DAC DAC2902 290 2 www.ti.com SBAS167C– JUNE 2001 – REVISED SEPTEMBER 2008 Dual, 12-Bit, 125MSPS DIGITAL-TO-ANALOG CONVERTER FEATURES APPLICATIONS ● ● ● ● ● ● ● ● COMMUNICATIONS: Base Stations, WLL, WLAN Baseband I/Q Modulation 125MSPS UPDATE RATE SINGLE SUPPLY: +3.3V or +5V HIGH SFDR: 70dB at fOUT = 20MHz LOW GLITCH: 2pV-s LOW POWER: 310mW INTERNAL REFERENCE POWER-DOWN MODE: 23mW ● MEDICAL/TEST INSTRUMENTATION ● ARBITRARY WAVEFORM GENERATORS (ARB) ● DIRECT DIGITAL SYNTHESIS (DDS) DESCRIPTION The DAC2902 is a monolithic, 12-bit, dual-channel, high-speed Digital-to-Analog Converter (DAC), and is optimized to provide high dynamic performance while dissipating only 310mW. The DAC2902 combines high dynamic performance with a high throughput rate to create a cost-effective solution for a wide variety of waveform-synthesis applications: • Pin compatibility between family members provides 10bit (DAC2900), 12-bit (DAC2902), and 14-bit (DAC2904) resolution. Operating with high update rates of up to 125MSPS, the DAC2902 offers exceptional dynamic performance, and enables the generation of very high output frequencies suitable for Direct IF applications. The DAC2902 has been optimized for communications applications in which separate I and Q data are processed while maintaining tight gain and offset matching. • Pin compatible to the AD9765 dual DAC. Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog output configurations. • All digital inputs are +3.3V and +5V logic compatible. The DAC2902 has an internal reference circuit, and allows use of an external reference. • Gain matching is typically 0.5% of full-scale, and offset matching is specified at 0.02% max. • The DAC2902 utilizes an advanced CMOS process; the segmented architecture minimizes output glitch energy, and maximizes the dynamic performance. • The DAC2902 is available in a TQFP-48 package, and is specified over the extended industrial temperature range of –40°C to +85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2001-2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS +VA to AGND ........................................................................ –0.3V to +6V +VD to DGND ........................................................................ –0.3V to +6V AGND to DGND ................................................................. –0.3V to +0.3V +VA to +VD ............................................................................... –6V to +6V CLK, PD, WRT to DGND ........................................... –0.3V to VD + 0.3V D0-D11 to DGND ....................................................... –0.3V to VD + 0.3V IOUT, IOUT to AGND ........................................................ –1V to VA + 0.3V GSET to AGND .......................................................... –0.3V to VA + 0.3V REFIN, FSA to AGND ................................................. –0.3V to VA + 0.3V Junction Temperature .................................................................... +150°C Case Temperature ......................................................................... +100°C Storage Temperature .................................................................... +125°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DAC2902Y/250 DAC2902Y/1K Tape and Reel, 250 Tape and Reel, 1000 PRODUCT PACKAGE PACKAGE DESIGNATOR DAC2902Y TQFP-48 PFB –40°C to +85°C DAC2902Y " " " " " NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PRODUCT DAC2902 EVM ORDERING NUMBER DAC2902-EVM COMMENT Fully populated evaluation board. See user manual for details. ELECTRICAL CHARACTERISTICS At TMIN to TMAX, +VA = +5V, +VD = +3.3V, differential transformer coupled output, and 50Ω doubly-terminated, unless otherwise noted. Independent Gain mode. DAC2902Y PARAMETER CONDITIONS MIN RESOLUTION Output Update Rate (fCLOCK) STATIC ACCURACY(1) Differential Nonlinearity (DNL) Integral Nonlinearity (INL) DYNAMIC PERFORMANCE Spurious-Free Dynamic Range (SFDR) fOUT = 1MHz, fCLOCK = 50MSPS fOUT = 1MHz, fCLOCK = 26MSPS fOUT = 2.18MHz, fCLOCK = 52MSPS fOUT = 5.24MHz, fCLOCK = 52MSPS fOUT = 10.4MHz, fCLOCK = 78MSPS fOUT = 15.7MHz, fCLOCK = 78MSPS fOUT = 5.04MHz, fCLOCK = 100MSPS fOUT = 20.2MHz, fCLOCK = 100MSPS fOUT = 20.1MHz, fCLOCK = 125MSPS fOUT = 40.2MHz, fCLOCK = 125MSPS Spurious-Free Dynamic Range within a Window fOUT = 1.0MHz, fCLOCK = 50MSPS fOUT = 5.02MHz, fCLOCK = 50MSPS fOUT = 5.03MHz, fCLOCK = 78MSPS fOUT = 5.04MHz, fCLOCK = 125MSPS Total Harmonic Distortion (THD) fOUT = 1MHz, fCLOCK = 50MSPS fOUT = 5.02MHz, fCLOCK = 50MSPS fOUT = 5.03MHz, fCLOCK = 78MSPS fOUT = 5.04MHz, fCLOCK = 125MSPS Multitone Power Ratio fOUT = 2.0MHz to 2.99MHz, fCLOCK = 65MSPS TYP MAX 12 125 TA = +25°C TMIN to