Cypress CY7C60455-48LTXCT Encoreâ ¢ v low voltage microcontroller Datasheet


CY7C604XX
enCoRe™ V Low Voltage Microcontroller
Features
■
Powerful Harvard Architecture processor
❐ M8C processor speeds running up to 24 MHz
❐ Low power at high processing speeds
❐ Interrupt controller
❐ 1.71 V to 3.6 V operating voltage
❐ Commercial temperature range: 0 °C to +70 °C
■
Flexible on-chip memory
❐ Up to 32 K flash program storage
• 50,000 erase and write cycles
• Flexible protection modes
❐ Up to 2048 bytes SRAM data storage
❐ In-system serial programming (ISSP)
■
Complete development tools
®
❐ Free development tool (PSoC Designer™)
❐ Full-featured, in-circuit emulator and programmer
❐ Full-speed emulation
❐ Complex breakpoint structure
❐ 128 K trace memory
■
Precision, programmable clocking
❐ Crystal-less oscillator with support for an external crystal or
resonator
❐ Internal ±5.0% 6, 12, or 24 MHz main oscillator
❐ Internal low-speed oscillator at 32 kHz for watchdog and
sleep. The frequency range is 19 to 50 kHz with a 32 kHz
typical value
■
Programmable pin configurations
❐ Up to 36 GPIO (depending on package)
❐ 25 mA sink current on all GPIO
❐ Pull-up, High Z, open drain, CMOS drive modes on all GPIO
❐ CMOS drive mode (5 mA source current) on Ports 0 and 1:
• 20 mA (at 3.0 V) total source current
❐ Low dropout voltage regulator for Port 1 pins:
• Programmable to output 3.0, 2.5, or 1.8V
❐ Selectable, regulated digital I/O on Port 1
❐ Configurable input threshold for Port 1
❐ Hot-swappable capability on Port 1
■
Additional system resources
❐ Configurable communication speeds
2
❐ I C Slave
• Selectable to 50 kHz, 100 kHz, or 400 kHz
• Implementation requires no clock stretching
• Implementation during sleep modes with less than 100 mA
• Hardware address detection
❐ SPI master and SPI slave
• Configurable between 46.9 kHz and 12 MHz
❐ Three 16-bit timers
❐ 10-bit ADC used to monitor battery voltage or other signals
with external components
❐ Watchdog and sleep timers
❐ Integrated supervisory circuit
enCoRe V LV Block Diagram
Port 4
Port 3
Port 2
Port 1
Port 0
Prog. LDO
enCoRe V
CORE
System Bus
SRAM
2048 Bytes
SROM
8 K / 16 K / 32 K
Flash
Sleep and
Watchdog
CPU Core (M8C)
Interrupt
Controller
6 / 12 / 24 MHz Internal Main Oscillator
3 16-Bit
Timers
ADC
I2C Slave/SPI
Master-Slave
POR and LVD
System Resets
System Resources
Cypress Semiconductor Corporation
Document Number: 001-12395 Rev. *N
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised April 24, 2013
CY7C604XX
Contents
Functional Overview ........................................................ 3
The enCoRe V LV Core .............................................. 3
10-bit ADC ................................................................... 3
SPI ............................................................................... 4
I2C Slave ..................................................................... 4
Additional System Resources ..................................... 5
Getting Started .................................................................. 5
Application Notes ........................................................ 5
Development Kits ........................................................ 5
Training ....................................................................... 5
CYPros Consultants .................................................... 5
Solutions Library .......................................................... 5
Technical Support ....................................................... 5
Development Tools .......................................................... 6
PSoC Designer Software Subsystems ........................ 6
Designing with PSoC Designer ....................................... 7
Select User Modules ................................................... 7
Configure User Modules .............................................. 7
Organize and Connect ................................................ 7
Generate, Verify, and Debug ....................................... 7
Pin Configuration ............................................................. 8
16-Pin Part Pinout ....................................................... 8
32-Pin Part Pinout ....................................................... 9
48-Pin Part Pinout ..................................................... 11
Register Reference ......................................................... 13
Register Conventions .................................................... 13
Register Mapping Tables ............................................... 13
Electrical Specifications ................................................ 16
Absolute Maximum Ratings ....................................... 17
Operating Temperature ............................................. 17
Document Number: 001-12395 Rev. *N
DC Electrical Characteristics ........................................ 18
DC Chip Level Specifications .................................... 18
DC General Purpose I/O Specifications .................... 19
ADC Electrical Specifications .................................... 21
DC POR and LVD Specifications .............................. 22
DC Programming Specifications ............................... 22
AC Electrical Characteristics ........................................ 23
AC Chip Level Specifications .................................... 23
AC General Purpose IO Specifications ..................... 24
AC External Clock Specifications .............................. 25
AC Programming Specifications ................................ 25
AC I2C Specifications ................................................ 26
Package Diagram ............................................................ 28
Packaging Dimensions .................................................. 28
Package Handling ........................................................... 30
Thermal Impedances ..................................................... 30
Capacitance on Crystal Pins .................................... 30
Solder Reflow Peak Temperature ................................. 30
Ordering Information ...................................................... 31
Ordering Code Definitions ......................................... 31
Acronyms ........................................................................ 32
Document Conventions ................................................. 32
Units of Measure ....................................................... 32
Appendix: Errata Document for 
enCoRe™ V – CY7C643xx and 
enCoRe™ V LV – CY7C604xx ........................................ 33
CY7C643xx and CY7C604xx Errata Summary ......... 33
Document History Page ................................................. 35
Sales, Solutions, and Legal Information ...................... 38
Worldwide Sales and Design Support ....................... 38
Products .................................................................... 38
PSoC Solutions ......................................................... 38
Page 2 of 38
CY7C604XX
Functional Overview
The enCoRe V LV family of devices are designed to replace
multiple traditional low voltage microcontroller system components with one, low cost single chip programmable component.
Communication peripherals (I2C/SPI), a fast CPU, flash program
memory, SRAM data memory, and configurable I/O are included
in a range of convenient pinouts.
Figure 1. ADC System Performance Block Diagram
VIN
TEMP SENSOR/ ADC
The architecture for this device family, as illustrated in enCoRe
V LV Block Diagram, is comprised of two main areas: the CPU
core and the system resources. Depending on the enCoRe V LV
package, up to 36 GPIO are also included.
Enhancements over the Cypress’s legacy low-voltage microcontrollers include faster CPU at lower voltage operation, lower
current consumption, twice the RAM and flash, hot-swapable
I/Os, I2C hardware address recognition, new very low-current
sleep mode, and new package options.
The enCoRe V LV Core
The enCoRe V LV Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO
(internal main oscillator) and ILO (internal low-speed oscillator).
The CPU core, called the M8C, is a powerful processor with
speeds up to 24 MHz. The M8C is a four-MIPS, 8-bit Harvard
architecture microprocessor.
TEMP
DIODES
ADC
SYSTEM BUS
INTERFACE BLOCK
COMMAND/ STATUS
System Resources provide additional capability, such as a
configurable I2C slave and SPI master-slave communication
interface and various system resets supported by the M8C.
10-bit ADC
The ADC on enCoRe V LV device is an independent block with
a state machine interface to control accesses to the block. The
ADC is housed together with the temperature sensor core and
can be connected to this or the Analog Mux Bus. As a default
operation, the ADC is connected to the temperature sensor
diodes to give digital values of the temperature.
Interface to the M8 C
( Processor ) Core
The ADC User Module contains an integrator block and one
comparator with positive and negative input set by the MUXes.
The input to the integrator stage comes from the Analog Global
Input Mux or the temperature sensor with an input voltage range
of 0 V to 1.3 V, where 1.3 V is 72% of full scale.
In the ADC only configuration (the ADC MUX selects the Analog
Mux Bus, not the default temperature sensor connection), an
external voltage can be connected to the input of the modulator
for voltage conversion. The ADC is run for a number of cycles
set by the timer, depending upon the resolution of the ADC
desired by the user. A counter counts the number of trips by the
comparator, which is proportional to the input voltage. The Temp
Sensor block clock speed is 36 MHz and is divided down to 1 to
12 MHz for ADC operation.
Document Number: 001-12395 Rev. *N
Page 3 of 38
CY7C604XX
SPI
The serial peripheral interconnect (SPI) 3-wire protocol uses
both edges of the clock to enable synchronous communication
without the need for stringent setup and hold requirements.
Figure 2. Basic SPI Configuration
Data is output by
Data is registered at the
both the Master
input of both devices on the
and Slave on
opposite edge of the clock.
one edge of the
clock.
SCLK
MOSI
MISO
A device can be a master or slave. A master outputs clock and
data to the slave device and inputs slave data. A slave device
inputs clock and data from the master device and outputs data
for input to the master. Together, the master and slave are essentially a circular Shift register, where the master generates the
clocking and initiates data transfers.
