Fairchild FSUSB30L10X Low-power 2-port hi-speed usb 2.0 (480mbps) switch Datasheet

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FSUSB30
Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Features
■
■
■
■
■
■
■
General Description
Low On Capacitance, 3.7pF (typical)
Low On Resistance, 6.5Ohm (typical)
Low power consumption (1µA maximum)
– 10µA maximum ICCT over an expanded control
voltage range (VIN = 2.6V, VCC = 4.3V)
Wide -3dB bandwidth, >720MHz
8KV ESD protection
Power-Off protection when VCC = 0V; D+/ D- pins can
tolerate up to 5.25V
Packaged in:
– Pb-Free 10-lead MicroPak™ (1.6 x 2.1mm)
– Pb-Free 14-lead DQFN
– Pb-Free 10-lead MSOP
– Pb-Free 10-lead UMLP (1.4 x 1.8mm)
Applications
■
Cell phone, PDA, Digital Camera, and Notebook LCD
Monitor, TV, and Set-top Box
Related Application Notes
■
AN-6022 Using the FSUSB30 / FSUSB31 to Comply
with USB 2.0 Fault Condition Requirements
The FSUSB30 is a low-power, two-port, high-speed USB
2.0 switch. Configured as a double-pole double-throw
(DPDT) switch, it is optimized for switching between two
high-speed (480Mbps) sources or a Hi-Speed and FullSpeed (12Mbps) source. The FSUSB30 is compatible
with the requirements of USB2.0 and features an
extremely low on capacitance (CON) of 3.7pF. The wide
bandwidth of this device (720MHz), exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
The FSUSB30 contains special circuitry on the D+/ Dpins which allows the device to withstand an overvoltage
condition when powered off. This device is also designed
to minimize current consumption even when the control
voltage applied to the S pin, is lower than the supply voltage (VCC). This feature is especially valuable to ultraportable applications such as cell phones, allowing for
direct interface with the general purpose I/Os of the
baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs,
digital cameras, printers, and notebook computers.
Ordering Information
Order
Number
Package
Number
Product Code
Top Mark
Pb-Free
FSUSB30L10X
MAC010A
FJ
Yes
10-Lead MicroPak, 1.6 x 2.1mm
Package Description
FSUSB30BQX
MLP014A
USB30
Yes
14-Terminal Depopulated Quad Very-Thin Flat Pack
No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
FSUSB30MUX
MUA10A
FSUSB30
Yes
10-Lead Molded Small Outline Package (MSOP),
JEDEC MO-187, 3.0mm Wide
FSUSB30UMX
MLP010A
GJ
Yes
10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
1D+
USB2.0
Controller
Set Top Box
(STB) CPU
or
DSP
Processor
VCC
FSUSB30
D+
1D–
USB
Connector
D–
2D+
DVR or
Mass Storage
2D–
Controller
Control
S
OE
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
January 2007
Analog Symbol
OE
HSD1–
HSD2–
D–
Pad Assignments for MicroPak
9
8
7
6
HSD1+
D+
HSD2+
HSD1–
D–
VCC
10
2
S
4
OE
HSD2+
D+
3
HSD1+
S
1
HSD2–
GND
5
(Top View)
Pin Descriptions
Pad Assignments for DQFN
NC
VCC
1
14
S
2
13
OE
HSD1+
3
12
HSD1–
NC
4
11
NC
HSD2+
5
10
HSD2–
D+
6
9
D–
7
Pin Name
Description
OE
Bus Switch Enable
S
Select Input
D+, D−, HSDn+, HSDn−
Data Ports
NC
No Connect
Truth Table
8
GND NC
(Top Through View)
Pin Assignment for MSOP
1
10
VCC
HSD1+
2
9
OE
HSD2+
3
8
HSD1–
D+
4
7
HSD2–
GND
5
6
D–
S
Control
S
OE
Function
X
HIGH
Disconnect
LOW
LOW
D+, D− = HSD1n
HIGH
LOW
D+, D− = HSD2n
(Top Through View)
9
Sel
10
HSD2–
VCC
7
6
1
2
HSD2+
8
HSD1+
OE
HSD1–
Pad Assignments for µMLP
5
D–
4
GND
3
D+
(Top Through View)
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
2
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Connection Diagrams
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol
VCC
VCNTRL
VSW
IIK
Parameter
Minimum
Maximum
Unit
-0.5
+4.6
V
Supply Voltage
(1)
DC Input Voltage
DC Switch Voltage(1)
-0.5
+4.6
V
HSDnX
0.5
VCC + 0.3
V
D+,D- when VCC > 0
0.5
VCC + 0.3
V
D+,D- when VCC = 0
-0.50
5.25
V
DC Input Diode Current
IOUT
DC Output Current
TSTG
Storage Temperature
ESD
Human Body Model
-50
mA
50
mA
+150
°C
All Pins
8
kV
I/O to GND
8
kV
-65
Note:
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed. DC switch voltage may never exceed 4.6V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.(2)
Symbol
Parameter
Minimum
Maximum
Unit
3.0
4.3
V
VCC
Supply Voltage
VIN
Control Input Voltage
0
VCC
V
VSW
Switch Input Voltage
0
VCC
V
-40
+85
°C
250
°C/W
TA
ΘJA
Operating Temperature
Thermal Resistance, 10 MicroPak
Note:
