HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Power Detectors - CHIP 5 Typical Applications Features The HMC813 is ideal for: High Logging Range: 55 dB • EW, ELINT & IFM Receivers Frequency Flatness: ±1.5 dB • DF Radar Systems Saturated Output Power: -7 dBm • ECM Systems Fast Rise/Fall Times: 4/10 ns • Broadband Test & Measurement Single Positive Supply: +3.3V • Power Measurement & Control Circuits ESD Sensitivity (HBM): Class 1A • Military & Space Applications -55 to +85° C Operating Temperature Functional Diagram General Description The HMC813 is a Successive Detection Log Video Amplifier (SDLVA) with a limited RF output which operates from 1 to 26 GHz. The HMC813 provides a logging range of 55 dB. This device offers typical fast rise/fall times of 4/10 ns. The HMC813 log video output slope is typically 14.5 mV/dB. Maximum recovery times are less than 20 ns. Ideal for high speed channelized receiver applications, the HMC813 operates from a single +3.3 V supply, and consumes only 150 mA. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes. Electrical Specifications, TA = +25 °C, Vcc1 = Vcc2 = Vcc3 = Vcc4 = 3.3V [1] Parameter Conditions Input Frequency Range Frequency Flatness (Video out) Log Linearity Log Linearity over Temperature Typ. Units 1 - 26 GHz Pin = -25 dBm ±1.5 dB Pin = -40 dBm to +0 dBm ±1 dB -55 to +85° C, Pin = -20 dBm ±0.5 dB Minimum Logging Range to ±3 dB error @ 18 GHz -53 dBm Maximum Logging Range to ±3 dB error @ 18 GHz 6 dBm -7 dBm Saturated Output Power, Psat Saturated Output Power Flatness ±2.5 dB RF Input Return Loss 7 dB RF Output Return Loss 13 dB Log Video Minimum Output Voltage 0.875 V Log Video Maximum Output Voltage 1.65 V Log Video Output Rise Time Pin = 0 dBm, 10% to 90% 4 ns Log Video Output Fall Time Pin = 0 dBm, 90% to 10% 10 ns [1] Electrical specs and performance plots are given for single-ended operation 5-1 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Electrical Specifications, (continued) [1] Parameter Log Video Recovery Time Conditions Typ. Units -50 dBm to 0 dBm 20 ns Log Video Output Slope 14.5 mV/dB 3 µV/dB°C Log Video Propagation Delay 15 ns Supply Current (Idc) 150 mA Log Video Output Slope Variation over Temperature @ 10 GHz [1] Electrical specs and performance plots are given for single-ended operation VIDEO OUT & Error vs. Input Power, Fin = 1 GHz [1] VIDEO OUT & Error vs. Input Power, Fin = 2 GHz [1] 3 2 1 -1 1 ERR +25C ERR +85C ERR -55C -40 -30 -20 -10 0 -1 1 ERR +25C ERR +85C ERR -55C -3 -50 1 1.5 -2 0.5 0 -60 -3 -50 -40 3 0 10 3 Ideal Video Out +25C Video Out +85C Video Out -55C 1 1.5 -1 1 ERR +25C ERR +85C ERR -55C 1 1.5 0 -1 1 ERR +25C ERR +85C ERR -55C -2 -3 0.5 -10 2 0 10 INPUT POWER (dBm) -2 -3 0.5 -60 ERROR (dB) 0 VIDEO OUT (V) 2 -20 -10 2 ERROR (dB) VIDEO OUT (V) Ideal Video Out +25C Video Out +85C Video Out -55C -30 -20 VIDEO OUT & Error vs. Input Power, Fin = 10 GHz [1] 2 -40 -30 INPUT POWER (dBm) VIDEO OUT & Error vs. Input Power, Fin = 6 GHz [1] -50 -2 0.5 10 INPUT POWER (dBm) -60 2 ERROR (dB) 0 VIDEO OUT (V) 2 1.5 -60 Ideal Video Out +25C Video Out +85C Video Out -55C ERROR (dB) VIDEO