ON MC78LC00 Micropower voltage regulator Datasheet

MC78LC00 Series
Micropower Voltage
Regulator
•
•
•
•
•
•
•
•
Low Quiescent Current of 1.1 mA Typical
Excellent Line and Load Regulation
Maximum Operating Voltage of 12 V
Low Output Voltage Option
High Accuracy Output Voltage of 2.5%
Industrial Temperature Range of −40°C to 85°C
Two Surface Mount Packages (SOT−89, 3 Pin, or SOT−23, 5 Pin)
These are Pb−Free Devices
MARKING DIAGRAMS AND
PIN CONNECTIONS
5
1
TSOP−5
NTR SUFFIX
CASE 483
GND
1
Vin
2
Vout
3
5 N/C
G
Features
www.onsemi.com
XXX AYW G
The MC78LC00 series of fixed output low dropout linear regulators
are designed for handheld communication equipment and portable
battery powered applications which require low quiescent current. The
MC78LC00 series features an ultra−low quiescent current of 1.1 mA.
Each device contains a voltage reference unit, an error amplifier, a
PMOS power transistor, and resistors for setting output voltage.
The MC78LC00 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1 mF. The
device is housed in the micro−miniature Thin SOT23−5 surface mount
package and SOT−89, 3 pin. Standard voltage versions are 1.5, 1.8,
2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in
100 mV steps.
4 N/C
(Top View)
XXX= Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
TAB
GND 1
Typical Applications
1
• Battery Powered Instruments
• Hand−Held Instruments
• Camcorders and Cameras
SOT−89
H SUFFIX
CASE 1213
Vin 2
XX
DD
Tab
Vout 3
(Top View)
(Tab is connected to Pin 2)
XX = Specific Device Code
DD = Date Code
2
3
Vin
VO
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Vref
1
GND
This device contains 8 active transistors.
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 11
1
Publication Order Number:
MC78LC00/D
MC78LC00 Series
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
GND
Description
2
Vin
Positive power supply input voltage
3
Vout
Regulated Output
4
N/C
No Internal Connection
5
N/C
No Internal Connection
Power supply ground
MAXIMUM RATINGS
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Symbol
Value
Unit
Input Voltage
Rating
Vin
12
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Power Dissipation and Thermal Characteristics
Case 483−01 (Thin SOT23−5) NTR Suffix
Power Dissipation @ TA = 85°C
Thermal Resistance, Junction−to−Ambient
Case 1213 (SOT−89) H Suffix
Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
PD
RqJA
140
280
mW
°C/W
PD
RqJA
900
111
mW
°C/W
Operating Junction Temperature
TJ
+125
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Tsolder
10
sec
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Lead Soldering Temperature @ 260°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
2
MC78LC00 Series
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 5)
NTR SUFFIX
Symbol
Characteristic
Output Voltage (TA = 25°C, Iout = 1.0 mA)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Vout
Output Voltage (TA = −40°C to 85°C)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Vout
Min
Typ
Max
1.455
1.746
2.425
2.646
2.744
2.94
3.234
3.9
4.90
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.545
1.854
2.575
2.754
2.856
3.06
3.366
4.1
5.10
1.455
1.746
2.425
2.619
2.716
2.910
3.201
3.9
4.90
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.545
1.854
2.575
2.781
2.884
3.09
3.399
4.1
5.10
Unit
V
V
Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA)
Regline
−
0.05
0.2
%/V
Load Regulation (Iout = 1.0 mA to 10 mA)
Regload
−
40
60
mV
Output Current (Note 6)
1.5 V, 1.8 V (Vin = 4.0 V)
2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V)
3.3 V (Vin = 6.0 V)
4.0 V (Vin = 7.0 V)
5.0 V (Vin = 8.0 V)
Iout
35
50
50
80
80
50
80
80
80
100
−
−
−
−
−
−
−
−
−
35
30
30
30
70
60
53
38
Dropout Voltage (Iout = 1.0 mA, Measured at Vout −3.0%)
1.5 V
1.6 V−3.2 V
3.3 V−3.9 V
4.0 V−5.0 V
mA
mV
Vin−Vout
Quiescent Current (Iout = 1.0 mA to IO(nom.))