A basic data transfer occurs when the master sends eight bits of
data, along with eight clocks. In any transfer, both master and
slave transmit and receive simultaneously. If the master only
sends data, the received data from the slave is ignored. If the
master wishes to receive data from the slave, the master must
send dummy bytes to generate the clocking for the slave to send
data back.
SPI configuration register (SPI_CFG) sets master/slave
functionality, clock speed and interrupt select. SPI control
register (SPI_CR) provides four control bits and four status bits
for device interfacing and synchronization.
The SPIM hardware has no support for driving the Slave Select
(SS_) signal. The behavior and use of this signal is application
and enCoRe V device dependent and, if required, must be implemented in firmware.
There is an additional data input in the SPIS, Slave Select (SS_),
which is an active low signal. SS_ must be asserted to enable
the SPIS to receive and transmit. SS_ has two high level
functions: 1) To allow for the selection of a given slave in a
multi-slave environment, and 2) To provide additional clocking
for TX data queuing in SPI modes 0 and 1.
I2C Slave
The I2C slave enhanced communications block is a
serial-to-parallel processor, designed to interface the
enCoRe V LV device to a two-wire I2C serial communications
bus. To eliminate the need for excessive CPU intervention and
overhead, the block provides I2C-specific support for status
detection and generation of framing bits. By default, the I2C
Slave Enhanced module is firmware compatible with the
previous generation of I2C slave functionality. However, this
module provides new features that are configurable to
implement significant flexibility for both internal and external
interfacing.
Figure 4. I2C Block Diagram
Figure 3. SPI Block Diagram
I2C Plus
Slave
SPI Block
SCLK
DATA_IN DATA_OUT
CLK_IN
CLK_OUT
SCLK
INT
SYSCLK
I2C Core
MOSI,
MISO
SS_
Buffer Module
CPU Port
SDA_IN
To/From
SCL_IN
I2C Basic
Configuration
I2C_BUF
I2C_CFG
GPIO
Pins
SDA_OUT
SCL_OUT
I2C_EN
I2C_SCR
32 Byte RAM
I2C_DR
HW Addr Cmp
I2C_ADDR
Buffer Ctl
I2C_BP
Registers
Plus Features
SYSCLK
I2C_CP
CONFIGURATION[7:0]
CONTROL[7:0]
I2C_XCFG
MCU_BP
TRANSMIT[7:0]
RECEIVE[7:0]
I2C_XSTAT
MCU_CP
Document Number: 001-12395 Rev. *N
System Bus
MOSI,
MISO
STANDBY
Page 4 of 38
CY7C604XX
The basic I2C features include:
■ ✟Slave,
■ ✟Byte
transmitter, and receiver operation
processing for low CPU overhead
■ ✟Interrupt
or polling CPU interface
■ ✟Support
for clock rates of up to 400 kHz
■ ✟7-
or 10-bit addressing (through firmware support)
■ ✟SMBus
operation (through firmware support)
Getting Started
The quickest way to understanding the enCoRe V silicon is by
reading this datasheet and using the PSoC Designer Integrated
Development Environment (IDE). This datasheet is an overview
of the enCoRe V integrated circuit and presents specific pin,
register, and electrical specifications. For in-depth information,
along with detailed programming information, refer to the PSoC
Programmable System-on-Chip Technical Reference Manual,
for CY8C28xxx PSoC devices.
■ ✟Support
for 7-bit hardware address compare
For up-to-date ordering, packaging, and electrical specification
information, reference the latest enCoRe V device datasheets on
the web at http://www.cypress.com.
■ ✟Flexible
data buffering schemes
Application Notes
Enhanced features of the I2C Slave Enhanced Module include:
■ ✟A
‘no bus stalling’ operating mode
■ ✟A
low power bus monitoring mode
Cypress application notes are an excellent introduction to the
wide variety of possible PSoC designs.
The I2C block controls the data (SDA) and the clock (SCL) to the
external I2C interface through direct connections to two
dedicated GPIO pins. When I2C is enabled, these GPIO pins are
not available for general purpose use. The enCoRe V LV CPU
firmware interacts with the block through I/O register reads and
writes, and firmware synchronization is implemented through
polling and/or interrupts.
Development Kits
In the default operating mode, which is firmware compatible with
previous versions of I2C slave modules, the I2C bus is stalled
upon every received address or byte, and the CPU is required to
read the data or supply data as required before the I2C bus
continues. However, this I2C Slave Enhanced module provides
new data buffering capability as an enhanced feature. In the
EZI2C buffering mode, the I2C slave interface appears as a
32-byte RAM buffer to the external I2C master. Using a simple
predefined protocol, the master controls the read and write
pointers into the RAM. When this method is enabled, the slave
never stalls the bus. In this protocol, the data available in the
RAM (this is managed by the CPU) is valid.
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems.
Additional resources include low voltage detection and power on
reset. The following statements describe the merits of each
system resource:
■
Low-voltage detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced power-on
reset (POR) circuit eliminates the need for a system supervisor.
■
The 3.6 V maximum input, 1.8, 2.5, or 3 V selectable output,
low dropout regulator (LDO) provides regulation for I/Os. A
register controlled bypass mode enables the user to disable
the LDO.
■
Standard Cypress PSoC IDE tools are available for debugging
the enCoRe V LV family of parts.
Document Number: 001-12395 Rev. *N
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
Training
CYPros Consultants
Certified PSoC consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC
consultant go to the CYPros Consultants web site.
Solutions Library
Visit our growing library of solution focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
Technical Support
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
Page 5 of 38
CY7C604XX
Development Tools
PSoC Designer™ is the revolutionary integrated design
environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
■
Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■
Extensive user module catalog
■
Integrated source-code editor (C and assembly)
■
Free C compiler with no size restrictions or time limits
■
Built-in debugger
■
In-circuit emulation
■
Built-in support for communication interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full-speed USB 2.0
❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
PSoC Designer Software Subsystems
Design Entry
In the chip-level view, choose a base device to work with. Then
select different onboard analog and digital components that use
the PSoC blocks, which are called user modules. Examples of
user modules are analog-to-digital converters (ADCs),
digital-to-analog converters (DACs), amplifiers, and filters.
Configure the user modules for your chosen application and
connect them to each other and to the proper pins. Then
generate your project. This prepopulates your project with APIs
and libraries that you can use to program your application.
The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration
makes it possible to change configurations at run time. In
essence, this lets you to use more than 100 percent of PSoC's
resources for an application.
Document Number: 001-12395 Rev. *N
Code Generation Tools
The code generation tools work seamlessly within the
PSoC Designer interface and have been tested with a full range
of debugging tools. You can develop your design in C, assembly,
or a combination of the two.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and linked
with other software modules to get absolute addressing.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all of the features of C, tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
Debugger
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow you to read and program and
read and write data memory, and read and write I/O registers.
You can read and write CPU registers, set and clear breakpoints,
and provide program run, halt, and step control. The debugger
also lets you to create a trace buffer of registers and memory
locations of interest.
Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an Online Support
Forum to aid the designer.
In-Circuit Emulator
A low-cost, high-functionality in-circuit emulator (ICE) is
available for development support. This hardware can program
single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full-speed 
(24 MHz) operation.
Page 6 of 38
CY7C604XX
Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed-function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and lowering inventory costs. These
configurable resources, called PSoC blocks, have the ability to
implement a wide variety of user-selectable functions. The PSoC
development process is:
1. Select user modules.
2. Configure user modules.
3. Organize and connect.
4. Generate, verify, and debug.
Select User Modules
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules.” User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
Configure User Modules
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a PWM
User Module configures one or more digital PSoC blocks, one
for each eight bits of resolution. Using these parameters, you can
establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application.
Enter values directly or by selecting values from drop-down
menus. All of the user modules are documented in datasheets
that may be viewed directly in PSoC Designer or on the Cypress
website. These user module datasheets explain the internal
operation of the user module and provide performance specifications. Each datasheet describes the use of each user module
parameter, and other information that you may need to successfully implement your design.
Document Number: 001-12395 Rev. *N
Organize and Connect
Build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. Perform the selection,
configuration, and routing so that you have complete control over
all on-chip resources.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides APIs with high-level functions to control
and respond to hardware events at run time, and interrupt
service routines that you can adapt as needed.
A complete code development environment lets you to develop
and customize your applications in C, assembly language, or
both.
The last step in the development process takes place inside
PSoC Designer's Debugger (accessed by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full-speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition
to traditional single-step, run-to-breakpoint, and watch-variable
features, the debug interface provides a large trace buffer. It lets
you to define complex breakpoint events that include monitoring
address and data bus values, memory locations, and external
signals.
