MPS MPM3630GQV 18v/3a dc/dc module synchronous step-down regulator with integrated inductor Datasheet

MPM3630
18V/3A DC/DC Module
Synchronous Step-Down Regulator
with Integrated Inductor
DESCRIPTION
FEATURES
The MPM3630 is a synchronous rectified, stepdown module regulator with built-in power
MOSFETs, inductor, and two capacitors. It
offers a very compact solution to achieve a 3A
continuous output current with excellent load
and line regulation over a wide input supply
range. The MPM3630 has a 1.4MHz switching
frequency, which provides fast load transient
response.
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Full protection features include over-current
protection (OCP) and thermal shutdown (TSD).
The MPM3630 eliminates
manufacturing
risks
while
improving time-to-market.
design and
dramatically
Complete Switch Mode Power Supply
4.5V to 18V Wide Operating Input Range
3A Continuous Load Current
50mΩ/22mΩ Low RDS(ON) Internal Power
MOSFETs
Integrated Inductor
Fixed 1.4MHz Switching Frequency
1MHz-2MHz Frequency Sync
Internal Power Save Mode for Light Load
Power Good Indicator
OCP Protection and Hiccup
Thermal Shutdown
Output Adjustable from 0.6V
Available in QFN20 (3x5x1.6mm) Package
APPLICATIONS
The MPM3630 is available in a space-saving
QFN20 (3mmx5mmx1.6mm) package.
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Industrial Controls
Medical and Imaging Equipment
Telecom Applications
LDO Replacement
Space and Resource-Limited Applications
Distributed Power Systems
All MPS parts are lead-free, halogen-free, and adhere to the RoHS
directive. For MPS green status, please visit MPS website under Quality
Assurance.
“MPS” and “The Future of Analog IC Technology” are Registered
Trademarks of Monolithic Power Systems, Inc.
TYPICAL APPLICATION
BST
VOUT
3.3V/3A
SW
VIN 12V
IN
C1
22µF
EN
R3
100k
MPM3630
OUT
C2
22µFx2
EN/SYNC
R1
51k
FB
VCC
NC
PG
PGND
R2
11.3k
AGND
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
ORDERING INFORMATION
Part Number*
Package
QFN-20
(3mmx5mmx1.6mm)
MPM3630GQV
Top Marking
See Below
* For Tape & Reel, add suffix –Z (e.g. MPM3630GQV–Z)
TOP MARKING
MP: MPS prefix
Y: Year code
W: Week code
3630: First four digits of the part number
LLL: Lot number
M: Module
PACKAGE REFERENCE
EN/
PG SYNC IN
18
FB
1
VCC
2
17
16
19
NC PGND PGND
15
14
13
12
PGND
11
BST
10
NC
20
AGND
3
SW
4
9
OUT
SW
5
8
OUT
SW
6
7
OUT
NC NC
All “NC” pins
must be left floating
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
VIN ................................................ -0.3V to 20V
VOUT ............................................... -0.3V to 20V
VSW ....................................................................
-0.3V (-5V for <10ns) to 20V (22V for <10ns)
VBST ....................................................VSW+5.5V
All other pins ..............................-0.3V to 5.5V (2)
(3)
Continuous power dissipation (TA = +25°C)
............................................................2.7W
Junction temperature ............................... 150°C
Lead temperature .................................... 260°C
Storage temperature .................. -65°C to 150°C
QFN-20 (3mmx5mmx1.6mm) . 46 ...... 10 ... °C/W
Recommended Operating Conditions
(4)
Supply voltage (VIN) ........................ 4.5V to 18V
Output voltage (VOUT) ……………………………..
………………………...……...0.6V to VIN *DMAX (5)
Operating junction temp. (TJ). .. -40°C to +125°C
(6)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) For additional details on EN pin’s ABS MAX rating, please
refer to the “Enable/SYNC Control” section.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) In practical design, the minimum VOUT is limited by the
minimum on-time. To allow a margin, a 50ns on-time is
recommended for calculating. To set the output voltage above
5.5V, please refer to the application information.
6) Measured on JESD51-7, 4-layer PCB.
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
ELECTRICAL CHARACTERISTICS