2. Control input must be held HIGH or LOW and it must not float.
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
3
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Absolute Maximum Ratings
All typical values are at 25°C unless otherwise specified.
Symbol
Parameter
VCC (V)
Conditions
VIK
Clamp Diode Voltage
VIH
Input Voltage HIGH
IIN = -18mA
TA = −40°C to +85°C
Min.
Typ.
Max.
3.0
-1.2
3.0 to 3.6
1.3
4.3
1.7
Unit
V
V
V
3.0 to 3.6
0.5
V
4.3
0.7
V
VIL
Input Voltage LOW
IIN
Control Input Leakage
VSW = 0.0V to VCC
4.3
-1.0
1.0
µA
IOZ
OFF State Leakage
0 ≤ Dn, HSD1n, HSD2n ≤ VCC
4.3
-2.0
2.0
µA
IOFF
Power OFF Leakage
Current (D+, D–)
VSW = 0V to 4.3V, VCC = 0V
0
-2.0
2.0
µA
RON
Switch On Resistance(3)
10.0
Ω
7.0
Ω
ΔRON
Delta
RON(4)
RON Flatness RON Flatness(3)
VSW = 0.4V, ION = -8mA
3.0
6.5
VSW = 0V, IO = 30mA at 25°C
3.6
VSW = 0.4V, ION = -8mA
3.0
0.35
Ω
VSW = 0.0V - 1.0V,
ION = -8mA
3.0
2.0
Ω
ICC
Quiescent Supply Current
VCNTRL = 0.0V or VCC,
IOUT = 0
4.3
1.0
µA
ICCT
Increase in ICC Current
per Control Voltage
VCNTRL (control input) = 2.6V
4.3
10.0
µA
Notes:
3. Measured by the voltage drop between Dn, HSD1n, HSD2n pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two ports.
4.Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC = 3.3V at 25°C unless otherwise specified.
Symbol
Parameter
VCC (V)
Conditions
TA = −40°C to +85°C
Figure
Number
Typ.
Max.
3.0 to 3.6
13.0
30.0
ns
Figure 8
HD1n, HD2n = 0.8V,
RL = 50Ω, CL = 5pF
3.0 to 3.6
12.0
25.0
ns
Figure 8
Propagation Delay(4)
RL = 50Ω, CL = 5pF
3.3
0.25
ns
Figure 6
Figure 7
tBBM
Break-Before-Make
RL = 50Ω, CL = 5pF,
VIN = 0.8V
3.0 to 3.6
ns
Figure 9
OIRR
Off Isolation
(Non-Adjacent)
f = 240MHz, RT = 50Ω
3.0 to 3.6
-30.0
dB
Figure 12
Xtalk
Non-Adjacent Channel
Crosstalk
RT = 50Ω, f = 240MHz
3.0 to 3.6
-45.0
dB
Figure 13
BW
−3dB Bandwidth
MHz
Figure 11
tON
Turn-On Time S,
OE to Output
HD1n, HD2n = 0.8V,
RL = 50Ω, CL = 5pF
tOFF
Turn-Off Time S,
OE to Output
tPD
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
RT = 50Ω, CL = 0pF
3.0 to 3.6
RT = 50Ω, CL = 5pF
Min.