Page 7 of 38
CY7C604XX
Pin Configuration
16-Pin Part Pinout
Vdd
(Top View)
10
9
P0[4]
XRES
P1[4]
P1[2]
P1[0]
7
8
3
4
5
6
P1[7]
P1[5]
12
QFN/COL11
P1[1]
Vss
1
2
P1[3]
P2[5]
P2[3]
14
13
P0[3]
P0[7]
16
15
P0[1]
Figure 5. CY7C60413 16-Pin enCoRe V LV Device
Table 1. 16-Pin Part Pinout (QFN)
Pin No.
Type
1
I/O
P2[5]
Name
Digital I/O, crystal out (Xout)
Description
2
I/O
P2[3]
Digital I/O, crystal in (Xin)
3
IOHR
P1[7]
Digital I/O, I2C SCL, SPI SS
4
IOHR
P1[5]
Digital I/O, I2C SDA, SPI MISO
5
IOHR
P1[3]
Digital I/O, SPI CLK
6
IOHR
P1[1](1, 2)
Digital I/O, ISSP CLK, I2C SCL, SPI MOSI
7
Power
Vss
Ground pin
8
IOHR
P1[0](1, 2)
Digital I/O, ISSP DATA, I2C SDA, SPI CLK
9
IOHR
P1[2]
Digital I/O
10
IOHR
P1[4]
Digital I/O, optional external clock input (EXTCLK)
11
Input
XRES
Active high external reset with internal pull-down
12
IOHR
P0[4]
Digital I/O
13
Power
Vdd
Power pin
14
IOHR
P0[7]
Digital I/O
15
IOHR
P0[3]
Digital I/O
16
IOHR
P0[1]
Digital I/O

LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Notes
1. During power up or reset event, device P1[0] and P1[1] may disturb the I2C bus. Use alternate pins if issues are encountered.
2. These are the ISSP pins, that are not High Z at POR.
Document Number: 001-12395 Rev. *N
Page 8 of 38
CY7C604XX
32-Pin Part Pinout
QFN
(Top View)
24
23
22
21
20
19
18
17
P0[0]
P2[6]
P2[4]
P2[2]
P2[0]
P3[2]
P3[0]
XRES
P1[4]
P1[6]
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
P1[5]
P1[3]
P1[1]
Vss
P1[0]
P1[2]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
P3[3]
P3[1]
P1[7]
26
25
Vdd
P0[6]
P0[4]
P0[2]
32
31
30
29
28
27
Vss
P0[3]
P0[5]
P0[7]
Figure 6. CY7C60445 32-Pin enCoRe V LV Device
Table 2. 32-Pin Part Pinout (QFN)
Pin No.
Type
1
IOH
P0[1]
Name
Digital I/O
2
I/O
P2[7]
Digital I/O
3
I/O
P2[5]
Digital I/O, crystal out (Xout)
4
I/O
P2[3]
Digital I/O, crystal in (Xin)
5
I/O
P2[1]
Digital I/O
6
I/O
P3[3]
Digital I/O
7
I/O
P3[1]
Digital I/O
8
IOHR
P1[7]
Digital I/O, I2C SCL, SPI SS
9
IOHR
P1[5]
Digital I/O, I2C SDA, SPI MISO
10
IOHR
P1[3]
Digital I/O, SPI CLK
11
IOHR
P1[1](1,2)
Digital I/O, ISSP CLK, I2C SCL, SPI MOSI
12
Power
Vss
Ground connection
13
IOHR
P1[0](1,2)
Digital I/O, ISSP DATA, I2C SDA, SPI CLK
14
IOHR
P1[2]
Digital I/O
15
IOHR
P1[4]
Digital I/O, optional external clock input (EXTCLK)
16
IOHR
P1[6]
Digital I/O
17
Reset Input
XRES
Active high external reset with internal pull-down
18
I/O
P3[0]
Digital I/O
19
I/O
P3[2]
Digital I/O
20
I/O
P2[0]
Digital I/O
21
I/O
P2[2]
Digital I/O
22
I/O
P2[4]
Digital I/O
23
I/O
P2[6]
Digital I/O
24
IOH
P0[0]
Digital I/O
25
IOH
P0[2]
Digital I/O
26
IOH
P0[4]
Digital I/O
27
IOH
P0[6]
Digital I/O
Document Number: 001-12395 Rev. *N
Description
Page 9 of 38
CY7C604XX
Table 2. 32-Pin Part Pinout (QFN) (continued)
Pin No.
Type
Name
Description
28
Power
Vdd
Supply voltage
29
IOH
P0[7]
Digital I/O
30
IOH
P0[5]
Digital I/O
31
IOH
P0[3]
Digital I/O
32
Power
Vss
Ground connection
CP
Power
Vss
Center pad must be connected to ground

LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
Document Number: 001-12395 Rev. *N
Page 10 of 38
CY7C604XX
48-Pin Part Pinout
P0[0]
37
P0[4]
P0[6]
P0[2]
38
39
Vdd
40
P0[7]
42
41
P0[5]
44
NC
NC
P0[3]
45
43
Vss
46
P0[1]
48
47
Figure 7. CY7C60455/CY7C60456 48-Pin enCoRe V LV Device
36
P2[6]
2
35
P2[4]
3
34
P2[2]
P2[3]
4
33
P2[0]
P2[1]
P4[3]
5
32
P4[2]
31
P4[0]
P4[1]
7
30
P3[6]
P3[7]
8
P3[4]
P3[5]
P3[0]
XRES
NC
1
P2[7]
P2[5]
QFN
6
(Top View)
16
17
18
19
20
21
22
23
24
P1[1]
Vss
NC
NC
Vdd
P1[0]
P1[2]
P3[2]
P1[6]
P1[4]
15
26
25
P1[3]
12
NC
11
P1[7]
14
P3[1]
13
10
27
NC
P3[3]
P1[5]
9
29
28
Table 3. 48-Pin Part Pinout (QFN)
Pin No.
Type
Name
1
NC
NC
No connection
2
I/O
P2[7]
Digital I/O
3
I/O
P2[5]
Digital I/O, crystal out (Xout)
4
I/O
P2[3]
Digital I/O, crystal in (Xin)
5
I/O
P2[1]
Digital I/O
6
I/O
P4[3]
Digital I/O
7
I/O
P4[1]
Digital I/O
8
I/O
P3[7]
Digital I/O
9
I/O
P3[5]
Digital I/O
10
I/O
P3[3]
Digital I/O
11
I/O
P3[1]
Digital I/O
12
IOHR
P1[7]
Digital I/O, I2C SCL, SPI SS
13
IOHR
P1[5]
Digital I/O, I2C SDA, SPI MISO
14
NC
NC
No connection
15
NC
NC
No connection
16
IOHR
P1[3]
Digital I/O, SPI CLK
17
IOHR
P1[1](1,2)
Digital I/O, ISSP CLK, I2C SCL, SPI MOSI
18
Power
Vss
Supply ground
19
NC
NC
No connection
20
NC
NC
No connection
21
Power
Vdd
Supply voltage
Document Number: 001-12395 Rev. *N
Description
Page 11 of 38
CY7C604XX
Table 3. 48-Pin Part Pinout (QFN) (continued)
Pin No.
Type
Name
22
IOHR
(1,2)
P1[0]
Digital I/O, ISSP DATA, I2C SDA, SPI CLK
23
IOHR
P1[2]
Digital I/O
24
IOHR
P1[4]
Digital I/O, optional external clock input (EXTCLK)
25
IOHR
P1[6]
Digital I/O
26
XRES
Ext Reset
Active high external reset with internal pull-down
27
I/O
P3[0]
Digital I/O
28
I/O
P3[2]
Digital I/O
29
I/O
P3[4]
Digital I/O
30
I/O
P3[6]
Digital I/O
31
I/O
P4[0]
Digital I/O
32
I/O
P4[2]
Digital I/O
33
I/O
P2[0]
Digital I/O
34
I/O
P2[2]
Digital I/O
35
I/O
P2[4]
Digital I/O
36
I/O
P2[6]
Digital I/O
37
IOH
P0[0]
Digital I/O
38
IOH
P0[2]
Digital I/O
39
IOH
P0[4]
Digital I/O
40
IOH
P0[6]
Digital I/O
41
Power
Vdd
Supply voltage
42
NC
NC
No connection
43
NC
NC
No connection
44
IOH
P0[7]
Digital I/O
45
IOH
P0[5]
Digital I/O
46
IOH
P0[3]
Digital I/O
47
Power
Vss
Supply ground
P0[1]
Digital I/O
Vss
Center pad must be connected to ground
48
IOH
CP
Power
Description

LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output
Document Number: 001-12395 Rev. *N
Page 12 of 38
CY7C604XX
Register Reference
The section discusses the registers of the enCoRe V LV device. It lists all the registers in mapping tables, in address order.
Register Conventions
Register Mapping Tables
The register conventions specific to this section are listed in the
following table.
