Material Content Data Sheet Sales Product Name BTF50060-1TEA MA# MA000943374 Package PG-TO252-5-11 Issued 29. August 2013 Weight* 356.48 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material plastics noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus Polyimide silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 26023-21-2 7440-22-4 7440-31-5 7439-92-1 4.311 1.21 0.205 0.06 wire encapsulation leadfinish plating glue solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.21 12093 12093 574 0.061 0.02 204.243 57.29 57.37 572942 172 573688 0.972 0.27 0.27 2725 2725 1.386 0.39 3889 24.260 6.81 112.982 31.69 38.89 316937 68054 388880 5.072 1.42 1.42 14229 14229 0.076 0.02 214 0.000 0.00 0.02 1 215 0.156 0.04 0.04 437 437 0.069 0.02 0.055 0.02 2.633 0.74 193 155 0.78 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7385 7733 1000000