Cypress CYRF6936-40LTXC Wirelessusb lp 2.4 ghz radio soc low external component count Datasheet

CYRF6936
WirelessUSB™ LP 2.4 GHz Radio SoC
Features
■
2.4 GHz Direct Sequence Spread Spectrum (DSSS) radio
transceiver
■
Battery Voltage Monitoring Circuitry
■
Supports coin-cell operated applications
■
Operating voltage from 1.8 V to 3.6 V
■
Operating temperature from 0 to 70°C
■
Space saving 40-pin QFN 6x6 mm package
■
Operates in the unlicensed worldwide Industrial, Scientific,
and Medical (ISM) band (2.400 GHz to 2.483 GHz)
■
21 mA operating current (Transmit at –5 dBm)
■
Transmit power up to +4 dBm
■
Receive sensitivity up to –97 dBm
■
Wireless Keyboards and Mice
■
Sleep Current less than 1 μA
■
Wireless Gamepads
■
DSSS data rates up to 250 kbps, GFSK data rate of 1 Mbps
■
Remote Controls
■
Low external component count
■
Toys
■
Auto Transaction Sequencer (ATS) - no MCU intervention
■
VOIP and Wireless Headsets
■
Framing, Length, CRC16, and Auto ACK
■
White Goods
■
Power Management Unit (PMU) for MCU/Sensor
■
Consumer Electronics
■
Fast Startup and Fast Channel Changes
■
Home Automation
■
Separate 16-byte Transmit and Receive FIFOs
■
Automatic Meter Readers
■
AutoRate™ - dynamic data rate reception
■
Personal Health and Entertainment
■
Receive Signal Strength Indication (RSSI)
Applications Support
■
Serial Peripheral Interface (SPI) control while in sleep mode
■
4 MHz SPI microcontroller interface
Applications
See www.cypress.com for development tools, reference
designs, and application notes.
Logic Block Diagram
VBAT
L/D
VREG
VDD VCC
Power Management
IRQ
SS
SCK
MISO
MOSI
SPI
Data
Interface
and
Sequencer
PACTL
GFSK
Modulator
RFBIAS
DSSS
Baseband
& Framer
GFSK
Demodulator
RSSI
Xtal Osc
RFP
RFN
Synthesizer
RST
XTAL XOUT
Cypress Semiconductor Corporation
Document #: 38-16015 Rev. *J
•
GND
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 18, 2011
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CYRF6936
Contents
Functional Description ..................................................... 3
Functional Overview ........................................................ 4
Data Transmission Modes ........................................... 4
Link Layer Modes ........................................................ 4
Packet Buffers ............................................................. 5
Auto Transaction Sequencer (ATS) ............................ 5
Data Rates .................................................................. 6
Functional Block Overview .............................................. 6
2.4 GHz Radio ............................................................. 6
Frequency Synthesizer ................................................ 6
Baseband and Framer ................................................. 6
Packet Buffers and Radio Configuration Registers ..... 6
SPI Interface ................................................................ 6
Interrupts ..................................................................... 8
Clocks .......................................................................... 8
Power Management .................................................... 8
Low Noise Amplifier and Received
Signal Strength Indication ............................................ 8
Receive Spurious Response ....................................... 9
Document #: 38-16015 Rev. *J
Application Examples ......................................................9
Registers .........................................................................14
Absolute Maximum Ratings ...........................................15
Operating Conditions .....................................................15
DC Characteristics ..........................................................15
AC Characteristics ..........................................................16
RF Characteristics ..........................................................17
Typical Operating Characteristics .................................19
Ordering Information ......................................................22
Ordering Code Definitions .........................................22
Package Description ......................................................23
Acronyms ........................................................................25
Document Conventions .................................................25
Units of Measure .......................................................25
Document History Page .................................................26
Sales, Solutions, and Legal Information ......................28
Worldwide Sales and Design Support .......................28
Products ....................................................................28
PSoC Solutions .........................................................28
Page 2 of 28
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CYRF6936
Functional Description
The CYRF6936 WirelessUSB™ LP radio is a second generation member of the Cypress WirelessUSB Radio System-On-Chip
(SoC) family. The CYRF6936 is interoperable with the first generation CYWUSB69xx devices. The CYRF6936 IC adds a range
of enhanced features, including increased operating voltage range, reduced supply current in all operating modes, higher data
rate options, reduced crystal start up, synthesizer settling, and link turnaround times.
Figure 1. Pin Diagram - CYRF6936 40 QFN
NC 32
NC 31
VI/O 33
RST 34
VDD 35
NC 36
L/D 37
VBAT0 38
NC 39
VREG 40
Corner
tabs
XTAL
1
30 PACTL / GPIO
NC
2
29 XOUT / GPIO
VCC
3
28 MISO / GPIO
NC
4
NC
5
VBAT1
6
VCC
7
24 SS
VBAT2
8
23 NC
NC
9
27 MOSI / SDAT
CYRF6936
WirelessUSB LP
40-Pin QFN
26 IRQ / GPIO
25 SCK
22 NC
* E-PAD Bottom Side
21 NC
RFBIAS 10
20 NC
19 RESV
18 NC
17 NC
16 VCC
15 NC
14 NC
13 RFN
12 GND
11 RFP
Table 1. Pin Description
Pin Number
1
Name
XTAL
Type
Default
I
I
Description
12 MHz crystal.
2, 4, 5, 9, 14, 15, 17, 18, NC
20, 21, 22, 23, 31, 32,
36, 39
NC
Connect to GND.
3, 7, 16
VCC
Pwr
VCC = 2.4 V to 3.6 V. Typically connected to VREG.
6, 8, 38
VBAT(0-2)
Pwr
VBAT = 1.8 V to 3.6 V. Main supply.
10
RFBIAS
O
O
RF I/O 1.8 V reference voltage.
11
RFP
I/O
I
Differential RF signal to and from antenna.
12
GND
GND
13
RFN
I/O
19
RESV
I
24
SS
I
I
SPI enable, active LOW assertion. Enables and frames transfers.
25
SCK
I
I
SPI clock.
26
IRQ
I/O
O
Interrupt output (configurable active HIGH or LOW), or GPIO.
27
MOSI
I/O
I
SPI data input pin (Master Out Slave In), or SDAT.
28
MISO
I/O
Z
SPI data output pin (Master In Slave Out), or GPIO (in SPI 3-pin mode).
Tri-states when SPI 3PIN = 0 and SS is deasserted.
29
XOUT
I/O
O
Buffered 0.75, 1.5, 3, 6, or 12 MHz clock, PACTL, or GPIO.
Tri-states in sleep mode (configure as GPIO drive LOW).
30
PACTL
I/O
O
Control signal for external PA, T/R switch, or GPIO.
33
VI/O
Pwr
Document #: 38-16015 Rev. *J
Ground.
I
Differential RF signal to and from antenna.
Must be connected to GND.
I/O interface voltage, 1.8–3.6 V.
Page 3 of 28
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CYRF6936
Table 1. Pin Description (continued)
Pin Number
Name
Type
Default
Description
I
Device reset. Internal 10 kohm pull down resistor. Active HIGH,
connect through a 0.47 μF capacitor to VBAT. Must have RST = 1 event
the first time power is applied to the radio. Otherwise the state of the
radio control registers is unknown.
34
RST
I
35
VDD
Pwr
Decoupling pin for 1.8 V logic regulator, connect through a 0.47 μF
capacitor to GND.
37
L/D
O
PMU inductor/diode connection, when used. If not used, connect to
GND.
40
VREG
Pwr
PMU boosted output voltage feedback.
E-PAD
GND
GND
Must be soldered to Ground.
Corner Tabs
NC
NC
Do Not solder the tabs and keep other signal traces clear. All tabs are
common to the lead frame or paddle which is grounded after the pad
is grounded. While they are visible to the user, they do not extend to
the bottom.
Functional Overview
The CYRF6936 IC provides a complete WirelessUSB SPI to
antenna wireless MODEMs. The SoC is designed to implement
wireless device links operating in the worldwide 2.4 GHz ISM
frequency band. It is intended for systems compliant with
worldwide regulations covered by ETSI EN 301 489-1 V1.41,
ETSI EN 300 328-1 V1.3.1 (Europe), FCC CFR 47 Part 15 (USA
and Industry Canada), and TELEC ARIB_T66_March, 2003
(Japan).
The SoC contains a 2.4 GHz, 1 Mbps GFSK radio transceiver,
packet data buffering, packet framer, DSSS baseband controller,
Received Signal Strength Indication (RSSI), and SPI interface
for data transfer and device configuration.
The radio supports 98 discrete 1 MHz channels (regulations may
limit the use of some of these channels in certain jurisdictions).
The baseband performs DSSS spreading/despreading, Start of
Packet (SOP), End of Packet (EOP) detection, and CRC16
generation and checking. The baseband may also be configured
to automatically transmit Acknowledge (ACK) handshake
packets whenever a valid packet is received.
When in receive mode, with packet framing enabled, the device
is always ready to receive data transmitted at any of the
supported bit rates. This enables the implementation of
mixed-rate systems in which different devices use different data
rates. This also enables the implementation of dynamic data rate
systems that use high data rates at shorter distances or in a
low-moderate interference environment or both. It changes to
lower data rates at longer distances or in high interference
environments or both.