IQ
−
1.1
3.6
mA
Output Voltage Temperature Coefficient
Tc
−
"100
−
ppm/°C
Output Noise Voltage (f = 1.0 kHz to 100 kHz)
Vn
−
89
−
mVrms
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch up capability (85°C) "100 mA
3. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.
www.onsemi.com
3
MC78LC00 Series
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 11)
HT SUFFIX
Symbol
Characteristic
Output Voltage
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 5.0 V)
40HT1 Suffix (Vin = 6.0 V)
50HT1 Suffix (Vin = 7.0 V)
Min
Typ
Max
2.950
3.218
3.900
4.875
3.0
3.3
4.0
5.0
3.075
3.382
4.100
5.125
−
0.05
0.2
−
−
−
−
40
40
50
60
60
60
70
90
35
35
45
55
50
50
65
80
−
−
−
−
−
−
−
−
40
35
25
25
60
53
38
38
−
−
−
−
1.1
1.1
1.2
1.3
3.3
3.3
3.6
3.9
−
±100
−
Unit
V
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Line Regulation
Vin = [VO + 1.0] V to 10 V, IO = 1.0 mA
Regline
Load Regulation (IO = 1.0 to 10 mA)
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 6.0 V)
40HT1 Suffix (Vin = 7.0 V)
50HT1 Suffix (Vin = 8.0 V)
Regload
Output Current (Note 12)
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 6.0 V)
40HT1 Suffix (Vin = 7.0 V)
50HT1 Suffix (Vin = 8.0 V)
IO
Dropout Voltage
30HT1 Suffix (IO = 1.0 mA)
33HT1 Suffix (IO = 1.0 mA)
40HT1 Suffix (IO = 1.0 mA)
50HT1 Suffix (IO = 1.0 mA)
Vin − VO
Quiescent Current
30HT1 Suffix (Vin = 5.0 V)
33HT1 Suffix (Vin = 5.0 V)
40HT1 Suffix (Vin = 6.0 V)
50HT1 Suffix (Vin = 7.0 V)
ICC
Output Voltage Temperature Coefficient
TC
%/V
mV
mA
mV
mA
ppm/°C
7. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
8. Latch up capability (85°C) "100 mA
9. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
10. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
12. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.
DEFINITIONS
Load Regulation
difference between the input current (measured through the
LDO input pin) and the output current.
The change in output voltage for a change in output current
at a constant temperature.
Line Regulation
Dropout Voltage
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low dissipation
or by using pulse technique such that the average chip
temperature is not significantly affected.
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3% below its
nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical over and undershoot response when input voltage is
excited with a given slope.
Maximum Power Dissipation
The maximum total dissipation for which the regulator will
operate within its specifications.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches its
maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
Quiescent Current
The quiescent current is the current which flows through the
ground when the LDO operates without a load on its output:
internal IC operation, bias, etc. When the LDO becomes
loaded, this term is called the Ground current. It is actually the
www.onsemi.com
4
MC78LC00 Series
3.2
3.2
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
3.1
3
IO = 1 mA
2.9
IO = 10 mA
2.8
2.7
2.6
IO = 5 mA
2.5
2.4
2.2
2.5
2.8
IO = 5.0 mA
2.6
2.4
MC78LC30HT1
IO = 10 mA
2.7
2.9
3.1
3.3
2.2
2.5
3.5
Vin, Input Voltage (V)
2.9
3.1
Vin, Input Voltage (V)
Figure 2. Output Voltage versus Input Voltage
Figure 3. Output Voltage versus Input Voltage
2.7
3.3
3.5
3.2