Unit
2.0
6.5
720
550
www.fairchildsemi.com
4
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
DC Electrical Characteristics
Figure
Number
50
ps
Figure 6
Figure 10
3.0 to 3.6
20
ps
Figure 6
Figure 10
3.0 to 3.6
200
ps
Parameter
tSK(O)
Channel-to-Channel
Skew(5)
RL = 50Ω, CL = 5pF
3.0 to 3.6
tSK(P)
Skew of Opposite
Transitions of the
Same Output(5)
RL = 50Ω, CL = 5pF
Total Jitter(5)
RL = 50Ω, CL = 5pF,
tR = tF = 500ps at 480 Mbps
(PRBS = 215 − 1)
tJ
TA = −40°C to +85°C
Units
VCC (V)
Symbol
Conditions
Min.
Typ.
Max.
Note:
5. Guaranteed by characterization.
Capacitance
Symbol
Parameter
Conditions
TA = −40°C to +85°C
Min.
Typ.
Max.
Units
Figure
Number
CIN
Control Pin Input Capacitance
VCC = 0V
1.5
pF
Figure 15
CON
D1n, D2n, Dn On Capacitance
VCC = 3.3, OE = 0V
3.7
pF
Figure 14
COFF
D1n, D2n Off Capacitance
VCC and OE = 3.3
2.5
pF
Figure 15
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
5
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
USB Hi-Speed Related AC Electrical Characteristics
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Typical Characteristics
Frequency Response
0
-1
Gain (dB)
-2
-3
-4
-5
-6
-7
-8
1
10
100
1000
10000
CL = 0pF, VCC = 3.3V
Frequency (MHz)
Figure 1. Gain vs. Frequency
Off Isolation (dB)
Frequency Response
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
1
10
100
1000
Frequency (MHz)
Figure 2. Off Isolation
Crosstalk (dB)
Frequency Response
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
1
10
100
Frequency (MHz)
1000
VCC = 3.3V
Figure 3. Crosstalk
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
6
VON
FSUSB30
FSUSB30
IDn(OFF)
NC
A
HSDn
Dn
VIN
VIN
ION
Select
GND
Select
GND
VS = 0 or VCC
GND
VS = 0 to VCC
Each switch port is tested separately.
RON = VON / ION
Figure 4. On Resistance
Figure 5. Off Leakage
FSUSB30
D+, D–
800mV
Input: HSDn+,
HSDn–
400mV
VIN
RS
GND
tFALL = 500ps
tRISE = 500ps
HSDn
RL VOUT
CL
GND
VSel
90%
90%
50%
50%
10%
10%
VOH
GND
Output: D+, D–
RL, RS, and CL are functions of the application environment
(see AC Electrical tables for specific values).
50%
VOL
tPLH
CL includes test fixture and stray capacitance.
Figure 6. AC Test Circuit Load
tPHL
Figure 7. Switch Propagation Delay Waveforms
tFALL = 2.5ns
tRISE = 2.5ns
VCC
90%
Input – S, OE
VCC/2
GND
50%
90%
VCC/2
10%
10%
VOH
90%
90%
Output – VOUT
VOL
tON
tOFF
Figure 8. Turn-On / Turn-Off Waveform
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
7
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Test Diagrams
VCC
HSDn
VO
VOUT
D+, D–
Control
Input
HSDn
RL
CL*
VCC
50%
0V
tR = tF = 2.5ns (10–90%)
S
Control
Input
VOUT
GND
0.9 x VOUT
tD
*CL includes test fixture and stray capacitance.
Figure 9. Break-Before-Make (tBBM)
tFALL = 500ps
tRISE = 500ps
800mV
90%
Input: D+, D–
50%
10%
400mV
10%
tFALL = 500ps
tRISE = 500ps
800mV
90%
Input: HSDn+
HSDn–
VOH
Output1: HSD1+
HSD1–
90%
50%
50%
10%
400mV
90%
50%
50%
50%
VOL
10%
VOH
tPLH1
tPHL1
50%
50%
VOH
50%
Output: D+, D–
50%
Output1: D2+, D2–
VOL
VOL
tPLH
tPHL
tPLH2
tPHL2
TSK(P) = | tPHL – tPLH |
TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 |
Pulse Skew, TSK(P)
Output Skew, TSK(OUT)
Figure 10. Switch Skew Tests
Network Analyzer
FSUSB30
RS
VIN
VS
GND
GND
VSel
GND
VOUT
GND
RS and RT are functions of the application environment
(See AC Electrical Tables for specific values).