In addition, the CYRF6936 IC has a Power Management Unit
(PMU), which enables direct connection of the device to any
battery voltage in the range 1.8 V to 3.6 V. The PMU conditions
the battery voltage to provide the supply voltages required by the
device, and may supply external devices.
Document #: 38-16015 Rev. *J
Data Transmission Modes
The SoC supports four different data transmission modes:
■
In GFSK mode, data is transmitted at 1 Mbps, without any
DSSS.
■
In 8DR mode, eight bits are encoded in each derived code
symbol transmitted.
■
In DDR mode, two bits are encoded in each derived code
symbol transmitted (As in the CYWUSB6934 DDR mode).
■
In SDR mode, one bit is encoded in each derived code symbol
transmitted (As in the CYWUSB6934 standard modes).
Both 64 chip and 32 chip Pseudo Noise (PN) codes are
supported. The four data transmission modes apply to the data
after the SOP. In particular the length, data, and CRC16 are all
sent in the same mode. In general, lower data rates reduce
packet error rate in any given environment.
Link Layer Modes
The CYRF6936 IC device supports the following data packet
framing features:
SOP
Packets begin with a two-symbol SoP marker. This is required in
GFSK and 8DR modes, but is optional in DDR mode and is not
supported in SDR mode. If framing is disabled then an SOP
event is inferred whenever two successive correlations are
detected. The SOP_CODE_ADR code used for the SOP is
different from that used for the “body” of the packet, and if desired
may be a different length. SOP must be configured to be the
same length on both sides of the link.
Length
There are two options for detecting the end of a packet. If SOP
is enabled, then the length field must be enabled. GFSK and
8DR must enable the length field. This is the first eight bits after
the SOP symbol, and is transmitted at the payload data rate.
When the length field is enabled, an EoP condition is inferred
after reception of the number of bytes defined in the length field,
plus two bytes for the CRC16. The alternative to using the length
Page 4 of 28
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CYRF6936
field is to infer an EOP condition from a configurable number of
successive noncorrelations; this option is not available in GFSK
mode and is only recommended when using SDR mode.
CRC16
The device may be configured to append a 16 bit CRC16 to each
packet. The CRC16 uses the USB CRC polynomial with the
added programmability of the seed. If enabled, the receiver
verifies the calculated CRC16 for the payload data against the
received value in the CRC16 field. The seed value for the CRC16
calculation is configurable, and the CRC16 transmitted may be
calculated using either the loaded seed value or a zero seed; the
received data CRC16 is checked against both the configured
and zero CRC16 seeds.
CRC16 detects the following errors:
■
Any one bit in error.
■
Any two bits in error (irrespective of how far apart, which
column, and so on).
■
Any odd number of bits in error (irrespective of the location).
■
An error burst as wide as the checksum itself.
Figure 2 shows an example packet with SOP, CRC16, and
lengths fields enabled, and Figure 3 shows a standard ACK
packet.
Figure 2. Example Packet Format
2 n d F ra m in g
S y m b o l*
P re a m b le
n x 16us
P
SOP 1
SOP 2
L e n g th
C R C 16
P a y lo a d D a ta
Packet
le n g th
1 B y te
P e rio d
1 s t F ra m in g
S y m b o l*
*N o te :3 2 o r 6 4 u s
Figure 3. Example ACK Packet Format
P r e a m b le
n x 16us
P
2 n d F r a m in g
S y m b o l*
SO P 1
SO P 2
C RC 16
C R C fie ld fr o m
r e c e iv e d p a c k e t.
2 B y te p e r io d s
1 s t F r a m in g
S y m b o l*
*N o te :3 2 o r 6 4 u s
Packet Buffers
Auto Transaction Sequencer (ATS)
All data transmission and reception use the 16 byte packet
buffers - one for transmission and one for reception.
The CYRF6936 IC provides automated support for transmission
and reception of acknowledged data packets.
The transmit buffer allows loading a complete packet of up to 16
bytes of payload data in one burst SPI transaction. This is then
transmitted with no further MCU intervention. Similarly, the
receive buffer allows receiving an entire packet of payload data
up to 16 bytes with no firmware intervention required until the
packet reception is complete.
When transmitting in transaction mode, the device automatically:
The CYRF6936 IC supports packets up to 255 bytes. However,
the actual maximum packet length depends on the accuracy of
the clock on each end of the link and the data mode. Interrupts
are provided to allow an MCU to use the transmit and receive
buffers as FIFOs. When transmitting a packet longer than 16
bytes, the MCU can load 16 bytes initially, and add further bytes
to the transmit buffer as transmission of data creates space in
the buffer. Similarly, when receiving packets longer than 16
bytes, the MCU must fetch received data from the FIFO
periodically during packet reception to prevent it from
overflowing.
■
starts the crystal and synthesizer
■
enters transmit mode
■
transmits the packet in the transmit buffer
■
transitions to receive mode and waits for an ACK packet
■
transitions to the transaction end state when an ACK packet is
received or a timeout period expires
Similarly, when receiving in transaction mode, the device
automatically:
■
waits in receive mode for a valid packet to be received
■
transitions to transmit mode, transmits an ACK packet
■
transitions to the transaction end state (receive mode to await
the next packet, and so on.)
The contents of the packet buffers are not affected by the
transmission or reception of ACK packets.
Document #: 38-16015 Rev. *J
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CYRF6936
In each case, the entire packet transaction takes place without
any need for MCU firmware action (as long as packets of 16
bytes or less are used). To transmit data, the MCU must load the
data packet to be transmitted, set the length, and set the TX GO
bit. Similarly, when receiving packets in transaction mode,
firmware must retrieve the fully received packet in response to
an interrupt request indicating reception of a packet.
Data Rates
The CYRF6936 IC supports the following data rates by
combining the PN code lengths and data transmission modes
described in the previous sections:
■
1000 kbps (GFSK)
■
250 kbps (32 chip 8DR)
■
125 kbps (64 chip 8DR)
■
62.5 kbps (32 chip DDR)
■
31.25 kbps (64 chip DDR)
■
15.625 kbps (64 chip SDR)
2.4 GHz Radio
The radio transceiver is a dual conversion low IF architecture
optimized for power, range, and robustness. The radio employs
channel-matched filters to achieve high performance in the
presence of interference. An integrated Power Amplifier (PA)
provides up to +4 dBm transmit power, with an output power
control range of 34 dB in seven steps. The supply current of the
device is reduced as the RF output power is reduced.
Table 2. Internal PA Output Power Step Table
Typical Output Power (dBm)
+4
0
–5
–13
–18
–24
–30
–35
Frequency Synthesizer
Before transmission or reception may begin, the frequency
synthesizer must settle. The settling time varies depending on
channel; 25 fast channels are provided with a maximum settling
time of 100 μs.
The ‘fast channels’ (less than 100 μs settling time) are every third
channel, starting at 0 up to and including 72 (for example, 0, 3,
6, 9 …. 69, 72).
Document #: 38-16015 Rev. *J
The baseband and framer blocks provide the DSSS encoding
and decoding, SOP generation and reception, CRC16
generation and checking, and EOP detection and length field.
Packet Buffers and Radio Configuration Registers
Packet data and configuration registers are accessed through
the SPI interface. All configuration registers are directly
addressed through the address field in the SPI packet (as in the
CYWUSB6934). Configuration registers allow configuration of
DSSS PN codes, data rate, operating mode, interrupt masks,
interrupt status, and so on.
SPI Interface
Functional Block Overview
PA Setting
7
6
5
4
3
2
1
0
Baseband and Framer
The CYRF6936 IC has an SPI interface supporting
communication between an application MCU and one or more
slave devices (including the CYRF6936). The SPI interface
supports single-byte and multi-byte serial transfers using either
4-pin or 3-pin interfacing. The SPI communications interface
consists of Slave Select (SS), Serial Clock (SCK), Master
Out-Slave In (MOSI), Master In-Slave Out (MISO), or Serial Data
(SDAT).
SPI communication may be described as the following:
■
Command Direction (bit 7) = ‘1’ enables SPI write transaction.
A ‘0’ enables SPI read transactions.
■
Command Increment (bit 6) = ‘1’ enables SPI auto address
increment. When set, the address field automatically
increments at the end of each data byte in a burst access.
Otherwise the same address is accessed.
■
Six bits of address
■
Eight bits of data
The device receives SCK from an application MCU on the SCK
pin. Data from the application MCU is shifted in on the MOSI pin.
Data to the application MCU is shifted out on the MISO pin. The
active LOW Slave Select (SS) pin must be asserted to initiate an
SPI transfer.
The application MCU can initiate SPI data transfers using a
multi-byte transaction. The first byte is the Command/Address
byte, and the following bytes are the data bytes shown in Table 3
through Figure 6 on page 7.
The SPI communications interface has a burst mechanism,
where the first byte can be followed by as many data bytes as
required. A burst transaction is terminated by deasserting the
slave select (SS = 1).
The SPI communications interface single read and burst read
sequences are shown in Figure 4 and Figure 5 on page 7,
respectively.
The SPI communications interface single write and burst write
sequences are shown in Figure 6 and Figure 7 on page 7,
respectively.
This interface may be optionally operated in a 3-pin mode with
the MISO and MOSI functions combined in a single bidirectional
data pin (SDAT). When using 3-pin mode, user firmware must
ensure that the MOSI pin on the MCU is in a high impedance
state except when MOSI is actively transmitting data.
Page 6 of 28
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CYRF6936
The device registers may be written to or read from one byte at
a time, or several sequential register locations may be written or
read in a single SPI transaction using incrementing burst mode.
