CY62148BN MoBL® 4-Mbit (512K x 8) Static RAM Features Functional Description • 4.5V–5.5V operation • Low active power The CY62148BN is a high performance CMOS static RAM organized as 512K words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE), an active LOW Output Enable (OE), and tri-state drivers. This device has an automatic power down feature that reduces power consumption by more than 99% when deselected. — Typical active current: 2.5 mA @ f = 1 MHz • • • • • • — Typical active current:12.5 mA @ f = fmax Low standby current Automatic power down when deselected TTL-compatible inputs and outputs Easy memory expansion with CE and OE features CMOS for optimum speed and power Available in standard Pb-free and non Pb-free 32-lead (450-mil) SOIC and 32-lead TSOP II packages To write to the device, take Chip Enable (CE) and Write Enable (WE) inputs LOW. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A18). To read from the device, take Chip Enable (CE) and Output Enable (OE) LOW while forcing Write Enable (WE) HIGH for read. Under these conditions, the contents of the memory location specified by the address pins appear on the I/O pins. The eight input/output pins (I/O0 through I/O7) go into a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), or a write operation is in progress (CE LOW and WE LOW). Logic Block Diagram I/O0 INPUT BUFFER I/O1 512 K x 8 ARRAY SENSE AMPS I/O2 ROW DECODER A0 A1 A4 A5 A6 A7 A12 A14 A16 A17 I/O3 I/O4 I/O5 COLUMN DECODER CE I/O6 POWER DOWN I/O7 OE Cypress Semiconductor Corporation Document #: 001-06517 Rev. *B A2 A3 A15 A18 A13 A8 A9 A11 A10 WE • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised March 1, 2007 [+] Feedback CY62148BN MoBL® Pin Configuration Top View SOIC TSOP II A17 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A15 A18 WE A13 A8 A9 A11 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 Product Portfolio Power Dissipation VCC Range Product CY62148BNLL Speed Min Typ Max 4.5 V 5.0V 5.5V 70 ns Operating ICC (mA) f = fmax Typ[1] Max 12.5 20 Standby ISB2 (µA) Typ[1] Max 4 20 Note 1. Typical values are measured at VCC = 5V, TA = 25°C, and are included for reference only and are not tested or guaranteed. Document #: 001-06517 Rev. *B Page 2 of 9 [+] Feedback CY62148BN MoBL® DC Input Voltage[2] ................................. –0.5V to VCC +0.5V Maximum Ratings Current into Outputs (LOW)......................................... 20 mA Exceeding the maximum rating may impair the device’s useful life. User guidelines only and are not tested. Static Discharge Voltage...............................................2001V (per MIL-STD-883, Method 3015) Storage Temperature ................................. –65°C to +150°C Latch Up Current ..................................................... >200 mA Ambient Temperature with Power Applied............................................. –55°C to +125°C Operating Range Supply Voltage on VCC to Relative GND........ –0.5V to +7.0V DC Voltage Applied to Outputs in High Z State[2] .....................................–0.5V to VCC +0.5V Range Industrial Ambient Temperature[3] VCC –40°C to +85°C 4.5V–5.5V Electrical Characteristics Over the Operating Range Parameter Description CY62148BN Test Conditions Min VOH Output HIGH Voltage IOH = –1 mA VOL Output LOW Voltage IOL = 2.1 mA VIH Input HIGH Voltage VIL Input LOW Voltage IIX Input Leakage Current GND < VI < VCC IOZ Output Leakage Current GND < VI < VCC, Output Disabled ICC VCC Operating Supply Current f = fMAX = 1/tRC ISB1 Automatic CE Power Down Current – TTL Inputs Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX ISB2 Automatic CE Power Down Current – CMOS Inputs Max. VCC, CE > VCC – 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f =0 Typ[1] Unit Max 2.4 V 0.4 V 2.2 VCC +0.3 V –0.3 0.8 V –1 +1 µA –1 +1 µA 20 mA IOUT = 0 mA VCC = Max., f = 1 MHz 12.5 2.5 4 mA 1.5 mA 20 µA Capacitance[4] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC – 5.0V Max. Unit 6 pF 8 pF AC Test Loads and Waveforms R1 1800Ω R1 1800Ω 5V ALL INPUT PULSES 5V OUTPUT 100 pF INCLUDING JIG AND SCOPE (a) OUTPUT R2 5 pF 990Ω INCLUDING JIG AND SCOPE (b) 3.0V R2 990Ω GND 90% 10% ≤ 3 ns 90% 10% ≤ 3 ns Equivalent to: THEVENIN EQUIVALENT 639Ω 1.77V OUTPUT Notes 2. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 3. TA is the “instant on” case temperature 4. Tested initially and after any design or process changes that may affect these parameters. Document #: 001-06517 Rev. *B Page 3 of 9 [+] Feedback CY62148BN MoBL® Switching Characteristics[5] Over the Operating Range Parameter Description CY62148BN Min Max Unit READ CYCLE tRC Read Cycle Time 70 tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid 70 ns tDOE OE LOW to Data Valid 35 ns [6] tLZOE OE LOW to Low Z tHZOE OE HIGH to High Z[6, 7] tLZCE CE LOW to Low Z[6] CE HIGH to High tPU CE LOW to Power Up tPD CE HIGH to Power Down WRITE 70 10 ns ns 5 ns 25 10 Z[6, 7] tHZCE ns ns ns 25 0 ns ns 70 ns CYCLE[8] tWC Write Cycle Time 70 ns tSCE CE LOW to Write End 60 ns tAW Address Setup to Write End 60 ns tHA Address Hold from Write End 0 ns tSA Address Setup to Write Start 0 ns tPWE WE Pulse Width 55 ns tSD Data Setup to Write End 30 ns tHD Data Hold from Write End 0 ns 5 ns tLZWE tHZWE WE HIGH to Low Z[6] WE LOW to High Z[6, 7] 25 ns Notes 5. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 100-pF load capacitance. 6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 7. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 8. The internal write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data setup and hold timing should be referenced to the leading edge of the signal that terminates the write. Document #: 001-06517 Rev. *B Page 4 of 9 [+] Feedback CY62148BN MoBL® Data Retention Characteristics (Over the Operating Range) Parameter Description Conditions VDR VCC for Data Retention ICCDR Data Retention Current tCDR[4] tR[9] Chip Deselect to Data Retention Time Typ[1] Min Max 2.0 No input may exceed VCC + 0.3V VCC = VDR CE > VCC – 0.3V VIN > VCC – 0.3V or VIN < 0.3V Operation Recovery Time Unit V 20 µA 0 ns tRC ns Data Retention Waveform DATA RETENTION MODE 3.0V VCC 3.0V VDR > 2V tCDR tR CE Switching Waveforms Read Cycle No. 1[10, 11] tRC ADDRESS tOHA DATA OUT tAA PREVIOUS DATA VALID DATA VALID Read Cycle No. 2 (OE Controlled)[11, 12] ADDRESS tRC CE tACE OE tHZOE tDOE DATA OUT tLZOE HIGH IMPEDANCE tHZCE DATA VALID tLZCE VCC SUPPLY CURRENT HIGH IMPEDANCE tPD tPU 50% 50% ISB Notes 9. Full Device operation requires linear VCC ramp from VDR to VCC(min) > 100 ms or stable at VCC(min) > 100 ms. 10. Device is continuously selected. OE, CE = VIL. 11. WE is HIGH for read cycle. 12. Address valid prior to or coincident with CE transition LOW. Document #: 001-06517 Rev. *B Page 5 of 9 [+] Feedback CY62148BN MoBL® Switching Waveforms (continued) Write Cycle No. 1 (CE Controlled)[13] tWC ADDRESS tSCE CE tSA tAW tHA tPWE WE tSD DATA I/O tHD DATA VALID Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[13, 14] tWC ADDRESS tSCE CE tHZCE tAW tSA tHA tPWE WE OE tSD DATA I/O tHD DATAIN VALID NOTE 15 tHZOE Notes 13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state. 14. Data I/O is high-impedance if OE = VIH. 15. During this period the I/Os are in the output state and input signals should not be applied. Document #: 001-06517 Rev. *B Page 6 of 9 [+] Feedback CY62148BN MoBL® Switching Waveforms (continued) Write Cycle No. 3 (WE Controlled, OE LOW)[13, 14] tWC ADDRESS tSCE CE tHZCE tAW tSA tHA tPWE WE tSD NOTE 15 DATA I/O tHD DATA VALID tLZWE tHZWE Truth Table CE OE WE H X X High Z I/O0–I/O7 Power Down Mode Standby (ISB) Power L L H Data Out Read Active (ICC) L X L Data In Write Active (ICC) L H H High Z Selected, Outputs Disabled Active (ICC) Ordering Information Speed (ns) 70 Ordering Code Package Diagram Package Type CY62148BNSL-70SXI[16] 51-85081 32-lead (450-Mil) Molded SOIC (Pb-Free) CY62148BNLL-70SXI 51-85081 32-lead (450-Mil) Molded SOIC (Pb-Free) CY62148BNLL-70ZXI 51-85095 32-lead TSOP II (Pb-Free) Operating Range Industrial Note 16. CY62148BNSL and CY62148BNLL are identical in specs. Please contact your local Cypress sales representative for availability of these parts Document #: 001-06517 Rev. *B Page 7 of 9 [+] Feedback CY62148BN MoBL® Package Diagrams Figure 1. 32-lead (450 Mil) Molded SOIC (51-85081) 16 1 0.546[13.868] 0.566[14.376] 0.440[11.176] 0.450[11.430] DIMENSIONS IN INCHES[MM] MIN. MAX. PACKAGE WEIGHT 1.42gms PART # S32.45 STANDARD PKG. SZ32.45 LEAD FREE PKG. 17 32 0.793[20.142] 0.817[20.751] 0.006[0.152] 0.012[0.304] 0.101[2.565] 0.111[2.819] 0.118[2.997] MAX. 0.004[0.102] 0.050[1.270] BSC. 0.004[0.102] MIN. 0.014[0.355] 0.020[0.508] 0.047[1.193] 0.063[1.600] 0.023[0.584] 0.039[0.990] SEATING PLANE 51-85081-*B Figure 2. 32-Lead Thin Small Outline Package Type II (51-85095) 51-85095 ** More Battery Life is a trademark, and MoBL is a registered trademark, of Cypress Semiconductor. All products and company names mentioned in this document may be the trademarks of their respective holders. Document #: 001-06517 Rev. *B Page 8 of 9 © Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. [+] Feedback CY62148BN MoBL® Document History Page Document Title: CY62148BN MoBL® 4-Mbit (512K x 8) Static RAM Document Number: 001-06517 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 426504 See ECN NXR New Data Sheet *A 485639 See ECN VKN Corrected the typo in the Array size in the Logic Block Diagram *B 832320 See ECN NXR Removed Commercial Operating Range Removed 32-lead Reverse TSOP II package from product offering Corrected the test condition typo error in Electrical Characteristics table Updated Ordering information table Document #: 001-06517 Rev. *B Page 9 of 9 [+] Feedback