OUT (V) Ideal Video Out +25C Video Out +85C Video Out -55C 3 2 power detectors - CHIP 5 -50 -40 -30 -20 -10 0 10 INPUT POWER (dBm) [1] Electrical specs and performance plots are given for single-ended operation For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 5-2 HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz VIDEO OUT & Error vs. Input Power, Fin = 14 GHz [1] VIDEO OUT & Error vs. Input Power, Fin = 18 GHz [1] 3 2 -1 1 -40 -30 -20 -10 0 -1 1 ERR +25C ERR +85C ERR -55C -3 -50 1 1.5 -2 0.5 -60 0 -60 -50 -40 10 3 0 -1 1 ERR +25C ERR +85C ERR -55C VIDEO OUT (V) 1 1.5 -10 0 1 1.5 0 -1 1 ERR +25C ERR +85C ERR -55C -2 -3 0.5 2 -3 0.5 10 -2 -60 -50 -40 INPUT POWER (dBm) -30 -20 -10 0 10 INPUT POWER (dBm) VIDEO OUT & Error vs. Input Power, Fin = 26 GHz [1] 3 2 2 1 1.5 0 -1 1 ERR +25C ERR +85C ERR -55C -2 -3 0.5 -60 ERROR (dB) VIDEO OUT (V) Ideal Video Out +25C Video Out +85C Video Out -55C -50 -40 -30 -20 -10 0 10 INPUT POWER (dBm) [1] Electrical specs and performance plots are given for single-ended operation 5-3 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] ERROR (dB) VIDEO OUT (V) 0 Ideal Video Out +25C Video Out +85C Video Out -55C 2 -20 -10 2 ERROR (dB) Power Detectors - CHIP 3 Ideal Video Out +25C Video Out +85C Video Out -55C -30 -20 VIDEO OUT & Error vs. Input Power, Fin = 22 GHz [1] 2 -40 -30 INPUT POWER (dBm) VIDEO OUT vs. Error vs. Input Power, Fin = 20 GHz [1] -50 -2 -3 0.5 10 INPUT POWER (dBm) -60 2 ERROR (dB) 0 VIDEO OUT (V) 1 1.5 ERR +25C ERR +85C ERR -55C 5 Ideal Video Out +25C Video Out +85C Video Out -55C 2 ERROR (dB) VIDEO OUT (V) Ideal Video Out +25C Video Out +85C Video Out -55C 3 2 HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Saturated RF Output Power vs. Frequency Over Temperature @ Pin = -10 dBm [1] VIDEO OUT vs. Frequency Over Input Power & Temperature [1] 1.7 0 -10 dBm 1.4 1.3 -25 dBm 1.2 1.1 -40 dBm -5 -10 -15 +25C +85C -55C -20 1 0.9 0 5 10 15 20 25 -25 30 0 5 FREQUENCY (GHz) 25 30 0 -5 -5 RETURN LOSS (dB) RF OUTPUT POWER (dBm) 20 Return Loss vs. Frequency Over Temperature [1] 0 -10 -15 2 GHz 10 GHz 20 GHz -20 RF INPUT -10 -15 RF OUTPUT -20 -25 -30 -50 -40 -30 -20 -10 0 -25 10 0 5 INPUT POWER (dBm) 1.7 1.7 1.6 1.6 VIDEO OUT (V) 1.8 +25C +85C -55C 1.4 1.3 1.2 1.1 100 30 1.2 1.1 0.9 75 25 125 150 TIME (ns) +25C +85C -55C 1.3 1 50 20 1.4 0.9 25 5 1.5 1 0 15 Fall Time @ Fin = 10 GHz @ Pin = 0 dBm Over Temperature [1] 1.8 1.5 10 FREQUENCY (GHz) Rise Time @ Fin = 10 GHz @ Pin = 0 dBm Over Temperature [1] VIDEO OUT (V) 15 FREQUENCY (GHz) RF Output Power vs. Input Power Over Frequency [1] 0.8 10 power detectors - CHIP VIDEO OUT (V) 1.5 RF OUTPUT POWER (dBm) +25C +85C -55C 1.6 0.8 0 25 50 75 100 125 150 TIME (ns) [1] Electrical specs and performance plots are given for single-ended operation For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 5-4 HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Absolute Maximum Ratings Power Detectors - CHIP 5 5-5 Vcc1, Vcc2, Vcc3, Vcc4 +3.6V ENBL +3.6V RF Input Power +15 dBm Channel Temperature 125 °C Continuous Pdiss (T=85°C) Derate 12.63 mW/°C above 85°C 0.51 W Thermal