Central HDDIPPD Hd dip case Datasheet

Package Details
HD DIP Case
Mechanical Drawing
Part Marking: 4-5 Character Alpha/Numeric Code
Mounting Pad Geometry (Dimensions in mm)
R3 (4-March 2010)
w w w. c e n t r a l s e m i . c o m
Package Details
HD DIP Case
Tape Dimensions and Orientation (Dimensions in mm)
Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-1-A
Tape Width: 12mm
Direction of Unreeling
Packaging Base
13” Reel
=
3,000 pcs.
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
Reels per
Box
(Maximum)
Parts per
Box
(Maximum)
INCH
CM
LB
KG
13”
5
14
26
15,000
42,000
78,000
15x4x15
15x15x9
15x15x18
38x10x38
38x38x23
38x38x46
9
25
46
4
12
21
Box Dimensions
Shipping Weight (Max.)
Ordering Information
• For devices taped and reeled on 13” reels, add TR13 suffix to part number.
• All SMDs are available in small quantities for prototype and manual placement applications.
R3 (4-March 2010)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
HD DIP Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126.8 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Component
Material
active device
doped Si
leadframe
die attach
Cu alloy
high temperature
solder paste
EMC
Material
(%wt)
(mg)
3.38%
4.28
33.5%
7.16%
55.48%
42.49
9.08
70.34
Substance CAS No.
Substance
(%wt)
(mg)
(ppm)
Si
7440-21-3
3.38%
4.28
33,754
Cu
7440-50-8
33.44%
42.405
334,424
Fe
7439-89-6
0.05%
0.064
505
P
7723-14-0
0.01%
0.018
142
Pb
7439-92-1
6.624%
8.399
66,238
Sn
7440-31-5
0.358%
0.454
3,580
Ag
7440-22-4
0.179%
0.227
1,790
SiO2
14808-60-7
37.72%
47.834
377,240
epoxy resin
29690-82-2
10.54%
13.365
105,402
phenol resin
9003-35-4
5.55%
7.034
55,473
Sb2O3
1309-64-4
0.55%
0.703
5,544
Br
7726-95-6
1.11%
1.407
11,096
silica (fused) 60676-86-0
42.72%
54.165
427,169
epoxy resin
29690-82-2
5.55%
7.034
55,473
phenol resin
9003-35-4
5.38%
6.823
53,809
carbon black
1333-86-4
0.17%
0.211
1,664
metal
hydroxide
1309-42-8
1.66%
2.11
16,640
Sn
7440-31-5
0.38%
0.488
3,849
Pb
7439-92-1
0.10%
0.122
962
Sn
7440-31-5
0.48%
0.61
4,811
encapsulation*
EMC GREEN
tin/lead process
55.48%
0.48%
70.34
0.61
plating**
matte tin
0.48%
0.61
*EMC GREEN molding compound is Halogen-Free.
**For Lead Free plating, add suffix “LEAD FREE” to part number.
For Tin/Lead plating, add suffix “TIN/LEAD” to part number.
No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R3 (3-June 2011)
w w w. c e n t r a l s e m i . c o m
Similar pages