The enCoRe V LV device has a total register address space of
512 bytes. The register space is also referred to as I/O space and
is broken into two parts: Bank 0 (user space) and Bank 1 (configuration space). The XIO bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XIO bit is
set, the user is said to be in the ‘extended’ address space or the
‘configuration’ registers.
Table 4. Register Conventions
Convention
Description
R
Read register or bits
W
Write register or bits
L
Logical register or bits
C
Clearable register or bits
#
Access is bit specific
Document Number: 001-12395 Rev. *N
Page 13 of 38
CY7C604XX
Table 5. Register Map Bank 0 Table: User Space
Addr (0,Hex)
Access
PRT0DR
Name
00
RW
Name
Addr (0,Hex)
40
Access
Name
Addr (0,Hex)
80
Access
Name
Addr (0,Hex)
C0
PRT0IE
01
RW
41
81
C1
02
42
82
C2
03
43
83
C3
PRT1DR
04
RW
44
84
C4
PRT1IE
05
RW
45
85
C5
06
46
86
C6
07
47
87
Access
C7
PRT2DR
08
RW
48
88
I2C_XCFG
C8
PRT2IE
09
RW
49
89
I2C_XSTAT
C9
R
4A
8A
I2C_ADDR
CA
RW
R
0A
0B
RW
4B
8B
I2C_BP
CB
PRT3DR
0C
RW
4C
8C
I2C_CP
CC
R
PRT3IE
0D
RW
4D
8D
CPU_BP
CD
RW
0E
4E
8E
CPU_CP
CE
R
0F
4F
8F
I2C_BUF
CF
RW
PRT4DR
10
RW
50
90
CUR_PP
D0
RW
PRT4IE
11
RW
51
91
STK_PP
D1
RW
12
52
92
13
53
93
IDX_PP
D3
RW
14
54
94
MVR_PP
D4
RW
15
55
95
MVW_PP
D5
RW
16
56
96
I2C_CFG
D6
RW
17
57
97
I2C_SCR
D7
#
18
58
98
I2C_DR
D8
RW
D2
19
59
99
1A
5A
9A
INT_CLR0
DA
D9
RW
1B
5B
9B
INT_CLR1
DB
RW
1C
5C
9C
INT_CLR2
DC
RW
1D
5D
9D
INT_CLR3
DD
RW
1E
5E
9E
INT_MSK2
DE
RW
1F
5F
9F
INT_MSK1
DF
RW
20
60
A0
INT_MSK0
E0
RW
21
61
A1
INT_SW_EN
E1
RW
22
62
A2
INT_VC
E2
RC
23
63
A3
RES_WDT
E3
W
24
64
A4
INT_MSK3
E4
RW
25
65
A5
E5
26
66
A6
E6
27
67
A7
E7
28
68
A8
E8
SPI_TXR
29
W
69
A9
E9
SPI_RXR
2A
R
6A
AA
EA
2B
#
SPI_CR
6B
AB
EB
2C
6C
AC
EC
2D
6D
AD
ED
2E
6E
AE
EE
2F
6F
AF
30
70
PT0_CFG
B0
RW
F0
31
71
PT0_DATA1
B1
RW
F1
32
72
PT0_DATA0
B2
RW
F2
33
73
PT1_CFG
B3
RW
F3
34
74
PT1_DATA1
B4
RW
F4
35
75
PT1_DATA0
B5
RW
F5
36
76
PT2_CFG
B6
RW
37
77
PT2_DATA1
B7
RW
38
78
PT2_DATA0
B8
RW
EF
F6
CPU_F
F7
RL
F8
39
79
B9
F9
3A
7A
BA
FA
3B
7B
BB
FB
3C
7C
BC
FC
3D
7D
BD
3E
7E
BE
CPU_SCR1
FE
#
3F
7F
BF
CPU_SCR0
FF
#
Gray fields are reserved and should not be accessed.
FD
# Access is bit specific.
Document Number: 001-12395 Rev. *N
Page 14 of 38
CY7C604XX
Table 6. Register Map Bank 1 Table: Configuration Space
Name
PRT0DM0
PRT0DM1
Addr (1,Hex)
Access
00
RW
Name
Addr (1,Hex)
40
Access
Name
Addr (1,Hex)
80
Access
Name
Addr (1,Hex)
C0
01
RW
41
81
C1
02
42
82
C2
03
43
83
C3
PRT1DM0
04
RW
44
84
C4
PRT1DM1
05
RW
45
85
C5
06
46
86
C6
07
47
87
C7
PRT2DM0
08
RW
48
88
C8
PRT2DM1
09
RW
49
89
C9
0A
4A
8A
CA
0B
4B
8B
CB
PRT3DM0
0C
RW
4C
8C
CC
PRT3DM1
0D
RW
4D
8D
CD
0E
4E
8E
CE
0F
4F
8F
CF
Access
PRT4DM0
10
RW
50
90
D0
PRT4DM1
11
RW
51
91
D1
12
52
92
D2
13
53
93
D3
14
54
94
D4
15
55
95
D5
16
56
96
D6
17
57
97
D7
18
58
98
D8
19
59
99
D9
1A
5A
9A
DA
1B
5B
9B
1C
5C
9C
IO_CFG
DC
RW
1D
5D
9D
OUT_P1
DD
RW
1E
5E
9E
1F
5F
9F
20
60
A0
OSC_CR0
E0
RW
21
61
A1
ECO_CFG
E1
#
22
62
A2
OSC_CR2
E2
RW
23
63
A3
VLT_CR
E3
RW
24
64
A4
VLT_CMP
E4
R
25
65
A5
E5
26
66
A6
E6
27
67
A7
28
68
A8
IMO_TR
E8
W
69
A9
ILO_TR
E9
W
6A
AA
SPI_CFG
29
RW
2A
2B
6B
DB
DE
DF
E7
EA
AB
SLP_CFG
EB
RW
2C
TMP_DR0
6C
RW
AC
SLP_CFG2
EC
RW
2D
TMP_DR1
6D
RW
AD
SLP_CFG3
ED
RW
2E
TMP_DR2
6E
RW
AE
EE
2F
TMP_DR3
6F
RW
AF
EF
30
70
B0
F0
31
71
B1
F1
32
72
B2
F2
33
73
B3
F3
34
74
B4
F4
35
75
B5
F5
36
76
B6
37
77
B7
38
78
B8
F8
F6
CPU_F
F7
39
79
B9
F9
3A
7A
BA
FA
3B
7B
BB
FB
3C
7C
BC
FC
3D
7D
BD
FD
3E
7E
BE
FE
3F
7F
BF
FF
Gray fields are reserved and should not be accessed.
RL
# Access is bit specific.
Document Number: 001-12395 Rev. *N
Page 15 of 38
CY7C604XX
Electrical Specifications
This section presents the DC and AC electrical specifications of the enCoRe V LV devices. For the most up to date electrical
specifications, verify that you have the most recent datasheet available by visiting the company web site at http://www.cypress.com.
Figure 9. IMO Frequency Trim Options
Figure 8. Voltage versus CPU Frequency
3.6V
3.6V
Vdd Voltage
Vdd Voltage
lid ng
Va rati n
e io
Op eg
R
SLIMO
Mode
= 01
SLIMO
Mode
= 00
SLIMO
Mode
= 10
1.71V
1.71V
5.7 MHz
24 MHz
CPU Frequency
Document Number: 001-12395 Rev. *N
750 kHz
3 MHz
6 MHz 12 MHz 24 MHz
IMO Frequency
Page 16 of 38
CY7C604XX
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Table 7. Absolute Maximum Ratings
Symbol
Description
[3]
Conditions
Min
Typ
Max
Units
Higher storage temperatures reduces data
retention time. Recommended storage
temperature is +25 °C ± 25 °C. Extended
duration storage temperatures above 85 °C
degrades reliability.
–55
+25
+125
°C
–0.5
–
+6.0
V
TSTG
Storage temperature
Vdd
Supply voltage relative to Vss
VIO
DC input voltage
Vss – 0.5
–
Vdd + 0.5
V
VIOZ
DC voltage applied to tristate
Vss –0.5
–
Vdd + 0.5
V
IMIO
Maximum current into any Port pin
ESD
Electro static discharge voltage
Human body model ESD
LU
Latch up current
In accordance with JESD78 standard
–25
–
+50
mA
2000
–
–
V
–
–
200
mA
Min
Typ
Max
Units
0
+70
°C
0
+85
°C
Operating Temperature
Table 8. Operating Temperature
Symbol
Description
TAC
Ambient commercial temperature
TJC
Operational commercial die 
temperature[4]
Conditions
The temperature rise from ambient to junction
is package specific. Refer the table “Thermal
Impedances” on page 30. The user must limit
the power consumption to comply with this
requirement.
Notes
3. Higher storage temperatures reduce data retention time. Recommended storage temperature is +25 °C ± 25 °C. Extended duration storage temperatures above 85 °C
degrade reliability.