In addition to single byte configuration registers, the device
includes register files. Register files are FIFOs written to and
read from using nonincrementing burst SPI transactions.
The SPI interface is not dependent on the internal 12 MHz clock.
Registers may therefore be read from or written to when the
device is in sleep mode, and the 12 MHz oscillator disabled.
The SPI interface and the IRQ and RST pins have a separate
voltage reference pin (VI/O). This enables the device to interface
directly to MCUs operating at voltages below the CYRF6936 IC
supply voltage.
The IRQ pin function may be optionally multiplexed onto the
MOSI pin. When this option is enabled, the IRQ function is not
available while the SS pin is LOW. When using this configuration,
user firmware must ensure that the MOSI pin on the MCU is in a
high impedance state whenever the SS pin is HIGH.
Table 3. SPI Transaction Format
Parameter
Bit #
Bit Name
Byte 1
7
DIR
6
INC
Byte 1+N
[7:0]
Data
[5:0]
Address
Figure 4. SPI Single Read Sequence
SCK
SS
cmd
MOSI
DIR
0
INC
addr
A5
A4
A3
A2
A1
A0
data to mcu
MISO
D7
D6
D5
D4
D3
D2
D1
D0
Figure 5. SPI Incrementing Burst Read Sequence
SCK
SS
cmd
MOSI
DIR
0
INC
addr
A5
A4
A3
A2
A1
A0
data to mcu1
MISO
D7
D6
D5
D4
D3
data to mcu1+N
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D1
D0
Figure 6. SPI Single Write Sequence
SCK
SS
cmd
MOSI
DIR
1
INC
addr
A5
A4
A3
A2
data from mcu
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
MISO
Figure 7. SPI Incrementing Burst Write Sequence
SCK
SS
cmd
MOSI
DIR
1
INC
addr
A5
A4
A3
A2
data from mcu1
A1
A0
D7
D6
D5
D4
D3
D2
data from mcu1+N
D1
D0
D7
D6
D5
D4
D3
D2
MISO
Document #: 38-16015 Rev. *J
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CYRF6936
Interrupts
The device provides an interrupt (IRQ) output, which is
configurable to indicate the occurrence of various different
events. The IRQ pin may be programmed to be either active
HIGH or active LOW, and be either a CMOS or open drain output.
The available interrupts are described in the section Registers
on page 14.
The CYRF6936 IC features three sets of interrupts: transmit,
receive, and system interrupts. These interrupts all share a
single pin (IRQ), but can be independently enabled or disabled.
The contents of the enable registers are preserved when
switching between transmit and receive modes.
If more than one interrupt is enabled at any time, it is necessary
to read the relevant status register to determine which event
caused the IRQ pin to assert. Even when a given interrupt source
is disabled, the status of the condition that would otherwise
cause an interrupt can be determined by reading the appropriate
status register. It is therefore possible to use the devices without
the IRQ pin, by polling the status registers to wait for an event,
rather than using the IRQ pin.
Clocks
A 12 MHz crystal (30 ppm or better) is directly connected
between XTAL and GND without the need for external
capacitors. A digital clock out function is provided, with
selectable output frequencies of 0.75, 1.5, 3, 6, or 12 MHz. This
output may be used to clock an external microcontroller (MCU)
or ASIC. This output is enabled by default, but may be disabled.
The requirements to directly connect the crystal to the XTAL pin
and GND are:
■
Nominal Frequency: 12 MHz
■
Operating Mode: Fundamental Mode
■
Resonance Mode: Parallel Resonant
■
Frequency Stability: ±30 ppm
■
Series Resistance: <60 ohms
■
Load Capacitance: 10 pF
■
Drive Level: 100 µW
Power Management
The operating voltage of the device is 1.8 V to 3.6 V DC, which
is applied to the VBAT pin. The device can be shut down to a fully
static sleep mode by writing to the FRC END = 1 and
END STATE = 000 bits in the XACT_CFG_ADR register over the
SPI interface. The device enters sleep mode within 35 µs after
the last SCK positive edge at the end of this SPI transaction.
Alternatively, the device may be configured to automatically
enter sleep mode after completing the packet transmission or
reception. When in sleep mode, the on-chip oscillator is stopped,
but the SPI interface remains functional. The device wakes from
sleep mode automatically when the device is commanded to
enter transmit or receive mode. When resuming from sleep
mode, there is a short delay while the oscillator restarts. The
device can be configured to assert the IRQ pin when the
oscillator has stabilized.
Document #: 38-16015 Rev. *J
The output voltage (VREG) of the Power Management Unit
(PMU) is configurable to several minimum values between 2.4 V
and 2.7 V. VREG may be used to provide up to 15 mA (average
load) to external devices. It is possible to disable the PMU and
provide an externally regulated DC supply voltage to the device’s
main supply in the range 2.4 V to 3.6 V. The PMU also provides
a regulated 1.8 V supply to the logic.
The PMU is designed to provide high boost efficiency (74–85%
depending on input voltage, output voltage, and load) when
using a Schottky diode and power inductor, eliminating the need
for an external boost converter in many systems where other
components require a boosted voltage. However, reasonable
efficiencies (69–82% depending on input voltage, output voltage,
and load) may be achieved when using low cost components
such as SOT23 diodes and 0805 inductors.
The current through the diode must stay within the linear
operating range of the diode. For some loads the SOT23 diode
is sufficient, but with higher loads it is not and an SS12 diode
must be used to stay within this linear range of operation. Along
with the diode, the inductor used must not saturate its core. In
higher loads, a lower resistance/higher saturation coil such as
the inductor from Sumida must be used.
The PMU also provides a configurable low battery detection
function, which may be read over the SPI interface. One of seven
thresholds between 1.8 V and 2.7 V may be selected. The
interrupt pin may be configured to assert when the voltage on the
VBAT pin falls below the configured threshold. LV IRQ is not a
latched event. Battery monitoring is disabled when the device is
in sleep mode.
Low Noise Amplifier and Received Signal Strength
Indication
The gain of the receiver can be controlled directly by clearing the
AGC EN bit and writing to the Low Noise Amplifier (LNA) bit of
the RX_CFG_ADR register. Clearing the LNA bit reduces the
receiver gain approximately 20 dB, allowing accurate reception
of very strong received signals (for example, when operating a
receiver very close to the transmitter). Approximately 30 dB of
receiver attenuation can be added by setting the Attenuation
(ATT) bit. This limits data reception to devices at very short
ranges. Disabling AGC and enabling LNA is recommended,
unless receiving from a device using external PA.
When the device is in receive mode the RSSI_ADR register
returns the relative signal strength of the on-channel signal
power.
When receiving, the device automatically measures and stores
the relative strength of the signal being received as a five bit
value. An RSSI reading is taken automatically when the SoP is
detected. In addition, a new RSSI reading is taken every time the
previous reading is read from the RSSI_ADR register, allowing
the background RF energy level on any given channel to be
easily measured when RSSI is read while no signal is being
received. A new reading can occur as fast as once every 12 µs.
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NEG2
NEG1
POS
3
"-"
2
"+"
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
KB 26 Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
J1
ROW1
ROW2
ROW3
ROW4
ROW5
ROW6
ROW7
ROW8
COL18
COL17
COL16
COL15
COL14
COL13
COL12
COL11
COL10
COL9
COL8
COL7
COL6
COL5
COL4
COL3
COL2
COL1
Keyboard Interface
BATT CON 2xAA
BH1
VBAT
1B
2B
R1 is a zero ohm
resistor that should
be installed for
production units
only, following
programming.
A 2-pin jumper
installed from J3.1
to J2.1 enables the
radio to power the
processor. Jumper
removal is required
when programming U2
to disconnect the
radio from the
Miniprog 5V source.
VCC
Serial debug
header
SW PUSHBUTTON
1A
2A
S1
BIND
3
2
1
COL17
COL18
P4_0
P4_1
P4_2
P4_3
P3_0
P3_1
P3_2
P3_3
P3_4
P3_5
P3_6
P3_7
P1_0
P1_1
P1_2
P1_3 / SSEL
P1_4 / SCLK
P1_5 / SMOSI
P1_6 / SMISO
P1_7
EVCC
P1_0
P1_1
0402
XRES
SCLK
SDATA
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
P2_0
P2_1
P2_2
P2_3
P2_4
P2_5
P2_6
P2_7
P0_0 / CLKIN
P0_1 / CLKOUT
P0_2 / INT0
P0_3 / INT1
P0_4 / INT2
P0_5 / TIO0
P0_6 / TIO1
P0_7
5 PIN HDR
1
2
3
4
5
J2
ISSP
CY7C60123-PVXC
7
6
42
43
34
35
36
37
38
39
40
41
25
26
28
29
30
31
32
33
U2
Layout J3 and J2.1 in a
0.100" spacing
configuration
1 PIN HDR
1
J3
NO LOAD
R1
3 PIN HDR
J4
COL9
COL10
COL11
COL12
COL13
COL14
COL15
COL16
P1_0
P1_1
SW1
nSS
SCK
MOSI
MISO
IRQ
0603
Power Supply
EVCC
27
5
1
2
3
4
45
46
47
48
15
14
13
12
11
10
9
8
23
22
21
20
19
18
17
16
0.01 uFd
C19
0402
ROW1
ROW2
ROW3
ROW4
ROW5
ROW6
ROW7
ROW8
COL1
COL2
COL3
COL4
COL5
COL6
COL7
COL8
E
100 uFd 10v
+ C18
VBAT
0.01 uFd
C20
1210
No Load
C6
L3
10 uH
TV8
0402
0402
2
1
BAT400D
SOT23
IRQ
TV7
D1
nSS
SCK
MOSI
MISO
RST
TV2
TV3
TV4
TV5
0805
10 uFd 6.3V
C7
2
4
5
9
14
15
17
18
37
26
24
25
27
28
34
0805
TP2
10 uFd 6.3V
C12
TP1
VCC
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
L/D
IRQ
SS
SCK
MOSI
MISO
RST
RF VCO
and VCO
Buffer
Filter
U1
CYRF6936
0.047 uFd
C13
C17
0.47 uFd
VBAT
0402
C8
1 uFd 6.3V
47
R3
1 1%
VCC
C15
0402
C16
0.047 uFd
C11
0.047 uFd
0402
R2
8
6
38
VBAT2
VBAT1
VBAT0
C9
0.047 uFd
C10
0.047 uFd
C5
0.047 uFd
0402
For reference design part numbers, please
refer to the Bill of Materials file
121-26504_A.xls.