TMAX TA = +25°C TMIN to TMAX To Nyquist 0dBFS Output –6dBFS Output –12dBFS Output 2MHz Span 10MHz Span 10MHz Span 10MHz Span Bits MSPS –2.0 –2.5 –2.0 –3.0 ±1 72 82 77 72 81 81 81 77 71 80 70 72 64 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 80 90 88 88 88 dBc dBc dBc dBc ±1 –79 –77 –76 –75 8 Tone with 110kHz Spacing 0dBFS Output UNIT 80 +2.0 +2.5 +2.0 +3.0 –70 LSB LSB LSB LSB dBc dBc dBc dBc dBc DAC2902 2 www.ti.com SBAS167C ELECTRICAL CHARACTERISTICS (continued) At TMIN to TMAX, +VA = +5V, +VD = +3.3V, differential transformer coupled output, and 50Ω doubly-terminated, unless otherwise noted. Independent Gain mode. DAC2902Y PARAMETER DYNAMIC PERFORMANCE (Cont.) Signal-to-Noise Ratio (SNR) fOUT = 5.02MHz, fCLOCK = 50MHz Signal-to-Noise and Distortion (SINAD) fOUT = 5.02MHz, fCLOCK = 50MHz Channel Isolation fOUT = 1MHz, fCLOCK = 52MSPS fOUT = 20MHz, fCLOCK = 125MSPS Output Settling Time(2) Output Rise Time(2) Output Fall Time(2) Glitch Impulse DC ACCURACY Full-Scale Output Range(3)(FSR) Output Compliance Range Gain Error—Full-Scale Gain Error Gain Matching Gain Drift Offset Error Offset Drift Power-Supply Rejection, +VA Power-Supply Rejection, +VD Output Noise Output Resistance Output Capacitance CONDITIONS POWER SUPPLY Supply Voltages +VA +VD Supply Current IVA(5) IVA(5) IVD(5) IVD(6) Power Dissipation(5) Power Dissipation(6) Power Dissipation(5) Power Dissipation Thermal Resistance, TQFP-48 θJA θJC TEMPERATURE RANGE Specified Operating TYP MAX UNIT 0dBFS Output 68 dBc 0dBFS Output 67 dBc 85 77 30 2 2 2 dBc dBc ns ns ns pV-s to 0.1% 10% to 90% 10% to 90% All Bits HIGH, IOUT With Internal Reference With External Reference With Internal Reference With Internal Reference With Internal Reference With Internal Reference +5V, ±10% +3.3V, ±10% IOUT = 20mA, RLOAD = 50Ω IOUT = 2mA 2 –1.0 –5 –2.5 –2.0 ±1 ±1 0.5 ±50 –0.02 +0.02 –0.2 –0.025 +0.2 +0.025 50 30 200 6 +1.18 +1.25 ±50 100 0.3 +0.5 +VD = +5V +VD = +5V +VD = 3.3V +VD = 3.3V +VD = 3.3V +VD = 3.3V 20 +1.25 +5 +2.5 +2.0 ±0.2 IOUT, IOUT to Ground REFERENCE/CONTROL AMP Reference Voltage Reference Voltage Drift Reference Output Current Reference Multiplying Bandwidth Input Compliance Range DIGITAL INPUTS Logic Coding Logic High Voltage, VIH Logic Low Voltage, VIL Logic High Voltage, VIH Logic Low Voltage, VIL Logic High Current, IIH(4) Logic Low Current Input Capacitance MIN 3.5 2 +3.0 +3.0 VA = +5V, lOUT = 20mA Power-Down Mode VA = +5V, VD = 3.3V, lOUT = 20mA VA = +5V, VD = 3.3V, lOUT = 20mA VA = +5V, VD = 3.3V, lOUT = 2mA Power-Down Mode +1.31 +1.25 Straight Binary 5 0 3 0 ±10 ±10 5 –40 –40 V ppmFSR/°C nA MHz V 0.8 V V V V µA µA pF +5 +3.3 +5.5 +5.5 V V 58 1.7 4.2 17 310 348 130 23 65 3 7 19.5 350 390 mA mA mA mA mW mW mW mW 1.2 38 °C/W °C/W 60 13 Ambient Ambient mA V %FSR %FSR %FSR ppmFSR/°C %FSR ppmFSR/°C %FSR/V %FSR/V pA/√Hz pA/√Hz kΩ pF +85 +85 °C °C NOTES: (1) At output lOUT, while driving a virtual ground. (2) Measured single-ended into 50Ω load. (3) Nominal full-scale output current is 32 × IREF; see Application section for details. (4) Typically 45µA for the PD pin, which has an internal pull-down resistor. (5) Measured at fCLOCK = 25MSPS and fOUT = 1MHz. (6) Measured at fCLOCK = 100MSPS and fOUT = 40MHz. DAC2902 SBAS167C 3 www.ti.com PIN CONFIGURATION +VA IOUT1 IOUT1 FSA REFIN GSET FSA2 IOUT2 IOUT2 AGND PD TQFP-48 NC Top View 48 47 46 45 44 43 42 41 40 39 38 37 D11_1 (MSB) 1 36 NC D10_1 2 35 NC D9_1 3 34 D0_2 D8_1 4 33 D1_2 D7_1 5 32 D2_2 D6_1 6 D5_1 7 30 D4_2 D4_1 8 29 D5_2 D3_1 9 28 D6_2 D2_1 10 27 D7_2 D1_1 11 26 D8_2 D0_1 12 25 D9_2 31 D3_2 13 14 15 16 17 18 19 20 21 22 23 24 NC NC DGND +VD WRT1 CLK1 CLK2 WRT2 DGND +VD D11_2 (MSB) D10_2 DAC2902 PIN DESCRIPTIONS PIN DESIGNATOR 1-12 13, 14 15 16 17 18 19 20 21 22 23-34 35, 36 37 38 39 40 41 42 43 D[11:0]_1 NC DGND +VD WRT1 CLK1 CLK2 WRT2 DGND +VD D[11:0]_2 NC PD AGND IOUT2 IOUT2 FSA2 GSET REFIN 44 45 46 47 48 FSA1 IOUT1 IOUT1 +VA NC DESCRIPTION Data Port DAC1, Data Bit 11 (MSB) to Bit 0 (LSB). No Connection Digital Ground Digital Supply, +3.0V to +5.5V DAC1 Input Latches Write Signal Clock Input DAC1 Clock Input DAC2 DAC2 Input Latches Write Signal Digital Ground Digital Supply, +3.0V to +5.5V Data Port DAC2, Data Bit 11 (MSB) to Bit 0 (LSB). No Connection Power-Down Function Control Input; H = DAC in power-down mode; L = DAC in normal operation (Internal pull-down for default “L”). Analog Ground Current Output DAC2. Full-scale with all bits of data port 2 HIGH. Complementary Current Output DAC2. Full-scale with all bits of data port 2 LOW. Full-Scale Adjust, DAC2. Connect External RSET Resistor. Gain-Setting Mode (H = 1 Resistor, L = 2 Resistor) Internal Reference Voltage output; External Reference Voltage