CRG05 TOSHIBA Rectifier Silicon Diffused Type CRG05 General-Purpose Rectifier Applications Repetitive peak reverse voltage: VRRM = 800 V Average forward current: IF (AV) = 1.0 A Average forward voltage: VFM = 1.2V (Max.) • Suitable for high-density board assembly due to the use of a small surface-mount package, S−FLAT 0.65 ± 0.2 • • 0.65 ± 0.2 ② 2.6 ± 0.1 3.5 ± 0.2 • Unit: mm Absolute Maximum Ratings (Ta = 25°C) 0.9 ± 0.1 0.16 + 0.2 1.6 − 0.1 Rating Unit Repetitive Peak Reverse Voltage VRRM 800 V Average Forward Current IF (AV) 1.0(Note1) A IFSM 15.0 (50Hz) A Tj −40 to 150 °C Tstg −40 to 150 °C Peak One Cycle Surge Forward Current (Non−Repetitive) Junction Temperature Storage Temperature Range Note 1: Ta=54°C Device mounted on a ceramic board board size: 50 mm × 50 mm soldering land: 2 mm ×2 mm 0.98 ± 0.1 Symbol 0 ~ 0.1 Characteristics ① ① ANODE ② CATHODE JEDEC ― JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) board thickness: 0.64 mm Half-sine waveform: α =180° Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 1 2008-02-01 CRG05 Electrical Characteristics (Ta = 25°C) Characteristics Symbol Peak forward voltage Repetitive peak reverse current Min Typ. Max Unit VFM(1) IFM = 0.1 A (Pulse test) ⎯ 0.86 ⎯ V VFM(2) IFM = 0.7 A (Pulse test) ⎯ 1.0 ⎯ V VFM(3) IFM = 1.0 A (Pulse test) ⎯ 1.05 1.2 V VRRM = 800 V (Pulse test) ⎯ ⎯ 10 μA ⎯ ⎯ 65 IRRM Rth (j-a) Thermal resistance Test Condition Rth (j-ℓ) Device mounted on a ceramic board Board size: 50 mm × 50 mm Soldering land: 2 mm × 2 mm Board thickness: 0.64 mm Device mounted on a glass-epoxy board Board size: 50 mm × 50 mm Soldering land: 6 mm × 6 mm Board thickness: 1.6 mm ― °C/W ⎯ ⎯ 130 ⎯ ⎯ 20 °C/W Marking Abbreviation Code Part No. G5 CRG05 Standard Soldering Pad Unit: mm 1.2 1.2 2.8 Handling Precaution The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The followings are the general derating methods that we recommend when you design a circuit with a device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the maximum rating of IF(AV). Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an allowable Ta max-IF(AV) curve. This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. 2 2008-02-01 CRG05 iF – vF PF (AV) – IF (AV) 10 1.4 Half-sine waveform Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) Pulse test Tj = 150°C 1 75°C 25°C 0.1 0.01 0 0.4 0.8 1.2 1.6 2.0 Instantaneous forward voltage vF 1.2 1.0 0° 0.8 0.6 0.4 0.2 0 0 2.4 180° Conduction angle 180° 0.2 0.4 Ta max – IF (AV) IF (AV) (A) Half-sine waveform 140 0° 180° Conduction angle 180° 100 1.4 160 Half-sine waveform 120 1.2 Device mounted on a ceramic board (Board size: 50mm x 50mm, Soldering land: 2mm x 2mm) 80 60 40 20 Maximum allowable temperature Ta max (°C) Maximum allowable temperature Ta max (°C) 1.0 Ta max – IF (AV) 140 0 0 0.8 Average forward current (V) Device mounted on a glass-epoxy board (Board size: 50mm x 50mm, Soldering land: 6mm x 6mm) 160 0.6 120 0° 100 180° Conduction angle 180° 80 60 40 20 0.2 0.4 0.6 Average forward current 0.8 1.0 IF (AV) (A) 0 0 1.2 0.2 0.4 0.6 Average forward current 0.8 1.0 IF (AV) (A) 1.2 Surge forward current rth (j-a) – t (non-repetitive) 10000 Ta = 25°C f = 50 Hz (1) Device mounted on a ceramic board: Soldering land: 2 mm × 2 mm Transient thermal impedance rth (j-a) (°C/W) Peak surge forward current IFSM (A) 16 12 8 4 0 1 3 5 10 30 50 1000 (2) Device mounted on a glass-epoxy board: Soldering land: 6 mm × 6 mm 100 (2) (1) 10 1 0.001 100 Number of cycles 0.01 0.1 1 10 100 Time t (s) 3 2008-02-01 CRG05 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. 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