MB1S-05~MB10S-05 Rev.C Feb.-2015 描述 / DATA SHEET Descriptions 0.5A 表面贴装玻璃钝化整流桥，MBS 封装。 0.5A Surface Mount Glass Passivated Bridge Rectifier, MBS package. 特征 / Features 玻璃钝化芯片，反向电压：100V~1000V，正向电流：0.5A，浪涌电流大，适用于表面贴装。无卤产 品。 Glass Passivated Chip Junction, Reverse Voltage:100to1000V, Forward Current:0.5 A, High Surge Current Capability, Designed for Surface Mount Application.Halogen free product. 用途 / Applications 一般用途. General purpose. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 印章代码 / Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 MB1S-05~MB10S-05 Rev.C Feb.-2015 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage Maximum DC Blocking Voltage Average Rectified Output Currentat Ta = 50℃ Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Typical Junction Capacitance（Note1） Typical Thermal （Note2） Resistance Typical Thermal （Note2） Resistance Operating and Storage Temperature Range 数值 Rating 单位 Unit MB1S-05 MB2S-05 MB4S-05 MB6S-05 MB8S-05 MB10S-05 VRRM 100 200 400 600 800 1000 V VRMS 70 140 280 420 560 700 V VDC 100 200 400 600 800 1000 V Io 0.5 A IFSM 20 A Cj 11 pF RθJA 120 ℃/W RθJL 35 ℃/W Tj,Tstg -55~+150 ℃ Note: 1. Measured at 1MHz and applied reverse voltage of 4 V D.C. 2. Mounted on glass epoxy PC board with 4×( 5×5mm2）copper pad.. 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Maximum Forward Voltage Maximum DC Reverse Current at Maximum DC Blocking Voltage 符号 Symbol 测试条件 Test condition 数值 Rating 单位 Unit VF IF=0.5A 1.1 V IR Ta=25℃ Ta=125℃ 5.0 40 μA http://www.fsbrec.com 2/6 MB1S-05~MB10S-05 Rev.C Feb.-2015 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 MB1S-05~MB10S-05 Rev.C Feb.-2015 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 MB1S-05~MB10S-05 Rev.C Feb.-2015 印章说明 / DATA SHEET Marking Instructions http://www.fsbrec.com 5/6 MB1S-05~MB10S-05 Rev.C Feb.-2015 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 MBS 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3000 2 6000 5 30000 13〞×15 336X336X40 345X345X235 / Notices http://www.fsbrec.com 6/6