VIN = 12V, TJ = -40°C to +125°C(7), typical value is tested at TJ = 25°C, unless otherwise noted.
Parameter
Symbol
Supply current (shutdown)
Supply current (quiescent)
HS switch on resistance
LS switch on resistance
Inductor DC resistance
Switch leakage
(8)
Current limit
Oscillator frequency
Foldback frequency
Maximum duty cycle
(8)
Minimum on time
Feedback voltage
Feedback voltage
Feedback current
IIN
Iq
HSRDS-ON
LSRDS-ON
LDCR
SW LKG
ILIMIT
fSW
fFB
DMAX
τON_MIN
VFB
VFB
IFB
Condition
Min
VEN = 0V
VFB = 0.7V
VBST-SW = 5V
VCC = 5V
VEN = 0V, VSW = 0V
30% Duty cycle
VFB = 0.5V
VFB = 200mV
VFB = 500mV
TA = 25°C
5
1100
85
Typ
Max
Units
5.5
320
50
22
40
8
420
μA
μA
mΩ
mΩ
mΩ
1
μA
A
kHz
fSW
%
ns
6.5
1400
0.4
90
50
1600
594
591
600
600
10
606
609
50
mV
mV
nA
VFB = 620mV
EN Rising threshold
VEN_RISING
1.2
1.4
1.6
V
EN Falling threshold
VEN_FALLING
1.1
1.25
1.4
V
EN input current
IEN
(8)
EN turn off delay
VEN = 2V
ENTd-off
SYNC frequency range
μA
2.5
μs
1000
VIN under-voltage lockout
threshold—rising
INUVVth
VIN under-voltage lockout
threshold—hysteresis
INUVHYS
PG rising threshold
PG falling threshold
PG rising delay
PG falling delay
PG sink current capability
PG leakage current
VCC regulator
PGVth-Hi
PGVth-Lo
PGTd
PGTd
VPG
IPG-LEAK
VCC
VCC load regulation
Soft-start time
1.8
tSS
3.9
4.1
2000
kHz
4.3
V
740
0.87
0.76
Rising edge
Falling edge
Sink 2mA
4.5V
ICC = 5mA
VOUT from 10% to
90%
(8)
Thermal shutdown
(8)
Thermal hysteresis
0.92
0.81
110
26
mV
0.97
0.86
VFB
VFB
μs
0.4
V
μA
V
3
%
2
5
2.2
ms
150
20
°C
°C
Notes:
7) Not tested in production. Guaranteed by over-temperature correlation.
8) Guaranteed by engineering sample characterization test.
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
TYPICAL CHARACTERISTICS
VIN = 12V, VOUT = 3.3V, TA = 25°C, unless otherwise noted.
w
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
TYPICAL CHARACTERISTICS (continued)
VIN = 12V, VOUT = 3.3V, TA = 25°C, unless otherwise noted.
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
TYPICAL PERFORMANCE CHARACTERISTICS
Performance waveforms are captured from the evaluation board discussed in the Design
Example section.VIN = 12V, VOUT = 3.3V, COUT = 22µFx2, TA = 25°C, unless otherwise noted.
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
TYPICAL PERFORMANCE CHARACTERISTICS
Performance waveforms are captured from the evaluation board discussed in the Design
Example section.VIN = 12V, VOUT = 3.3V, COUT = 22µFx2, TA = 25°C, unless otherwise noted.
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
PIN FUNCTIONS
Package
Pin #
Name
1
FB
2
VCC
3
AGND
4, 5, 6
SW
7, 8, 9
10, 15, 19,
20
OUT
11
12, 13, 14
16
17
18
NC
Description
Feedback. Connect FB to the tap of an external resistor divider from the output to
AGND to set the output voltage. To prevent current-limit runaway during a short-circuit
fault, the frequency foldback comparator lowers the oscillator frequency when the FB
voltage is below 240mV. Place the resistor divider as close as possible to FB. Avoid
placing vias on the FB traces.
Internal 5V LDO output. The internal circuit integrates an LDO output capacitor, so
there is no need to add an external capacitor.
Analog ground. Reference ground of the logic circuit. AGND is connected internally to
PGND. There is no need to add external connections to PGND.
Switch Output. There is no needed connection for the SW pins, but a large copper
plane is recommended on pins 4, 5, and 6 for improved heat sink.
Power output. Connect the load to OUT. An output capacitor is needed.
DO NOT CONNECT. NC must be left floating.
Bootstrap. The bootstrap capacitor is integrated internally. There is no need for
external connections.
Power ground. Reference ground of the power device. PCB layout requires extra care
PGND
(see Page 15). For best results, connect to PGND with copper and vias.
Supply voltage. IN supplies power for the internal MOSFET and regulator. The
MPM3630 operates from a +4.5V to +18V input rail. It requires a low ESR and lowIN