RT
GND
Figure 11. Bandwidth
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
8
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
VCC
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Network Analyzer
FSUSB30
RS
VIN
VS
GND
RT
GND
VSel
GND
GND
VOUT
RT
GND
OFF-Isolation = 20 Log (VOUT / VIN)
GND
Figure 12. Channel Off Isolation
NC
Network Analyzer
FSUSB30
RS
VIN
VS
GND
GND
VSel
RT
GND
GND
GND
RS and RT are functions of the application environment
(50, 75 or 100Ω)
RT
VOUT
GND
Crosstalk = 20 Log (VOUT / VIN)
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk
Capacitance
Meter
Dn
FSUSB30
f = 240MHz
Dn
S
S
Capacitance
Meter
VSel = 0 or VCC
f = 240MHz
D1n, D2n
Figure 14. Channel On Capacitance
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
FSUSB30
VSel = 0 or VCC
D1n, D2n
Figure 15. Channel Off Capacitance
www.fairchildsemi.com
9
Power-On Protection
In section 7.1.1 of the USB 2.0 specification, it notes that
USB devices must be able to withstand a Vbus short to
D+ or D- when the USB devices is either powered off or
powered on. The FSUSB30 can be successfully configured to meet both these requirements.
The USB 2.0 specification also notes that the USB
device should be capable of withstanding a Vbus short
during transmission of data. Fairchild recommends adding a 100Ω series resister between the switch VCC pin
and supply rail to protect against this case. This modification works by limiting current flow back into the VCC
rail during the over-voltage event so current remains
within the safe operating range. In this application, the
switch passes the full 5.25V input signal through to the
selected output, while maintaining specified off isolation
on the un-selected pins.
Power-Off Protection
For a Vbus short circuit, the switch is expected to withstand such a condition for at least 24 hours. The
FSUSB30 has specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability during a power-down, overvoltage condition. The protection has been added to the
common pins (D+, D-).
VCC= 3.6 V
100 Ohms
HSD+
HSD+
HSD-
D+ = 5.25V
FSUSB30
D- = 5.25V
HSD-
Figure 16. Adding 100Ω resistor in series with the VCC supply allows the FSUSB30 to withstand a
Vbus short when powered up
For more information, see Applications Note AN-6022 Using the FSUSB30 to Comply with USB 2.0 Fault
Condition Requirements at www.fairchildsemi.com
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
10
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Application Guidance: Meeting USB 2.0 Vbus Short Requirements
Tape Format for MircoPak
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
5000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
L10X
Tape Dimension
Dimensions are in millimeters unless otherwise specified.
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
11
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Tape and Reel Specifications
Dimensions are in inches (millimeters) unless otherwise specified.
Tape Size
A
B
C
D
N
W1
W2
W3
(8mm)
7.0
(177.8)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
2.165
(55.00)
0.331 + 0.059/−0.000
(8.40 + 1.50/−0.00)
0.567
(14.40)
W1 + 0.078/−0.039
(W1 + 2.00/−1.00)
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
12
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimension for MircoPak
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
2500/3000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
BQX
Tape Dimensions
Dimenions are in millimeters unless otherwise specified.
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
13
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Tape Format for DQFN
Dimensions are in inches (millimeters) unless otherwise specified.
Tape Size
A
B
C
D
N
W1
W2
(12mm)
13.0
(330)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
7.008
(178)
0.488
(12.4)
0.724
(18.4)
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
14
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Reel Dimensions for DQFN
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Tape Dimensions for MSOP
Dimensions are in inches (millimeters) unless otherwise specified.
Reel Dimensions for MSOP
Dimensions are in inches (millimeters) unless otherwise specified
Tape Size
A
B
C
D
N
W1
W2
W3
(12mm)
13
(330)
0.059
(1.5)
0.512
(13)
0.795
(20.2)
7.008
(178)
0.448
(12.4)
0.724
(18.4)
0.468-0.606
(11.9 -15.4)
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
15
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
Figure 17. 10-Lead MicroPak, 1.6 x 2.1mm
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
16
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
Figure 18. 14-Terminal De-populated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
17
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
Figure 19. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
18
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise specified.
Figure 20. 10-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
19
FSUSB30 Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
www.fairchildsemi.com
20
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