PulseCore ASM3P2183AF-08SR Emi reduction ic Datasheet

ASM3P2183A
March 2007
rev 1.7
EMI Reduction IC
Features
The ASM3P2183A reduces electromagnetic interference
•
FCC approved method of EMI attenuation.
•
Provides up to 15dB EMI reduction.
•
Generates a 1X low EMI spread spectrum clock of
the input frequency.
•
Input frequency range: 6MHz to 90MHz.
•
Internal loop filter minimizes external components
and board space.
•
Selectable spread options: Down and Center Spread
•
2 spread frequency deviation selections:
•
-1.25% or ± 0.42%
•
Low inherent cycle-to-cycle jitter.
•
Supply Voltage: 3.3 V ± 0.3V.
•
Low power CMOS design.
•
Supports notebook VGA and other LCD timing
controller applications.
•
Products are available for Industrial temperature
range.
•
Available in 8-pin SOIC and TSSOP Packages.
Product Description
(EMI) at the clock source, allowing system wide reduction
of EMI of
down stream clock and data dependent
signals. The ASM3P2183A allows significant system cost
savings by reducing the number of circuit board layers
ferrite beads, shielding and other passive components
that are traditionally required to pass EMI regulations.
The ASM3P2183A uses the most efficient and optimized
modulation profile approved by the FCC and is
implemented in a proprietary all digital method.
The ASM3P2183A modulates the output of a single PLL
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of
its harmonics. This results in significantly lower system
EMI compared to the typical narrow band signal produced
by oscillators and most frequency generators. Lowering
EMI by increasing a signal’s bandwidth is called ‘spread
spectrum clock generation’.
Applications
The ASM3P2183A is a versatile spread spectrum
frequency modulators designed specifically for a wide
range of input clock frequencies from 6MHz to 90MHz.
(Refer Input Frequency and Modulation Rate Table). The
ASM3P2183A can generate an EMI reduced clock from
an OSC or a system generated clock. The ASM3P2183A
The ASM3P2183A is targeted towards EMI management
for memory and LVDS interfaces in mobile graphic
chipsets and high-speed digital applications such as PC
peripheral devices, consumer electronics, and embedded
controller systems.
offers a Down Spread clock with a percentage deviation
of -1.25% and a Center Spread clock with a percentage
deviation of ± 0.42%.
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018
www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
ASM3P2183A
March 2007
rev 1.7
Block Diagram
FS0
FS1
VDD
SS%
PLL
Modulation
XIN /CLKIN
Crystal
Oscillator
Frequency
Divider
XOUT
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
ModOUT
VSS
Pin Configuration
XIN / CLKIN 1
8
XOUT 2
FS1
7 FS0
ASM3P2183A
VSS
3
6
SS%
4
5
VDD
ModOUT
Pin Description
Pin#
Pin Name
Type
Description
1
XIN /CLKIN
I
2
XOUT
I
3
VSS
P
Ground to entire chip.
4
SS%
I
Spread range select. Digital logic input used to select frequency deviation
(Refer Spread Deviation Selection Table). This pin has an internal pull-up resistor.
5
ModOUT
O
Spread spectrum low EMI output.
6
VDD
P
Power supply for the entire chip.
7
FS0
I
8
FS1
I
Crystal connection or external frequency input. This pin has dual functions. It can
be connected to either an external crystal or an external reference clock.
Crystal connection. Input connection for an external crystal. If using an external
reference, this pin must be left unconnected.
Frequency range select. Digital logic input used to select frequency range
(Refer Input Frequency and Modulation Rate Table). This pin has an internal
pull-up resistor.
Frequency range select. Digital logic input used to select frequency range
(Refer Input Frequency and Modulation Rate Table). This pin has an internal
pull-up resistor.
