Melexis MLX80020 Enhanced lin transceiver Datasheet

MLX80020
Enhanced LIN Transceiver
Features

RxD
1
EN
2
WAKE
3
TxD
4
8
INH
7
VS
6
LIN
5
GND
Compatible to LIN Physical Layer Specification
Rev.2.x and SAE J2602
MLX
80020

Baud rate up to 20 kBaud

Wide operating voltage range VS = 5 to 27 V

Very low standby current consumption of 10µA in sleep mode

Bus and local wake up capable with source recognition

Control output for voltage regulator with low on – resistance for switchable master termination

Low EME(emission) and high EMI(immunity) level

Fully compatible to 3.3V and 5V devices

Integrated termination resistor for LIN slave nodes

TxD dominant time out function

Sleep timer to guarantee the most power saving mode after power on or wake up in case of faulty passive
microcontroller

High impedance Bus pin in case of loss of ground and undervoltage condition

Bus short to ground protection

Enhanced ESD robustness according to IEC 61000-4-2

RoHs compliant and AECQ-100 qualified
Ordering Code
Product Code
MLX80020
MLX80020
MLX80020
MLX80020
Temperature Code
K
K
K
K
Package Code
DC
DC
DC
DC
Option Code
BBA-000
BBA-000
BAA-000
BAA-000
Legend:
Temperature Code:
Package Code:
Option Code:
Packing Form:
K for Temperature Range -40°C to 125°C
DC for SOIC150Mil
BBA-000 for SAE J2602, BAA-000 for LIN 2.x
RE for Reel, TU for Tube
Ordering example:
MLX80020KDC-BBA-000-TU
Packing Form Code
TU
RE
TU
RE
General Description
The MLX80020 is a physical layer device for a single wire data link capable of operating in applications using
baud rates from 1kBd to 20kBd. The MLX80020 is compatible to LIN2.x as well as to the SAE J2602
specifications.
Because of the very low power consumption of the MLX80020 in the sleep mode it’s suitable for ECU
applications with hard standby current requirements. The implemented high resistive termination in sleep
mode as well as the driving capability of the INH pin allows a comfortable handling of LIN short circuits to
GND. In order to reduce the power consumption in case of failure modes, the integrated sleep timer takes
care for switching the ECU into the most power saving sleep mode after power on or wake up events that
are not followed by a mode change response of the microcontroller.
The MLX80020 has an improved EMI performance and ESD robustness. The MLX80020 version with the
ordering code extension ‘A’ is suitable for applications with baud rates up to 20kbd. The version of the
MLX80020 with the ordering code extension ‘B’ is optimized for baud rates up to 10.4kbd as specified in the
SAE J2602 standard.
MLX80020 – Datasheet
3901080020
Page 1 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
Contents
1.
Functional Diagram .................................................................................................... 4
2.
Pin Description ........................................................................................................... 5
3.
Electrical Specification .............................................................................................. 6
3.1
3.2
3.3
3.4
4.
Functional Description ............................................................................................. 11
4.1
4.2
4.3
4.4
4.5
4.6
5.
Operating Modes ................................................................................................. 11
Initialization and Standby mode ........................................................................... 12
Normal Mode ....................................................................................................... 12
Sleep Mode ......................................................................................................... 16
Wake Up .............................................................................................................. 16
Wake Up Source Recognition.............................................................................. 16
Fail-safe features ...................................................................................................... 18
5.1
5.2
5.3
5.4
5.5
5.6
5.7
6.
Operating Conditions ............................................................................................. 6
Absolute Maximum Ratings ................................................................................... 6
Static Characteristics ............................................................................................. 7
Dynamic Characteristics ...................................................................................... 10
Loss of battery ..................................................................................................... 18
Loss of Ground .................................................................................................... 18
