Gunter Semiconductor GmbH GLC110 N Channel Power MOSFET FOR LOGIC DRIVER Chip Specification General Description: * Advanced Process Technology * Dynamic dv/dt Rating * 175℃ ℃ Operating Temperature * Fast Switching * Fully Avalanche Rated * RDS(ON) rated at VGS = 5V * Ease of parallel Mechanical Data: D3 1.61mm x 2.21mm Dimension 400 µm Thickness: Metallization: Al Top : : CrNiAg / Au Backside : Suggested Bonding Conditions: Die Mounting: Solder Perform 95/5 PbSn or 92.5./2.5/5 PbAgIn Source Bonding Wire: 5 mil Al Absolute Maximum Rating Characteristics @Ta=25℃ ℃ Symbol Limit Unit Test Conditions Drain-to-Source Breakdown Voltage V(BR)DSS 100 V VGS=0V, ID=250µΑ Static Drain-to - Source On-resistance RDS(ON) 0.54 Ω VGS=5V, ID=3.45Α Continuous Drain current ( in target package) ID@25℃ 5.6 A VGS= 5V Continuous Drain current ( in target package) ID@100℃ 4 A VGS= 5V Tj -55~175 ℃ TSTR -55~175 ℃ PD 43 W Operation Junction Temperature Storage Temperature Target Device: IRL510 TO-220AB @Tc=25℃