AOT27S60/AOB27S60/AOTF27S60 600V 27A α MOS TM Power Transistor General Description Product Summary The AOT27S60& AOB27S60 & AOTF27S60 have been fabricated using the advanced αMOSTM high voltage process that is designed to deliver high levels of performance and robustness in switching applications. By providing low RDS(on), Qg and EOSS along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. VDS @ Tj,max 700V IDM 110A RDS(ON),max 0.16Ω Qg,typ 26nC Eoss @ 400V 6µJ 100% UIS Tested 100% Rg Tested For Halogen Free add "L" suffix to part number: AOT27S60L & AOB27S60L & AOTF27S60L Top View TO-220 TO-263 TO-220F(3kVAC;1s) D D2PAK D G AOT27S60 D S G D G S S AOB27S60 Absolute Maximum Ratings TA=25°C unless otherwise noted AOT27S60/AOB27S60 Parameter Symbol Drain-Source Voltage 600 VDS Gate-Source Voltage Continuous Drain Current TC=100°C AOTF27S60 ±30 VGS TC=25°C S G AOTF27S60 27 ID Units V V 27* 17 17* A Pulsed Drain Current C IDM Avalanche Current C IAR 7.5 A Repetitive avalanche energy C EAR 110 mJ Single pulsed avalanche energy G TC=25°C Power Dissipation B Derate above 25oC MOSFET dv/dt ruggedness Peak diode recovery dv/dt H Junction and Storage Temperature Range EAS 110 480 PD W 2.9 0.4 W/ oC 100 20 -55 to 150 TJ, TSTG TL Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D Symbol RθJA V/ns °C 300 °C AOT27S60/AOB27S60 AOTF27S60 Units 65 65 °C/W 0.5 0.35 -2.5 °C/W °C/W RθCS Maximum Case-to-sink A Maximum Junction-to-Case RθJC * Drain current limited by maximum junction temperature. Rev 5: Sep 2012 50 dv/dt Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds J mJ 357 www.aosmd.com Page 1 of 6 AOT27S60/AOB27S60/AOTF27S60 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units ID=250µA, VGS=0V, TJ=25°C 600 - - ID=250µA, VGS=0V, TJ=150°C 650 700 - V µA STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current VDS=600V, VGS=0V - - 1 VDS=480V, TJ=150°C - 10 - IGSS Gate-Body leakage current VDS=0V, VGS=±30V - - ±100 VGS(th) Gate Threshold Voltage VDS=5V,ID=250µA 2.5 3.3 4 nΑ V RDS(ON) Static Drain-Source On-Resistance VSD Diode Forward Voltage IS ISM VGS=10V, ID=13.5A, TJ=25°C - 0.14 0.16 Ω VGS=10V, ID=13.5A, TJ=150°C - 0.38 0.44 Ω IS=13.5A,VGS=0V, TJ=25°C - 0.85 - V Maximum Body-Diode Continuous Current - - 27 A Maximum Body-Diode Pulsed Current - - 110 A - 1294 - pF - 80 - pF - 69 - pF - 221 - pF VGS=0V, VDS=100V, f=1MHz - 2.3 - pF VGS=0V, VDS=0V, f=1MHz - 4.7 - Ω DYNAMIC PARAMETERS Input Capacitance Ciss Coss Output Capacitance Co(er) Effective output capacitance, energy related H Crss Effective output capacitance, time related I Reverse Transfer Capacitance Rg Gate resistance Co(tr) VGS=0V, VDS=100V, f=1MHz VGS=0V, VDS=0 to 480V, f=1MHz SWITCHING PARAMETERS Total Gate Charge Qg - 26 - nC - 6.2 - nC Gate Drain Charge - 8.8 - nC Turn-On DelayTime - 31 - ns - 33 - ns - 99 - ns - 34 - ns IF=13.5A,dI/dt=100A/µs,VDS=400V Qgs Gate Source Charge Qgd tD(on) tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time VGS=10V, VDS=480V, ID=13.5A VGS=10V, VDS=400V, ID=13.5A, RG=25Ω Body Diode Reverse Recovery Time Peak Reverse Recovery Current - 440 - ns Irm IF=13.5A,dI/dt=100A/µs,VDS=400V - 28 - Qrr Body Diode Reverse Recovery Charge IF=13.5A,dI/dt=100A/µs,VDS=400V - 7.5 - A µC A. The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g. G. L=60mH, IAS=4A, VDD=150V, Starting TJ=25°C H. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS. I. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS. J. Wavesoldering only allowed at leads. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 5: Sep 2012 www.aosmd.com Page 2 of 6 AOT27S60/AOB27S60/AOTF27S60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 40 55 10V 50 45 7V 40 35 30 5.5V 20 5.5V 15 20 15 6V 25 6V 25 7V 30 ID (A) ID (A) 10V 35 10 5V 10 5V 5 VGS=4.5V VGS=4.5V 5 0 0 0 5 10 15 0 20 5 10 15 20 VDS (Volts) Figure 2: On-Region Characteristics@125°C VDS (Volts) Figure 1: On-Region Characteristics@25°C 0.5 1000 VDS=20V -55°C 0.4 100 RDS(ON) (Ω ) 125°C ID(A) 10 1 25°C VGS=10V 0.3 0.2 0.1 0.1 0.0 0.01 2 4 6 8 0 10 VGS(Volts) Figure 3: Transfer Characteristics 20 30 40 50 60 ID (A) Figure 4: On-Resistance vs. Drain Current and Gate Voltage 1.2 3 2.5 VGS=10V ID=13.5A BVDSS (Normalized) Normalized On-Resistance 10 2 1.5 1 1.1 1 0.9 0.5 0 -100 -50 0 50 100 150 200 Temperature (°C) Figure 5: On-Resistance vs. Junction Temperature Rev 5: Sep 2012 www.aosmd.com 0.8 -100 -50 0 50 100 150 200 TJ (oC) Figure 6: Break Down vs. Junction Temperature Page 3 of 6 AOT27S60/AOB27S60/AOTF27S60 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 15 1.0E+02 1.0E+01 12 125°C VDS=480V ID=13.5A 25°C 1.0E-01 9 VGS (Volts) IS (A) 1.0E+00 1.0E-02 6 1.0E-03 3 1.0E-04 1.0E-05 0 0.0 0.2 0.4 0.6 0.8 1.0 0 VSD (Volts) Figure 7: Body-Diode Characteristics (Note E) 5 10 15 20 25 30 35 40 Qg (nC) Figure 8: Gate-Charge Characteristics 10000 12 Ciss Eoss(uJ) Capacitance (pF) 10 1000 Coss 100 Eoss 8 6 4 Crss 10 2 0 1 0 100 200 300 400 500 VDS (Volts) Figure 9: Capacitance Characteristics 100 200 300 400 VDS (Volts) Figure 10: Coss stored Energy 500 600 1000 1000 100 100 RDS(ON) limited 10 100µs 1 1ms 10ms DC 0.1 10µs 10µs ID (Amps) ID (Amps) 0 600 10 RDS(ON) limited 0.01 1ms 1 10ms 0.1s 1s DC 0.1 TJ(Max)=150°C TC=25°C 100µs TJ(Max)=150°C TC=25°C 0.01 1 10 100 1000 VDS (Volts) 1 10 100 1000 VDS (Volts) Figure 11: Maximum Forward Biased Safe Operating Area for AOT(B)27S60 (Note F) Rev 5: Sep 2012 0.1 www.aosmd.com Figure 12: Maximum Forward Biased Safe Operating Area for AOTF27S60(Note F) Page 4 of 6 AOT27S60/AOB27S60/AOTF27S60 500 30 400 25 Current rating ID(A) EAS(mJ) TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 300 200 20 15 10 100 5 0 0 25 50 75 100 125 TCASE (°C) Figure 13: Avalanche energy 150 175 0 25 50 75 100 125 TCASE (°C) Figure 14: Current De-rating (Note B) 150 Zθ JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC RθJC=0.35°C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD 0.01 Ton Single Pulse 0.001 0.00001 0.0001 0.001 0.01 T 0.1 1 10 Pulse Width (s) Figure 15: Normalized Maximum Transient Thermal Impedance for AOT(B)27S60 (Note F) Zθ JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC RθJC=2.5°C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD 0.01 Ton Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 T 10 100 Pulse Width (s) Figure 16: Normalized Maximum Transient Thermal Impedance for AOTF27S60 (Note F) Rev 5: Sep 2012 www.aosmd.com Page 5 of 6 AOT27S60/AOB27S60/AOTF27S60 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC DUT - Vgs Ig Charge Res istive Switching Test Circuit & Waveforms RL Vds Vds DUT Vgs + VDC 90% Vdd - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L EAR= 1/2 LI Vds 2 AR BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Tes t Circuit & Waveforms Qrr = - Idt Vds + DUT Vgs Vds - Isd Vgs Ig Rev 5: Sep 2012 L Isd + VDC - IF trr dI/dt IRM Vdd Vdd Vds www.aosmd.com Page 6 of 6