Short circuit to battery .......................................................................................... 18
Short circuit to ground ......................................................................................... 18
Thermal overload................................................................................................. 18
Undervoltage lock out .......................................................................................... 18
Open Circuit protection ........................................................................................ 18
Application Hints ...................................................................................................... 19
6.1
Application Circuitry ............................................................................................. 19
7.
Mechanical Specification SOIC8 ............................................................................. 20
8.
Tape and Reel Specification .................................................................................... 21
8.1
8.2
9.
Tape Specification ............................................................................................... 21
Reel Specification ................................................................................................ 22
ESD/EMC Remarks ................................................................................................... 23
9.1
9.2
9.3
General Remarks ................................................................................................ 23
ESD-Test ............................................................................................................. 23
EMC .................................................................................................................... 23
MLX80020 – Datasheet
3901080020
Page 2 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
10.
Standard information regarding manufacturability of Melexis products with
different soldering processes ......................................................................................... 24
11.
Revision History .................................................................................................... 25
12.
Disclaimer .............................................................................................................. 26
List of Figures
Figure 1: Block Diagram ......................................................................................................................... 4
Figure 2: Pin description SOIC8 package ............................................................................................... 5
Figure 3: State Diagram of the MLX80020 ........................................................................................... 12
Figure 4 - Duty cycle measurement and calculation in accordance to
LIN physical layer specification 2.x for baud rates up to 20Kbps ................................................... 14
Figure 5 - Duty cycle measurement and calculation in accordance to
LIN physical layer specification 2.x for baud rates of 10.4Kbps or below ...................................... 15
Figure 6: Remote wake-up behavior .................................................................................................... 17
Figure 7: Application Circuitry ............................................................................................................... 19
MLX80020 – Datasheet
3901080020
Page 3 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
1. Functional Diagram
Figure 1: Block Diagram
MLX80020 – Datasheet
3901080020
Page 4 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
2. Pin Description
RxD
1
EN
2
WAKE
3
TxD
4
MLX
80020
8
INH
7
VS
6
LIN
5
GND
Figure 2: Pin description SOIC8 package
Pin
Name
IO-Type
1
RXD
O
Received data from LIN bus, LOW in dominant state
2
EN
I
Mode control pin, enables the normal operation mode when HIGH
3
WAKE
I
High voltage input for local wake up, negative edge triggered
4
TXD
I/O
Transmit data input (LOW = dominant), active low after local wake up
5
GND
G
Ground
6
BUS
I/O
LIN bus transmitter/receiver pin, (LOW = dominant)
7
VS
P
Battery supply voltage
8
INH
O
Control output for voltage regulator, termination pin for master pull up
MLX80020 – Datasheet
3901080020
Description
Page 5 of 26
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Enhanced LIN Transceiver
3. Electrical Specification
All voltages are referenced to ground (GND). Positive currents flow into the IC.
3.1 Operating Conditions
Parameter
Symbol
Min
Max
Unit
VS
7
18
V
High battery supply voltage
VS_S
18
27
V
Low battery supply voltage
Vs_L
5
7
V
Operating ambient temperature