inductance capacitor to decouple the input rail. Place the input capacitor very close to
IN and connect it with wide PCB traces and multiple vias.
Enable/Sync. EN = high to enable the module. Floating EN or connecting it to ground
EN/SYN
will disable the converter. Apply an external clock to EN to change the switching
C
frequency.
Power good indicator. Open drain structure.
PG
BST
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
FUNCTIONAL BLOCK DIAGRAM
EN/SYNC
OUT
55pF
AGND
PG
PGND
Figure 1: Functional Block Diagram
MPM3630 Rev. 1.0
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
OPERATION
The MPM3630 is a high frequency,
synchronous, rectified, step-down, switch-mode
converter with built-in power MOSFETs,
integrated inductor, and two capacitors. It offers
a very compact solution that achieves a 3A
continuous output current with excellent load
and line regulation over a 4.5V to 18V input
supply range.
The MPM3630 has three working modes:
advanced asynchronous modulation (AAM),
similar to PFM mode, discontinuous conduction
mode (DCM), and continuous conduction mode
(CCM). The load current increases as the
device transitions from AAM mode to DCM to
CCM.
AAM Operation
In a light-load condition, the MPM3630 operates
in AAM mode (see Figure 2). VCOMP is the erroramplifier output, which represents the peak
inductor current information. When VCOMP is
lower than VAAM, the internal clock is blocked.
This causes the MPM3630 to skip pulses,
achieving the light-load power save. Refer to
AN032 for additional details.
The internal clock re-sets every time VCOMP
exceeds VAAM. Simultaneously, the high-side
MOSFET (HS-FET) turns on and remains on
until VILsense reaches the value set by VCOMP.
until the inductor-current value decreases to
zero. The device repeats the same operation in
every clock cycle to regulate the output voltage
(see Figure 3).
HS-FET is on
HS/LS-FETs are off
VSW
VOUT
LS-FET is on
A Clock Cycle
IL
IOUT
Zero Current Detect
Figure 3: DCM Control Operation
CCM Control Operation
The device enters CCM from DCM once the
inductor current no longer drops to zero in a
clock cycle. In CCM, the internal 1.4MHz clock
initiates the PWM cycle, the HS-FET turns on
and remains on until VILsense reaches the value
set by VCOMP (after a period of dead time), and
then the LS-FET turns on and remains on until
the next clock cycle starts. The device repeats
the same operation in every clock cycle to
regulate the output voltage.
If VILsense does not reach the value set by VCOMP
within 90% of one PWM period, the HS-FET will
be forced off.
Internal VCC Regulator
55pF 4
R1
17.5k
R2
Figure 2: Simplified AAM Control Logic
DCM Control Operation
The VCOMP ramps up as the output current
increases. When its minimum value exceeds
VAAM, the device enters DCM. In this mode the
internal 1.4MHz clock initiates the PWM cycle,
the HS-FET turns on and remains on until
VILsense reaches the value set by VCOMP (after a
period of dead time), and then the low-side
MOSFET (LS-FET) turns on and remains on
A 5V internal regulator powers most of the
internal circuitries. This regulator takes VIN and
operates in the full VIN range. After EN pulls
high, when VIN exceeds 5V, the output of the
regulator is in full regulation. When VIN is less
than 5V, the output decreases, and the part
integrates an internal decoupling capacitor.
There is no need to add an external VCC output
capacitor.
Error Amplifier (EA)
The error amplifier compares the FB pin voltage
to the internal 0.6V reference (VREF) and
outputs a current proportional to the difference
between the two. This output current then
charges
or
discharges
the
internal
compensation network to form the COMP
voltage, which controls the power MOSFET
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
current. The optimized internal compensation
network minimizes the external component
counts and simplifies the control loop design.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) protects the chip