4. The temperature rise from ambient to junction is package specific. See Thermal Impedances on page 30. The user must limit the power consumption to comply with
this requirement.
Document Number: 001-12395 Rev. *N
Page 17 of 38
CY7C604XX
DC Electrical Characteristics
DC Chip Level Specifications
Table 9 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 9. DC Chip Level Specifications
Symbol
[5, 6]
Description
Conditions
Min
Typ
Max
Units
1.71
–
3.6
V
Vdd
Supply voltage
See table titled DC POR and LVD
Specifications on page 22.
IDD24
Supply current, IMO = 24 MHz
Conditions are Vdd  3.0 V, TA = 25 °C,
CPU = 24 MHz
No I2C/SPI
–
2.9
4.0
mA
IDD12
Supply current, IMO = 12 MHz
Conditions are Vdd  3.0 V, TA = 25 °C,
CPU = 12 MHz
No I2C/SPI
–
1.7
2.6
mA
IDD6
Supply current, IMO = 6 MHz
Conditions are Vdd  3.0 V, TA = 25 °C,
CPU = 6 MHz
No I2C/SPI
–
1.2
1.8
mA
ISB1
Standby current with POR, LVD, and
Sleep timer
Vdd  3.0V, TA = 25 °C, I/O regulator
turned off
–
1.1
1.5
A
ISB0
Deep sleep current
Vdd  3.0 V, TA = 25 °C, I/O regulator
turned off
–
0.1
–
A
Notes
5. When Vdd remains in the range from 1.71 V to 1.9 V for more than 50 µsec, the slew rate when moving from the 1.71 V to 1.9 V range to greater than 2 V must be
slower than 1 V/500 µsec to avoid triggering POR. The only other restriction on slew rates for any other voltage range or transition is the SRPOWER_UP parameter.
6. If powering down in standby sleep mode, to properly detect and recover from a VDD brown out condition any of the following actions must be taken:
❐ Bring the device out of sleep before powering down.
❐ Assure that VDD falls below 100 mV before powering backup.
❐ Set the No Buzz bit in the OSC_CR0 register to keep the voltage monitoring circuit powered during sleep.
❐ Increase the buzz rate to assure that the falling edge of VDD is captured. The rate is configured through the PSSDC bits in the SLP_CFG register.
For the referenced registers, refer to the enCoRe V Technical Reference Manual. In deep sleep mode, additional low power voltage monitoring circuitry allows VDD
brown out conditions to be detected for edge rates slower than 1 V/ms.
Document Number: 001-12395 Rev. *N
Page 18 of 38
CY7C604XX
DC General Purpose I/O Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 1.71 V to 3.6 V
and 0 °C  TA  70 °C. Typical parameters apply to 3.3 V at 25 °C. These are for design guidance only.
Table 10. 3.0 V to 3.6 V DC GPIO Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
4
5.6
8
k
IOH < 10 A, maximum of 10 mA source
current in all I/Os
Vdd – 0.2
–
–
V
High output voltage
Port 2 or 3 pins
IOH = 1 mA, maximum of 20 mA source
current in all I/Os
Vdd – 0.9
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
disabled for Port 1
IOH < 10 A, maximum of 10 mA source
current in all I/Os
Vdd – 0.2
–
–
V
VOH4
High output voltage
Port 0 or 1 pins with LDO regulator
disabled for Port 1
IOH = 5 mA, maximum of 20 mA source
current in all I/Os
Vdd – 0.9
–
–
V
VOH5
IOH < 10 A, Vdd > 3.1 V, maximum of
High output voltage
Port 1 pins with LDO regulator enabled 4 I/Os all sourcing 5 mA
for 3 V out
2.85
3.00
3.3
V
VOH6
IOH = 5 mA, Vdd > 3.1 V, maximum of
High output voltage
Port 1 pins with LDO regulator enabled 20 mA source current in all I/Os
for 3 V out
2.20
–
–
V
VOH7
High output voltage
IOH < 10 A, Vdd > 2.7 V, maximum of
Port 1 pins with LDO enabled for 2.5 V 20 mA source current in all I/Os
out
2.35
2.50
2.75
V
VOH8
High output voltage
IOH = 2 mA, Vdd > 2.7 V, maximum of
Port 1 pins with LDO enabled for 2.5 V 20 mA source current in all I/Os
out
1.90
–
–
V
VOH9
IOH < 10 A, Vdd > 2.7 V, maximum of
High output voltage
Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os
out
1.60
1.80
2.1
V
VOH10
High output voltage
IOH = 1 mA, Vdd > 2.7 V, maximum of
Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os
out
1.20
–
–
V
VOL
Low output voltage
IOL = 25 mA, Vdd > 3.3 V, maximum of
60 mA sink current on even port pins (for
example, P0[2] and P1[4]) and 60 mA sink
current on odd port pins (for example,
P0[3] and P1[5])
–
–
0.75
V
VIL
Input low voltage
–
–
–
0.80
V
RPU
Pull-up resistor
–
VOH1
High output voltage
Port 2 or 3 pins
VOH2
VIH
Input high voltage
–
2.00
–
–
V
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
0.001
1
µA
CPIN
Pin capacitance
Package and pin dependent
Temp = 25 °C
0.5
1.7
5
pF
Document Number: 001-12395 Rev. *N
Page 19 of 38
CY7C604XX
Table 11. 2.4 V to 3.0 V DC GPIO Specifications
Symbol
RPU
VOH1
Conditions
–
IOH < 10 A, maximum of 10 mA source
current in all I/Os
IOH = 0.2 mA, maximum of 10 mA source
current in all I/Os
IOH < 10 A, maximum of 10 mA source
current in all I/Os
Min
4
Vdd – 0.2
Typ
5.6
–
Max
8
–
Units
k
V
Vdd – 0.4
–
–
V
Vdd – 0.2
–
–
V
IOH = 2 mA, maximum of 10 mA source
current in all I/Os
Vdd – 0.5
–
–
V
1.50
1.80
2.10
V
1.20
–
–
V
VOL
Description
Pull-up resistor
High output voltage
Port 2 or 3 pins
High output voltage
Port 2 or 3 pins
High output voltage
Port 0 or 1 pins with LDO regulator
disabled for Port 1
High output voltage
Port 0 or 1 pins with LDO regulator
disabled for Port 1
High output voltage
Port 1 pins with LDO enabled for 1.8 V out
High output voltage
Port 1 pins with LDO enabled for 1.8 V out
Low output voltage
–
–
0.75
V
VIL
Input low voltage
–
0.72
V
Input high voltage
1.4
–
–
V
VH
Input hysteresis voltage
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
–
–
–
VIH
–
0.001
1
µA
CPIN
Capacitive load on pins
0.5
1.7
5
pF
Min
Typ
Max
Units
4
5.6
8
k
VOH2
VOH3
VOH4
VOH5A
VOH6A
IOH < 10 A, Vdd > 2.4V, maximum of
20 mA source current in all I/Os.
IOH = 1 mA, Vdd > 2.4V, maximum of 20 mA
source current in all I/Os
IOL = 10 mA, maximum of 30 mA sink
current on even port pins (for example,
P0[2] and P1[4]) and 30 mA sink current on
odd port pins (for example, P0[3] and P1[5])
Package and pin dependent
Temp = 25 °C
Table 12. 1.71 V to 2.4 V DC GPIO Specifications
Symbol
Description
Conditions
RPU
Pull-up resistor
–
VOH1
High output voltage
Port 2 or 3 pins
IOH = 10 A, maximum of 10 mA source
current in all I/Os
Vdd – 0.2
–
–
V
VOH2
High output voltage
Port 2 or 3 pins
IOH = 0.5 mA, maximum of 10 mA source
current in all I/Os
Vdd – 0.5
–
–
V
VOH3
High output voltage
Port 0 or 1 pins with LDO regulator
disabled for Port 1
IOH = 100 A, maximum of 10 mA source
current in all I/Os
Vdd – 0.2
–
–
V
VOH4
High output voltage
Port 0 or 1 pins with LDO regulator
disabled for Port 1
IOH = 2 mA, maximum of 10 mA source
current in all I/Os
Vdd – 0.5
–
–
V
VOL
Low output voltage
IOL = 5 mA, maximum of 20 mA sink current
on even port pins (for example, P0[2] and
P1[4]) and 30 mA sink current on odd port
pins (for example, P0[3] and P1[5])
–
–
0.4
V
VIL
Input low voltage
–
–
–
0.3 x
Vdd
V
VIH
Input high voltage
–
0.65 x Vdd
–
–
V
VH
Input hysteresis voltage
–
–
80
–
mV
IIL
Input leakage (absolute value)
–
–
0.001
1
µA
CPIN
Capacitive load on pins
Package and pin dependent.