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
2 of 8
ASM3P2183A
March 2007
rev 1.7
Input Frequency and Modulation Rate Table
FS1 (pin 8)
FS0 (pin 7)
Frequency Range
0
0
6MHz to 13MHz
0
1
12MHz to 25MHz
1
0
25MHz to 50MHz
1
1
50MHz to 90MHz
Spread Deviation Selection Table
SS% (pin 4)
Spread Deviation (%)
0
- 1.25
1
± 0.42
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VDD, VIN
Voltage on any pin with respect to Ground
-0.5 to +4.6
V
Storage temperature
-65 to +125
°C
TSTG
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
150
°C
2
KV
TDV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Recommended Operating Conditions
Symbol
TA
VDD
Parameter
Operating Temperature
Core Voltage
Min
Typ
0
+3.0
+3.3
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
Max
Units
+70
°C
+3.6
V
3 of 8
ASM3P2183A
March 2007
rev 1.7
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VIL
Input low voltage
VSS – 0.3
-
0.8
V
VIH
Input high voltage
2.0
-
VDD + 0.3
V
IIL
Input low current
-
-
-35
µA
IIH
-
-
35
µA
-
3
-
mA
-
3
-
mA
VOL
Input high current
XOUT Output low current
(@ 0.4V, VDD = 3.3V)
XOUT Output high current
(@ 2.5V, VDD = 3.3V)
Output low voltage (VDD = 3.3V, IOL = 20mA)
-
-
0.4
V
VOH
Output high voltage (VDD = 3.3V, IOH = 20mA)
2.5
-
-
V
ICC
Dynamic supply current
Normal mode (3.3V,90MHz and 10pF loading)
-
28
-
mA
IDD
Static supply current *
-
7.0
-
mA
VDD
Operating voltage
3.0
3.3
3.6
V
tON
Power up time (first locked clock cycle after power up)
-
0.18
-
mS
Clock out impedance
-
50
-
Ω
IXOL
IXOH
ZOUT
* XIN /CLKIN pin is pulled low
AC Electrical Characteristics
Symbol
fIN
ModOUT
Parameter
Input frequency
Typ
Max
Unit
6
-
90
MHz
6
-
90
MHz
Output rise time (measured at 0.8V to 2.0V)
0.3
0.9
1.1
nS
tHL*
Output fall time (measured at 2.0V to 0.8V)
0.5
1.0
1.2
nS
tJC
Jitter (cycle to cycle)
-
-
200
pS
TD
Output duty cycle
45
50
55
%
tLH*
Output frequency
Min
* tLH and tHL are measured with a capacitive load of 15pF at 27MHz
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
4 of 8
ASM3P2183A
March 2007
rev 1.7
Package Information
8-lead (150-mil) SOIC Package
H
E
D
A2
A
C
A1
D
θ
e
L
B
Dimensions
Symbol
Inches
Min
Max
Millimeters
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.010
0.18
0.25
D
0.193 BSC
4.90 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
0.41
1.27
θ
0°
8°
0°
8°
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
5 of 8
ASM3P2183A
March 2007
rev 1.7
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)
H
E
D
A2
A
C
θ
e
A1
L
B
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.10
A1
0.002
0.006
0.05
0.15
A2
0.033
0.037
0.85
0.95
B
0.008
0.012
0.19
0.30
c
0.004
0.008
0.09
0.20
D
0.114
0.122
2.90
3.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.028
0.50
0.70
θ
0°
8°
0°
8°
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
6 of 8
ASM3P2183A
March 2007
rev 1.7
Ordering Information
Part Number
Marking
Package Type
Temperature
ASM3P2183A-08ST
3P2183A
8-Pin SOIC, TUBE
Commercial
ASM3P2183A-08SR
3P2183A
8-Pin SOIC, TAPE & REEL
Commercial
ASM3P2183A-08TT
3P2183A
8-Pin TSSOP, TUBE
Commercial
ASM3P2183A-08TR
3P2183A
8-Pin TSSOP, TAPE & REEL
Commercial
ASM3P2183AF-08ST
3P2183AF
8-Pin SOIC, TUBE, Pb Free
Commercial
ASM3P2183AF-08SR
3P2183AF
8-Pin SOIC, TAPE & REEL, Pb Free
Commercial
ASM3P2183AF-08TT
3P2183AF
8-Pin TSSOP, TUBE, Pb Free
Commercial
ASM3P2183AF-08TR
3P2183AF
8-Pin TSSOP, TAPE & REEL, Pb Free
Commercial
ASM3P2183AG-08ST
3P2183AG
8-Pin SOIC, TUBE, Green
Commercial
ASM3P2183AG-08SR
3P2183AG
8-Pin SOIC, TAPE & REEL, Green
Commercial
ASM3P2183AG-08TT
3P2183AG
8-Pin TSSOP, TUBE, Green
Commercial
ASM3P2183AG-08TR
3P2183AG
8-Pin TSSOP, TAPE & REEL, Green
Commercial
Device Ordering Information
A S M 3 P 2 1 8 3 A F - 0 8 T R
R = Tape & Reel, T = Tube or Tray
O = SOT
S = SOIC
T = TSSOP
A = SSOP
V = TVSOP
B = BGA
Q = QFN
U = MSOP
E = TQFP
L = LQFP
U = MSOP
P = PDIP
D = QSOP
X = SC-70
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE, LEAD FREE, and RoHS
PART NUMBER
X= Automotive
I= Industrial
P or n/c = Commercial
(-40C to +125C) (-40C to +85C)
(0C to +70C)
1 = Reserved
2 = Non PLL based
3 = EMI Reduction
4 = DDR support products
5 = STD Zero Delay Buffer
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
6 = Power Management
7 = Power Management
8 = Power Management
9 = Hi Performance
0 = Reserved
PulseCore Semiconductor Mixed Signal Product
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
7 of 8
ASM3P2183A
March 2007
rev 1.7
Copyright © PulseCore Semiconductor
All Rights Reserved
Part Number: ASM3P2183A
Document Version: v1.7
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200
Campbell, CA 95008
Tel: 408-879-9077
Fax: 408-879-9018
www.pulsecoresemi.com
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
© Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or
registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their
respective companies. PulseCore reserves the right to make changes to this document and its products at any time without
notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein
represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct
this data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product
described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products
including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual
property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from
PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale.
The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights,
trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products
for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result
in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the
manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
EMI Reduction IC
Notice: The information in this document is subject to change without notice.
8 of 8
Similar pages