Tamb
-40
+125
°C
Battery supply voltage [1]
[1]
Vs is the IC supply voltage including voltage drop of reverse battery protection diode, V DROP = 0.4 to 1V,
VBAT_ECU voltage range is 8 to 18V
3.2 Absolute Maximum Ratings
In accordance with the Maximum Rating System (IEC 60134). The absolute maximum ratings given in the
table below are limiting values that do not lead to a permanent damage of the device but exceeding any of
these limits may do so. Long term exposu re to limiting values may affect the reliability of the device.
Parameter
Battery Supply Voltage
Symbol
VS
Condition
Min
Max
Unit
Respective to GND
-0.3
40
V
-100
Transients at battery supply voltage
VVS.tr1
ISO 7637/2 pulse 1[1]
Transients at battery supply voltage
VVS.tr2
ISO 7637/2 pulse 2[1]
Transients at high voltage signal pins
VLIN..tr1
ISO 7637/3 pulses 1[2]
Transients at high voltage signal pins
VLIN..tr2
ISO 7637/3 pulses 2[2]
Transients at high voltage signal and power supply
pins
VHV..tr3
ISO 7637/2 pulses 3A, 3B [3]
DC voltage LIN, WAKE
VLIN_DC
Respective to GND and VS
Loss of Ground( VGND=VS )
DC voltage INH
DC voltage low voltage I/O’s (RxD,TxD,EN)
MLX80020 – Datasheet
3901080020
75
-30
V
V
30
V
-150
100
V
-27
40
V
VINH_DC
-0.3
VS + 0.3
V
Vlv_DC
-0.3
7
V
-6
6
kV
-8
-2
8
2
kV
kV
-1000
1000
V
VESD_IEC
ESD voltage
V
IEC 61000-4-2
Pin LIN, VS,to GND, WAKE
VESD_HBM
HBM (AEC-Q100-002)
Pin LIN, VS to GND, WAKE, INH
All other pins
VESD_CDM
CDM (AEC-Q100-011)
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MLX80020
Enhanced LIN Transceiver
Parameter
Symbol
Maximum latch - up free current at any Pin
Condition
ILATCH
Min
Max
Unit
-500
500
mA
152
K/W
Thermal impedance
JA
Storage temperature
Tstg
-55
150
°C
Junction temperature
Tvj
-40
150
°C
[1]
[2]
[3]
in free air
ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >2uF blocking capacitor.
ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF.
ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a
reverse polarity diode and >10uF blocking capacitor
3.3 Static Characteristics
Unless otherwise specified all values in the following tables are valid for VS = 5 to 27V and
TJ= -40 to 150°C. Typical values are valid for VS = 12V and TAMB= 25°C. All voltages are referenced to
ground (GND), positive currents are flow into the IC.
Parameter
Symbol
Condition
Min
Typ
Max
Unit
4.8
V
0.7
V
4.9
V
PIN VS
Power on reset
Power on reset hysteresis
Undervoltage lockout
Undervoltage lockout hysteresis
VS_POR
2.4
VS_POR_hys
0.1
VS_UV
4.2
VS_UV_hys
0.1
0.3
0.7
V
3
9
20
µA
300
800
2000
µA
0.3
Supply current, sleep mode
ISsl
VEN = 0V,
VWAKE = VS = VLIN <14V
Supply current standby mode
ISBY
VEN = 0V, after POR or WU
Supply current normal mode, dominant
ISd
VEN = 5V, VTxD = 0V
1
3
5
mA
Supply current normal mode, recessive
ISr
VEN = 5V, VTxD = 5V
300
800
2000
µA
40
200
mA
20
60
kΏ
-20
µA
PIN LIN – Transmitter
Short circuit bus current
IBUS_LIM
Pull up resistance bus, normal & standby
mode
RSLAVE
VLIN = VS, VEN = 5V,VTxD = 0V
IBUS_SLEEP
VLIN = 0, VS = 12V, VEN = 5V,
VTxD = 5V
-100
Input Leakage current at the receiver incl.
pull-up resistor
IBUS_PAS_dom
VLIN =0V ,VS =12V, VEN = 5V,
VTxD = 5V
-600
Bus reverse current, recessive
IBUS_PAS_rec
VLIN=18V, VS =5V, VEN = 5V,
VTxD = 5V, Tamb<125°C
20
µA
Bus reverse current loss of battery [2]
IBUS_NO_BAT
VS = 0V, 0V < VLIN < 18V
Tamb<125°C
20
µA
Bus current during loss of ground [2]
IBUS_NO_GND
VS = 12V,
0 < VLIN < 18V
-100
20
µA
VolBUS
Rload = 500
0
0.2 VS
V
Pull up current bus, sleep mode
Transmitter dominant voltage [2]
MLX80020 – Datasheet
3901080020
Page 7 of 26
µA
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
Parameter
Symbol
Condition
Transmitter recessive voltage [2]
VohBUS
No load, VEN = 0/5V,VTxD = 5V
BUS input capacitance [1]
CBUS
Pulse response via 10k,
VPULSE = 12V, Vs open
Voltage drop serial Diode [3]
VSerDiode
Min
Typ
0.8 VS
25
0.4
Max
Unit
VS
V
35
pF
1.0
V
PIN LIN – Receiver
Receiver dominant voltage
Receiver recessive voltage
Center point of receiver threshold
Receiver hysteresis
VilLIN
VihLIN
ViLIN_cnt
ViLIN_hys
0.4 *VS
High level input voltage
Low level input voltage
Hysteresis
Vih_EN
Vil_EN
Vihys_EN
Rising edge
Falling edge
Pull down resistor
Rpd_EN
VEN = 5V
Leakage Current
Vleak_EN
VEN = 0V
PIN TxD
-5
High level input voltage
Low level input voltage
Hysteresis
Vih_TxD
Vil_TxD
Vihys_TxD
Rising edge
Falling edge
2
Pull down resistor
Rpd_TxD
VTxD = 5V
Low level output voltage
Leakage Current
Vol_rxd
Vleak_TxD
ITxD = 2mA
VTxD = 0V
VLIN_cnt = ( VilLIN_ + VihLIN )/2
VLIN_cnt = ( VihLIN -VilLIN )
PIN EN
0.6 *VS
0.475 *VS 0.5 *VS 0.525 *VS
0.175 *VS
2
0.05
0.1
0.8
0.3
100
350
600
V
V
V
V
V
V
V
5
k
µA
V
V
V
0.05
0.1
0.8
0.3
100
350
600
-5
0.4
5
k
V
µA
-5
-5
0.4
5
5
V
µA
µA
50