input. Bypass with 0.1µF to AGND for internal reference operation. Full-Scale Adjust, DAC1. Connect External RSET Resistor Complementary Current Output DAC1. Full-scale with all bits of data port 1 LOW. Current Output DAC1. Full-scale with all bits of data port 1 HIGH. Analog Supply, +3.0V to +5.5V No Connection DAC2902 4 www.ti.com SBAS167C TIMING DIAGRAM tS DATA IN tH D[11:0](n) D[11:0](n + 1) tLPW WRT1 WRT2 tCPW CLK1 CLK2 tCW tSET IOUT1 IOUT(n) 50% IOUT(n +1) IOUT2 tPD SYMBOL DESCRIPTION MIN tS tH tLPW, tCPW tCW Input Setup Time Input Hold Time Latch/Clock Pulsewidth Delay Rising CLK Edge to Rising WRT Edge Propagation Delay Settling Time (0.1%) 2 1.5 3.5 0 tPD tSET DIGITAL INPUTS AND TIMING The data input ports of the DAC2902 accept a standard positive coding with data bit D11 being the most significant bit (MSB). The converter outputs support a clock rate of up to 125MSPS. The best performance will typically be achieved with a symmetrical duty cycle for write and clock; however, the duty cycle may vary as long as the timing specifications are met. Also, the setup and hold times may be chosen within their specified limits. All digital inputs of the DAC2902 are CMOS-compatible. The logic thresholds depend on the applied digital supply voltages, such that they are set to approximately half the supply voltage: Vth = +VD/2 (±20% tolerance). The DAC2902 is designed to operate with a digital supply (+VD) of +3.0V to +5.5V. MAX UNITS tPW – 2 ns ns ns ns 4 1 30 ns ns The two converter channels within the DAC2902 consist of two independent, 12-bit, parallel data ports. Each DAC channel is controlled by its own set of write (WRT1, WRT2) and clock (CLK1, CLK2) inputs. Here, the WRT lines control the channel input latches and the CLK lines control the DAC latches. The data is first loaded into the input latch by a rising edge of the WRT line. This data is presented to the DAC latch on the following falling edge of the WRT signal. On the next rising edge of the CLK line, the DAC is updated with the new data and the analog output signal will change accordingly. The double latch architecture of the DAC2902 results in a defined sequence for the WRT and CLK signals, expressed by parameter tCW. A correct timing is observed when the rising edge of CLK occurs at the same time, or before, the rising edge of the WRT signal. This condition can simply be met by connecting the WRT and CLK lines together. Note that all specifications were measured with the WRT and CLK lines connected together. DAC2902 SBAS167C TYP 5 www.ti.com TYPICAL CHARACTERISTICS TA = +25°C, +VD = +3.3V, +VA = +5V, differential transformer coupled, IOUT = 20mA, 50Ω double-terminated load, and SFDR up to Nyquist, unless otherwise noted. TYPICAL DNL TYPICAL INL 1.4 1.5 1.2 1 1 0.6 0.4 INL (LSBs) DNL (LSBs) 0.8 0.2 0 0.5 0 –0.2 –0.5 –0.4 –0.6 –1 –0.8 –1 –1.5 0 500 1k 1k5 2k Code 2k5 3k 3k5 4k 0 500 1k SFDR vs fOUT AT 26MSPS 2k5 3k 3k5 4k 90 85 85 0dBFS 80 SFDR (dBc) SFDR (dBc) 2k Code SFDR vs fOUT AT 52MSPS 90 75 –6dBFS 70 0dBFS 80 75 –6dBFS 70 65 65 60 60 0 2 4 6 fOUT (MHz) 8 10 12 0 5 SFDR vs fOUT AT 78MSPS 10 15 fOUT (MHz) 85 80 80 25 0dBFS 75 75 20 SFDR vs fOUT AT 100MSPS 85 0dBFS SFDR (dBc) SFDR (dBc) 1k5 70 –6dBFS 65 70 65 60 60 –6dBFS 55 55 50 0 5 10 15 20 fOUT (MHz) 25 30 0 35 5 10 15 20 25 fOUT (MHz) 30 35 40 45 DAC2902 6 www.ti.com SBAS167C TYPICAL CHARACTERISTICS (continued) TA = +25°C, +VD = +3.3V, +VA = +5V, differential transformer coupled, IOUT = 20mA, 50Ω double-terminated load, and SFDR up to Nyquist, unless otherwise noted. SFDR vs fOUT AT 125MHz SFDR vs IOUTFS AND fOUT AT 78MSPS, 0dBFS 85 80 76 –6dBFS 75 74 SFDR (dBc) SFDR (dBc) IOUTFS = 20mA 78 80 70 0dBFS 65 IOUTFS = 5mA IOUTFS = 10mA 72 70 IOUTFS = 2mA 68 66 60 64 55 62 50 60 0 10 20 30 fOUT (MHz) 40 50 0 60 5 SFDR AT 125MSPS vs TEMPERATURE 20 25 SINAD vs fCLK AND IOUT AT 5MHz 70 90 85 2MHz 80 20mA 67.5 10MHz SINAD (dBc) SFDR (dBc) 10 15 fOUT (MHz) 75 70 20MHz 65 40MHz 60 10mA 65 5mA 62.5 55 50 –40 60 –20 0 25 50 Temperature (°C) 70 85 20 40 GAIN AND OFFSET DRIFT 60 80 100 fCLK (MSPS) 120 140 IVD vs RATIO AT +VD = +3.3V 0.8 0.004 0.6 0.003 25 0.002 0.2 0.001 0 0 –0.2 –0.001 Gain Error –0.4 –0.002 100MSPS 20 IVD (mA) Offset Error 0.4 Offset Error (% FS) Gain Error (% FS) 125MSPS 78MSPS 15 52MSPS 10 26MSPS 5 –0.6 –0.8 –40 –0.003 –0.004 –20 0 20 40 Temperature (°C) 60 80 85 DAC2902 SBAS167C 0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 Ratio (FOUT/FCLK) 0.45 7 www.ti.com TYPICAL CHARACTERISTICS (continued) TA = +25°C, +VD = +3.3V, +VA = +5V, differential transformer coupled, IOUT = 20mA, 50Ω double-terminated load, and SFDR up to Nyquist, unless otherwise noted. IVA vs IOUTFS SINGLE-TONE SFDR 10 55 0 