MGCHIP MDF9N60B N-channel mosfet 600v, 9a, 0.80(ohm) Datasheet

N-Channel MOSFET 600V, 9A, 0.80Ω
Ω
General Description
Features
These N-channel MOSFET are produced using advanced
MagnaChip’s MOSFET Technology, which provides low onstate resistance, high switching performance and excellent
quality.
These devices are suitable device for SMPS, high Speed
switching and general purpose applications.
D
@ VGS = 10V
@ VGS = 10V
Applications
G
VDS = 600V
ID = 9.0A
RDS(ON) ≤ 0.80Ω
Power Supply
PFC
High Current, High Speed Switching
S
Absolute Maximum Ratings (Ta = 25oC)
Characteristics
Symbol
Rating
Unit
Drain-Source Voltage
VDSS
600
V
Gate-Source Voltage
VGSS
±30
V
9.0*
A
5.7*
A
32*
A
48
0.38
W
o
W/ C
4.8
mJ
dv/dt
4.5
V/ns
EAS
480
mJ
TJ, Tstg
-55~150
Symbol
Rating
RθJA
62.5
RθJC
2.62
o
TC=25 C
Continuous Drain Current(※)
Pulsed Drain Current
ID
o
TC=100 C
(1)
IDM
o
TC=25 C
Power Dissipation
o
Derate above 25 C
(1)
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
PD
EAR
(3)
(4)
Single Pulse Avalanche Energy
Junction and Storage Temperature Range
o
C
※ Id limited by maximum junction temperature
Thermal Characteristics
Characteristics
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
Jan. 2012 Version 1.0
(1)
(1)
1
Unit
o
C/W
MagnaChip Semiconductor Ltd.
MDF9N60B N-channel MOSFET 600V
MDF9N60B
Part Number
Temp. Range
MDF9N60BTH
o
-55~150 C
Package
Packing
RoHS Status
TO-220F
Tube
Halogen Free
Electrical Characteristics (Ta =25oC)
Characteristics
Symbol
Test Condition
Min
Typ
Max
Unit
Static Characteristics
Drain-Source Breakdown Voltage
BVDSS
ID = 250µA, VGS = 0V
600
-
-
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
2.0
-
4.0
Drain Cut-Off Current
IDSS
VDS = 600V, VGS = 0V
-
-
1
µA
Gate Leakage Current
IGSS
VGS = ±30V, VDS = 0V
-
-
100
nA
Drain-Source ON Resistance
RDS(ON)
VGS = 10V, ID = 4.5A
gfs
VDS = 30V, ID = 4.5A
Forward Transconductance
V
0.65
0.80
Ω
-
7.0
-
S
-
23.9
Dynamic Characteristics
Total Gate Charge
Qg
(3)
Gate-Source Charge
Qgs
-
5.1
Gate-Drain Charge
Qgd
-
8.3
Input Capacitance
Ciss
-
1226
Reverse Transfer Capacitance
Crss
-
6.2
VDS = 480V, ID = 9.0A, VGS = 10V
VDS = 25V, VGS = 0V, f = 1.0MHz
Output Capacitance
Coss
-
134
Turn-On Delay Time
td(on)
-
21.5
-
33.4
-
100.3
tf
-
41.6
IS
-
9
Rise Time
Turn-Off Delay Time
Fall Time
tr
td(off)
VGS = 10V, VDS = 300V, ID = 9.0A,
(3)
RG = 25Ω
nC
pF
ns
Drain-Source Body Diode Characteristics
Maximum Continuous Drain to
Source Diode Forward Current
Source-Drain Diode Forward
Voltage
Body Diode Reverse Recovery
Time
Body Diode Reverse Recovery
Charge
VSD
IS = 9.0A, VGS = 0V
trr
IF = 9.0A, dl/dt = 100A/µs
-
-
A
1.4
V
-
360
ns
-
3.9
µC
(3)
Qrr
Note :
1. Pulse width is based on RθJC & RθJA and the maximum allowed junction temperature of 150°C.
2. Pulse test: pulse width ≤300us, duty cycle≤2%, pulse width limited by junction temperature TJ(MAX)=150°C.
3. ISD ≤9.0A, di/dt≤200A/us, VDD≤BVDSS, Rg =25Ω, Starting TJ=25°C
4. L=10.8mH, IAS=9.0A, VDD=50V, Rg =25Ω, Starting TJ=25°C,
Jan. 2012 Version 1.0
2
MagnaChip Semiconductor Ltd.
MDF9N60B N-channel MOSFET 600V
Ordering Information
MDF9N60B N-channel MOSFET 600V
20
Vgs=5.0V
=5.5V
=6.0V
=6.5V
=7.0V
=10.0V
=15.0V
12
1.0
RDS(ON) [Ω ]
ID,Drain Current [A]
16
8
VGS=10.0V
0.8
VGS=20V
Notes
1. 250㎲ Pulse Test
2. TC=25℃
4
0
0.6
0
5
10
15
4
8
VDS,Drain-Source Voltage [V]
ID,Drain Current [A]
3.0
1.2
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
※ Notes :
RDS(ON), (Normalized)
Drain-Source On-Resistance
16
Fig.2 On-Resistance Variation with
Drain Current and Gate Voltage
Fig.1 On-Region Characteristics
1. VGS = 10 V
2. ID = 4.5A
2.5
2.0
1.5
1.0
0.5
0.0
-50
0
50
100
150
※ Notes :
1. VGS = 0 V
2. ID = 250㎂
1.1
1.0
0.9
0.8
-50
200
0
o
IDR
Reverse Drain Current [A]
ID(A)
-55℃
0.1
4
6
150℃
25℃
1
0.1
0.0
8
0.2
0.4
0.6
0.8
1.0
1.2
VSD, Source-Drain Voltage [V]
VGS [V]
Fig.5 Transfer Characteristics
Jan. 2012 Version 1.0
200
※ Notes :
1. VGS = 0 V
2.250µs Pulse test
10
1
2
150
Fig.4 Breakdown Voltage Variation vs.