5
5
µA
µA
-20
VS-3.3V
5
-1
V
V
µA
µA
170
10
190
30
°C
°C
PIN RXD
Low level output voltage
Leakage Current high
Leakage Current low
Vol_rxd
Vleak_rxd
Vleak_rxd
IRxD = 2mA
VRxD = 5V,VTxD = 5V, VEN = 5V
VRxD = 0V,VTxD = 5V, VEN = 5V
PIN INH
On resistance INH
Ron_INH
Leakage current INH high
Leakage current INH low
IINH_lk
IINH_lk
Normal or standby mode,
VINH = VS-1V , VS = 12V
EN = L ,VINH = 27V, VS = 27V
EN = L ,VINH = 0V, VS = 27V
20
-5
-5
PIN WAKE
High level input voltage
Low level input voltage
Leakage current WAKE high
Pull up current WAKE
Vih_WK
Vil_WK
IWAKE_lk
IWAKE_pu
VS-1V
VWAKE = 27V, VS = 27V
-5
-30
Thermal Protection
Thermal shutdown
Thermal hysteresis
[1]
Tsd [1]
155
Thys [1]
No production test, guaranteed by design and qualification
MLX80020 – Datasheet
3901080020
Page 8 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
[2]
[3]
In accordance to SAE J2602
Guaranteed by design
MLX80020 – Datasheet
3901080020
Page 9 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
3.4 Dynamic Characteristics
Unless otherwise specified all values in the following table are valid for V S = 5 to 27V and
o
TAMB= -40 to 125 C.
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Propagation delay receiver
[1]
trec_pdf
CRxD =25pF falling edge
6
µs
Propagation delay receiver
[1]
trec_pdr
CRxD =25pF rising edge
6
µs
Propagation delay receiver symmetry
trec_sym
Calculate trec_pdf - trec_pdr
-2
2
µs
Receiver debounce time
trec_deb
LIN rising & falling edge
0.5
4
µs
[2]
LIN duty cycle 1 [2] [3] [4]
D1
20kbps operation ,
0.396
LIN duty cycle 2 [2] [3] [4]
D2
20kbps operation ,
LIN duty cycle 3 [2] [3]
D3
LIN duty cycle 4 [2] [3]
D4
0.590
trec(max) – tdom(min) [5]
Δt3
15.9
µs
trec(min) – tdom(max) [5]
Δt4
17.28
µs
0.581
0.417
Remote Wake-up filter time
twu_remote
sleep mode,
LIN rising & falling edge
30
150
µs
Local Wake-up filter time
twu_local
sleep mode,
WAKE falling edge
10
50
µs
Delay from Standby to Sleep Mode
tdsleep
VEN = 0
150
500
ms
TxD dominant time out time
tTxD_to
normal mode, VTxD = 0
27
60
ms
EN – debounce time
tEN_deb
normal <--> standby mode
transitions
0.5
4
µs
[1]
[2]
[3]
[4]
[5]
This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling
edges is 50V/us
See figure 5 – LIN timing diagram
Standard loads for duty cycle measurements are 1K/1nF, 660/6.8nF, 500/10nF
Not valid for the SAE J2602 version (optimized for 10.4kBd operation) of the MLX80020 xA
In accordance to SAE J2602, only for device version MLX80020 xB
MLX80020 – Datasheet
3901080020
Page 10 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
4.
Functional Description
4.1 Operating Modes
Mode
EN
TxD
RxD
INH
Standby
0
weak pull down/active low[1]
floating/active low[2]
Vs
off
entered after power on
or wake up
Normal mode
1
weak pull down/input for
transmit data stream
output for LIN data
stream
Vs
on
[3] [4] [5]
Sleep mode
0
weak pull down
floating
floating
off
No local or remote wake
up
[1]
[2]
[3]
[4]
[5]
Transmitter Remarks
Indicates the wake up flag in case of local wake up
After power on RxD is floating. If any wake up(local or remote) occurs it will be indicated by active low
Active low interrupt at pin RxD will be removed when entering normal mode
Wake up source flag at pin TxD will be removed when entering normal mode
Normal mode will be entered by a low -> high transition on pin EN. When recessive level (high) on pin TxD is present the
transmit path will be enabled
MLX80020 – Datasheet
3901080020
Page 11 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
VS on
Normal Mode
EN
EN =>Low
high
INH
RxD
Vs
receive
data
LIN termination 30kO
Transmitter on
EN
=>High
Standby
t > 150ms
-> no mode change
-> no valid wake up
EN INH
low
RxD TxD
VS floating low/
low[1]
high[2]
LIN termination 30kO
Transmitter off
EN =>High
Sleep Mode
EN
INH
RxD
low
floating
floating
Remote or
local wake
up request
LIN termination 200kO
Transmitter off
[1]
[2]
floating after power on
active low interrupt after wake up
weak pull down after power on
indicates wake up source via weak /strong pull down
Figure 3: State Diagram of the MLX80020
4.2 Initialization and Standby mode
When the battery supply voltage Vs exceeds the specified threshold VS_POR, the MLX80020 automatically
enters an intermediate standby mode. The INH output becomes HIGH (Vs) and therefore the external
voltage regulator will provide the Vcc supply voltage to the ECU. The pin RxD is floating and the integrated