50 –10 Magnitude (dBm) 60 IVA (mA) 45 40 35 30 25 fOUT = 5.23MHz Amplitude = 0dBFS –20 –30 –40 –50 –60 20 –70 15 –80 10 fCLOCK = 52MSPS –90 0 5 10 15 IOUTFS (mA) 20 25 0 4 8 12 Frequency (MHz) SINGLE-TONE SFDR 20 DUAL-TONE SFDR 10 10 fCLOCK = 100MSPS 0 fCLOCK = 78MSPS 0 fOUT = 20.2MHz –10 –20 –30 –40 –50 –60 fOUT1 = 9.44MHz –10 Amplitude = 0dBFS Magnitude (dBm) Magnitude (dBm) 16 –20 Amplitude = 0dBFS –30 –40 –50 –60 –70 –70 –80 –80 –90 fOUT2 = 10.44MHz –90 0 10 20 30 Frequency (MHz) 40 50 0 7.8 15.6 23.4 Frequency (MHz) 31.2 39.0 FOUR-TONE SFDR 10 fCLOCK = 50MSPS 0 fOUT1 = 6.25MHz Magnitude (dBm) –10 fOUT2 = 6.75MHz –20 fOUT3 = 7.25MHz –30 fOUT4 = 7.75MHz –40 Amplitude = 0dBFS –50 –60 –70 –80 –90 0 5 15 10 Frequency (MHz) 20 25 DAC2902 8 www.ti.com SBAS167C APPLICATION INFORMATION DAC TRANSFER FUNCTION Each of the DACs in the DAC2902 has a complementary current output, IOUT1 and IOUT2. The full-scale output current, IOUTFS, is the summation of the two complementary output currents: THEORY OF OPERATION The architecture of the DAC2902 uses the current steering technique to enable fast switching and a high update rate. The core element within the monolithic DAC is an array of segmented current sources that are designed to deliver a fullscale output current of up to 20mA, as shown in Figure 1. An internal decoder addresses the differential current switches each time the DAC is updated and a corresponding output current is formed by steering all currents to either output summing node, IOUT or IOUT. The complementary outputs deliver a differential output signal, which improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise), and double the peakto-peak output signal swing by a factor of two, compared to single-ended operation. IOUTFS = IOUT + IOUT The individual output currents depend on the DAC code and can be expressed as: IOUT = IOUTFS × (Code/4096) (2) IOUT = IOUTFS × (4095 - Code) (3) where Code is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the reference current IREF, which is determined by the reference voltage and the external setting resistor, RSET. The segmented architecture results in a significant reduction of the glitch energy, improves the dynamic performance (SFDR), and DNL. The current outputs maintain a very high output impedance of greater than 200kΩ. IOUTFS = 32 × IREF = 32 × VREF /RSET The full-scale output current is determined by the ratio of the internal reference voltage (approx. +1.25V) and an external resistor, RSET. The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC output current that can range from 2mA to 20mA, depending on the value of RSET. +VD +VD Input Latch 1 DAC Latch 1 VOUT = IOUT × RLOAD (5) VOUT = IOUT × RLOAD (6) +VA DAC1 Segmented Switches Current Sources lOUT1 lOUT1 REFIN WRT1 FSA1 CLK1 DAC2902 CLK2 Reference Control Amplifier FSA2 GSET PD WRT2 Data Input Port 2 D[11:0]_2 (4) In most cases the complementary outputs will drive resistive loads or a terminated transformer. A signal voltage will develop at each output according to: The DAC2902 is split into a digital and an analog portion, each of which is powered through its own supply pin. The digital section includes edge-triggered input latches and the decoder logic, while the analog section consists of the current source array with its associated switches, and the reference circuitry. Data Input Port 1 D[11:0]_1 (1) Input Latch 2 DGND DAC Latch 2 DGND DAC2 Segmented Switches Current Sources lOUT2 lOUT2 AGND FIGURE 1. Block Diagram of the DAC2902. DAC2902 SBAS167C 9 www.ti.com The value of the load resistance is limited by the output compliance specification of the DAC2902. To maintain specified linearity performance, the voltage for IOUT and IOUT should not exceed the maximum allowable compliance range. The two single-ended output voltages can be combined to find the total differential output swing: VOUTDIFF = VOUT – VOUT (2 × Code – 4095) = × IOUTFS × RLOAD (7) 4096 ANALOG OUTPUTS The DAC2902 provides two complementary current outputs, IOUT and IOUT. The simplified circuit of the analog output stage representing the differential topology is shown in Figure 2. The output impedance of IOUT and IOUT results from the parallel combination of the differential switches, along with the current sources and associated parasitic capacitances. +VA DAC2902 be adapted to the output of the DAC2902 by selecting a suitable transformer while maintaining optimum voltage levels at IOUT and IOUT. Furthermore, using the differential output configuration in combination with a transformer will be instrumental for achieving excellent distortion performance. Common-mode errors, such as even-order harmonics or noise, can be substantially