3.05
NTR Series
3
−40°C
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
IO = 1.0 mA
3.0
TA = 25°C
2.3
2.95
80°C
2.9
2.85
2.8
2.75
25°C
2.7
2.65
3.1
TA = −30°C
3.0
2.9
0
20
40
60
80
100
TA = 25°C
2.8
MC78LC30HT1
2.7
2.6
0
0
120
20
TA = 80°C
100
120
IO, Output Current (mA)
40
60
80
IO, Output Current (mA)
Figure 4. Output Voltage versus Output Current
Figure 5. Output Voltage versus Output Current
2
2.0
Vin −VO, DROPOUT VOLTAGE (V)
Vin −VO, DROPOUT VOLTAGE (V)
TA = 25°C
NTR Series
MC78LC30NTR
TA = 25°C
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
10
20
30
40
1.6
1.2
0.8
0
0
50
MC78LC30HT1
TA = 25°C
0.4
IO, Output Current (mA)
10
20
30
40
50
IO, Output Current (mA)
Figure 6. Dropout Voltage versus Output Current
Figure 7. Dropout Voltage versus Output Current
www.onsemi.com
5
MC78LC00 Series
3.10
MC78LC30NTR
Vin = 4.0 V
IO = 10 mA
3.06
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
3.1
3.02
2.98
2.94
2.9
−40
−20
0
20
40
60
3.06
3.02
2.98
MC78LC30HT1
2.94
2.90
−40
80
−20
20
40
60
80
TA, Ambient Temperature (°C)
Figure 8. Output Voltage versus Temperature
Figure 9. Output Voltage versus Temperature
1.4
1.3
IQ, QUIESCENT CURRENT (mA)
MC78LC30NTR
TA = 25°C
IO = 0 mA
1.2
1.1
1
0.9
0.8
3
4
5
6
7
8
9
10
11
TA = 25°C
1.3
1.2
1.1
1.0
MC78LC30HT1
0.9
0.8
3.0
12
4.0
Vin, Input Voltage (V)
7.0
8.0
9.0
10
1.2
IQ, QUIESCENT CURRENT (mA)
MC78LC30NTR
Vin = 4.0 V
IO = 0 mA
1.25
1
0.75
0.5
−20
6.0
Figure 11. Quiescent Current versus Input Voltage
1.75
1.5
5.0
Vin, Input Voltage (V)
Figure 10. Quiescent Current versus Input Voltage
IQ, QUIESCENT CURRENT (mA)
0
TA, Ambient Temperature (°C)
1.4
IQ, QUIESCENT CURRENT (mA)
Vin = 5.0 V
IO = 10 mA
0
20
40
60
Vin = 5.0 V
1.1
1.0
0.9
0.8
MC78LC30HT1
0.7
0.6
−40
80
−20
0
20
40
60
80
TA, Ambient Temperature (°C)
TA, Ambient Temperature (°C)
Figure 12. Quiescent Current versus Temperature
Figure 13. Quiescent Current versus Temperature
www.onsemi.com
6
MC78LC00 Series
0.8
Vin − Vout, DROPOUT VOLTAGE (V)
Vin − Vout, DROPOUT VOLTAGE (V)
0.8
NTR Series
0.7
HT1 Series
0.7
0.6
IO = 10 mA
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.1
0
0.0
1.0
2.0
4.0
3.0
5.0
IO = 1.0 mA
0
0
6.0
1.0
2.0
VO, Set Output Voltage (V)
Output Voltage
Deviation (mV)
INPUT VOLTAGE/OUTPUT VOLTAGE (V)
Input Voltage (V)
6.0
NTR Series
5.0
4.0
300
Vin = 4.5 V to 5.5 V
Vout = 3.0 V
RL = 3 k
Cout = 0.1 mF
100
0
−100
−200
−300
0
0.5
1.0
1.5
2.0
2.5
6.0
8.0
7.5
Input Voltage
7.0
6.5
6.0
HT1 Series
5.5
Output Voltage
5.0
CO = 0.1 mF
IO = 1.0 mA
4.5
4.0
0
2.0
4.0
6.0
t, Time (ms)
Figure 16. Line Transient
Figure 17. Line Transient Response
1.5
TA = 25°C
3.0
NTR Series
Ig GROUND CURRENT (mA)
Vout, OUTPUT VOLTAGE (V)
5.0
Time (mS)
3.5
2.5
2.0
1.5
IO = 50 mA
1.0
100 mA
0.5
0
4.0
Figure 15. Dropout Voltage versus
Set Output Voltage
Figure 14. Dropout Voltage versus Set Output Voltage
200
3.0
VO, Set Output Voltage (V)
TA = 25°C
IO = 0 mA
1.0
NTR Series
50 mA
0.8
200 mA
0.6
100 mA
50 mA
0.4
200 mA
0.2
200 mA
0
0.5
1.0
1.5
2.0
0
2.5
0
Vin, Input Voltage (V)
0.5
1.0
1.5
2.0
2.5
Vin, Input Voltage (V)
Figure 18. Output Voltage versus Input Voltage
Figure 19. Ground Current versus Input Voltage
www.onsemi.com
7
MC78LC00 Series
APPLICATIONS INFORMATION
Thermal
A typical application circuit for the MC78LC00 series is
shown in Figure 20.