Temp = 25 °
0.5
1.7
5
pF
Document Number: 001-12395 Rev. *N
Page 20 of 38
CY7C604XX
ADC Electrical Specifications
Table 13.ADC User Module Electrical Specifications
Symbol
Description
Conditions
Min
Typ
Max
Units
0
–
VREFADC
V
–
5
pF
1/(500fF ×
data clock)
1/(400fF ×
data clock)
1/(300fF ×
data clock)

Input
VIN
Input voltage range
CIIN
Input capacitance
–
RIN
Input resistance
Equivalent switched cap input
resistance for 8-, 9-, or 10-bit
resolution
ADC reference voltage
–
1.14
–
1.26
V
FCLK
Data clock
Source is chip’s internal main
oscillator. See AC Chip-Level
Specifications for accuracy
2.25
–
6
MHz
S8
8-bit sample rate
Data Clock set to 6 MHz.
Sample Rate = 0.001/
(2^Resolution/Data Clock)
–
–
–
ksps
S10
10-bit sample rate
Data Clock set to 6 MHz.
Sample Rate = 0.001/
(2^Resolution/Data Clock)
–
5.859
–
ksps
RES
Resolution
Can be set to 8-, 9-, or 10-bit
8
–
10
bits
DNL
Differential nonlinearity
–
–1
–
+2
LSB
INL
Integral nonlinearity
–
–2
–
+2
LSB
EOffset
Offset error
–
Reference
VREFADC
Conversion Rate
DC Accuracy
8-bit resolution
0
3.2
19.2
LSB
10-bit resolution
0
12.8
76.8
LSB
Gain error
For any resolution
–5
–
+5
%FSR
IADC
Operating current
–
–
2.1
2.6
mA
PSRR
Power supply rejection ratio PSRR (Vdd > 3.0 V)
–
24
–
dB
PSRR (Vdd < 3.0 V)
–
30
–
dB
Egain
Power
Document Number: 001-12395 Rev. *N
Page 21 of 38
CY7C604XX
DC POR and LVD Specifications
Table 14 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 14. DC POR and LVD Specifications
Symbol
Description

VPPOR0
VPPOR1
VPPOR2
VPPOR3
Vdd Value for PPOR Trip
PORLEV[1:0] = 00b, HPOR = 0
PORLEV[1:0] = 00b, HPOR = 1
PORLEV[1:0] = 01b, HPOR = 1
PORLEV[1:0] = 10b, HPOR = 1
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
Vdd Value for LVD Trip
VM[2:0] = 000b(8)
VM[2:0] = 001b(9)
VM[2:0] = 010b(10)
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b(11)
Min
Typ
Max
Units
1.61
1.66
2.36
2.60
2.82
1.71
2.41
2.66
2.95
V
V
V
V
2.40
2.64
2.85
2.95
3.06
1.84
1.75
2.45
2.71
2.92
3.02
3.13
1.9
1.8
2.51
2.78
2.99
3.09
3.20
2.32
1.84
V
V
V
V
V
V
V
(7)
DC Programming Specifications
Table 15 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 15. DC Programming Specifications
Symbol
VddIWRITE
IDDP
VILP
VIHP
IILP
IIHP
VOLP
VOHP
FlashENPB
FlashDR
Description
Supply voltage for flash write operations
Supply current during programming or verify
Input low voltage during programming or verify
Input high voltage during programming or verify
Input current when applying Vilp to P1[0] or P1[1]
during programming or verify(12)
Input current when applying Vihp to P1[0] or P1[1]
during programming or verify(12)
Output low voltage during programming or verify
Output high voltage during programming or verify
Flash write endurance(14)
Flash data retention(15)
Min
1.71
–
–
1.71
–
Typ
–
5
–
–
–
VddIWRITE +0.3
0.2
Units
V
mA
V
V
mA
–
–
1.5
mA
–
–
–
–
20
Vss + 0.75
VddIWRITE
–
–
V
V
Cycles
Years
VddIWRITE - 0.9 V
50,000
10
Max
5.25
25
VIL[11]
Notes
7. Vdd must be greater than or equal to 1.71 V during startup, reset from the XRES pin, or reset from watchdog.
8. Always greater than 50 mV above VPPOR1 for falling supply.
9. Always greater than 50 mV above VPPOR2 for falling supply.
10. Always greater than 50 mV above VPPOR3 for falling supply.
11. Always greater than 50 mV above VPPOR0 voltage for falling supply.
12. Driving internal pull-down resistor.
13. See appropriate DC General Purpose I/O Specifications table.
14. Erase/write cycles per block.
15. Following maximum Flash write cycles at Tamb = 55C and Tj = 70C.
Document Number: 001-12395 Rev. *N
Page 22 of 38
CY7C604XX
AC Electrical Characteristics
AC Chip Level Specifications
Table 16 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 16. AC Chip Level Specifications
Symbol
FCPU
F32K1
Description
Processing frequency
Internal low speed oscillator
frequency
F32K_U
Internal low speed oscillator
(ILO) untrimmed frequency)
F32K2
Internal low speed oscillator
frequency
FIMO24
Internal main oscillator stability
for 24 MHz ± 5%
FIMO12
Internal main oscillator stability
for 12 MHz
FIMO6
Internal main oscillator stability
for 6 MHz
DCIMO
Duty Cycle of IMO
DCILO
Internal low speed oscillator
duty cycle
SRPOWER_UP Power supply slew rate
TXRST
External reset pulse width at
power up
TXRST2
External reset pulse width after
power up[16]
Conditions
Min
5.7
19
Typ
–
32
Max
25.2
50
Units
MHz
kHz
13
32
82
kHz
13
32
82
kHz
–
22.8
24
25.2
MHz
–
11.4
12
12.6
MHz
–
5.7
6.0
6.3
MHz
–
–
40
40
50
50
60
60
%
%
–
After supply voltage is valid
–
1
–
–
250
–
V/ms
ms
Applies after part has booted
10
–
–
s
Trimmed for 3.3 V operation
using factory trim values
–
Untrimmed
Note
16. The minimum required XRES pulse length is longer when programming the device (see Table
Document Number: 001-12395 Rev. *N
19 on page 25).
Page 23 of 38
CY7C604XX
AC General Purpose IO Specifications
Table 17 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 17. AC GPIO Specifications
Symbol
FGPIO
Description
GPIO operating frequency
Conditions
Normal strong mode, port 0, 1
Normal strong mode, Port 2, 3
Rise time, strong mode, 
cload = 50 pF
Ports 2 or 3
TRise23L Rise time, strong mode low
supply, cload = 50 pF
Ports 2 or 3
TRise01
Rise time, strong mode, cload =
50 pF
Ports 0 or 1
TRise01L Rise time, strong mode low
supply, cload = 50 pF
Ports 0 or 1
TFall
Fall time, strong mode, cload =
50 pF, All Ports
TFallL
Fall time, strong mode low
supply, cload = 50 pF, all ports
TRise23
Min
0
Typ
–
Max
6 MHz for
1.71 V < Vdd < 2.4 V
0
–
0
–
12 MHz for
2.4 V < Vdd < 3.6 V
3 MHz for
1.71 V < Vdd < 2.4 V
Units
MHz
MHz
Vdd = 3.0 to 3.6 V, 10% – 90%
15
–
6 MHz for
3.0 V< Vdd < 3.6 V
80
Vdd = 1.71 to 3.0 V, 10% – 90%
15
–
80
ns
Vdd = 3.0 to 3.6 V, 10% – 90%
LDO enabled or disabled
10
–
50
ns
Vdd = 1.71 to 3.0 V, 10% – 90%
LDO enabled or disabled
15
–
–
80
ns
Vdd = 3.0 to 3.6 V, 10% – 90%
10
–
50
ns
Vdd = 1.71 to 3.0 V, 10% - 90%
10
–
70
ns
ns
Figure 10. GPIO Timing Diagram
90%
GPIO Pin
Output
Voltage
10%
TRise23
TRise01
Document Number: 001-12395 Rev. *N
TFall
Page 24 of 38
CY7C604XX
AC External Clock Specifications
Table 18 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 18. AC External Clock Specifications
Symbol
FOSCEXT
–
–
–
Description
Frequency
High period
Low period
Power up IMO to switch
Conditions
–
–
–
–
Min
0.750
20.6
20.6
150
Typ
–
–
–
–
Max
25.2
5300
–
–
Units
MHz
ns
ns
s
AC Programming Specifications
Table 19 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 19. AC Programming Specifications
Symbol
TRSCLK
TFSCLK
TSSCLK
THSCLK
FSCLK
TERASEB
TWRITE
TDSCLK1
TDSCLK2
TXRST3
Description
Rise time of SCLK
Fall time of SCLK
Data set up time to falling edge of
SCLK
Data hold time from falling edge of
SCLK
Frequency of SCLK
Flash erase time (block)
Flash block write time
Data out delay from falling edge of
SCLK
Data out delay from falling edge of
SCLK
External reset pulse width after
power up
Conditions
–
–
–
Min
1
1
40
Typ
–
–
–
Max
20
20
–
Units
ns
ns
ns
–
40
–
–
ns
–
–
–
3.0 V < Vdd < 3.6 V
0
–
–
–
–
–
–
–
8
18
25
85
MHz
ms
ms
ns
1.71 V < Vdd < 3.0 V
–
–
130
ns
263
–
–
s
Required to enter programming
mode when coming out of sleep
Figure 11. Timing Diagram - AC Programming Cycle
Document Number: 001-12395 Rev. *N
Page 25 of 38
CY7C604XX
AC I2C Specifications
Table 20 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 20. AC Characteristics of the I2C SDA and SCL Pins
Symbol
FSCLI2C
THDSTAI2C
TLOWI2C
THIGHI2C
TSUSTAI2C
THDDATI2C
TSUDATI2C
TSUSTOI2C
TBUFI2C
TSPI2C
Description
SCL clock frequency
Hold time (repeated) START condition. After this period,
the first clock pulse is generated.