reduced. This is particularly the case with high output frequencies. For those applications requiring the optimum distortion and noise performance, it is recommended to select a full-scale output of 20mA. A lower full-scale range down to 2mA may be considered for applications that require a low power consumption, but can tolerate a slightly reduced performance level. OUTPUT CONFIGURATIONS The current outputs of the DAC2902 allow for a variety of configurations, some of which are illustrated in Table I. As mentioned previously, utilizing the converter’s differential outputs will yield the best dynamic performance. Such a differential output circuit may consist of an RF transformer or a differential amplifier configuration. The transformer configuration is ideal for most applications with ac coupling, while op amps will be suitable for a DC-coupled configuration. INPUT CODE (D11 - D0) IOUT IOUT 1111 1111 1111 20mA 0mA 1000 0000 0000 10mA 10mA 0000 0000 0000 0mA 20mA TABLE I. Input Coding Versus Analog Output Current. IOUT IOUT RL RL The single-ended configuration may be considered for applications requiring a unipolar output voltage. Connecting a resistor from either one of the outputs to ground will convert the output current into a ground-referenced voltage signal. To improve on the DC linearity by maintaining a virtual ground, an I-to-V or op-amp configuration may be considered. FIGURE 2. Equivalent Analog Output. The signal voltage swing that may develop at the two outputs, IOUT and IOUT, is limited by a negative and positive compliance. The negative limit of –1V is given by the breakdown voltage of the CMOS process, and exceeding it will compromise the reliability of the DAC2902, or even cause permanent damage. With the full-scale output set to 20mA, the positive compliance equals 1.25V, operating with an analog supply of +VA = 5V. Note that the compliance range decreases to about 1V for a selected output current of IOUTFS = 2mA. Care should be taken that the configuration of the DAC2902 does not exceed the compliance range to avoid degradation of the distortion performance and integral linearity. Best distortion performance is typically achieved with the maximum full-scale output signal limited to approximately 0.5VPP. This is the case for a 50Ω doubly-terminated load and a 20mA full-scale output current. A variety of loads can DIFFERENTIAL WITH TRANSFORMER Using an RF transformer provides a convenient way of converting the differential output signal into a single-ended signal while achieving excellent dynamic performance (see Figure 3). The appropriate transformer should be carefully selected based on the output frequency spectrum and impedance requirements. The differential transformer configuration has the benefit of significantly reducing common-mode signals, thus improving the dynamic performance over a wide range of frequencies. Furthermore, by selecting a suitable impedance ratio (winding ratio), the transformer can be used to provide optimum impedance matching while controlling the compliance voltage for the converter outputs. The model shown, ADTT1-1 (by MiniCircuits), has a 1:1 ratio and may be used to interface the DAC2902 to a 50Ω load. This results in a 25Ω load for each of the outputs, IOUT and IOUT. The output signals are ac coupled and inherently isolated because of its magnetic coupling. DAC2902 10 www.ti.com SBAS167C As shown in Figure 3, the transformer center tap is connected to ground. This forces the voltage swing on IOUT and IOUT to be centered at 0V. In this case the two resistors, RL, may be replaced with one, RDIFF, or omitted altogether. This approach should only be used if all components are close to each other, and if the VSWR is not important. A complete power transfer from the DAC output to the load can be realized, but the output compliance range should be observed. Alternatively, if the center tap is not connected, the signal swing will be centered at RL × IOUTFS/2. However, in this case, the two resistors (RL) must be used to enable the necessary DC-current flow for both outputs. ADTT1-1 (Mini-Circuits) 1:1 IOUT DAC2902 RL 50Ω RDIFF 100Ω RS 50Ω IOUT RL 50Ω FIGURE 3. Differential Output Configuration Using an RF Transformer. DIFFERENTIAL CONFIGURATION USING AN OP AMP If the application requires a DC-coupled output, a difference amplifier may be considered, as shown in Figure 4. Four external resistors are needed to configure the voltage-feedback op amp OPA680 as a difference amplifier performing the differential to single-ended conversion. Under the shown configuration, the DAC2902 generates a differential output signal of 0.5VPP at the load resistors, RL. The resistor values shown were