PRELIMINARY CM3018 Micropower, 150mA Low Noise CMOS Regulator with Fast Response Features Product Description • The CM3018 is a very low dropout, low noise regulator that delivers up to 150mA of load current at a fixed output voltage. Available with 1.5V, 1.8V, 2.5V, 2.6V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V or 3.3V outputs Fast (60µs) VOUT response when enabled Ultra low noise (35µV rms typ.) Delivers up to 150mA output current Very low dropout (150mV at 150mA) Low quiescent operating current (110µA) Stable with low-ESR ceramic capacitors “Zero” disable mode current consumption Thermal overload protection Foldback overload current protection -40°C to +85°C temperature operation Available in a 5-pin SOT23 and 5-bump Chip Scale Packages (CSP) Lead-free versions available • • • • • • • • • • • • Applications • Wireless handsets, PDAs, MP3 players, digital cameras PCs and notebooks Graphics cards, set-top boxes Compact Flash memory cards Battery-powered devices PC cards • • • • • Simplified Electrical Schematic VIN VOUT EN VIN VOUT OUT EN + 1µF - The CM3018 is fully protected, offering both overload current limiting and high temperature thermal shutdown. All versions of the CM3018 are now available with optional lead-free finishing. CM3018 CIN An optional bypass pin is provided for further improvement of noise performance and to maximize the power supply ripple rejection. The CM3018 is available in a tiny 5 lead SOT-23 package or a 5-bump CSP and is ideal for space critical applications. The CSP version of the CM3018 incorporates OptiGuardTM technology to provide increased reliability at assembly. Typical Application Circuit + A dedicated control input (EN, Active High) provides power-up sequencing flexibility. When this input is taken low, the regulator is disabled. In this state, the supply current will drop to near zero. An internal discharge MOSFET resistance (300Ω) will force the output to ground whenever the device is disabled. + BYP COUT BYP GND CBYP + VREF - 1µF 10nF GND 1x GND © 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 PRELIMINARY CM3018 Pin / Bump Descriptions PIN / BUMP DESCRIPTIONS SOT23-5 PIN CSP BUMP NAME 1 C3 VIN 2 B2 GND 3 A1 EN 4 A3 BYP This pin is connected to the internal voltage reference of the regulator. An external bypass capacitor CBYP of 10nF is recommended to improve the noise performance and to maximize the power supply ripple rejection. 5 C1 VOUT The regulator voltage output used to power the load. A nominal output capacitor of 1µF is sufficient to minimize any transient disturbances under normal operating conditions. Additional output capacitance can be used to further improve transient load response. DESCRIPTION The input power supply for the regulator. If this input is within a few inches of the main supply filter, a capacitor may not be necessary. Otherwise an input filter capacitor of approximately 1µF will ensure adequate filtering. The negative reference for all voltages. A logic input control to enable the regulator output. When EN is asserted (logic high), it allows output regulation to commence. When EN is deasserted (logic low), the regulator pass transistor is forced into a high impedance mode, and an internal discharge resistance (300Ω) is applied to the output. Package / Ordering Information SOT23-5 Package PACKAGE / PINOUT DIAGRAM Top View 1 GND 2 EN 3 5 VOUT 4 BYP ENxx VIN 5-pin SOT23 Note: This drawing is not to scale. SOT-23 PART NUMBERING INFORMATION SOT23-5 PKG. Pins 5 5 5 5 5 5 5 5 Output Voltage 1.5V 1.8V 2.5V 2.8V 2.9V 3.0V 3.1V 3.3V Package SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 Standard Finish Ordering Part Part Marking Number1 CM3018-15ST EA15 CM3018-18ST EA18 CM3018-25ST EA25 CM3018-28ST EA28 CM3018-29ST EA29 CM3018-30ST EA30 CM3018-31ST EA31 CM3018-33ST EA33 Lead-free Finish Ordering Part Part Marking Number1 CM3018-15SO EG15 CM3018-18SO EG18 CM3018-25SO EG25 CM3018-28SO EG28 CM3018-29SO EG29 CM3018-30SO EG30 CM3018-31SO EG31 CM3018-33SO EG33 © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 07/29/04 PRELIMINARY CM3018 Package / Ordering Information (Cont’d) Chip Scale Package PACKAGE / PINOUT DIAGRAM TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 1 2 3 VOUT A VIN C1 C3 B nn GND B2 Pin "A1" Marking C EN BYP A1 A3 A1 CM3018 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Package Ordering Part Number1 CSP CM3018-15CS 1.8V CSP CM3018-18CS MB CM3018-18CP MB 2.5V CSP CM3018-25CS MC CM3018-25CP MC 5 2.6V CSP CM3018-26CS MD CM3018-26CP MD 5 2.8V CSP CM3018-28CS ME CM3018-28CP ME 5 2.85V CSP CM3018-2JCS MF CM3018-2JCP MF 5 2.9V CSP