VBAT
19
20
21
22
23
31
32
36
39
29
1
30
13
11
10
IND0402
TV6
L2
1.8 nH
CLKOUT TV1
PACTL
IND0603
L1
22 nH
C1
15 pFd
12 MHz Crystal
Y1
2.0 pFd
C3
E-PAD must be soldered to ground.
RESV
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
XOUT
XTAL
PACTL
RFn
RFp
RFbias
0.47 uFd
Radio Decoupling Caps
0402
An alternate decoupling configuration is
the following:
C6=47uF ceramic
R2=0ohm
C7=.047uF.
For this configuration, it is not required
to load C18.
33
VIO
GND1
VDD2
VDD1
VSS2
VSS1
44
24
40
VREG
0402
3
7
16
VCC1
VCC2
VCC3
0402
0402
35
VDD
12
0402
1.5 pFd
C4
ANT1
WIGGLE 63
The transmitter may exhibit spurs around 50MHz offset at levels
approximately 50dB to 60dB below the carrier power. Receivers
operating at the transmit spur frequency may receive the spur if
the spur level power is greater than the receive sensitivity level.
41
Receive Spurious Response
E-PAD
0402
0402
Document #: 38-16015 Rev. *J
1
2
0805
The power supply decoupling shown for VBAT0
is a recommended cost effective
configuration:
C6=No Load
R2= 1ohm
C7=10uF ceramic.
For this configuration, it is required that
C18 be installed.
CYRF6936
The workaround for this is to program an additional byte in the
packet header which contains the transmitter channel number.
After the packet is received, the channel number can be
checked. If the channel number does not match the receive
channel then the packet is rejected.
Application Examples
Figure 8. Recommended Circuit for Systems where VBAT ≤ 2.4 V
Page 9 of 28
[+] Feedback
CYRF6936
Table 4. Recommended BoM for Systems where VBAT ≤ 2.4 V
Item
Qty
CY Part Number
Reference
Description
1
1
NA
ANT1
2.5GHZ H-STUB WIGGLE
ANTENNA FOR 63MIL PCB
2
1
NA
BH1
BATTERY CLIPS 2AA CELL
3
1
730-10012
C1
4
1
730-11955
5
1
6
7
Manufacturer
Mfr Part Number
NA
NA
CAP 15PF 50 V CERAMIC NPO
0402
Panasonic
ECJ-0EC1H150J
C3
CAP 2.0 PF 50 V CERAMIC NPO
0402
Kemet
C0402C209C5GACTU
730-11398
C4
CAP 1.5PF 50 V CERAMIC NPO
0402 SMD
PANASONIC
ECJ-0EC1H1R5C
2
730R-13322
C5,C17
CAP CER .47UF 6.3 V X5R 0402
Murata
GRM155R60J474KE19D
2
730-13037
C12,C7
CAP CERAMIC 10UF 6.3 V X5R
0805
Kemet
C0805C106K9PACTU
8
1
730-13400
C8
CAP 1 uF 6.3 V CERAMIC X5R
0402
Panasonic
ECJ-0EB0J105M
9
6
730-13404
C9,C10,C11, CAP 0.047 uF 16 V CERAMIC X5R AVX
C13,C15,C16 0402
0402YD473KAT2A
10
1
710-13201
C18
CAP 100UF 10 V ELECT FC
Panasonic - ECG
EEU-FC1A101S
11
2
730-10794
C20,C19
CAP 10000PF 16 V CERAMIC
0402 SMD
Panasonic - ECG
ECJ-0EB1C103K
12
1
800-13317
D1
DIODE SCHOTTKY 0.5A 40 V
SOT23
DIODES INC
BAT400D-7-F
NONE
13
1
NA
J1
PCB COPPER PADS
14
1
420-11496
J2
CONN HDR BRKWAY 5POS STR AMP Division of
AU PCB
TYCO
103185-5
15
1
420-11964
J3
HEADER 1 POS 0.230 HT MODII
.100CL
103185-1
16
1
800-13401
L1
INDUCTOR 22NH 2% FIXED 0603 Panasonic - ECG
SMD
ELJ-RE22NGF2
17
1
800-11651
L2
INDUCTOR 1.8NH +-.3NH FIXED Panasonic - ECG
0402 SMD
ELJ-RF1N8DF
18
1
800-10594
L3
COIL 10UH 1100MA CHOKE 0805 Newark
30K5421
19
1
630-11356
R2
RES 1.00 OHM 1/8W 1% 0805
SMD
9C08052A1R00FKHFT
20
1
610-13402
R3
RES 47 OHM 1/16W 5% 0402 SMD Panasonic - ECG
ERJ-2GEJ470X
21
1
800-13368
S1
LT SWITCH 6MM 100GF H=7MM
TH
Panasonic - ECG
EVQ-PAC07K
22
1
CYRF6936-40LF U1
C
IC, LP 2.4 GHz RADIO SoC
QFN-40
Cypress
Semiconductor
CYRF6936 Rev A5
23
1
CY7C60123-PV U2
XC
IC WIRELESS EnCore II
CONTROLLER SSOP48
Cypress
Semiconductor
CY7C60123-PVXC
24
1
800-13259
Y1
CRYSTAL 12.00MHZ HC49 SMD eCERA
GF-1200008
25
1
PDC-9265-*B
PCB
PRINTED CIRCUIT BOARD
PDC-9265-*B
26
1
920-11206
LABEL1
Serial Number
27
1
920-26504 *A
LABEL2
PCA #
Document #: 38-16015 Rev. *J
AMP/Tyco
Yageo
Cypress
Semiconductor
121-26504 *A
Page 10 of 28
[+] Feedback
CYRF6936
Table 4. Recommended BoM for Systems where VBAT ≤ 2.4 V (continued)
Item
Qty
CY Part Number
Reference
Description
Manufacturer
Mfr Part Number
No Load Components - Do Not Install
28
1
730-13403
C6
CAP 47UF 6.3 V CERAMIC X5R
1210
Panasonic
ECJ-4YB0J476M
29
1
630-10242
R2
RES CHIP 0.0 OHM 1/10W 5%
0805 SMD
Phycomp USA Inc
9C08052A0R00JLHFT
30
1
730-13404
C7
CAP 0.047 uF 50 V CERAMIC X5R AVX
0402
0402YD473KAT2A
31
1
420-10921
J4
HEADER 3POS FRIC STRGHT
MTA 100
644456-3
32
1
620-10519
R1
RES ZERO OHM 1/16W 5% 0603 Panasonic - ECG
SMD
Document #: 38-16015 Rev. *J
AMP/Tyco
ERJ-3GEY0R00V
Page 11 of 28
[+] Feedback
1
2
3
4
5
6
USB A SMT PLUG
VBUS
DM
DP
GND
S1
S2
R1
zero
VBUS
DM
DP
5V
5V
R2
620
SSEL/P1_3
SCLK/P1_4
MOSI/P1_5
MISO/P1_6
CY7C63803-SXC
13
14
15
16
DM/P1_1
DP/P1_0
S1
SW RA PUSH
1A
1B
D1
C
C
LED Green Red
RD
GR
2A
2B
"BIND"
2
1
4
3
SW1
nLED2
nLED1
"CONNECT/ACTIVITY"
nSS
SCK
MOSI
MISO
10
9
0402
P0_0
P0_1
P0_2/INT0
P0_3/INT1
P0_4/INT2
P0_5/TIO0
P0_6/TIO1
VREG
7
6
5
4
3
2
1
12
1500 pFd
RST
nLED2
nLED1
IRQ
SW1
VCC
0805
5V
4.7 uFd
C13
0805
VCC
2.2 uFd
C14
C15
0.47 uFd
Power Supply
0402
VCC
0402
0.047 uFd
C6
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
L/D
IRQ
SS
SCK
MOSI
MISO
RST
VCC
2
4
5
9
14
15
17
18
37
26
24
25
27
28
nSS
SCK
MOSI
MISO
IRQ
34
RST
U1
CYRF6936
VCC
0402
8
6
38
VBAT2
VBAT1
VBAT0
U2
33
VIO
11
VCC
VSS
8
0.047 uFd
C7
0402
19
20
21
22
23
31
32
36
39
29
1
30
13
11
10
TV1
22 nH
1.8 nH
IND0402
TV-20R
L2
L1
IND0603
15 pFd
C1
0.047 uFd
C8
0402
0.047 uFd
C9
0402
0.047 uFd
C10
0402
0.047 uFd
C11
0402
12 MHz Crystal
Y1
2.0 pFd
C3
0402
E-PAD must be soldered to ground.
