TSC BAS21-D0RFG 225mw smd switching diode Datasheet

BAS21 / A / C / S
Taiwan Semiconductor
Small Signal Product
225mW SMD Switching Diode
FEATURES
- Fast switching speed
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
SOT-23
MECHANICAL DATA
- Case: SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
- Weight: 8 ± 0.5 mg
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
PD
225
mW
Repetitive Peak Reverse Voltage
VRRM
250
V
Repetitive Peak Forward Current
IFRM
625
mA
IO
200
mA
IFSM
1
Power Dissipation
Mean Forward Current
Non-Repetitive Peak Forward Surge Current
Thermal Resistance (Junction to Ambient)
(Note 1)
(Note 2)
Junction and Storage Temperature Range
RθJA
500
TJ , TSTG
-55 to +150
A
o
C/W
o
C
Notes : 1. Test condition : 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) pulse width = 1 μsec
2. Valid provided that electrodes are kept at ambient temperature
PARAMETER
Reverse Breakdown Voltage
Forward Voltage
Reverse Leakage Current
Junction Capacitance
Reverse Recovery Time
Document Number: DS_S1412039
IR = 100 μA
IF = 100 mA
IF = 200 mA
SYMBOL
MIN
MAX
UNIT
VR(BR)
250
-
V
-
1.00
-
1.25
VF
V
VR = 200 V
IR
-
0.1
μA
VR = 1 V , f = 1.0 MHz
CJ
-
5
pF
IF= IR= 30mA , RL= 100Ω , IRR= 1mA
trr
-
50
ns
Version: D14
BAS21 / A / C / S
Taiwan Semiconductor
Small Signal Product
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
Fig. 2 Reverse Current VS. Junction temperature
Fig. 1 Typical Forward Characteristics
100
VR=200V
100
Reverse Current (μA)
Instantaneous Forward Current (mA)
1000
10
1
10
1
0.1
0.1
0.01
0.01
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
0
40
80
120
Tj, Junction Temperature
Instantaneous Forward Voltage (V)
160
200
(o C)
Fig. 3 Admissible Power Dissipation Curve
Power Dissipation (mW)
250
200
150
100
50
0
0
25
50
75
100
125
150
175
200
Ambient Temperature (oC)
Document Number: DS_S1412039
Version: D14
BAS21 / A / C / S
Taiwan Semiconductor
Small Signal Product
ORDERING INFORMATION
PART NO.
PACKING
PACKING CODE
SUFFIX (Note 2)
CODE
SUFFIX
PART NO.
BAS2xx
(Note 1)
-xx
RF
G
R5
PACKAGE
PACKING
3K / 7" Reel
SOT-23
10K / 13" Reel
Note 1: "xx" is Device Code "1" thru "1S"
Note 2: Part No. Suffix „-xx “ would be used for special requirement
EXAMPLE
PREFERRED P/N PART NO.
PART NO.
SUFFIX
PACKING CODE
PACKING CODE
BAS21 RF
BAS21
RF
BAS21 RFG
BAS21
RF
SUFFIX
DESCRIPTION
Multiple manufacture
source
G
Multiple manufacture
source
Green compound
BAS21-B0 RFG
BAS21
-B0
RF
G
Defined manufacture
source
Green compound
BAS21-D0 RFG
BAS21
-D0
RF
G
Defined manufacture
source
Green compound
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
2.70
3.10
0.106
0.122
B
1.10
1.50
0.043
0.059
C
0.30
0.51
0.012
0.020
D
1.78
2.04
0.070
0.080
E
2.10
2.64
0.083
0.104
F
0.89
1.30
0.035
0.051
G
0.55 REF
0.022 REF
H
0.10 REF
0.004 REF
Unit (mm)
Unit (inch)
SUGGEST PAD LAYOUT
DIM.
Document Number: DS_S1412039
Typ.
Typ.
Z
2.8
0.110
X
0.7
0.028
Y
0.9
0.035
C
1.9
0.075
E
1.0
0.039
Version: D14
BAS21 / A / C / S
Taiwan Semiconductor
Small Signal Product
PIN CONFIGURATION
BAS21
BAS21A
BAS21C
BAS21S
MARKING
Part NO.
Marking
BAS21
JS
BAS21A
JS2
BAS21C
JS3
BAS21S
JS4
Document Number: DS_S1412039
Version: D14
BAS21 / A / C / S
Taiwan Semiconductor
Small Signal Product
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_S1412039
Version: D14
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