Resistance (Channel to die bottom) 79.20 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ESD Sensitivity (HBM) Class 1A Outline Drawing Die Packaging Information [1] Standard Alternate WP-3 (Waffle Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. DIE THICKNESS IS 0.011 [0.28] 3. TYPICAL BOND PAD IS 0.0024 SQUARE 4. BOND PAD METALLIZATION: ALUMINUM 5. NO BACKSIDE METAL 6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 7. OVERALL DIE SIZE IS ±.002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Pad Descriptions Pad Number Function Description 1 -4, 31 VCC1 6, 7 VCC3 8, 9 VCC4 5 VCC2 Bias supply. Connect supply voltage to this pad with appropriate filtering. See application circuit. 10 EN Enable pad, connected to supply voltage for normal operation. Total supply current reduced to less than 3mA when EN is set to 0V. 11, 14 - 17, 20 26, 29, 30 Die Bottom GND Die bottom must be connected to RF and DC ground. 12, 13 RFOUT+, RFOUT- RF Output pads. AC couple RF to RF OUT+, and AC couple RF OUT- to ground via 50 Ohm for single ended operation. Interface Schematic Bias supply. Connect supply voltage to these pads with appropriate filtering. See application circuit. For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] power detectors - CHIP 5 5-6 HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Pad Descriptions (Continued) Pad Number Function Description 18, 19 VIDEO OUT VIDEO FB Video out and feedback. 27, 28 RFIN-, RFIN+ RF Input pads. Connect RF to RF IN+, and AC couple RF IN- to ground via 50 Ohm for single ended operation. Interface Schematic Power Detectors - CHIP 5 5-7 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Application Circuit power detectors - CHIP 5 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 5-8 HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Assembly Diagram Power Detectors - CHIP 5 List of Materials for Assembly Diagram Item 5-9 Description C3 - C6 100 pF SLC Capacitor, Presidio SA1212BX101M16VHXF C7 - C10 10 nF SLC Capacitor, Presidio MVB3030X103ZGH5N C1, C2, C11, C12 33 pF Capacitor, 0402 Pkg. R1, R2 50 Ohm Resistor, 0402 Pkg. R3 10 Ohm Resistor, 0402 Pkg. R4 1k Ohm Resistor, 0402 Pkg. U1 HMC813 Die ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC813 v00.1210 SUCCESSIVE DETECTION LOG VIDEO AMPLIFIER (SDLVA) WITH LIMITED RF OUTPUT, 1 - 26 GHz Mounting & Bonding Techniques for MMICs 50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). Microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.279mm (0.011”) Thick MMIC Wire Bond 0.076mm (0.003”) Handling Precautions RF Ground Plane Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 1. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. HMC813 is a Class-1A ESD sensitive part. Observe handling precautions. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: The chip may be handled by a vacuum collet or with a sharp pair of tweezers. Mounting Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 5 power detectors - CHIP The die should be attached directly to the ground plane with epoxy (see HMC general Handling, Mounting , Bonding Note). 5 - 10