selected to result in a symmetric 25Ω loading for each of the current outputs since the input impedance of the difference amplifier is in parallel to resistors RL, and should be considered. The OPA680 is configured for a gain of two. Therefore, operating the DAC2902 with a 20mA full-scale output will produce a voltage output of ±1V. This requires the amplifier to operate from a dual power supply (±5V). The tolerance of the resistors typically sets the limit for the achievable common-mode rejection. An improvement can be obtained by fine tuning resistor R4. This configuration typically delivers a lower level of ac performance than the previously discussed transformer solution because the amplifier introduces another source of distortion. Suitable amplifiers should be selected based on their slew-rate, harmonic distortion, and output swing capabilities. High-speed amplifiers like the OPA680 or OPA687 may be considered. The ac performance of this circuit may be improved by adding a small capacitor (CDIFF) between the outputs IOUT and IOUT, as shown in Figure 4). This will introduce a real pole to create a low-pass filter in order to slew-limit the DAC fast output signal steps, that otherwise could drive the amplifier into slew-limitations or into an overload condition; both would cause excessive distortion. The difference amplifier can easily be modified to add a level shift for applications requiring the single-ended output voltage to be unipolar (that is, swing between 0V and +2V.) DUAL TRANSIMPEDANCE OUTPUT CONFIGURATION The circuit example of Figure 5 shows the signal output currents connected into the summing junctions of the dual voltage-feedback op amp OPA2680 that is set up as a transimpedance stage, or I-to-V converter. With this circuit, the DAC output will be kept at a virtual ground, minimizing the effects of output impedance variations, which results in the best DC linearity (INL). As mentioned previously, care should be taken not to drive the amplifier into slew-rate limitations, and produce unwanted distortion. +5V 50Ω 1/2 OPA2680 RF1 DAC2902 R2 402Ω IOUT R1 200Ω –VOUT = IOUT • RF1 CD1 CF1 RF2 IOUT DAC2902 IOUT OPA680 COPT RL 26.1Ω R3 200Ω RL 28.7Ω VOUT IOUT CD2 CF2 –5V +5V 1/2 OPA2680 R4 402Ω –VOUT = IOUT • RF2 50Ω –5V FIGURE 4. Difference Amplifier Provides Differential to Single-Ended Conversion and DC-Coupling. FIGURE 5. Dual, Voltage-Feedback Amplifier OPA2680 Forms Differential Transimpedance Amplifier. DAC2902 SBAS167C 11 www.ti.com The DC gain for this circuit is equal to feedback resistor RF. At high frequencies, the DAC output impedance (CD1, CD2) will produce a 0 in the noise gain for the OPA2680 that may cause peaking in the closed-loop frequency response. CF is added across RF to compensate for this noise gain peaking. To achieve a flat transimpedance frequency response, the pole in each feedback network should be set to: IOUTFS = 20mA VOUT = 0V to +0.5V IOUT DAC2902 50Ω IOUT 50Ω 25Ω 1 GBP = 2 πR F C F 4 πR F C D (8) with GBP = Gain Bandwidth Product of OPA, FIGURE 6. Driving a Doubly Terminated 50Ω Cable Directly. which will give a corner frequency f-3dB of approximately: f−3dB GBP = 2πR F C D (9) The full-scale output voltage is simply defined by the product of IOUTFS × RF, and has a negative unipolar excursion. To improve on the ac performance of this circuit, adjustment of RF and/or IOUTFS should be considered. Further extensions of this application example may include adding a differential filter at the OPA2680 output followed by a transformer, in order to convert to a single-ended signal. SINGLE-ENDED CONFIGURATION Using a single-load resistor connected to the one of the DAC outputs, a simple current-to-voltage conversion can be accomplished. The circuit in Figure 6 shows a 50Ω resistor connected to IOUT, providing the termination of the further connected 50Ω cable. Therefore, with a nominal output current of 20mA, the DAC produces a total signal swing of 0V to 0.5V into the 25Ω load. VOUT ~ 0Vp to 1.20Vp DAC2902 One of the main applications for the dual-channel DAC is baseband I- and Q-channel transmission for digital communications. In this application, the DAC is followed by an analog quadrature modulator, modulating an IF carrier with the baseband data, as shown in Figure 7. Often, the input stages of these quadrate modulators consist of npn-type transistors that require a DC bias (base) voltage of > 0.8V. The wide output compliance range (–10V to +1.25V) allows for a direct DC–coupling between the DAC2902 and the quadrature modulator. IIN IREF IIN IREF IOUT1 Signal Conditioning IOUT2 INTERFACING ANALOG QUADRATURE MODULATORS VIN ~ 0.6Vp to 1.8Vp IOUT1 IOUT2 Different load resistor values may