RESV
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
XOUT
XTAL
PACTL
RFn
RFp
0402
0.47 uFd
C5
RFbias
40
VREG
GND1
12
3
7
16
VCC1
VCC2
VCC3
E-PAD
35
VDD
C12
1.5 pFd
C4
ANT1
WIGGLE 32
1
2
J1
0402
Document #: 38-16015 Rev. *J
41
0402
5V
CYRF6936
Figure 9. Recommended Circuit for Systems where VBAT is 2.4 V - 3.6 V (PMU Disabled)
Page 12 of 28
[+] Feedback
0402
CYRF6936
Table 5. Recommended BoM for Systems where VBAT is 2.4 V - 3.6 V (PMU disabled)
Item Qty CY Part Number
Reference
1
1
NA
ANT1
2
1
730-10012
3
1
730-11955
4
1
730-11398
5
1
7
Description
Manufacturer
Mfr Part Number
2.5GHZ H-STUB WIGGLE ANTENNA
FOR 32MIL PCB
NA
NA
C1
CAP 15PF 50 V CERAMIC NPO 0402
Panasonic
ECJ-0EC1H150J
C3
CAP 2.0 PF 50 V CERAMIC NPO 0402
Kemet
C0402C209C5GACTU
C4
CAP 1.5PF 50 V CERAMIC NPO 0402
SMD
PANASONIC
ECJ-0EC1H1R5C
730-13322
C5, C15
CAP 0.47 uF 6.3 V CERAMIC X5R 0402 Murata
6
730-13404
C6,C7,C8,C CAP 0.047 uF 16 V CERAMIC X5R 0402 AVX
9,C10,C11
8
1
730-11953
C12
CAP 1500PF 50 V CERAMIC X7R 0402 Kemet
C0402C152K5RACTU
9
1
730-13040
C13
CAP CERAMIC 4.7UF 6.3 V XR5 0805
Kemet
C0805C475K9PACTU
10
1
730-12003
C14
CAP CER 2.2UF 10 V 10% X7R 0805
GRM21BR71A225KA01L
Murata
Electronics North
America
11
1
800-13333
D1
LED GREEN/RED BICOLOR 1210 SMD LITEON
LTST-C155KGJRKT
UAR72-4N5J10
GRM155R60J474KE19D
6
ACON
0402YD473KAT2A
12
1
420-13046
J1
CONN USB PLUG TYPE A PCB SMT
13
1
800-13401
L1
INDUCTOR 22NH 2% FIXED 0603 SMD Panasonic - ECG ELJ-RE22NGF2
14
1
800-11651
L2
INDUCTOR 1.8NH +-.3NH FIXED 0402
SMD
Panasonic - ECG ELJ-RF1N8DF
15
1
610-10343
R1
RES ZERO OHM 1/16W 0402 SMD
Panasonic - ECG ERJ-2GE0R00X
16
1
610-13472
R2
RES CHIP 620 OHM 1/16W 5% 0402
SMD
Panasonic - ECG ERJ-2GEJ621X
17
1
200-13471
S1
SWITCH LT 3.5MMX2.9MM 160GF SMD Panasonic - ECG EVQ-P7J01K
18
1
CYRF6936-40LFC U1
IC, LP 2.4 GHz RADIO SoC QFN-40
Cypress
Semiconductor
CYRF6936 Rev A5
19
1
CY7C63803-SXC U2
IC LOW SPEED USB ENCORE II
CONTROLLER SOIC16
Cypress
Semiconductor
CY7C63803-SXC
20
1
800-13259
Y1
CRYSTAL 12.00MHZ HC49 SMD
eCERA
GF-1200008
21
1
PDC-9263-*B
PCB
PRINTED CIRCUIT BOARD
Cypress
Semiconductor
PDC-9263-*B
22
1
LABEL1
Serial Number
XXXXXX
23
1
LABEL2
PCA #
121-26305 **
Document #: 38-16015 Rev. *J
Page 13 of 28
[+] Feedback
CYRF6936
Registers
All registers are read and writable, except where noted. Registers may be written to or read from individually or in sequential groups.[1, 2]
Table 6. Register Map Summary
Address
Mnemonic
b7
b6
0x00
0x01
CHANNEL_ADR
TX_LENGTH_ADR
0x02
TX_CTRL_ADR
TX GO
TX CLR
0x03
TX_CFG_ADR
Not Used
OS
IRQ
Not Used
LV
IRQ
b5
Not Used
b4
0x04
TX_IRQ_STATUS_ADR
0x05
0x06
RX_CTRL_ADR
RX GO
RSVD
TXB15
IRQEN
DATA CODE
LENGTH
TXB15
IRQ
RXB16
IRQEN
RX_CFG_ADR
AGC EN
RXOW
IRQ
RX ACK
LNA
SOPDET
IRQ
PKT ERR
ATT
RXB16
IRQ
EOP ERR
LVIRQ EN
PMU Mode
Force
XSIRQ EN
MISO OD
PFET
disable[3]
Not Used
XOUT OD
PACTL OP
FRC END
LEN EN
Not Used
Not Used
LNA
HINT
IRQ OP
0x07
0x08
0x09
0x0A
RX_IRQ_STATUS_ADR
RX_STATUS_ADR
RX_COUNT_ADR
RX_LENGTH_ADR
0x0B[1]
PWR_CTRL_ADR
PMU EN
0x0C
0x0D
XTAL_CTRL_ADR
IO_CFG_ADR
XOUT FN
IRQ OD
IRQ POL
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
GPIO_CTRL_ADR
XACT_CFG_ADR
FRAMING_CFG_ADR
DATA32_THOLD_ADR
DATA64_THOLD_ADR
RSSI_ADR
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
EOP_CTRL_ADR[4]
CRC_SEED_LSB_ADR
CRC_SEED_MSB_ADR
TX_CRC_LSB_ADR
TX_CRC_MSB_ADR
RX_CRC_LSB_ADR
RX_CRC_MSB_ADR
TX_OFFSET_LSB_ADR
TX_OFFSET_MSB_ADR
MODE_OVERRIDE_ADR
0x1E
0x1F
0x26
0x27
0x28
0x29
0x32
0x35
0x39
Register Files
0x20
0x21
0x22
0x23
0x24
0x25
XOUT OP
ACK EN
SOP EN
Not Used
Not Used
SOP
HEN
MISO OP
Not Used
SOP LEN
Not Used
Not Used
Not Used
Not Used
RSVD
Not Used
RSVD
RX_OVERRIDE_ADR
ACK RX
RXTX DLY
TX_OVERRIDE_ADR
XTAL_CFG_ADR
CLK_OVERRIDE_ADR
CLK_EN_ADR
RX_ABORT_ADR
AUTO_CAL_TIME_ADR
AUTO_CAL_OFFSET_ADR
ANALOG_CTRL_ADR
ACK TX
RSVD
RSVD
RSVD
RSVD
FRC PRE
RSVD
RSVD
RSVD
RSVD
RSVD
RSVD
TX_BUFFER_ADR
RX_BUFFER_ADR
SOP_CODE_ADR
DATA_CODE_ADR
PREAMBLE_ADR
MFG_ID_ADR
b3
b2
Channel
TX Length
TXB8
TXB0
IRQEN
IRQEN
DATA MODE
TXB8
TXB0
IRQ
IRQ
RXB8
RXB1
IRQEN
IRQEN
FAST
HILO
TURN EN
RXB8
RXB1
IRQ
IRQ
CRC0
Bad CRC
RX Count
RX Length
b1
TXBERR
IRQEN
TXC
IRQEN
TXE
IRQEN
TXBERR
IRQ
RXBERR
IRQEN
PA SETTING
TXC
IRQ
RXC
IRQEN
TXE
IRQ
RXE
IRQEN
Not Used
RXBERR
IRQ
RX Code
RXOW EN
VLD EN
RXC
RXE
IRQ
IRQ
RX Data Mode
LVI TH
Not Used
PACTL OD
XOUT IP
END STATE
Not Used
PMU OUTV
PACTL
GPIO
MISO IP
FREQ
SPI 3PIN
IRQ GPIO
PACTL IP
IRQ IP
ACK TO
SOP TH
TH32
TH64
RSSI
EOP
CRC SEED LSB
CRC SEED MSB
CRC LSB
CRC MSB
CRC LSB
CRC MSB
STRIM LSB
Not Used
Not Used
STRIM MSB
FRC SEN
FRC AWAKE
Not Used
Not Used
FRC
MAN RXACK
RXDR
DIS CRC0 DIS RXCRC
ACE
MAN
RSVD
TXACK
OVRD ACK DIS TXCRC
RSVD
RSVD
RSVD
START DLY
RSVD
RSVD
RSVD
RSVD
RSVD
RSVD
RXF
RSVD
RSVD
RSVD
RSVD
RXF
ABORT EN
RSVD
RSVD
RSVD
RSVD
AUTO_CAL_TIME
AUTO_CAL_OFFSET
RSVD
RSVD
RSVD
RSVD
RX INV
TX Buffer File
RX Buffer File
SOP Code File
Data Code File
Preamble File
MFG ID File
b0
RST
Default[1] Access[1]
-1001000
00000000
00000011
-bbbbbbb
bbbbbbbb
bbbbbbbb
--000101
--bbbbbb
--------
rrrrrrrr
00000111
bbbbbbbb
10010-10
bbbbb-bb
--------
brrrrrrr
-------00000000
00000000
rrrrrrrr
rrrrrrrr
rrrrrrrr
10100000
bbbbbbbb
000--100
00000000
bbb--bbb
bbbbbbbb
0000---1-000000
10100101
----0100
---01010
0-100000
10100100
bbbbrrrr
b-bbbbbb
bbbbbbbb
----bbbb
---bbbbb
r-rrrrrr
bbbbbbbb
00000000
00000000
--------------11111111
11111111
00000000
----0000
00000--0
0000000-
bbbbbbbb
bbbbbbbb
rrrrrrrr
rrrrrrrr
rrrrrrrr
rrrrrrrr
bbbbbbbb
----bbbb
wwwww--w
bbbbbbb-
00000000
bbbbbbbb
00000000
00000000
00000000
00000000
00000011
00000000
00000000
wwwwwwww
wwwwwwww
wwwwwwww
wwwwwwww
wwwwwwww
wwwwwwww
wwwwwwww
--------------Note 5
Note 6
Note 7
NA
wwwwwwww
rrrrrrrr
bbbbbbbb
bbbbbbbb
bbbbbbbb
rrrrrrrr
Not Used
TX INV
RSVD
RSVD
RSVD
RSVD
ALL SLOW
Notes
1. b = read/write; r = read only; w = write only; ‘-’ = not used, default value is undefined.