slave pull up resistor with decoupling diode secures high level on the pin LIN. The transmitter as well as the
receiver is disabled.
If there occurs no mode change to normal mode via an EN LOW to HIGH transition within the time defined
(typically 350ms), the IC enters the most power saving sleep mode and the INH output will become floating
(logic 0).
Furthermore the standby mode will be entered after a valid local or remote wake up event, when the
MLX80020 is in sleep mode. The entering of the standby mode after wake up will be indicated by an active
LOW interrupt on pin RxD.
4.3 Normal Mode
By entering this mode the MLX80020 can be used as interface between the single wire LIN bus and the
microcontroller. The incoming bus traffic is detected by the receiver and transferred via the RxD output pin to
the microcontroller. (see figure 3, LIN timing diagram)
MLX80020 – Datasheet
3901080020
Page 12 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
RxD
The pin RxD is a buffered open drain output with a typical load of:
Resistance: 2.7 kOhm
Capacitance: < 25 pF
The output signal supports by the external pull up resistor 3.3V and 5V supply systems.
TxD
The transmit data stream of the LIN protocol controller applied to the pin TxD is converted into the LIN bus
signal with slew rate control in order to minimize electromagnetic emissions.
The pin TxD contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply
systems. To enable the transmit path, the TxD pin has to be driven recessive (HIGH) after or during the
normal mode has been entered.
TxD dominant time-out feature
By the first dominant level on pin TxD after the transmit path has been enabled, the dominant time-out
counter is started. In case of a faulty blocked permanent dominant level on pin TxD the transmit path will be
disabled after the specified time tTxD_to. The time-out counter is reset by the first negative edge on pin TxD.
EN
The normal mode can be entered being in sleep or standby mode, when the pin EN is driven HIGH. To
prevent unwanted mode transitions, the EN input contains a debounce filter as specified (tEN_deb).
The pin EN contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply
systems.
Additionally the positive edge on pin EN results in an immediate reset of the active low interrupt on pin RxD
as well as the wake-up source recognition flag on pin TxD (see chapter 4.5 Wake Up).
MLX80020 – Datasheet
3901080020
Page 13 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
Data transmission speed
The MLX80020 is a constant slew rate transceiver that means the bus driver operates with a fixed slew rate
range independent of the supply voltage. This principle secures a very good symmetry of the slope times
between recessive to dominant and dominant to recessive slopes within the LIN bus load range (C BUS, Rterm).
The MLX80020 KDC A version guarantees data rates up to 20kbd within the complete bus load range under
worst case conditions.
The version MLX80020 KDC B is optimized for applications with a maximum baud rate of 10.4kBd (SAE
J2602) in order to minimize EME. These devices can not be used in applications with higher baud rates.
The constant slew rate principle is very robust against voltage drops and can operate with RC- oscillator
systems with a clock tolerance up to ±2% between 2 nodes.
Duty cycle calculation LIN 2.x
With the timing parameters shown in the picture below two duty cycles , based on trec(min) and
trec(max) can be calculated as follows : tBit =50µs
D1 = trec(min) / (2 x tBit)
D2 = trec(max) / (2 x tBit)
Figure 4 - Duty cycle measurement and calculation in accordance to LIN physical layer specification
2.x for baud rates up to 20Kbps
MLX80020 – Datasheet
3901080020
Page 14 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
Duty cycle calculation J2602:
With the timing parameters shown in the table below two duty cycles , based on trec(min) and trec(max)
can be calculated as follows : tBit =96µs
D3 = trec(min) / (2 x tBit)
D4 = trec(max) / (2 x tBit)
Figure 5 - Duty cycle measurement and calculation in accordance to LIN physical layer specification
2.x for baud rates of 10.4Kbps or below
MLX80020 – Datasheet
3901080020
Page 15 of 26
November 2015
Rev 006
MLX80020
Enhanced LIN Transceiver
4.4 Sleep Mode
The most power saving mode of the MLX80020 is the sleep mode. The MLX80020 offers two procedures to
enter the sleep mode:

The mode is selected when the pin EN is driven LOW in normal mode for longer than the specified
filter time (tEN_deb). The mode change into sleep mode is possible even in case of dominant voltage
levels on the LIN bus, pins WAKE or TxD.

If the MLX80020 is in standby mode after power-on or wake-up, a sleep counter is started and
switches the transceiver into sleep mode after the specified time (typ. 350ms) even when the
microcontroller of the ECU will not confirm the normal operation by setting the EN pin to logic HIGH.
This new feature allows faulty blocked LIN nodes to reach always the most power saving mode.
Being in sleep mode the INH pin becomes floating and the ECU voltage regulator can be switched off in
order to minimize the current consumption of the complete LIN node. The transmitter is disabled and the pin
RxD is disconnected from the receive path and is floating. The slave termination resistor (LIN pull up resistor
with decoupling diode between pins LIN and Vs) is disconnected and only a weak LIN pull up resistor is
applied to the LIN bus (see chapter 5.4 fail-safe features)
4.5 Wake Up
When in sleep mode the MLX80020 offers thee wake-up procedures:

In applications with continuously powered ECU a wake up via mode transition to normal mode is
possible (see chapter 4.3 Normal Mode)

Remote wake-up via LIN bus traffic
After a falling edge on the LIN bus followed by a dominant voltage level for longer than the specified
value(twu_remote) and a rising edge on pin LIN will cause a remote wake up (see fig.4 page )

Local wake-up via a negative edge on pin WAKE
A negative edge on the pin WAKE and a dominant voltage level for longer than the specified
time(twu_local) will cause a local wake-up. The current for an external switch has to be provided by an
external pull up resistor RWK. For a reverse current limitation in case of a closed external switch and
a negative ground shift or an ECU loss of ground a protection resistor RWK_prot between pin WAKE
and the switch is recommended. (see fig.5 page )
The pin WAKE provides a weak pull up current towards the battery voltage that provides a HIGH
level on the pin in case of open circuit failures or if no local wake up is required. In such applications
it is recommended to connect the pin WAKE directly to pin Vs in order to prevent influences due to
EMI.
4.6 Wake Up Source Recognition
The device can distinguish between a local wake-up event (pin WAKE) and a remote wake-up event. The
wake-up source flag is set after a local wake-up event and is indicated by an active LOW on pin TxD.
The wake-up flag can be read if an external pull up resistor towards the microcontroller supply voltage has
been added (see fig.5 ) and the MLX80020 is still in stanby mode:


LOW level indicates a local wake-up event
HIGH level indicates a remote wake up event
The wake-up request is indicated by an active LOW on pin RxD and can be used for an interrupt..
When the microcontroller confirms a normal mode operation by setting the pin EN to HIGH, both the wake-up
request on pin RxD as well as the wake-up source flag on pin TxD are reset immediately.
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Enhanced LIN Transceiver
VLIN
t
VINH
t > twu_remote
t
VCC_ECU
t
VEN
t
VRxD
wake-up interrupt
t
Figure 6: Remote wake-up behavior
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Enhanced LIN Transceiver
5. Fail-safe features
5.1 Loss of battery
If the ECU is disconnected from the battery, the bus pin is in high impedance state. There is no impact to the
bus traffic and to the ECU itself. Reverse current is limited to < 20µA
5.2 Loss of Ground
In case of an interrupted ECU ground connection there is no influence to the bus line. The current from the
ECU to the LIN bus is limited by the weak pull up resistance of the pin LIN, the slave termination resistor is
disconnected in order to fulfill the SAE J2602 requirements for the loss of ground current (<100µA @12V).
5.3 Short circuit to battery
The transmitter output current is limited to the specified value in case of short circuit to battery in order to
prevent high current densities and thermal hot spots in the LIN driver.
5.4 Short circuit to ground
If the LIN bus wiring is shorted to negative shifted ground levels, there is no current flow from the ECU
ground to the bus and no distortion of the bus traffic occurs.
The permanent failure current from battery to ground can be reduced dramatically by using the INH pin as
termination control pin for the master pull up resistor (See Figure 7: Application Circuitry).
If the controller detects a short circuit of the LIN bus to ground the transceiver can be set into sleep mode.
The INH pin is floating and therefore the master pull up resistor is disconnected from the bus line.
Additionally the internal slave termination resistor is switched off and only a weak pull up termination is
applied to the LIN bus (typ. 75A). If the failure disappears, the bus level will become recessive again and
will wake up the system even if no local wake up occurs or is possible.
5.5 Thermal overload
The MLX80020 is protected against thermal overloads. If the chip temperature exceeds the specified value,
the transmitter is disabled until thermal recovery and the following recessive to dominant transition on pin
TxD. The receiver is still working while thermal shutdown.
5.6 Undervoltage lock out
If the battery supply voltage is missing or decreased under the specified value(VS_UV), the transmitter is
disabled to prevent undefined bus traffic.
5.7 Open Circuit protection




The pin TxD provides a weak pull down. The transmitter can not be enabled.
The pin EN provides a weak pull down to prevent undefined normal mode transitions.
If the battery supply voltage is disconnected, the pin RxD is floating
The pin WAKE provides a weak pull up current towards supply voltage Vs to prevent local wake-up
requests
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Enhanced LIN Transceiver
6. Application Hints
6.1 Application Circuitry
VS
100nF
1N4001
10uF
VBAT
MASTER
ECU
Voltage regulator
VBAT
Optinal connection in case
switchable termination is required
3.3V/5V
100nF
1kO
RRX
INH
RWK
VS
RxD
RTX
µP
LIN
MLX80020
TxD
RWK_PROT
WAKE
180pF
VS
100nF
1N4001
10uF
VBAT
GND
LIN BUS
GND
SLAVE
ECU
Voltage regulator
VBAT
3.3V/5V
100nF
RRX
INH
VS
RxD
µP
LIN
MLX80020
TxD
WAKE
180pF
GND
GND
Figure 7: Application Circuitry
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Page 19 of 26
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Enhanced LIN Transceiver
7. Mechanical Specification SOIC8
Small Outline Integrated Circiut (SOIC), SOIC 8, 150 mil
A1
B
D
E
e
H
h
L
A