Temperature
* Notes ;
1. Vds=30V
25℃
100
TJ, Junction Temperature [ C]
Fig.3 On-Resistance Variation with
Temperature
150℃
50
o
TJ, Junction Temperature [ C]
10
12
Fig.6 Body Diode Forward Voltage
Variation with Source Current and
Temperature
3
MagnaChip Semiconductor Ltd.
MDF9N60B N-channel MOSFET 600V
2500
10
※ Note : ID = 9.0A
VGS, Gate-Source Voltage [V]
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Coss
120V
300V
480V
2000
Capacitance [pF]
8
6
4
Ciss
1500
1000
※ Notes ;
1. VGS = 0 V
2. f = 1 MHz
Crss
2
500
0
0
4
8
12
16
20
24
0
28
1
QG, Total Gate Charge [nC]
Fig.7 Gate Charge Characteristics
10
10
VDS, Drain-Source Voltage [V]
Fig.8 Capacitance Characteristics
2
Operation in This Area
is Limited by R DS(on)
10 µs
D=0.5
0
10
100 µs
1
0.2
1 ms
Zθ JC(t),
Thermal Response
ID, Drain Current [A]
10
10 ms
DC 1s
10
10
100 ms
0
0.1
0.05
-1
10
0.02
0.01
-1
Single Pulse
TJ=Max rated
TC=25℃
10
single pulse
-2
-2
10
10
-1
10
0
10
1
10
2
-5
10
-4
-3
10
-2
10
-1
10
0
10
10
1
10
t1, Rectangular Pulse Duration [sec]
VDS, Drain-Source Voltage [V]
Fig.9 Maximum Safe Operating Area
Fig.10 Transient Thermal Response Curve
16000
10
single Pulse
RthJC = 2.62℃/W
TC = 25℃
14000
8
ID, Drain Current [A]
12000
10000
Power (W)
※ Notes :
Duty Factor, D=t1/t2
PEAK TJ = PDM * Zθ JC* Rθ JC(t) + TC
RΘ JC=2.62℃/W
8000
6000
6
4
4000
2
2000
0
1E-5
0
1E-4
1E-3
0.01
0.1
1
25
10
75
100
125
150
Fig.12 Maximum Drain Current vs. Case
Temperature
Fig.11 Single Pulse Maximum Power
Dissipation
Jan. 2012 Version 1.0
50
TC, Case Temperature [℃]
Pulse Width (s)
4
MagnaChip Semiconductor Ltd.
3 Leads, TO-220F
Dimensions are in millimeters unless otherwise specified
Symbol
A
b
b1
C
D
E
e
F
G
L
L1
Q
Q1
¢R
Jan. 2012 Version 1.0
Min
4.50
0.63
1.15
0.33
15.47
9.60
Nom
Max
4.93
0.91
1.47
0.63
16.13
10.71
2.54
2.34
6.48
12.24
2.79
2.52
3.10
3.00
2.84
6.90
13.72
3.67
2.96
3.50
3.55
5
MagnaChip Semiconductor Ltd.
MDF9N60B N-channel MOSFET 600V
Physical Dimensions
U.S.A
Sunnyvale Office
787 N. Mary Ave. Sunnyvale
CA 94085 U.S.A
Tel : 1-408-636-5200
Fax : 1-408-213-2450
E-Mail : [email protected]
China
Hong Kong Office
Suite 1024, Ocean Centre 5 Canton Road,
Tsim Sha Tsui Kowloon, Hong Kong
Tel : 852-2828-9700
Fax : 852-2802-8183
E-Mail : [email protected]
U.K
Knyvett House The Causeway,
Staines Middx, TW18 3BA,U.K.
Tel : +44 (0) 1784-895-000
Fax : +44 (0) 1784-895-115
E-Mail : [email protected]
Shenzhen Office
Room 2003B, 20/F
International Chamber of Commerce Tower
Fuhua Road3 CBD, Futian District, China
Tel : 86-755-8831-5561
Fax : 86-755-8831-5565
E-Mail : [email protected]
Shanghai Office
Room E, 8/F, Liaoshen International Building 1068
Wuzhong Road, (C) 201103
Shanghai, China
Tel : 86-21-6405-1521
Fax : 86-21-6505-1523
E-Mail : [email protected]
Japan
Osaka Office
3F, Shin-Osaka MT-2 Bldg 3-5-36
Miyahara Yodogawa-Ku
Osaka, 532-0003 Japan
Tel : 81-6-6394-9160
Fax : 81-6-6394-9150
E-Mail : [email protected]
Korea
891, Daechi-Dong, Kangnam-Gu
Seoul, 135-738 Korea
Tel : 82-2-6903-3451
Fax : 82-2-6903-3668 ~9
Email : [email protected]
Taiwan R.O.C
2F, No.61, Chowize Street, Nei Hu
Taipei,114 Taiwan R.O.C
Tel : 886-2-2657-7898
Fax : 886-2-2657-8751
E-Mail : [email protected]
DISCLAIMER:
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power
generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be
expected to result in a personal injury. Seller’s customers using or selling Seller’s products for use in such
applications do so at their own risk and agree to fully defend and indemnify Seller.
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility
for use of any circuitry other than circuitry entirely included in a MagnaChip product.
is a registered trademark of MagnaChip
Semiconductor Ltd.
Jan. 2012 Version 1.0
6
MagnaChip Semiconductor Ltd.
MDF9N60B N-channel MOSFET 600V
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