CM3018-29CS MG CM3018-29CP MG 5 3.0V CSP CM3018-30CS MH CM3018-30CP MH 5 3.1V CSP CM3018-31CS MJ CM3018-31CP MJ 3.3V CSP CM3018-33CS MK CM3018-33CP MK CSP BUMPS Output Voltage 5 1.5V 5 5 5 Part Marking Ordering Part Number1 Part Marking MA CM3018-15CP MA Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 PRELIMINARY CM3018 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS +2000 V [GND - 0.6] to [+6.0] [GND - 0.6] to [VIN + 0.6] [GND - 0.6] to [VIN + 0.6] V V V Storage Temperature Range -65 to +150 °C Operating Temperature Range Ambient Junction -40 to +85 0 to +130 °C °C Power Dissipation (Notes 1,2) Internally Limited W ESD Protection (HBM) Pin Voltages VIN (pin 1) EN (pin 3) VOUT (pin 5) Note 1: The CM3018 contains a thermal overload circuit that automatically disables the device thereby preventing excessive junction temperature. For example, a SOT23-5 packaged device mounted on a typical multi-layer board with a moderate heat spreading copper area (2 square inches) will allow up to 0.315W to be safely dissipated, maintaining a safe operating temperature. Please consult with factory for thermal evaluation assistance. Note 2: Consult CAMD Technical Support to obtain detailed power dissipation information for the CM3018 packaged in the SOT23 and CSP packages. STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS VIN 2.7 to 5.5 V Ambient Operating Temperature Range -40 to +85 °C Load Current 0 to +150 mA 1 ±20% µF COUT © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 07/29/04 PRELIMINARY CM3018 Specifications (continued) ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL VOUT VOUTRT PARAMETER CONDITIONS MIN MAX UNITS Regulator Output Voltage TA = 25°C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V -1% +1% V 0°C < TA < 125°C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V -2% +2% V -40°C < TA < 125°C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V -3% +3% V Regulator Response Time RDROPOUT Dropout Resistance TYP No Load; COUT = 1µf Ceramic Cap 60 0mA < ILOAD < 150mA 1 µs Ω 1.3 VR LOAD Load Regulation VIN-VOUT = 1V; 10mA < ILOAD < 150mA .25 % VR LINE Line Regulation 3.3V < VIN < 4.3V; ILOAD = 5mA 0.15 %/V 400 mA ILIM Overload Current Limit ISC Short Circuit Current Limit VOUT < 1V 200 mA Discharge Resistance EN tied to ground; VIN = 3.0V 300 Ω Ground Current with EN tied to VIN; ILOAD = 0mA: 100 200 µA with EN tied to VIN; ILOAD = 150mA: 110 250 µA with EN tied to GND (Disable Mode): 0.1 10 µA 0.8 1.2 V RDISCH IGND VIH Enable High Threshold Regulator enabled VIL Enable Low Threshold Regulator shutdown IEN Enable Input Current VEN > 0.8V 0.7 V .01 µA Shutdown Temperature 150 °C THYST Thermal Hysteresis 15 °C PSRR Ripple Rejection ƒ = 120Hz; VIN − VOUT = 1V; ILOAD= 100µA; COUT = 1µF Ceramic; CBYP = 10nF 60 dB Output Noise 300Hz-100kHz; COUT = 10µF Ceramic; CBYP = 10nF 35 µVrms TDISABLE eN 0.4 Note 1: Electrical operating characteristics are guaranteed over standard operating conditions unless otherwise noted. © 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 PRELIMINARY CM3018 Performance Information Typical Noise Characteristics Curves shown for CM3018-33, 3.3V output unless noted otherwise Power Supply Ripple Rejection Power Supply Ripple Rejection 80 70 100uA 60 1mA 50 40 10mA 30 Vin = 4.3V, Vout = 3.3V Cout = 10uF cer. Cbyp = 10nF 20 10 150mA Ripple Rejecttion [dB] Ripple Rejecttion [dB] 80 70 60 100uA 50 150mA 40 30 Vin = 4.3V, Vout = 3.3V Cout = 1uF cer. Cbyp = 10nF 20 10 0 1mA 10mA 0 10 100 1000 10000 Frequency [Hz] 100000 10 100 1000 10000 Frequency [Hz] 100000 Power Supply Ripple Rejection Ripple Rejecttion [dB] 80 70 60 100uA 50 40 1mA 30 Vin = 4.3V, Vout = 3.3V Cout = 1uF cer. NO Byp cap 20 10 10mA 150mA 0 10 100 1000 10000 Frequency [Hz] 100000 Noise Performance Noise Performance 1.E-05 Voltage [V] Voltage [V] 1.E-05 1.E-06 1.E-07 1.E-08 100 Vin = 4.8V, Vout = 3.3V Cout = 1uF cer. Cbyp = 10nF 100uA load 1000 10000 100000 1.E-06 1.E-07 Vin = 4.8V Vout = 3.3V Cout = 10uF cer. Cbyp = 10nF 100uA load 1.E-08 100 frequency [Hz] 1000 10000 100000 frequency [Hz] © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 07/29/04 PRELIMINARY CM3018 Performance Information (cont’d) Typical DC Characteristics (nominal conditions unless otherwise specified) Curves shown for CM3018-33, 3.3V output unless noted otherwise Ground Current vs. Input (5mA Load) Ground Current vs. Load (VIN = 5V) 150 Ground Current [uA] GROUND CURRENT [uA] 150 100 50 125 100 75 50 25 0 0 0 1 2 3 4 INPUT VOLTAGE [V] 5 0 6 Load Regulation (VIN = 5V) DROPOUT VOLTAGE [mV] 200 3.35 3.30 3.25 150 100 50 3.20 0 0 100 200 300 0 LOAD CURRENT [mA] 