from operating at an insufficient supply voltage.
The MPM3630 UVLO comparator monitors the
output voltage of the internal regulator (VCC).
The UVLO rising threshold is about 4.1V while
its falling threshold is 3.36V.
ENABLE/SYNC Control (EN)
EN turns the converter on and off. Drive EN
high to turn on the converter; drive EN low to
turn off the converter. An internal 1.1MΩ
resistor from EN to GND allows EN to be
floated to shut down the chip.
EN is clamped internally using a 5.6V seriesZener-diode (see Figure 4).
5.6
1.1MΩ
soft-start voltage (SS) that ramps up from 0V to
5V. When SS is lower than REF, the error
amplifier uses SS as the reference. When SS is
higher than REF, the error amplifier uses REF
as the reference. The SS time is set to 2.2ms
internally.
Power Good Indicator (PG)
The MPM3630 has power good (PG) output to
indicate whether the output voltage of the
module is ready. PG is an open-drain output.
Connect PG to VCC (or another voltage source)
through a pull-up resistor (e.g. 10 kΩ). When
the input voltage is applied, PG is pulled down
to GND before the internal VSS > 1V. Once VSS >
1V (when VFB is above 92% of VREF), PG is
pulled high (after a 110 μs delay). During
normal operation, PG is pulled low when the
VFB drops below 81% of VREF (after a 26μs
delay).
Since the MPM3630 doesn’t implement
dedicated output over-voltage protection, PG
will not respond to an output over-voltage
condition.
Over-Current Protection (OCP) and Hiccup
Figure 4: 5.6V Zener Diode Connection
Connecting EN to a voltage source directly
without a pull-up resistor requires limiting the
amplitude of the voltage source to ≤ 5V to
prevent damage to the Zener diode.
Connecting the EN input through a pull-up
resistor to the voltage on VIN limits the EN input
current to less than 100µA.
For example, with 12V connected to VIN,
RPULLUP ≥ (12V – 5.6V) ÷ 100µA = 64kΩ.
For external clock synchronization, connect a
clock with a frequency range between 1MHz
and 2MHz. 2.2ms after the output voltage is set,
the internal clock rising edge will synchronize
with the external clock rising edge. Meanwhile
the width of the high level should be longer than
250ns, and the width of the low level should be
longer than 100ns.
Internal Soft Start (SS)
The soft start prevents the converter output
voltage from overshooting during startup. When
the chip starts, the internal circuitry generates a
The MPM3630 has a cycle-by-cycle overcurrent limiting control. When the inductor
current peak value exceeds the internal peak
current limit threshold, the HS-FET turns off and
the LS-FET turns on, remaining on until the
inductor current falls below the internal valley
current limit threshold. The valley current limit
circuit is employed to decrease the operation
frequency (after the peak current limit threshold
is triggered). Meanwhile, the output voltage
drops until VFB is below the under-voltage (UV)
threshold (240mV, typically). Once UV is
triggered, the MPM3630 enters hiccup mode to
re-start the part periodically. This protection
mode is useful when the output is dead-shorted
to ground and greatly reduces the average
short-circuit current to alleviate thermal issues
and protect the converter. The MPM3630 exits
hiccup mode once the over-current condition is
removed.
Thermal Shutdown (TSD)
Thermal shutdown prevents the chip from
operating at exceedingly high temperatures.
When the silicon die reaches temperatures that
exceed 150°C, it shuts down the whole chip.
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
When the temperature drops below its lower
threshold, typically 130°C, the chip is enabled
again.
Floating Driver and Bootstrap Charging
An internal bootstrap capacitor powers the
floating power MOSFET driver. This floating
driver has its own UVLO protection. This
UVLO’s rising threshold is 2.2V with a
hysteresis of 150mV. The bootstrap capacitor
voltage is regulated internally by VIN through