LOW period of the SCL clock
HIGH period of the SCL clock
Setup Time for a Repeated START condition
Data hold time
Data setup time
Setup time for STOP condition
Bus free time between a STOP and START condition
Pulse width of spikes are suppressed by the input filter
Standard Mode
Min
Max
0
100
4.0
–
4.7
4.0
4.7
0
250
4.0
4.7
–
–
–
–
–
–
–
–
–
Fast Mode
Min
Max
0
400
0.6
–
1.3
0.6
0.6
0
100(17)
0.6
1.3
0
–
–
–
–
–
–
–
50
Units
kHz
s
s
s
s
s
ns
s
s
ns
Figure 12. Definition of Timing for Fast/Standard Mode on the I2C Bus
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
TSPI2C
TBUFI2C
SCL
S THDSTAI2C THDDATI2C THIGHI2C
TSUSTAI2C
Sr
TSUSTOI2C
P
S
Note
17. A fast mode I2C bus device can be used in a standard mode I2C bus system, but the requirement tSU;DAT Š 250 ns must then be met. This is automatically the case
if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the
SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the standard mode I2C bus specification) before the SCL line is released.
Document Number: 001-12395 Rev. *N
Page 26 of 38
CY7C604XX
Table 21. SPI Master AC Specifications
Symbol
Description
Conditions
FSCLK
SCLK clock frequency
VDD 2.4 V
VDD < 2.4 V
Min
Typ
Max
Units
–
–
6
3
MHz
DC
SCLK duty cycle
–
–
50
–
%
TSETUP
MISO to SCLK setup time
VDD  2.4 V
VDD < 2.4 V
60
100
–
–
ns
THOLD
SCLK to MISO hold time
–
40
–
–
ns
TOUT_VAL
SCLK to MOSI valid time
–
–
–
40
ns
TOUT_HIGH
MOSI high time
–
40
–
–
ns
Min
Typ
Max
Units
–
–
12
6
MHz
Table 22.SPI Slave AC Specifications
Symbol
Description
Conditions
FSCLK
SCLK clock frequency
VDD  2.4 V
VDD < 2.4 V
TLOW
SCLK low time
–
41.67
–
–
ns
THIGH
SCLK high time
–
41.67
–
–
ns
TSETUP
MOSI to SCLK setup time
–
30
–
–
ns
THOLD
SCLK to MOSI hold time
–
50
–
–
ns
TSS_MISO
SS high to MISO valid
–
–
–
153
ns
TSCLK_MISO
SCLK to MISO valid
–
–
–
125
ns
TSS_HIGH
SS high time
–
–
–
50
ns
TSS_CLK
Time from SS low to first SCLK
–
2/SCLK
–
–
ns
TCLK_SS
Time from last SCLK to SS high
–
2/SCLK
–
–
ns
Document Number: 001-12395 Rev. *N
Page 27 of 38
CY7C604XX
Package Diagram
This section illustrates the packaging specifications for the enCoRe V LV device, along with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V LV emulation tools and their dimensions, refer to the development kit.
Packaging Dimensions
Figure 13. 16-Pin (3 x 3 mm) QFN (001-09116)
001-09116 *H
Document Number: 001-12395 Rev. *N
Page 28 of 38
CY7C604XX
Figure 14. 32-Pin (5 x 5 x 0.55 mm) QFN (001-42168)
001-42168 *E
Figure 15. 48-Pin QFN (7 x 7x 0.90 mm) Sawn (001-13191)
001-13191 *G
Document Number: 001-12395 Rev. *N
Page 29 of 38
CY7C604XX
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade
device reliability.
Table 23.Package Handling
Parameter
Description
TBAKETEMP
Bake Temperature
TBAKETIME
Bake Time
Minimum
Typical
Maximum
Unit
125
See package label
°C
72
hours
–
See package label
–
Thermal Impedances
Typical JA (18)
32.69 °C/W
19.51 °C/W
17.68 °C/W
Package
16 QFN
32 QFN(19)
48 QFN(19)
Capacitance on Crystal Pins
Table 24. Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
32 QFN
3.2 pF
48 QFN
3.3 pF
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Package
Minimum Peak Temperature(20)
Maximum Peak Temperature
16 QFN
240 °C
260 °C
32 QFN
240 °C
260 °C
48 QFN
240 °C
260 °C
Notes
18. TJ = TA + Power x JA.
19. To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.
20. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 °C with Sn-Pb or 245 ± 5 °C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
Document Number: 001-12395 Rev. *N
Page 30 of 38
CY7C604XX
Ordering Information
Ordering Code
Flash
SRAM
No. of GPIOs
Target Applications
8K
1K
13
Feature-rich wireless mouse
CY7C64013-16LKXCT 16-Pin QFN - (Tape and Reel)
(3X3 mm)
8K
1K
13
Feature-rich wireless mouse
CY7C60445-32LQXC
16 K
1K
28
Feature-rich wireless mouse
CY7C60445-32LQXCT 32-Pin QFN - (Tape and Reel)
(5x5x0.55 mm)
16 K
1K
28
Feature-rich wireless mouse
CY7C60455-48LTXC
48-Pin QFN
(7x7x0.9 mm)
16 K
1K
36
Mid-tier wireless keyboard
CY7C60455-48LTXCT
48-Pin QFN - (Tape and Reel)
(7x7x0.9 mm)
16 K
1K
36
Mid-tier wireless keyboard
CY7C60456-48LTXC
48-Pin QFN
(7x7x0.9 mm)
32 K
2K
36
Feature-rich wireless
keyboard
CY7C60456-48LTXCT
48-Pin QFN - (Tape and Reel)
(7x7x0.9 mm)
32 K
2K
36
Feature-rich wireless
keyboard
CY7C60413-16LKXC
Package Information
16-Pin QFN
(3x3 mm)
32-Pin QFN
(5x5x0.55 mm)
Ordering Code Definitions
CY 7 C XXXXX XX X CT

Temperature Grade: C = Commercial, I = Industrial
Pb-free
Package Type
Family
Technology: CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Document Number: 001-12395 Rev. *N
Page 31 of 38
CY7C604XX
Acronyms
Document Conventions
The following table lists the acronyms that are used in this
document.
Units of Measure
Acronym
Description
The following table lists the units of measure that are used in this
document.
API
application programming interface
CPU
central processing unit
o
degree Celsius
GPIO
general purpose IO
dB
decibels
ICE
in-circuit emulator
fF
femto farad
ILO
internal low speed oscillator
Hz
hertz
IMO
internal main oscillator
KB
1024 bytes
IO
input/output
Kbit
1024 bits
LSb
least significant bit
kHz
kilohertz
LVD
low voltage detect
k
kilohm
MSb
most significant bit
MHz
megahertz
POR
power on reset
M
megaohm
PPOR
precision power on reset
A
microampere
PSoC
Programmable System-on-Chip
F
microfarad
SLIMO
slow IMO
H
microhenry
SRAM
static random access memory
s
microsecond
V
microvolts
Symbol
C
Vrms
microvolts root-mean-square
W
microwatts
mA
milli-ampere
ms
milli-second
mV
milli-volts
nA
nanoampere
ns
nanosecond
nV
nanovolts

ohm
pA
picoampere
pF
picofarad
pp
peak-to-peak
ppm
Document Number: 001-12395 Rev. *N
Unit of Measure
parts per million
ps
picosecond
sps
samples per second

sigma: one standard deviation
V
volts
Page 32 of 38
CY7C604XX
Appendix: Errata Document for enCoRe™ V – CY7C643xx and enCoRe™ V LV – CY7C604xx
This section describes the errata for the enCoRe V – CY7C643xx and enCoRe V LV – CY7C604xx. Details include errata trigger
conditions, scope of impact, available workarounds, and silicon revision applicability.
