0
1.0
11.5
9.5
ns
3−8
* Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
y
Parameter
VCC
(V)
74ACT
74ACT
TA = +25°C
TA = −40°C to +85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum
u High
g Level
e e
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum
a
u Low
o Level
e e
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum
u High
g Level
e e
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
VOL
Maximum
a
u Low
o Level
e e
Output Voltage
V
V
IOUT = −50 A
*VIN = VIL or VIH
−24 mA
IOH
−24 mA
IOUT = 50 A
IIN
Maximum
a
u Input
u
Leakage Current
55
5.5
−
±0 1
±0.1
±1 0
±1.0
A
VI = VCC, GND
∆ICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOZ
Maximum
a
u
3−State
C
Current
5.5
−
±0.5
±5.0
A
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
55
5.5
−
80
8.0
80
A
VIN = VCC or GND
IOLD
IOHD
ICC
†Minimum Dynamic
O t t Current
Output
C
t
Maximum
a
u Quiescent
Qu esce
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
http://onsemi.com
4
MC74AC240, MC74ACT240
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Pro agation Delay
Propagation
Data to Output
50
5.0
15
1.5
60
6.0
85
8.5
15
1.5
95
9.5
ns
3−5
tPHL
Propagation
Pro
agation Delay
Data to Output
50
5.0
15
1.5
55
5.5
75
7.5
15
1.5
85
8.5
ns
3−5
tPZH
Output Enable Time
5.0
1.5
7.0
8.5
1.0
9.5
ns
3−7
tPZL
Output Enable Time
5.0
2.0
7.0
9.5
1.5
10.5
ns
3−8
tPHZ
Output Disable Time
5.0
2.0
8.0
9.5
2.0
10.5
ns
3−7
tPLZ
Output Disable Time
5.0
2.5
6.5
10.0
2.0
10.5
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
MARKING DIAGRAMS
PDIP−20
MC74AC240N
AWLYYWW
MC74ACT240N
AWLYYWW
SO−20
TSSOP−20
EIAJ−20
AC240
AWLYYWW
AC
240
ALYW
74AC240
AWLYWW
ACT240
AWLYYWW
ACT
240
ALYW
74ACT240
AWLYWW
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
http://onsemi.com
5
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
20 PIN PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
−A−
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
L
C
−T−
K
SEATING
PLANE
M
N
E
G
F
J
D
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
M
T A
M
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0
15 0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0
15
0.51
1.01
SO−20
DW SUFFIX
20 PIN PLASTIC SOIC PACKAGE
CASE 751D−05
ISSUE G
A
20
X 45 h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
11
B
M
D
18X
e
A1
SEATING
PLANE
C
T
http://onsemi.com
6
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0
7
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
20 PIN PLASTIC TSSOP PACKAGE
CASE 948E−02
ISSUE B
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
M
20
L/2
T U
S
V
J J1
B
−U−
PIN 1
IDENT
ÍÍÍ
ÍÍÍ
ÍÍÍ
K
K1
11
L
SECTION N−N
1
10
0.25 (0.010)
N
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
M
A
−V−
N
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
8
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
−−−
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0
8
PLANE
EIAJ−20
M SUFFIX
20 PIN PLASTIC EIAJ PACKAGE
CASE 967−01
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
11
Q1
E HE
1
M
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
M
0.10 (0.004)
http://onsemi.com
7
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 0
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 0
0.028
0.035
−−−
0.032
MC74AC240, MC74ACT240
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
8
For additional information, please contact your
local Sales Representative.
MC74AC240/D
Similar pages