FTB10F-15 Rev.C Feb.-2015 描述 / DATA SHEET Descriptions 1.5A 表面贴装玻璃钝化整流桥，薄型 ABF 封装。 1.5A Surface Mount Glass Passivated Bridge Rectifier, ABF thin package. 特征 / Features 玻璃钝化芯片，反向电压：1000V，正向电流：1.5A，快速反向恢复时间，适用于表面贴装。无卤产品。 Glass Passivated Chip Junction,Reverse Voltage: 1000V,Forward Current:1.5A, Fast reverse recovery time,Designed for Surface Mount Application.Halogen free product. 用途 / Applications 一般用途. General purpose. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 印章代码 / Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 FTB10F-15 Rev.C Feb.-2015 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Maximum Repetitive Peak Reverse Voltage VRRM 1000 V Maximum RMS Voltage VRMS 700 V Maximum DC Blocking Voltage VDC 1000 V Average Rectified Output Current at Tc = 125℃ Io 1.5 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load IFSM 50 A Cj 35 pF RθJA 70 ℃/W Tj,Tstg -55~150 ℃ Typical Junction Capacitance（Note1） Typical Thermal Resistance（Note2） Operating and Storage Temperature Range Note: 1.Measured at 1MHz and applied reverse voltage of 4 V D.C. 2. Mounted on glass epoxy PC board with 4×1.0" X 1.0" (2.54 X 2.54 cm) copper pad. 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter 符号 Symbol Forward Voltage per element VF Maximum DC Reverse Current at Maximum DC Blocking Voltage IR Maximum Reverse Recovery Time trr http://www.fsbrec.com 测试条件 Test Conditions 数值 Rating 单位 Unit IF=1.5A 1.3 V Ta=25℃ 5.0 μA Ta=125℃ 50 μA IF =0.5A IR=1.0A Irr=0.25A 200 ns 2/6 FTB10F-15 Rev.C Feb.-2015 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 FTB10F-15 Rev.C Feb.-2015 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 FTB10F-15 Rev.C Feb.-2015 印章说明 / DATA SHEET Marking Instructions http://www.fsbrec.com 5/6 FTB10F-15 Rev.C Feb.-2015 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 ABF 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 5000 2 10000 5 50000 13〞×15 336X336X40 345X345X235 / Notices http://www.fsbrec.com 6/6