D1, M1, C4, L1, and C2 (see Figure 5). If (VINVSW) exceeds 5V, U1 will regulate M1 to
maintain a 5V BST voltage across C4.
The power dissipation of the RC snubber circuit
is estimated using Equation (1):
PLoss  fS  CS  VIN2
(1)
Where fS is the switching frequency, Cs is the
snubber capacitor, and VIN is the input voltage.
For improved efficiency, the value of CS should
not be set too high. Generally, a 4.99Ω RS and
a 470pF CS are recommended to generate the
RC snubber circuit (see Figure 6).
RS
4.99
SW
CS
470pF
Figure 6: Additional RC Snubber Circuit
Figure 5: Internal Bootstrap Charging Circuit
Startup and Shutdown
If both VIN and VEN exceed their respective
thresholds, the chip starts up. The reference
block starts first, generating stable reference
voltage, and then the internal regulator is
enabled. The regulator provides a stable supply
for the remaining circuitries.
Three events shut down the chip: VIN low, VEN
low, and thermal shutdown. During the
shutdown procedure, the signaling path is
blocked first to avoid any fault triggering. The
COMP voltage and the internal supply rail are
then pulled down. The floating driver is not
subject to this shutdown command.
Additional RC Snubber Circuit
An additional RC snubber circuit can be chosen
to clamp the voltage spike and damp the ringing
voltage for better EMI performance.
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
APPLICATION INFORMATION
downgrade when the output voltage is higher
than 5.5V due to thermal concerns.
Setting the Output Voltage
The external resistor divider sets the output
voltage (see Typical Application on page 1).
The feedback resistor R1 also sets the
feedback loop bandwidth with the internal
compensation capacitor (see Figure 7). R2 is
then given using Equation (2):
Selecting the Input Capacitor
The input current to the step-down converter is
discontinuous, therefore it requires a capacitor
to supply the AC current to the step-down
converter while maintaining the DC input
voltage. Use low ESR capacitors for the best
performance. Use ceramic capacitors with X5R
or X7R dielectrics for best results because of
their low ESR and small temperature
coefficients. For most applications, use a 22µF
capacitor.
R2 
R1
VOUT
(2)
1
0.6V
Since the capacitor absorbs the input switching
current, it requires an adequate ripple current
rating. The
C3
R3
OUT
FB
R2
R1
RMS current in the input capacitor can be
estimated using Equation (3) and Equation (4):
IC1  ILOAD 
Figure 7: Feedback Network
Table 1 lists the recommended resistor values
for common output voltages.
Table 1: Resistor Selection for Common Output
Voltages
VOUT
R1
R2
R3
C3
COUT
(V)
(kΩ)
(kΩ)
(kΩ)
(pF)
(µF)
1.0
51
76.8
51
3x22
1.2
51
51
51
3x22
1.5
51
34
51
3x22
1.8
51
25.5
0
2.5
51
16
0
2x22
3.3
51
11.3
0
2x22
5
51
6.98
0
2x22
22
2x22
Normally, it is recommended to set the output
voltage from 0.6V to 5.5V. However, it can be
set higher than 5.5V. In this case, the outputvoltage ripple is larger due to a larger inductor
ripple current. An additional output capacitor is
needed to reduce the output ripple voltage.
If the output voltage is high, heat dissipation
becomes more important. Please refer to the
“PCB Layout Guidelines” section to achieve
better thermal performance. Also, the output will
VOUT  VOUT 
 1
VIN 
VIN 
(3)
The worst case condition occurs at VIN = 2VOUT,
where:
IC1 
ILOAD
2
(4)
To simplifiy, choose an input capacitor with an
RMS current rating greater than half of the
maximum load current.
The input capacitor can be electrolytic,
tantalum, or ceramic. When using electrolytic or
tantalum capacitors, add a small, high-quality
ceramic capacitor (e.g. 0.1μF) placed as close
to the IC as possible. When using ceramic
capacitors, make sure that they have enough
capacitance to provide sufficient charge to
prevent excessive voltage ripple at input. The
input voltage ripple caused by capacitance can
be estimated with Equation (5):
VIN 