50 100 150 200 LOAD CURRENT [mA] Line Regulation (5mA Load) Foldback Current Limiting (VIN = 3.8V) 4.0 3.7 3.5 OUTPUT VOLTAGE [V] OOUTPUT VOLTAGE [V] 200 Dropout Voltage vs. Load Current (VOUT = 3.25V) 3.40 OUTPUT VOLTAGE [V 50 100 150 Load Current [mA] 3.3 3.1 2.9 2.7 3.0 2.0 1.0 0.0 2.5 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE [V] 5.5 6.0 0 100 200 300 400 500 LOAD CURRENT [mA] © 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 PRELIMINARY CM3018 Performance Information (cont’d) Typical Transient Characteristics (nominal conditions unless specified otherwise) Curves shown for CM3018-33, 3.3V output unless noted otherwise Load transient (10% to 100%) Step Response Enable Response (CBYP = 10nF) EN Line Transient (1Vpp) Step Response Disable Response (CBYP = 10nF) EN VOUT VOUT NO Load COUT = 1uF Cer. NO Load COUT = 1uF Cer. © 2004 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 07/29/04 PRELIMINARY CM3018 Performance Information (cont’d) Typical Thermal Characteristics TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA) Ground Current vs. Temperature (VIN=5V) 100 GROUND CURRENT [uA] The overall junction to ambient thermal resistance (θJA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction to the case (θJC) which is defined by the package style, and the second path is case to ambient (θCA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: = TAMB + PD ∗ (θJA) 80 60 40 20 0 0 SOT-23 Package Considerations 25 50 75 100 125 o TEMPERATURE [ C] When the SOT23 version of the CM3018 is mounted on a double-sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting θJA is 175°C/W. TJUNC = TAMB + PD ∗ (θJA) = 70°C + 315mW ∗ (175°C/W) = 70°C + 57.75°C = 127.75°C Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pins for “heat spreading”. 50 40 OUTPUT CHANGE [mV] Based on a maximum power dissipation of 320mW (Load x VIN-VOUT = 150mA x 2.2V) with an ambient of 70°C the resulting junction temperature will be: Output Voltage Change vs. Temperature (VIN=5V, 1mA Load) 30 20 10 0 -10 -20 -30 -40 -50 -50 -25 0 25 50 75 TEMPERATURE [oC] 100 125 Measurements showing performance up to a junction temperature of 125°C were performed under light load conditions (1mA). This allows the ambient temperature to be representative of the internal junction temperature. Note: The use of multi-layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction using only the minimum size pad layout will typically provide the CM3018 in a SOT23 package with an overall θJA of 175°C/W, which allows up to 450mW to be dissipated safely. Please consult CAMD Technical Support for assistance with thermal analysis of the CM3018 with respect to a specific application. © 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 9 PRELIMINARY CM3018 Mechanical Details SOT23 Mechanical Specifications Dimensions for CM3018 devices packaged in 5-pin SOT23 packages are presented below. Mechanical Package Diagrams TOP VIEW For complete information on the SOT23 package, see the California Micro Devices SOT23 Package Information document. e1 e 5 4 PACKAGE DIMENSIONS Package SOT23 (JEDEC name is MO-178) Pins Dimensions E1 E 2 3 5 Millimeters Inches Min Max Min Max A -- 1.45 -- 0.057 A1 0.00 0.15 0.000 0.006 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.75 3.05 0.108 0.120 E 2.60 3.00 0.102 0.118 E1 1.45 1.75 0.057 0.069 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L 0.60 REF # per tape and reel 1 b SIDE VIEW D A A1 END VIEW 0.0236 REF 3000 pieces c Controlling dimension: inches L1 Package Dimensions for SOT23-5. © 2004 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 07/29/04 PRELIMINARY CM3018 Mechanical Details CSP Mechanical Specifications CM3018CS/CP devices are packaged in a custom Chip Scale Package (CSP) with OptiGuardTM coating. Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS Custom CSP Bumps 5 Millimeters Dim Nom B A Inches Max Min Nom A1 0.961 1.006 1.051 0.0378 0.0396 0.0414 A2 1.418 1.463 1.508 0.0558 0.0576 0.0594 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.203 0.253 0.303 0.0080 0.0100 0.0119 C2 0.247 0.297 0.347 0.0097 0.0117 0.0136 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel 1 2 3 Max C2 Min C A2 Package B4 B3 B2 B1 D1 D2 0.30 DIA. 63/37 Sn/Pb SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Custom 5-Bump Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM3018 1.463 X 1.006 X 0.670 1.67 X 1.17 X 0.730 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 1. Tape and Reel Mechanical Data © 2004 California Micro Devices Corp. All rights reserved. 07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 11