2. Registers must be configured or accessed only when the radio is in IDLE or SLEEP mode. The PMU, GPIOs, and RSSI registers can be accessed in Active Tx and
Rx mode.
3. PFET Bit: Setting this bit to "1" disables the FET, therefore safely allowing Vbat to be connected to a separate reference from Vcc when the PMU is disabled to the radio.
4. EOP_CTRL_ADR[6:4] must never have the value of “000”, that is, EOP Hint Symbol count must never be “0”
5. SOP_CODE_ADR default = 0x17FF9E213690C782.
6. DATA_CODE_ADR default = 0x02F9939702FA5CE3012BF1DB0132BE6F.
7. PREAMBLE_ADR default = 0x333302. The count value must be great than 4 for DDR and greater than 8 for SDR.
Document #: 38-16015 Rev. *J
Page 14 of 28
[+] Feedback
CYRF6936
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage Temperature .................................. –65°C to +150°C
Ambient Temperature with Power Applied.. –55°C to +125°C
Supply Voltage on any power supply pin
relative to VSS ...............................................–0.3 V to +3.9 V
DC Voltage to Logic Inputs[8] .................–0.3 V to VI/O +0.3 V
DC Voltage applied to Outputs
in High-Z State.......................................–0.3 V to VI/O +0.3 V
Static Discharge Voltage (Digital)[9] .......................... >2000 V
Static Discharge Voltage (RF)[9] ................................ 1100 V
Latch Up Current .....................................+200 mA, –200 mA
Operating Conditions
VCC ...................................................................2.4 V to 3.6 V
VI/O ...................................................................1.8 V to 3.6 V
VBAT ..................................................................1.8 V to 3.6 V
TA (Ambient Temperature Under Bias) ............. 0°C to +70°C
Ground Voltage................................................................. 0 V
FOSC (Crystal Frequency)........................... 12 MHz ±30 ppm
DC Characteristics
(T = 25°C, VBAT = 2.4 V, PMU disabled, fOSC = 12.000000 MHz)
Parameter
VBAT
Description
Conditions
Min
Typ
Battery Voltage
0–70°C
1.8
[10]
PMU Output Voltage
2.4 V mode
2.4
2.43
VREG[10]
PMU Output Voltage
2.7 V mode
2.7
2.73
VI/O[11]
VI/O Voltage
VCC
VCC Voltage
0–70°C
VOH1
Output High Voltage Condition 1
At IOH = –100.0 µA
VI/O – 0.2
VI/O
VOH2
Output High Voltage Condition 2
At IOH = –2.0 mA
VI/O – 0.4
VI/O
VOL
Output Low Voltage
At IOL = 2.0 mA
VIH
Input High Voltage
VIL
Input Low Voltage
IIL
Input Leakage Current
0 < VIN < VI/O
CIN
Pin Input Capacitance
except XTAL, RFN, RFP, RFBIAS
ICC (GFSK)[13]
Average TX ICC, 1 Mbps, slow channel PA = 5, 2 way, 4 bytes/10 ms
0.87
ICC (32-8DR)[13]
Average TX ICC, 250 kbps, fast channel PA = 5, 2 way, 4 bytes/10 ms
1.2
ISB[14]
Sleep Mode ICC
0.8
[14]
VREG
ISB
Max
Unit
3.6
V
V
V
1.8
3.6
V
2.4[12]
3.6
V
0
V
V
0.45
V
0.7 VI/O
VI/O
V
0
0.3 VI/O
V
0.26
+1
µA
3.5
10
–1
pF
mA
mA
10
µA
Sleep Mode ICC
PMU enabled
31.4
µA
IDLE ICC
Radio off, XTAL Active
XOUT disabled
1.0
mA
Isynth
ICC during Synth Start
8.4
mA
TX ICC
ICC during Transmit
PA = 5 (–5 dBm)
20.8
mA
TX ICC
ICC during Transmit
PA = 6 (0 dBm)
26.2
mA
TX ICC
ICC during Transmit
PA = 7 (+4 dBm)
34.1
mA
RX ICC
ICC during Receive
LNA off, ATT on
18.4
mA
RX ICC
ICC during Receive
LNA on, ATT off
21.2
mA
Boost Eff
PMU Boost Converter Efficiency
VBAT = 2.5 V, VREG = 2.73 V,
ILOAD = 20 mA
81
%
ILOAD_EXT[15]
Average PMU External Load current
VBAT = 1.8 V, VREG = 2.73 V,
0–50°C, RX Mode
15
mA
ILOAD_EXT[15]
Average PMU External Load current
VBAT = 1.8 V, VREG = 2.73 V, 50–70°C, RX
Mode
10
mA
Notes
8. It is permissible to connect voltages above VI/O to inputs through a series resistor limiting input current to 1 mA. AC timing not guaranteed.
9. Human Body Model (HBM).
10. VREG depends on battery input voltage.
11. In sleep mode, the I/O interface voltage reference is VBAT.
12. In sleep mode, VCC min. can be as low as 1.8 V.
13. Includes current drawn while starting crystal, starting synthesizer, transmitting packet (including SOP and CRC16), changing to receive mode, and receiving ACK
handshake. Device is in sleep except during this transaction.
14. ISB is not guaranteed if any I/O pin is connected to voltages higher than VI/O.
15. ILOAD_EXT is dependent on external components and this entry applies when the components connected to L/D are SS12 series diode and DH53100LC inductor from
Sumida.
Document #: 38-16015 Rev. *J
Page 15 of 28
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CYRF6936
AC Characteristics[16]
Table 7. SPI Interface[17]
Parameter
Description
tSCK_CYC
SPI Clock Period
tSCK_HI
Min
Typ
Max
Unit
238.1
ns
SPI Clock High Time
100
ns
tSCK_LO
SPI Clock Low Time
100
ns
tDAT_SU
SPI Input Data Setup Time
25
ns
tDAT_HLD
SPI Input Data Hold Time
10
ns
tDAT_VAL
SPI Output Data Valid Time
0
tDAT_VAL_TRI
SPI Output Data Tri-state (MOSI from Slave Select Deassert)
tSS_SU
SPI Slave Select Setup Time before first positive edge of SCK[18]
