Material Content Data Sheet Sales Product Name SAK-XC2733X-20F66L AA MA# MA001053254 Package PG-LQFP-64-22 Issued 29. August 2013 Weight* 369.75 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 17.352 4.69 0.032 0.01 0.130 0.04 352 2.600 0.70 7031 105.558 28.55 29.30 285487 292958 1.683 0.46 0.46 4551 4551 1.150 0.31 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 4.69 46929 46929 88 3111 31.057 8.40 197.846 53.50 62.21 535084 622191 4.066 1.10 1.10 10996 10996 1.611 0.44 0.44 4356 4356 1.666 0.45 4.997 1.35 83996 4505 1.80 13514 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 18019 1000000