Toshiba CRG05 General-purpose rectifier application Datasheet

CRG05
TOSHIBA Rectifier Silicon Diffused Type
CRG05
General-Purpose Rectifier Applications
Repetitive peak reverse voltage: VRRM = 800 V
Average forward current: IF (AV) = 1.0 A
Average forward voltage: VFM = 1.2V (Max.)
•
Suitable for high-density board assembly due to the use of a small
surface-mount package, S−FLAT
0.65 ± 0.2
•
•
0.65 ± 0.2
②
2.6 ± 0.1
3.5 ± 0.2
•
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
0.9 ± 0.1
0.16
+ 0.2
1.6 − 0.1
Rating
Unit
Repetitive Peak Reverse Voltage
VRRM
800
V
Average Forward Current
IF (AV)
1.0(Note1)
A
IFSM
15.0 (50Hz)
A
Tj
−40 to 150
°C
Tstg
−40 to 150
°C
Peak One Cycle Surge Forward
Current (Non−Repetitive)
Junction Temperature
Storage Temperature Range
Note 1: Ta=54°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
0.98 ± 0.1
Symbol
0 ~ 0.1
Characteristics
①
① ANODE
② CATHODE
JEDEC
―
JEITA
―
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
board thickness: 0.64 mm
Half-sine waveform: α =180°
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
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CRG05
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Peak forward voltage
Repetitive peak reverse current
Min
Typ.
Max
Unit
VFM(1)
IFM = 0.1 A (Pulse test)
⎯
0.86
⎯
V
VFM(2)
IFM = 0.7 A (Pulse test)
⎯
1.0
⎯
V
VFM(3)
IFM = 1.0 A (Pulse test)
⎯
1.05
1.2
V
VRRM = 800 V (Pulse test)
⎯
⎯
10
μA
⎯
⎯
65
IRRM
Rth (j-a)
Thermal resistance
Test Condition
Rth (j-ℓ)
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64 mm
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
―
°C/W
⎯
⎯
130
⎯
⎯
20
°C/W
Marking
Abbreviation Code
Part No.
G5
CRG05
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The
followings are the general derating methods that we recommend when you design a circuit with a device.
VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum
rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit.
VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
at low temperature.
IF(AV): We recommend that the worst case current be no greater than 80% of the maximum rating of IF(AV). Carry out
adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an
allowable Ta max-IF(AV) curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
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CRG05
iF – vF
PF (AV) – IF (AV)
10
1.4
Half-sine waveform
Average forward power dissipation
PF (AV) (W)
Instantaneous forward current
iF (A)
Pulse test
Tj = 150°C
1
75°C
25°C
0.1
0.01
0
0.4
0.8
1.2
1.6
2.0
Instantaneous forward voltage vF
1.2
1.0
0°
0.8
0.6
0.4
0.2
0
0
2.4
180°
Conduction angle 180°
0.2
0.4
Ta max – IF (AV)
IF (AV)
(A)
Half-sine waveform
140
0°
180°
Conduction angle 180°
100
1.4
160
Half-sine waveform
120
1.2
Device mounted on a ceramic board
(Board size: 50mm x 50mm, Soldering land: 2mm x 2mm)
80
60
40
20
Maximum allowable temperature
Ta max (°C)
Maximum allowable temperature
Ta max (°C)
1.0
Ta max – IF (AV)
140
0
0
0.8
Average forward current
(V)
Device mounted on a glass-epoxy board
(Board size: 50mm x 50mm, Soldering land: 6mm x 6mm)
160
0.6
120
0°
100
180°
Conduction angle 180°
80
60
40
20
0.2
0.4
0.6
Average forward current
0.8
1.0
IF (AV)
(A)
0
0
1.2
0.2
0.4
0.6
Average forward current
0.8
1.0
IF (AV)
(A)
1.2
Surge forward current
rth (j-a) – t
(non-repetitive)
10000
Ta = 25°C
f = 50 Hz
(1) Device mounted on a ceramic board:
Soldering land: 2 mm × 2 mm
Transient thermal impedance
rth (j-a) (°C/W)
Peak surge forward current
IFSM (A)
16
12
8
4
0
1
3
5
10
30
50
1000
(2) Device mounted on a glass-epoxy board:
Soldering land: 6 mm × 6 mm
100
(2)
(1)
10
1
0.001
100
Number of cycles
0.01
0.1
1
10
100
Time t (s)
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CRG05
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Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
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