10
ns
tSS_HLD
SPI Slave Select Hold Time after last negative edge of SCK
10
ns
tSS_PW
SPI Slave Select Minimum Pulse Width
20
ns
tSCK_SU
SPI Slave Select Setup Time
10
ns
tSCK_HLD
SPI SCK Hold Time
10
ns
tRESET
Minimum RST Pin Pulse Width
10
ns
50
ns
20
ns
Figure 10. SPI Timing
tSCK_CYC
tSCK_HI
SCK
tSCK_LO
tSCK_HLD
tSCK_SU
nSS
tSS_SU
tDAT_SU
tSS_HLD
tDAT_HLD
MOSI input
tDAT_VAL
tDAT_VAL_TRI
MISO
MOSI output
Notes
16. AC values are not guaranteed if voltage on any pin exceeding VI/O.
17. CLOAD = 30 pF
18. SCK must start low at the time SS goes LOW, otherwise the success of SPI transactions are not guaranteed.
Document #: 38-16015 Rev. *J
Page 16 of 28
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CYRF6936
RF Characteristics
Table 8. Radio Parameters
Parameter Description
Conditions
RF Frequency Range
Note 19
Receiver (T = 25°C, VCC = VBAT = 3.0 V, fOSC = 12.000000 MHz, BER < 1E-3)
Sensitivity 125 kbps 64-8DR
BER 1E-3
Sensitivity 250 kbps 32-8DR
Min
BER 1E-3
Sensitivity
CER 1E-3
Sensitivity GFSK
BER 1E-3, ALL SLOW = 1
Typ
2.400
–80
Max
Unit
2.497
GHz
–97
dBm
–93
dBm
–87
dBm
–84
dBm
LNA Gain
22.8
dB
ATT Gain
–31.7
dB
Maximum Received Signal
LNA On
RSSI Value for PWRin –60 dBm[20]
LNA On
–15
RSSI Slope
–6
dBm
21
Count
1.9
dB/Count
9
dB
Interference Performance (CER 1E-3)
Co-channel Interference rejection
Carrier-to-Interference (C/I)
C = –60 dBm
Adjacent (±1 MHz) channel selectivity C/I 1 MHz
C = –60 dBm
3
dB
Adjacent (±2 MHz) channel selectivity C/I 2 MHz
C = –60 dBm
–30
dB
Adjacent (> 3 MHz) channel selectivity C/I > 3 MHz
C = –67 dBm
–38
dB
Out-of-Band Blocking 30 MHz–12.75 MHz[21]
C = –67 dBm
–30
dBm
Intermodulation
C = –64 dBm, Δf = 5,10 MHz
–36
dBm
Receive Spurious Emission
800 MHz
100 kHz ResBW
–79
dBm
1.6 GHz
100 kHz ResBW
–71
dBm
3.2 GHz
100 kHz ResBW
–65
dBm
Transmitter (T = 25°C, VCC = 3.0 V)
Maximum RF Transmit Power
PA = 7
+2
4
+6
dBm
Maximum RF Transmit Power
PA = 6
–2
0
+2
dBm
Maximum RF Transmit Power
PA = 5
–7
–5
–3
Maximum RF Transmit Power
PA = 0
–35
39
dB
RF Power Range Control Step Size
Seven steps, monotonic
5.6
dB
Frequency Deviation Min
PN Code Pattern 10101010
270
kHz
Frequency Deviation Max
PN Code Pattern 11110000
323
kHz
Error Vector Magnitude (FSK error)
>0 dBm
Occupied Bandwidth
–6 dBc, 100 kHz ResBW
RF Power Control Range
dBm
dBm
10
%rms
876
kHz
In-band Spurious Second Channel Power (±2 MHz)
–38
dBm
In-band Spurious Third Channel Power (>3 MHz)
–44
dBm
500
Transmit Spurious Emission (PA = 7)
Notes
19. Subject to regulation.
20. RSSI value is not guaranteed. Extensive variation from part to part.
21. Exceptions F/3 & 5C/3.
Document #: 38-16015 Rev. *J
Page 17 of 28
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CYRF6936
Table 8. Radio Parameters (continued)
Parameter Description
Conditions
Min
Typ
Max
Unit
Non-Harmonically Related Spurs (800 MHz)
–38
dBm
Non-Harmonically Related Spurs (1.6 GHz)
–34
dBm
Non-Harmonically Related Spurs (3.2 GHz)
–47
dBm
Harmonic Spurs (Second Harmonic)
–43
dBm
Harmonic Spurs (Third Harmonic)
–48
dBm
Fourth and Greater Harmonics
–59
dBm
Power Management (Crystal PN# eCERA GF-1200008)
Crystal Start to 10ppm
0.7
1.3
0.6
ms
Crystal Start to IRQ
XSIRQ EN = 1
Synth Settle
Slow channels
270
ms
µs
Synth Settle
Medium channels
180
µs
Synth Settle
Fast channels
100
µs
Link Turnaround Time
GFSK
30
µs
Link Turnaround Time
250 kbps
62
µs
Link Turnaround Time
125 kbps
94
µs
Link Turnaround Time
<125 kbps
31
µs
Max Packet Length
<60 ppm crystal-to-crystal
all modes except 64-DDR and
64-SDR
40
bytes
Max Packet Length
<60 ppm crystal-to-crystal
64-DDR and 64-SDR
16
bytes
Document #: 38-16015 Rev. *J
Page 18 of 28
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CYRF6936
Typical Operating Characteristics[22]
Transmit Power vs. Temperature
(Vcc = 2.7v)
Transmit Power vs. Channel
Transmit Power vs. Vcc
(PMU off)
6
6
PA6
0
-2
-4
PA5
-6
-8
-10
PA4
-12
0
20
2
PA6
0
-2
-4
PA5
-6
-8
-10
PA4
-12
-14
40
-14
2.4
60
Output Power (dBm)
2
2.6
2.8
3
3.2
3.4
PA5
-6
-8
-10
PA4
0
3.6
20
40
20
19
18
ATT ON
LNA OFF
RSSI Count
RSSI Count
LNA OFF
80
Average RSSI vs. Vcc
(Rx signal = -70dBm)
17
LNA ON
60
Channel
19
24
RSSI Count
-4
-12
18
16
15
17
16
15
14
13
14
12
13
11
10
2.4
12
-100
-80
-60
-40
0
-20
20
40
60
RSSI vs. Channel
(Rx signal = -70dBm)
12
10
8
6
4
2
0
40
60
-82
-84
-86
CER
-88
-90
8DR32
-92
-94
2.4
80
3.2
3.4
3.6
-80
Receiver Sensitivity (dBm)
Receiver Sensitivity (dBm)
14
3
Rx Sensitivity vs. Temperature
(1Mbps CER)
-80
16
20
2.8
Vcc
Rx Sensitivity vs. Vcc
(1Mbps CER)
18
0
2.6
Temp (deg C)
Input Power (dBm)
RSSI Count
-2
Average RSSI vs. Temperature
(Rx signal = -70dBm)
32
0
-120
PA6
0
Vcc
Typical RSSI Count vs Input Power
8
2
-14
Temp (deg C)
16
PA7
4
PA7
4
Output Power (dBm)
Output Power (dBm)
6
PA7
4
-82
-84
-86
CER
-88
-90
8DR32
-92
-94
2.6
2.8
Channel
3
3.2
3.4
3.6
0
20
Vcc
Receiver Sensitivity vs. Frequency Offset
40
60
Temp (deg C)
Receiver Sensitivity vs Channel
(3.0v, Room Temp)
Carrier to Interferer
(Narrow band, LP modulation)
-82
-84
GFSK
-86
-88
-90
DDR32
-92
-94
8DR64
-96
-98
-150
-100
-50
0
50
Crystal Offset (ppm)
100
150
-81
20.0
GFSK
-83
10.0
0.0
-85
C/I (dB)
Receiver Sensitivity (dBm)
Receiver Sensitivity (dBm)
-80
CER
-87
-89
-91
20
-30.0
-50.0
8DR32
-95
0
-20.0
-40.0
DDR32
-93
-10.0
40
Channel
60
80
-60.0
-10
-5
0
5
10
Channel Offset (MHz)
Note
22. With LNA on, ATT off, above -2dBm erroneous RSSI values may be read. Cross-checking RSSI with LNA off/on is recommended for accurate readings.