ILOAD
V
V 
 OUT   1  OUT 
fS  C1 VIN 
VIN 
(5)
Selecting the Output Capacitor
The output capacitor (C2) maintains the DC
output voltage. Use ceramic, tantalum, or lowESR electrolytic capacitors. For best results,
use low ESR capacitors to keep the output
voltage ripple low. The output voltage ripple can
be estimated using Equation (6):
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14
MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
VOUT 
VOUT  VOUT
 1
fS  L1 
VIN

 
1

   RESR 
8

f

C2
 
S

(6)
VIN
GND
VOUT
Where L1 is the inductor value and RESR is the
equivalent series resistance (ESR) value of the
output capacitor, and L1=1µH.
OUT

8  fS2  L1  C2 

VIN 
For tantalum or electrolytic capacitors, the ESR
dominates the impedance at the switching
frequency. To simlpify, the output ripple can be
approximated with Equation (8):
ΔVOUT 
VOUT 
V
  1  OUT
fS  L1 
VIN

  RESR

PGND
NC
FB
NC
BST
NC
VCC
AGND
C2
NC
SW
C2B
R2
PGND
IN
NC
PGND
EN
PG
R4
C1
R1
C3
For ceramic capacitors, the capacitance
dominates the impedance at the switching
frequency, and the capacitance causes the
majority of the output voltage ripple. For
simplification, the output voltage ripple can be
estimated using Equation (7):
 V 
VOUT
(7)
ΔV