Contact your local Cypress Sales Representative if you have questions.
CY7C643xx and CY7C604xx Errata Summary
The following Errata item applies to the CY7C643xx and CY7C604xx data sheets.
1. Latch up susceptibility when maximum I/O sink current exceeded
■ PROBLEM DEFINITION
P1[3], P1[6], and P1[7] pins are susceptible to latch up when the I/O sink current exceeds 25 mA per pin on these pins.
■ PARAMETERS AFFECTED
LU – Latch up current. Per JESD78A, the maximum allowable latch up current per pin is 100 mA. Cypress internal specification
is 200 mA latch up current limit.
■ TRIGGER CONDITIONS
Latch up occurs when both the following conditions are met:
A. The offending I/O is externally connected to a voltage higher than the I/O high state, causing a current to flow into the pin
that exceeds 25 mA.
B. A Port1 I/O (P1[1], P1[4], and P1[5] respectively) adjacent to the offending I/O is connected to a voltage lower than the I/O
low state. This causes a signal that drops below Vss (signal undershoot) and a current greater than 200 mA to flow out of
the pin.
■ SCOPE OF IMPACT
The trigger conditions outlined in this item exceed the maximum ratings specified in the CY7C643xx and CY7C604xx data
sheets.
■ WORKAROUND
Add a series resistor > 300  to P1[3], P1[6], and P1[7] pins to restrict current to within latch up limits.
■ FIX STATUS
This issue will be corrected in the next new silicon revision.
The following errata item applies only to the CY7C643xx data sheet.
2. Does not meet USB 2.0 specification for D+ and D- rise/fall matching when supply voltage is under 3.3 V
■ PROBLEM DEFINITION
Rising to falling rate matching of the USB D+ and D- lines has a corner case at lower supply voltages, such as those under 3.3 V.
■ PARAMETERS AFFECTED
Rising to falling rate matching of the USB data lines.
■ TRIGGER CONDITION(S)
Operating the VCC supply voltage at the low end of the chip’s specification (under 3.3 V) may cause a mismatch in the rising
to falling rate.
■ SCOPE OF IMPACT
This condition does not affect USB communications but could cause corner case issues with USB lines’ rise/fall matching
specification. Signal integrity tests were run using the Cypress development kit and excellent eye was observed with supply
voltage of 3.15 V.
Document Number: 001-12395 Rev. *N
Page 33 of 38
CY7C604XX
Figure 16. Eye Diagram
■
■
WORKAROUND
Avoid the trigger condition by using lower tolerance voltage regulators.
FIX STATUS
This issue will not be corrected in the next new silicon revision.
Document Number: 001-12395 Rev. *N
Page 34 of 38
CY7C604XX
Document History Page
Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller
Document Number: 001-12395
Rev.
ECN No.
Orig. of
Change
Submission
Date
**
626516
TYJ
See ECN
New data sheet
*A
735721
TYJ / ARI
See ECN
Added new block diagram, replaced TBDs, corrected values, updated pinout
information, changed part number to reflect new specifications.
*B
1120504
ARI
See ECN
Corrected the description to pin 29 on Table 1, the Typ/Max values for ISB0 on
the DC chip-level specifications, and the Min voltage value for VddIWRITE in the
DC Programming Specifications table.
Corrected Flash Write Endurance minimum value in the DC Programming
Specifications table.
Corrected the Flash Erase Time max value and the Flash Block Write Time
max value in the AC Programming Specifications table.
Implemented new latest template.
*C
1225864
AESA / ARI
See ECN
Corrected the description to pin 13, 29 on Table 1 and 22,44 on Table 2.
Added sections Register Reference, Register Conventions and Register
Mapping Tables. Corrected Max values on the DC Chip-Level Specifications
table.
*D
1446763
AESA
See ECN
Changed TERASEB parameter, max value to 18ms in Table 13, AC
Programming Specification.
*E
1639963
AESA
See ECN
Post to www.cypress.com
*F
2138889
TYJ /
PYRS
See ECN
Updated Ordering Code table:
- Ordering code changed for 32-QFN package: From -32LKXC to -32LTXC
- Added a new package type – “LTXC” for 48-QFN
- Included Tape and Reel ordering code for 32-QFN and 48-QFN packages
Changed active current values at 24, 12 and 6MHz in table “DC Chip-Level
Specifications”
- IDD24: 2.15 to 3.1mA
- IDD12: 1.45 to 2.0mA
- IDD6: 1.1 to 1.5mA
Added information on using P1[0] and P1[1] as the I2C interface during POR
or reset events
Document Number: 001-12395 Rev. *N
Description of Change
Page 35 of 38
CY7C604XX
Document History Page (continued)
Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller
Document Number: 001-12395
Rev.
ECN No.
Orig. of
Change
Submission
Date
Description of Change
*G
2583853
TYJ /
PYRS /
HMT
10/10/08
Converted from Preliminary to Final
ADC resolution changed from 10-bit to 8-bit
On Page1, SPI Master and Slave – speeds changed
Rephrased battery monitoring clause in page 1 to include “with external components”
Included ADC specifications table
Voh5, Voh7, Voh9 specs changed
Flash data retention – condition added to Note [15]
Input leakage spec changed to 25 nA max
Under AC Char, Frequency accuracy of ILO corrected
GPIO rise time for ports 0,1 and ports 2,3 made common
AC Programming specifications updated
Included AC Programming cycle timing diagram
AC SPI specification updated
Spec change for 32-QFN package
Input Leakage Current maximum value changed to 1 uA
Maximum specification for VOH5A parameter changed from 2.0 to 2.1V
Minimum voltages for FSPIM and FSPIS specifications changed from 1.8V to
1.71V (Table 18)
Updated VOHV parameter in Table 13
Updated Thermal impedance values for the packages - Table 20.
Update Development Tools, add Designing with PSoC Designer. Edit, fix links
and table format. Update TMs. Update maximum data in Table 12. DC POR
and LVD Specifications.
*H
2653717
DVJA /
PYRS
02/04/09
Changed master page from CY7C60445, CY7C6045X to CY7C604XX.
Updated Features, Functional Overview, Development Tools, and Designing
with PSoC Designer sections.
Removed ‘GUI - graphical user interface’ from Document Conventions
acronym table.
Added Figure 1 and Table 1 (16-pin part information) to Pin Configurations
section.
Removed ‘O - Only a read/write register or bits’ in Table 4
Edited Table 8: removed 10-bit resolution information and corrected units
column.
Added Figure 9 (16-pin part information) to Package Dimensions section.
Added ‘Package Handling’ section.
Added 8K part ‘CY7C60413-16LKXC’ to Ordering Information.
*I
2714694
DVJA /
AESA
06/04/2009
Updated Block Diagram.
Added 10-bit ADC, SPI, and I2C Slave sections.
ADC Resolution changed from 8-bit to 10-bit
Updated Figure 9: 5.7 MHz minimum CPU frequency
Updated Table 15 AC Chip Level Specs
Figure 8: Changed minimum CPU Frequency from 750 kHz to 5.7 MHz
*J
2764460
DVJA /
AESA
09/15/2009
Added footnote #5 to Table 10: DC Chip Level Specs
Added F32K2 (Untrimmed) spec to Table 17: AC Chip level Specs
Changed TRAMP spec to SRPOWER_UP in Table 17: AC Chip Level Specs
Changed Table 14: ADC Specs
Added Table 25: Typical Package Capacitance on Crystal Pins
*K
2811903
DVJA
11/23/2009
Added Note 6 on page 18. Changed VIHP in Table 15 on page 22
*L
3075921
NXZ
11/01/2010
Added Ordering Code Definition.
*M
3283876
DIVA
06/15/2011
Updated Getting Started, Development Tools, and Designing with PSoC
Designer.
Document Number: 001-12395 Rev. *N
Page 36 of 38
CY7C604XX
Document History Page (continued)
Document Title: CY7C604XX, enCoRe™ V Low Voltage Microcontroller
Document Number: 001-12395
Rev.
ECN No.
Orig. of
Change
Submission
Date
*N
3980412
CSAI
04/24/2013
Description of Change
Updated Packaging Dimensions:
spec 001-09116 – Changed revision from *E to *H.
spec 001-42168 – Changed revision from *D to *E.
spec 001-13191 – Changed revision from *E to *G.
Added Appendix: Errata Document for enCoRe™ V – CY7C643xx and
enCoRe™ V LV – CY7C604xx.
Document Number: 001-12395 Rev. *N
Page 37 of 38
CY7C604XX
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
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cypress.com/go/USB
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© Cypress Semiconductor Corporation, 2006-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-12395 Rev. *N
Revised April 24, 2013
®
Page 38 of 38
enCoRe™, PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC is a registered trademark of Cypress Semiconductor Corporation. All other trademarks or registered
trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the
Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names
mentioned in this document may be the trademarks of their respective holders.