MC74LVXU04 Hex Inverter (Unbuffered) The MC74LVX04 is an advanced high speed CMOS unbuffered hex inverter. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3.0 V systems. http://onsemi.com Features • • • • • • • High Speed: tPD = 4.1 ns (Typ) at VCC = 3.3 V Low Power Dissipation: ICC = 2 mA (Max) at TA = 25°C Power Down Protection Provided on Inputs Balanced Propagation Delays Low Noise: VOLP = 0.5 V (Max) Pin and Function Compatible with Other Standard Logic Families These Devices are Pb−Free and are RoHS Compliant A0 A1 A2 A3 A4 A5 1 2 3 4 5 6 9 8 11 10 13 12 SOIC−14 NB D SUFFIX CASE 751A TSSOP−14 DT SUFFIX CASE 948G PIN ASSIGNMENT VCC A5 O5 A4 O4 A3 O3 14 13 12 11 10 9 8 O0 O1 O2 1 2 3 4 5 6 7 A0 O0 A1 O1 A2 O2 GND O3 14−Lead (Top View) O4 MARKING DIAGRAMS 14 O5 LVXU04G AWLYWW Figure 1. Logic Diagram 1 PIN NAMES SOIC−14 NB Pins Function An On Data Inputs Outputs 14 LVX U04 ALYWG G FUNCTION TABLE 1 An On L H H L TSSOP−14 LVXU04 A WL, L Y WW, W G or G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 4 1 Publication Order Number: MC74LVXU04/D MC74LVXU04 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V −0.5 to VCC + 0.5 V VI < GND −20 mA VO < GND ±20 mA VOUT DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Sink Current ±25 mA ICC DC Supply Current per Supply Pin ±50 mA −65 to +150 _C 260 _C TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias +150 _C qJA Thermal Resistance SOIC TSSOP 250 _C/W PD Power Dissipation in Still Air at 85_C SOIC TSSOP 250 mW MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup Level 1 Oxygen Index: 30% − 35% ESD Withstand Voltage UL 94−V0 @ 0.125 in Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Latchup Performance Above VCC and Below GND at 85_C (Note 4) > 2000 > 200 2000 V ±300 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate (Note 5) (HIGH or LOW State) VCC = 3.0 V ± 0.3 V Min Max Unit 2.0 3.6 V 0 5.5 V 0 VCC V −40 +85 _C 0 100 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 MC74LVXU04 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions TA = 25°C VCC V Min 1.5 2.0 2.4 VIH High−Level Input Voltage 2.0 3.0 3.6 VIL Low−Level Input Voltage 2.0 3.0 3.6 VOH High−Level Output Voltage (Vin = VIH or VIL) IOH = −50 mA IOH = −50 mA IOH = −4 mA 2.0 3.0 3.0 VOL Low−Level Output Voltage (Vin = VIH or VIL) IOL = 50 mA IOL = 50 mA IOL = 4 mA 2.0 3.0 3.0 Iin Input Leakage Current Vin = 5.5 V or GND ICC Quiescent Supply Current Vin = VCC or GND Typ TA = −40 to 85°C Max Min 0.5 0.8 0.8 1.9 2.9 2.58 Max 1.5 2.0 2.4 2.0 3.0 0.0 0.0 Unit V 0.5 0.8 0.8 1.9 2.9 2.48 V V 0.1 0.1 0.36 0.1 0.1 0.44 V 3.6 ±0.1 ±1.0 mA 3.6 2.0 20.0 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns) TA = 25°C Symbol tPLH, tPHL tOSHL tOSLH Typ Max Min Max Unit CL = 15 pF CL = 50 pF 5.4 7.9 10.1 13.6 1.0 1.0 12.5 16.0 ns VCC = 3.3 ± 0.3V CL = 15 pF CL = 50 pF 4.1 6.6 6.2 9.7 1.0 1.0 7.5 11.0 Parameter Test Conditions Propagation Delay, Input to Output Output−to−Output Skew (Note 6) VCC = 2.7V VCC = 2.7V VCC = 3.3 ±0.3V Min TA = −40 to 85°C CL = 50 pF CL = 50 pF 1.5 1.5 1.5 1.5 ns 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. CAPACITIVE CHARACTERISTICS TA = 25°C Typ Max Cin Input Capacitance 4 10 CPD Power Dissipation Capacitance (Note 7) 18 Symbol Min TA = −40 to 85°C Parameter Min Max Unit 10 pF pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 6 (per buffer). CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 3.3 V, Measured in SOIC Package) TA = 25°C Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.3 0.5 V VOLV Quiet Output Minimum Dynamic VOL −0.3 −0.5 V VIHD Minimum High Level Dynamic Input Voltage 2.0 V VILD Maximum Low Level Dynamic Input Voltage 0.8 V Symbol Characteristic http://onsemi.com 3 MC74LVXU04 TEST POINT VCC A OUTPUT 50% DEVICE UNDER TEST GND tPLH O tPHL CL* 50% VCC *Includes all probe and jig capacitance Figure 2. Switching Waveforms Figure 3. Test Circuit ORDERING INFORMATION Package Shipping† MC74LVXU04DG SOIC−14 NB (Pb−Free) 55 Units / Rail MC74LVXU04DR2G SOIC−14 NB (Pb−Free) 2500 Tape & Reel MC74LVXU04DTG TSSOP−14 (Pb−Free) 96 Units / Rail MC74LVXU04DTR2G TSSOP−14 (Pb−Free) 2500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74LVXU04 PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MC74LVXU04 PACKAGE DIMENSIONS D SOIC−14 NB CASE 751A−03 ISSUE K A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S e DETAIL A h A X 45 _ M A1 C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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