 1  OUT
OUT
Top Layer
(8)
The characteristics of the output capacitor also
affect the stability of the regulation system. The
MPM3630 can be optimized for a wide range of
capacitance and ESR values.
GND
VOUT
PCB Layout (9)
Efficient PCB layout is critical to achieve stable
operation, especially for input capacitor
placement. For best results, see Figure 8 and
follow the guidelines below:
1.
2.
Place the high current paths GND and IN
very close to the device with short, direct,
and wide traces.
Use a large ground plane to connect
directly to PGND. Add vias near PGND if
the bottom layer is ground plane.
3.
Place the ceramic input capacitor close to
IN and the PGND pins. Keep the
connection of the input capacitor and IN as
short and wide as possible.
4.
Place the external feedback resistors next
to FB.
5.
Keep the feedback network away from the
switching node.
Bottom Layer
Figure 8: Recommended PCB Layout
Notes:
9) The recommended layout is based on the Figure 14 Typical
Application circuit.
MPM3630 Rev. 1.0
www.MonolithicPower.com
6/21/2016
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© 2016 MPS. All Rights Reserved.
15
MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
Design Example
Below is a design example following the
application guidelines for the specifications
below:
Table 2: Design Example
VIN
VOUT
Io
12V
3.3V
3A
The detailed application schematic is shown in
Figure 14. The typical performance and circuit
waveforms have been shown in the Typical
Performance Characteristics section. For more
device applications, please refer to the related
Evaluation Board Datasheets.
MPM3630 Rev. 1.0
www.MonolithicPower.com
6/21/2016
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© 2016 MPS. All Rights Reserved.
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
TYPICAL APPLICATION CIRCUITS
BST
SW
VOUT
12V
1V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
R3
51K
EN/SYNC
EN
C2A
22µF
C2B
22µF
FB
VCC
R5
10k
C2
22µF
R1
51K
R2
76.8K
PG
AGND PGND
Figure 9: Vo = 1V, Io = 3A
BST
SW
VOUT
12V
1.2V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
R3
51K
EN/SYNC
EN
C2A
22µF
C2B
22µF
FB
VCC
R5
10k
C2
22µF
R1
51K
R2
51K
PG
AGND PGND
Figure 10: Vo = 1.2V, Io = 3A
BST
SW
VOUT
12V
1.5V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
R3
51K
EN/SYNC
EN
R5
10k
C2
22µF
C2A
22µF
C2B
22µF
FB
VCC
R1
51K
R2
34K
PG
AGND PGND
Figure 11: Vo = 1.5V, Io = 3A
MPM3630 Rev. 1.0
www.MonolithicPower.com
6/21/2016
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© 2016 MPS. All Rights Reserved.
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
BST
SW
VOUT
12V
1.8V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
EN/SYNC
EN
C2A
22µF
FB
VCC
R5
10k
C2
22µF
R1
51K
R2
25.5K
PG
AGND PGND
Figure 12: Vo = 1.8V, Io = 3A
BST
SW
VOUT
12V
2.5V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
EN/SYNC
EN
C2A
22µF
FB
VCC
R5
10k
C2
22µF
R1
51K
R2
16K
PG
AGND PGND
Figure 13: Vo = 2.5V, Io = 3A
BST
SW
VOUT
12V
3.3V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
EN/SYNC
EN
R5
10k
C2
22µF
C2A
22µF
FB
VCC
R1
51K
R2
11.3K
PG
AGND PGND
Figure 14: Vo = 3.3V, Io = 3A
MPM3630 Rev. 1.0
www.MonolithicPower.com
6/21/2016
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© 2016 MPS. All Rights Reserved.
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MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
BST
SW
VOUT
12V
5V/3A
IN
VIN
C1
22µF
R4
100k
MPM3630
OUT
C3
22pF
EN/SYNC
EN
R5
10k
C2
22µF
C2A
22µF
FB
VCC
R1
51K
R2
6.98K
PG
AGND PGND
Figure 15: Vo = 5, Io = 3A
MPM3630 Rev. 1.0
www.MonolithicPower.com
6/21/2016
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© 2016 MPS. All Rights Reserved.
19
MPM3630 – SYNCHRONOUS STEP-DOWN MODULE WITH INTEGRATED INDUCTOR
PACKAGE OUTLINE DRAWING FOR 20L FCMQFN (3X5MM)
PACKAGE INFORMATIONMF-PO-D-0175 revision 4.0
QFN-20 (3mmx5mmx1.6mm)
PIN 1 ID
0.125X45º TYP
PIN 1 ID
MARKING
NOTE 2
PIN 1 ID
INDEX AREA
BOTTOM VIEW
TOP VIEW
SIDE VIEW
NOTE:
0.125X45º
NOTE 2
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) SHADED AREA IS THE KEEP-OUT ZONE. ANY
PCB METAL TRACE AND VIA ARE NOT ALLOWED
TO CONNECT TO THIS AREA ELECTRICALLY OR
MECHANICALLY.
3) EXPOSED PADDLE SIZE DOES NOT INCLUDE
MOLD FLASH.
4) LEAD COPLANARITY SHALL BE 0.10
MILLIMETERS MAX.
5) JEDEC REFERENCE IS MO-220.
6) DRAWING IS NOT TO SCALE.
RECOMMENDED LAND PATTERN
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MPM3630 Rev. 1.0
www.MonolithicPower.com
6/21/2016
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2016 MPS. All Rights Reserved.
20
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