ZD
A2
4.80
4.98
3.81
3.99
1.27
5.80
6.20
0.25
0.50
0.41
1.27
1.52
1.72
0°
8°
0.53
1.37
1.57
0.189
0.196
0.150
0.157
0.050
0.2284
0.244
0.0099
0.0198
0.016
0.050
0.060
0.068
0°
8°
0.021
0.054
0.062
C
All Dimension in mm, coplanarity < 0.1 mm
min
max
0.10
0.25
0.36
0.46
0.19
0.25
All Dimension in inch, coplanarity < 0.004”
min
max
0.004
0.0098
0.014
0.018
MLX80020 – Datasheet
3901080020
0.0075
0.0098
Page 20 of 26
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Enhanced LIN Transceiver
8. Tape and Reel Specification
8.1 Tape Specification
max. 10°
max. 10°
IC pocket
R
Top View
n.
mi
Sectional View
T2
P0
D0
36 m
P2
T
E
G1
< A0 >
F
K0
W
B0
B1
S1
G2
P1
D1
T1
Cover Tape
Abwickelrichtung
Standard Reel with diameter of 13“
Package
Parts per Reel
Width
Pitch
SOIC8
3000
12 mm
8 mm
D0
E
P0
P2
Tmax
T1 max
G1 min
G2 min
B1 max
D1 min
F
P1
Rmin
T2 max
W
1.5
+0.1
1.75
0.1
4.0
0.1
2.0
0.05
0.6
0.1
0.75
0.75
8.2
1.5
5.5
0.05
4.0
0.1
30
6.5
12.0
0.3
A0, B0, K0 can be calculated with package specification.
Cover Tape width 9.2 mm.
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Enhanced LIN Transceiver
8.2 Reel Specification
W2
W1
B*
D*
C
A
N
Amax
B*
C
D*min
330
2.0 0.5
13.0 +0,5/-0,2
20.2
Width of half reel
Nmin
W1
W2 max
4 mm
100,0
4,4
7,1
8 mm
100,0
8,4
11,1
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Enhanced LIN Transceiver
9. ESD/EMC Remarks
9.1 General Remarks
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
9.2 ESD-Test
The MLX80020 is tested according to HBM AEC-Q100-002.
The ESD test CDM according to AEC-Q100-011 as well as system level ESD test according to
IEC 61000-4-2 are performed by an external test house.
9.3 EMC
The test on EMC impacts is done according to ISO 7637-2 for power supply pins and ISO 7637-3 for dataand signal pins as well as the “Hardware requirements for LIN, CAN and FlexRay Interfaces in Automotive
Applications”; Audi, BMW, Daimler, Porsche, VW; 2009-12-02”
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Enhanced LIN Transceiver
10.
Standard information regarding manufacturability of Melexis products with different
soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)


IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)


EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)

EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and
qualification tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For
more information on qualifications of RoHS compliant products (RoHS = European directive on the
Restriction Of the use of certain Hazardous Substances) please visit the quality page on our
website: http://www.melexis.com/quality.aspx
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Enhanced LIN Transceiver
11. Revision History
Version
Changes
Remark
001
Initial release
Date
October
2010
002
Changed maximum ratings (ESD value CDM increased)
Changed Static Characteristic in acc to CPK-values
Changed Chapter 9.3 EMC
Changes Tape Specification Chapter 8.1
November
2010
003
Change of Order Code
November
2010
004
Change “short term” to “high” operating range in chapter “Operating Conditions”
June 2011
005
Logo, disclaimer, ordering code
June 2012
006
Electrical Specification of LIN-Transmitter updated
November
2015
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Enhanced LIN Transceiver
12.
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions
appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or
by description regarding the information set forth herein or regarding the freedom of the
described devices from patent infringement. Melexis reserves the right to change
specifications and prices at any time and without notice. Therefore, prior to designing this
product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring
extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment are
specifically not recommended without additional processing by Melexis for each
application.
The information furnished by Melexis is believed to be correct and accurate. However,
Melexis shall not be liable to recipient or any third party for any damages, including but not
limited to personal injury, property damage, loss of profits, loss of use, interrupt of
business or indirect, special incidental or consequential damages, of any kind, in
connection with or arising out of the furnishing, performance or use of the technical data
herein. No obligation or liability to recipient or any third party shall arise or flow out of
Melexis’ rendering of technical or other services.
© 2012 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
America:
Phone: +1 248 306 5400
E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified
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