REF : PAGE: 1 PROD. NAME ABC'S DWG NO. MULTILAYER CHIP INDUCTOR MH2012□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： C B A A : 2.00±0.20 m/m B : 1.20±0.20 m/m C : 0.85±0.20 m/m D : 0.50±0.30 m/m D Ⅱ﹒SCHEMATIC DIAGRAM： Ⅲ﹒FEATURES： a﹒Monolithic structure ensuring high performance and reliability. b﹒High frequency applications up to 6GHz. c﹒Terminal：Ag/Cu/Ni/Sn d﹒Remark：Products comply with RoHS' requirements Ⅳ﹒APPLICATIONS： a﹒RF modules for telecommunication systems including GSM, PCS,DECT,WLAN,Bluetooth,etc. Peak Temp：260℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. Ⅴ﹒GENERAL SPECIFICATION： Temperature Rising Area Preheat Area +4.0℃ / sec max. 150 ~ 200℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max. a﹒Storage temp.：-55℃---- +125℃ b﹒Operating temp.：-55℃ ---- +125℃ 50sec max. Temperature ( ℃ ) c﹒Solderability：Preheat 150℃. 60 sec Solder：H63A Solder temp.：230±5℃ Flux：Rosin Dip time：4±1 sec 230℃ 200 150 70sec max. 100 50 0 AR-001A Peak Temperature: 260℃ 250 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : PAGE: 2 PROD. NAME ABC'S DWG NO. MULTILAYER CHIP INDUCTOR MH2012□□□□L□-□□□ ABC'S ITEM NO. Ⅵ﹒ELECTRICAL CHARACTERISTICS ： DWG No. MH20121N2DL□-□□□ MH20121N5DL□-□□□ MH20121N8DL□-□□□ MH20122N2DL□-□□□ MH20122N7DL□-□□□ MH20123N3DL□-□□□ MH20123N9DL□-□□□ MH20124N7DL□-□□□ MH20125N6DL□-□□□ MH20126N8JL□-□□□ MH20128N2JL□-□□□ MH201210NJL□-□□□ MH201212NJL□-□□□ MH201215NJL□-□□□ MH201218NJL□-□□□ MH201222NJL□-□□□ MH201227NJL□-□□□ MH201233NJL□-□□□ MH201239NJL□-□□□ MH201247NJL□-□□□ MH201256NJL□-□□□ MH201268NJL□-□□□ MH201282NJL□-□□□ MH2012R10JL□-□□□ MH2012R12JL□-□□□ MH2012R15JL□-□□□ MH2012R18JL□-□□□ MH2012R22JL□-□□□ MH2012R27JL□-□□□ MH2012R33JL□-□□□ Inductance ( nH ) 1.2 ± 0.3 1.5 ± 0.3 1.8 ± 0.3 2.2 ± 0.3 2.7 ± 0.3 3.3 ± 0.3 3.9 ± 0.3 4.7 ± 0.3 5.6 ± 0.3 6.8 ± 5% 8.2 ± 5% 10.0 ± 5% 12.0 ± 5% 15.0 ± 5% 18.0 ± 5% 22.0 ± 5% 27.0 ± 5% 33.0 ± 5% 39.0 ± 5% 47.0 ± 5% 56.0 ± 5% 68.0 ± 5% 82.0 ± 5% 100.0 ± 5% 120.0 ± 5% 150.0 ± 5% 180.0 ± 5% 220.0 ± 5% 270.0 ± 5% 330.0 ± 5% Q min 10 10 10 10 12 12 12 12 12 15 15 15 15 15 15 15 15 15 18 18 18 18 18 18 13 13 13 12 12 12 L/Q Test Freq. (MHz) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 1). □：Packaging Information… A：Bulk B：Taping Reel 2)."- AR-001A □□□ ":Reference code SRF ( MHz ) nom >6000 >6000 >6000 >6000 >6000 >6000 5600 5500 4700 3900 3200 3100 2800 2400 2100 2000 1800 1700 1400 1200 1000 900 900 700 600 500 430 400 340 320 RDC (Ω) max 0.10 0.10 0.10 0.10 0.12 0.13 0.15 0.20 0.23 0.25 0.28 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.10 1.20 1.30 1.50 IDC ( mA ) max 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 SPECIFICATION FOR APPROVAL REF : PAGE: 3 PROD. NAME MULTILAYER CHIP INDUCTOR ABC'S DWG NO. MH2012□□□□L□-□□□ ABC'S ITEM NO. Ⅶ﹒L / Q VS. FREQ. CURVE： L vs. Frequency 1000 R15 Inductance ( nH ) 100 R10 56N 27N 12N 10 4N7 2N2 1 1.0 e-02 10 Frequency ( GHz ) Q vs. Frequency 150 2N2 120 Q 90 4N7 60 12N 27N 56N R15 30 0 R10 1.0 e-02 10 Frequency ( GHz ) AR-001A SPECIFICATION FOR APPROVAL REF : PAGE: 4 PROD. ABC'S DWG NO. MULTILAYER CHIP INDUCTOR NAME MH2012□□□□L□-□□□ ABC'S ITEM NO. Ⅷ﹒PACKAGING INFORMATION： ( 1 ) Configuration T Cover Tape N A B 2.0±0.5 ∮C ∮C D G Emobossed Carrier ※ Carrier tape width : D P:4 m/m 4 m/m End Start Leader no component 200 m/m min. Trailer no component 400 m/m min. Components User direction of feed Unit:m/m ( 2 ) Dimensions Style A 07 - 08 178 B 21±0.8 C D G N T 13 8 10 +0 50 -0 12.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Series MH2012 AR-001A Q'TY (pcs) 4,000 G.W. (gw) 120 Outer : Carton Style 07 - 08 Q'TY (pcs) 200,000 G.W. (Kg) 8.5 Size (cm) 41 x 39 x 22 SPECIFICATION FOR APPROVAL REF : PAGE: 5 PROD. ABC'S DWG NO. MH2012□□□□L□-□□□ MULTILAYER CHIP INDUCTOR NAME ABC'S ITEM NO. ( 4 ) TYPE DIMENSIONS 4±0.1 (0.157 ±0.004) φ1.55±0.05 2±0.05 (0.079 ±0.002) (0.061 ±0.002) T max. B±0 .1(0.004) F±0.05 (0.002) W±0.2 (0.008) 1.75 ±0.1 (0.069 ±0.004) Fig 1. P±0.1 (0.004) A±0.1 (0.004) Unit:m/m AR-001A Type A B F P T W Fig MH2012 1.50 2.30 3.50 4.0 1.10 8.0 1 SPECIFICATION FOR APPROVAL REF : PAGE: 6 PROD. NAME MULTILAYER CHIP INDUCTOR ABC'S DWG NO. MH2012□□□□L□-□□□ ABC'S ITEM NO. Ⅸ﹒DWGING NUMBER EXPRESSION： M H 2 0 1 2 Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1：Product Classification L：Lead Free Standard products comply with RoHS' requirements 1 ~ 9：Lead Free Special products comply with RoHS' requirements Appendix code 2：Package Information Code AR-001A Inner package A T.B.D. B T / R ( Reel package ) Inner package Q'TY T.B.D. 4000 pcs Remark