Material Content Data Sheet Sales Product Name IPI50R350CP Issued MA# MA001135252 Package PG-TO262-3-22 Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel silver antimony tin iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-22-4 7440-36-0 7440-31-5 7439-89-6 7723-14-0 7440-50-8 wire encapsulation leadfinish plating solder heatspreader *deviation 29. August 2013 1564.37 mg Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] 5.444 0.35 0.35 3480 3480 0.851 0.05 Weight [mg] 544 0.255 0.02 849.682 54.30 54.37 543147 163 543854 1.335 0.09 0.09 853 853 2.322 0.15 1484 67.339 4.30 510.847 32.66 37.11 326552 43046 371082 15.198 0.97 0.97 9715 9715 1.651 0.11 0.11 1055 1055 0.774 0.05 0.310 0.02 2.013 0.13 0.106 0.01 0.032 0.00 106.210 6.79 495 198 0.20 1287 20 6.80 67893 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1980 68 67981 1000000