Document #: 38-16015 Rev. *J
Page 19 of 28
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CYRF6936
Typical Operating Characteristics (continued)
10
10
3
1
1
GFSK vs. BER
(SOP Threshold = 5, C38 slow)
BER vs. Data Threshold (32-8DR)
(SOP Threshold = 5, C38 slow)
BER vs. Data Threshold (32-DDR)
(SOP Threshold = 5, C38 slow)
0
100
0 Thru 7
10
1
6
0.01
0.01
0.001
0.0001
0.0001
0.00001
-100
-95
-90
-85
-80
-75
0.0001
0.00001
-100
-70
-95
-90
ICC RX
(LNA OFF)
-75
-70
19.5
V
V
V
V
19
18.5
18
17.5
3.3
3.0
2.7
2.4
24
23.5
23
22.5
OPERATING CURRENT (mA)
3.3
3.0
2.7
2.4
20
V
V
V
V
22
21.5
21
20.5
20
19.5
17
19
5
10 15 20 25 30 35 40 45 50 55 60 65 70
0
5
0
5
V
V
V
V
15.5
15
14.5
OPERATING CURRENT (mA)
16
16.5
16
15
14.5
5
0
10 15 20 25 30 35 40 45 50 55 60 65 70
16
15.5
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
Document #: 38-16015 Rev. *J
10 15 20 25 30 35 40 45 50 55 60 65 70
ICC TX @ PA4
20.5
3.3
3.0
2.7
2.4
18.5
18
V
V
V
V
17.5
17
16.5
16
3.3
3.0
2.7
2.4
20
19.5
19
V
V
V
V
18.5
18
17.5
17
15.5
15
5
TEMPERATURE (C)
OPERATING CURRENT (mA)
16.5
OPERATING CURRENT (mA)
17
V
V
V
V
15.5
19
V
V
V
V
3.3
3.0
2.7
2.4
17
ICC TX @ PA3
ICC TX @ PA2
3.3
3.0
2.7
2.4
10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
18
V
V
V
V
14
0
TEMPERATURE (C)
17.5
0
17.5
3.3
3.0
2.7
2.4
16.5
10 15 20 25 30 35 40 45 50 55 60 65 70
-20
ICC TX @ PA1
14
0
5
ICC TX @ PA0
OPERATING CURRENT (mA)
V
V
V
V
-40
TEMPERATURE (C)
17
3.3
3.0
2.7
2.4
3.3
3.0
2.7
2.4
TEMPERATURE (C)
ICC TX SYNTH
9.2
9.1
9
8.9
8.8
8.7
8.6
8.5
8.4
8.3
8.2
8.1
8
7.9
7.8
9.2
9.1
9
8.9
8.8
8.7
8.6
8.5
8.4
8.3
8.2
8.1
8
7.9
7.8
10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
-60
ICC RX SYNTH
24.5
20.5
-80
Input Power (dBm)
ICC RX
(LNA ON)
OPERATING CURRENT (mA)
OPERATING CURRENT (mA)
-80
25
21
OPERATING CURRENT (mA)
-85
GFSK
0.00001
-100
Input Power (dBm)
Input Power (dBm)
OPERATING CURRENT (mA)
0.01
0.001
0.001
0
0.1
%BER
%BER
%BER
1
0.1
0.1
16.5
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
Page 20 of 28
[+] Feedback
CYRF6936
Typical Operating Characteristics (continued)
ICC TX @ PA5
3.3
3.0
2.7
2.4
22.5
22
29.5
V
V
V
V
21.5
21
20.5
20
3.3
3.0
2.7
2.4
29
28.5
28
V
V
V
V
OPERATING CURRENT (mA)
23
OPERATING CURRENT (mA)
OPERATING CURRENT (mA)
ICC TX @ PA7
ICC TX @ PA6
30
23.5
27.5
27
26.5
26
25.5
25
19.5
24.5
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70
0
40.5
40
39.5
39
38.5
38
37.5
37
36.5
36
35.5
35
34.5
34
33.5
33
32.5
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
3.3
3.0
2.7
2.4
V
V
V
V
5 10 15 20 25 30 35 40 45 50 55 60 65 70
TEMPERATURE (C)
TEMPERATURE (C)
Figure 11. AC Test Loads and Waveforms for Digital Pins
AC Test Loads
DC Test Load
OUTPUT
OUTPUT
5 pF
30 pF
INCLUDING
JIG AND
SCOPE
VCC
R1
OUTPUT
INCLUDING
JIG AND
Typical
SCOPE
Max
R2
ALL INPUT PULSES
Parameter
R1
R2
RTH
VTH
VCC
1071
937
500
1.4
3.00
Document #: 38-16015 Rev. *J
Unit
Ω
Ω
Ω
V
V
VCC
GND
90%
10%
Rise time: 1 V/ns
90%
10%
Fall time: 1 V/ns
THÉVENIN EQUIVALENT
RTH
VTH
OUTPUT
Equivalent to:
Page 21 of 28
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CYRF6936
Ordering Information
Part Number
CYRF6936-40LFXC
CYRF6936-40LTXC
Radio
Transceiver
Transceiver
Package Name
Package Type
40-Pin QFN
40-Pin Quad Flat Package Pb-free
40-Pin QFN
40-Pin QFN (Sawn type)
Operating Range
Commercial
Commercial
Ordering Code Definitions
CY RF 6936 40L(F,T)X C
Temperature range:
Commercial
40-pin package
F = QFN; T = Sawn QFN
X = Pb-free
Part Number
Marketing Code: RF = Wireless
(radio frequency) product line
Company ID: CY = Cypress
Document #: 38-16015 Rev. *J
Page 22 of 28
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CYRF6936
Package Description
Figure 12. 40-Pin Pb-free QFN 6 × 6 mm
SOLDERABLE
EXPOSED
PAD
001-12917 *C
The recommended dimension of the PCB pad size for the E-PAD underneath the QFN is 3.5 mm × 3.5 mm (width × length).
Document #: 38-16015 Rev. *J
Page 23 of 28
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CYRF6936
Figure 13. 40-Pin Sawn QFN (6 × 6 × 0.90 mm)
001-44328 *D
Document #: 38-16015 Rev. *J
Page 24 of 28
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CYRF6936
Acronyms
Document Conventions
Table 9. Acronyms Used in this Document
Units of Measure
Acronym
Description
Table 10. Units of Measure
ACK
Acknowledge (packet received, no errors)
BER
Bit error rate
°C
degree Celsius
BOM
Bill of materials
dB
decibels
CMOS
Complementary metal oxide semiconductor
dBc
decibel relative to carrier
CRC
Cyclic redundancy check
dBm
decibel-milliwatt
GFSK
Gaussian frequency-shift keying
Hz
hertz
HBM
Human body model
KB
1024 bytes
ISM
Industrial, scientific, and medical
Kbit
1024 bits
kHz
kilohertz
kΩ
kilohm
MHz
megahertz
MΩ
megaohm
μA
microampere
Symbol
Unit of Measure
IRQ
Interrupt request
MCU
Microcontroller unit
QFN
Quad flat no-leads
RSSI
Received signal strength indication
RF
Radio frequency
μs
microsecond
Rx
Receive
μV
microvolts
Tx
Transmit
μVrms
microvolts root-mean-square
μW
microwatts
mA
milliampere
ms
millisecond
mV
millivolts
nA
nanoampere
ns
nanosecond
nV
nanovolts
Ω
ohm
pp
peak-to-peak
ppm
parts per million
ps
picosecond
V
volts
Document #: 38-16015 Rev. *J
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CYRF6936
Document History Page
Description Title: CYRF6936 WirelessUSB™ LP 2.4 GHz Radio SoC
Document Number: 38-16015
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
**
307437
TGE
See ECN
New data sheet
*A
377574
TGE
See ECN
Preliminary release–
- updated Section 1.0 - Features
- updated Section 2.0 - Applications
- added Section 3.0 - Applications Support
- updated Section 4.0 - Functional Descriptions
- updated Section 5.0 - Pin Description
- added Figure 5-1
- updated Section 6.0 - Functional Overview
- added Section 7.0 - Functional Block Overview
- added Section 9.0 - Register Descriptions
- updated Section 10.0 - Absolute Maximum Ratings
- updated Section 11.0 - Operating Conditions
- updated Section 12.0 - DC Characteristics
- updated Section 13.0 - AC Characteristics
- updated Section 14.0 - RF Characteristics
- added Section 16.0 - Ordering Information
*B
398756
TGE
See ECN
ES-10 update- changed part no.
- updated Section 9.0 - Register Descriptions
- updated Section 12.0 - DC Characteristics
- updated Section 14.0 - RF Characteristics
*C
412778
TGE
See ECN
ES-10 update- updated Section 4.0 - Functional Descriptions
- updated Section 5.0 - Pin Descriptions
- updated Section 6.0 - Functional Overview
- updated Section 7.0 - Functional Block Overview
- updated Section 9.0 - Register Descriptions
- updated Section 10.0 - Absolute Maximum Ratings
- updated Section 11.0 - Operating Conditions
- updated Section 14.0 - RF Characteristics
*D
435578
TGE
See ECN
- updated Section 1.0 - Features
- updated Section 5.0 - Pin Descriptions
- updated Section 6.0 - Functional Overview
- updated Section 7.0 - Functional Block Overview
- updated Section 9.0 - Register Descriptions
- added Section 10.0 - Recommended Radio Circuit Schematic
- updated Section 11.0 - Absolute Maximum Ratings
- updated Section 12.0 - Operating Conditions
- updated Section 13.0 - DC Characteristics
- updated Section 14.0 - AC Characteristics
- updated Section 15.0 - RF Characteristics
*E
460458
BOO
See ECN
Final data sheet - removed “Preliminary” notation
*F
487261
TGE
See ECN
- updated Section 1.0 - Features
- updated Section 5.0 - Pin Descriptions
- updated Section 6.0 - Functional Overview
- updated Section 7.0 - Functional Block Overview
- updated Section 8.0 - Application Example
- updated Section 9.0 - Register Descriptions
- updated Section 12.0 - DC Characteristics
- updated Section 13.0 - AC Characteristics
- updated Section 14.0 - RF Characteristics
- added Section 15.0 - Typical Operating Characteristics
Document #: 38-16015 Rev. *J
Page 26 of 28
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CYRF6936
Document History Page
(continued)
Description Title: CYRF6936 WirelessUSB™ LP 2.4 GHz Radio SoC
Document Number: 38-16015
Orig. of
Submission
Revision
ECN
Description of Change
Change
Date
*G
778236
OYR/ARI
See ECN
-modified radio function register descriptions
-changed L/D pin description
-footnotes added
-changed RST Capacitor from 0.1uF to 0.47 uF
-updated Figure 9, Recommended Circuit for Systems
-updated Table 3, Recommended bill of materials for systems
-updated package diagram from ** to *A
*H
2640987 VNY/OYR/TGE/
02/20/2009
-Removed range values in features description
AESA
-Bit level register details removed and appended to the Wireless LP and
PRoC TRM
-updated register summary table 4
-updated pin description diagram (figure 1)
-updated the schematic of the radio (figure 10).
-Removed Backward Compatibility section.
-Removed Table 2
-Updated RF table characteristics for Payload size
-Added pkg diagram 001-12917
-Updated BOM Table 4 on page 10.
-Updated Table 8 on page 17 with Receiver information (T = 25°C,
VCC = VBAT = 3.0 V, fOSC = 12.000000 MHz, BER < 1E-3)
*I
2673333
TGE/PYRS
03/13/2009
Corrected Figure 9 on page 12
Updated packaging and ordering information for 40 QFN (sawn)
package
*J
3232571
JCJC
04/18/2011
Added section Receive Spurious Response on page 9.
Added note # 20 and referred in Table 8 on page 17.
Updated template as per new Cypress standards.
Added ordering code definitions, acronyms, and units of measure.
Updated package diagrams:
001-12917: *A to *C
001-44328: *C to *D
Document #: 38-16015 Rev. *J
Page 27 of 28
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CYRF6936
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2005-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-16015 Rev. *J
Revised April 18, 2011
Page 28 of 28
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