be selected as long as the output compliance range is not exceeded. Additionally, the output current, IOUTFS, and the load resistor, may be mutually adjusted to provide the desired output signal swing and performance. ∑ RF QIN QREF Quadrature Modulator FIGURE 7. Generic Interface to a Quadrature Modulator. Signal Conditioning (Level-Shifting) May Be Required to Ensure Correct DC Common-Mode Levels At the Input of the Quadrature Modulator. DAC2902 12 www.ti.com SBAS167C Figure 8 shows an example of a DC-coupled interface with DC level-shifting, using a precision resistor network. An accoupled interface, as shown in Figure 9, has the advantage that the common-mode levels at the input of the modulator can be set independently of those at the output of the DAC. Furthermore, no voltage loss is obtained in this setup. VDC R3 VOUT1 INTERNAL REFERENCE OPERATION VOUT1 The DAC2902 has an on-chip reference circuit that consists of a 1.25V bandgap reference and two control amplifiers, one for each DAC. The full-scale output current, IOUTFS, of the DAC2902 is determined by the reference voltage, VREF, and the value of resistor RSET. IOUTFS can be calculated by: IOUTFS = 32 × IREF = 32 × VREF / RSET R4 IOUT1 IOUT1 (10) The external resistor RSET connects to the FSA pin (FullScale Adjust), see Figure 10. The reference control amplifier operates as a V-to-I converter producing a reference current, IREF, which is determined by the ratio of VREF and RSET (as shown in Equation 10). The full-scale output current, IOUTFS, results from multiplying IREF by a fixed factor of 32. IOUT1 DAC2902 IOUT1 R5 FIGURE 8. DC-Coupled Interface to Quadrature Modulator Applying Level Shifting. VDC R1 IOUT1 DAC2902 0.01µF VOUT1 IOUT1 VOUT1 IOUT1 0.01µF IOUT1 50Ω RLOAD 50Ω R2 FIGURE 9. AC-Coupled Interface to Quadrature Modulator Applying Level Shifting. DAC2902 SBAS167C 13 www.ti.com one RSET connected to the FSA1 pin (pin 44) and the other to the FSA2 pin (pin 41). In this configuration, the user has the flexibility to set and adjust the full-scale output current for each DAC independently, allowing for the compensation of possible gain mismatches elsewhere within the transmit signal path. +5V +VA DAC2902 IREF = Alternatively, bringing the GSET pin HIGH (that is, connected to +VA), the DAC2902 will switch into the simultaneous gain set mode. Now the full-scale output current of both DAC channels is determined by only one external RSET resistor connected to the FSA1 pin. The resistor at the FSA2 pin may be removed, however this is not required since this pin is not functional in this mode and the resistor has no effect to the gain equation. The formula for deriving the correct RSET remains unchanged (for example, RSET = 2kΩ will result in a 20mA output for both DACs). VREF RSET FSA REFIN RSET 2kΩ Ref Control Amp Current Sources 0.1µF +1.25V Ref. EXTERNAL REFERENCE OPERATION FIGURE 10. Internal Reference Configuration. The internal reference can be disabled by simply applying an external reference voltage into the REFIN pin, which in this case functions as an input, as shown in Figure 11. The use of an external reference may be considered for applications that require higher accuracy and drift performance, or to add the ability of dynamic gain control. Using the internal reference, a 2kΩ resistor value results in a full-scale output of approximately 20mA. Resistors with a tolerance of 1% or better should be considered. Selecting higher values, the output current can be adjusted from 20mA down to 2mA. Operating the DAC2902 at lower than 20mA output currents may be desirable for reasons of reducing the total power consumption, optimizing the distortion performance, or observing the output compliance voltage limitations for a given load condition. While a 0.1µF capacitor is recommended to be used with the internal reference, it is optional for the external reference operation. The reference input, REFIN, has a high input impedance (1MΩ) and can easily be driven by various sources. Note that the voltage range of the external reference should stay within the compliance range of the reference input (0.5V to 1.25V). It is recommended to bypass the REFIN pin with a ceramic chip capacitor of 0.1µF or more. The control amplifier is internally compensated, and its small signal bandwidth is approximately 0.3MHz. POWER-DOWN MODE The DAC2902 features a power-down function that can be used to reduce the total supply current to less than 6mA. Applying a logic HIGH to the PD pin will initiate the powerdown mode, while a logic LOW enables normal operation. When left unconnected, an internal active pull-down circuit will enable the normal operation of the converter. GAIN SETTING