As power across the MC78LC00 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and also the
ambient temperature effect the rate of temperature rise for
the part. This is stating that when the MC78LC00 has good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.
The maximum dissipation the package can handle is
given by:
Input Decoupling (C1)
A 0.1 mF capacitor either ceramic or tantalum is
recommended and should be connected close to the
MC78LC00 package. Higher values and lower ESR will
improve the overall line transient response.
Output Decoupling (C2)
The MC78LC00 is a stable component and does not
require any specific Equivalent Series Resistance (ESR) or
a minimum output current. Capacitors exhibiting ESRs
ranging from a few mW up to 3.0 W can thus safely be used.
The minimum decoupling value is 0.1 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
PD +
If junction temperature is not allowed above the
maximum 125°C, then the MC78LC00NTR can dissipate
up to 357 mW @ 25°C.
The power dissipated by the MC78LC00NTR can be
calculated from the following equation:
Hints
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
chance to pick up noise or cause the regulator to
malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Battery or
Unregulated
Voltage
TJ(max) * TA
RqJA
Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout
or
P ) Vout * Iout
VinMAX + tot
Ignd ) Iout
If an 80 mA output current is needed then the ground
current from the data sheet is 1.1 mA. For an
MC78LC30NTR (3.0 V), the maximum input voltage will
then be 7.4 V.
+
C1
Vout
+
C2
Figure 20. Basic Application Circuit for NTR Suffixes
www.onsemi.com
8
MC78LC00 Series
MJD32C
0.033 mF
2
100
Vin
2
Vin
3
3
VO
MC78LC00
VO
MC78LC00
R1
1
1
0.1 mF
ICC
C1
0.1 mF
GND
R2
GND
GND
Figure 21. Current Boost Circuit
R2
Figure 22. Adjustable VO
MJD32C
Q1
0.033 mF
Q2
Vin
C2
MMBT2907
ALT1
2
3
VO
MC78LC00
R1
1
0.1 mF
0.1 mF
GND
GND
Figure 23. Current Boost Circuit with
Overcurrent Limit Circuit
V
O
+ V
O(Reg)
ǒ1 ) R2
Ǔ ) ICC R2
R1
I
www.onsemi.com
9
O(short circuit)
[
V
BE2 )
R2
V
BE1
) V
R1
BE2
MC78LC00 Series
ORDERING INFORMATION
Nominal
Output Voltage
Marking
MC78LC15NTRG
1.5
LAG
MC78LC18NTRG
1.8
LAH
MC78LC25NTRG
2.5
LAI
MC78LC27NTRG
2.7
LAJ
MC78LC28NTRG
2.8
LAK
MC78LC30NTRG
3.0
LAL
MC78LC33NTRG
3.3
LAM
MC78LC40NTRG
4.0
LEC
MC78LC50NTRG
5.0
LAN
MC78LC30HT1G
3.0
0C
MC78LC33HT1G
3.3
3C
MC78LC40HT1G
4.0
0D
MC78LC50HT1G
5.0
0E
Device
Package
Shipping†
Thin SOT23−5
(Pb−Free)
3000 Units/7″ Tape & Reel
SOT−89
(Pb−Free)
1000 Units Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.
www.onsemi.com
10
MC78LC00 Series
PACKAGE DIMENSIONS
TSOP−5 (SOT23−5)
NTR SUFFIX
CASE 483
ISSUE M
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
MC78LC00 Series
PACKAGE DIMENSIONS
SOT−89
H SUFFIX
CASE 1213−02
ISSUE C
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. 1213-01 OBSOLETE, NEW STANDARD 1213-02.
C
J
F
−B−
L
K
D
0.10
E
G
M
T B
S
A
S
−T−
SEATING
PLANE
2 PL
0.10
M
T B
S
A
S
DIM
A
B
C
D
E
F
G
H
J
K
L
MILLIMETERS
MIN
MAX
4.40
4.60
2.40
2.60
1.40
1.60
0.37
0.57
0.32
0.52
1.50
1.83
1.50 BSC
3.00 BSC
0.30
0.50
0.80
----4.25
INCHES
MIN
MAX
0.173
0.181
0.094
0.102
0.055
0.063
0.015
0.022
0.013
0.020
0.059
0.072
0.059 BSC
0.118 BSC
0.012
0.020
0.031
----0.167
H
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
12
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC78LC00/D
Similar pages