OPTIONS The full-scale output current on the DAC2902 can be set two ways: either for each of the two DAC channels independently or for both channels simultaneously. For the independent gain set mode, the GSET pin (pin 42) must be LOW (that is, connected to AGND). In this mode, two external resistors are required— +5V +VA DAC2902 IREF = VREF RSET FSA REFIN External Reference Ref Control Amp Current Sources RSET +1.25V Ref. FIGURE 11. External Reference Configuration. DAC2902 14 www.ti.com SBAS167C GROUNDING, DECOUPLING, AND LAYOUT INFORMATION Proper grounding and bypassing, short lead length, and the use of ground planes are particularly important for high-frequency designs. Multilayer PCBs are recommended for best performance since they offer distinct advantages such as minimization of ground impedance, separation of signal layers by ground layers, etc. The DAC2902 uses separate pins for its analog and digital supply and ground connections. The placement of the decoupling capacitor should be such that the analog supply (+VA) is bypassed to the analog ground (AGND), and the digital supply bypassed to the digital ground (DGND). In most cases 0.1µF ceramic chip capacitors at each supply pin are adequate to provide a low impedance decoupling path. Keep in mind that their effectiveness largely depends on the proximity to the individual supply and ground pins. Therefore, they should be located as close as physically possible to those device leads. Whenever possible, the capacitors should be located immediately under each pair of supply/ ground pins on the reverse side of the pc board. This layout approach will minimize the parasitic inductance of component leads and PCB runs. Further supply decoupling with surface-mount tantalum capacitors (1µF to 4.7µF) may be added as needed in proximity of the converter. Low noise is required for all supply and ground connections to the DAC2902. It is recommended to use a multilayer PCB utilizing separate power and ground planes. Mixed signal designs require particular attention to the routing of the different supply currents and signal traces. Generally, analog supply and ground planes should only extend into analog signal areas, such as the DAC output signal and the reference signal. Digital supply and ground planes must be confined to areas covering digital circuitry, including the digital input lines connecting to the converter, as well as the clock signal. The analog and digital ground planes should be joined together at one point underneath the DAC. This can be realized with a short track of approximately 1/8" (3mm). The power to the DAC2902 should be provided through the use of wide PCB runs or planes. Wide runs will present a lower trace impedance, further optimizing the supply decoupling. The analog and digital supplies for the converter should only be connected together at the supply connector of the pc board. In the case of only one supply voltage being available to power the DAC, ferrite beads along with bypass capacitors may be used to create an LC filter. This will generate a low-noise analog supply voltage that can then be connected to the +VA supply pin of the DAC2902. While designing the layout, it is important to keep the analog signal traces separated from any digital line, in order to prevent noise coupling onto the analog signal path. DAC2902 SBAS167C 15 www.ti.com Revision History DATE REVISION 9/08 C PAGE SECTION DESCRIPTION 1 – 2 Pkg/Ordering Info Table Updated front page to standard format. Updated Package/Ordering Information table. 3 Electrical Characteristics Changed values for Supply Current and Power Dissipation. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DAC2902 16 www.ti.com SBAS167C PACKAGE OPTION ADDENDUM www.ti.com 21-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) DAC2902Y/1K ACTIVE TQFP PFB 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC2902Y/1KG4 ACTIVE TQFP PFB 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC2902Y/250 ACTIVE TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC2902Y/250G4 ACTIVE TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DAC2902Y/1K TQFP PFB 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 DAC2902Y/250 TQFP PFB 48 250 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC2902Y/1K TQFP PFB 48 1000 367.0 367.0 38.0 DAC2902Y/250 TQFP PFB 48 250 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MTQF019A – JANUARY 1995 – REVISED JANUARY 1998 PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 48 13 0,13 NOM 1 12 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,05 MIN 0°– 7° 1,05 0,95 Seating Plane 0,75 0,45 0,08 1,20 MAX 4073176 / B 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated