ON MC14490FG Hex contact bounce eliminator Datasheet

MC14490
Hex Contact Bounce
Eliminator
The MC14490 is constructed with complementary MOS enhancement
mode devices, and is used for the elimination of extraneous level changes
that result when interfacing with mechanical contacts. The digital contact
bounce eliminator circuit takes an input signal from a bouncing contact
and generates a clean digital signal four clock periods after the input has
stabilized. The bounce eliminator circuit will remove bounce on both the
“make” and the “break” of a contact closure. The clock for operation of
the MC14490 is derived from an internal R−C oscillator which requires
only an external capacitor to adjust for the desired operating frequency
(bounce delay). The clock may also be driven from an external clock
source or the oscillator of another MC14490 (see Figure 5).
NOTE: Immediately after powerup, the outputs of the MC14490 are in
indeterminate states.
Features
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MARKING
DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
16
MC14490P
AWLYYWWG
1
1
Diode Protection on All Inputs
Six Debouncers Per Package
Internal Pullups on All Data Inputs
Can Be Used as a Digital Integrator, System Synchronizer, or Delay Line
Internal Oscillator (R−C), or External Clock Source
TTL Compatible Data Inputs/Outputs
Single Line Input, Debounces Both “Make” and “Break” Contacts
Does Not Require “Form C” (Single Pole Double Throw) Input Signal
Cascadable for Longer Time Delays
Schmitt Trigger on Clock Input (Pin 7)
Supply Voltage Range = 3.0 V to 18 V
Chip Complexity: 546 FETs or 136.5 Equivalent Gates
Pb−Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter
DC Supply Voltage Range
Symbol
Value
Unit
VDD
−0.5 to +18.0
V
Vin, Vout
−0.5 to VDD
+ 0.5
V
Input Current (DC or Transient) per Pin
Iin
± 10
mA
Power Dissipation, per Package (Note 1)
PD
500
mW
Ambient Temperature Range
TA
−55 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (8−Second Soldering)
TL
260
°C
Input or Output Voltage Range
(DC or Transient)
June, 2006 − Rev. 7
1
SOIC−16
DW SUFFIX
CASE 751G
14490
AWLYYWWG
1
1
16
SOEIAJ−16
F SUFFIX
CASE 966
MC14490
ALYWG
1
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2006
16
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Publication Order Number:
MC14490/D
MC14490
PIN ASSIGNMENT
Ain
1
16
VDD
Bout
2
15
Aout
Cin
3
14
Bin
Dout
4
13
Cout
Ein
5
12
Din
Fout
6
11
Eout
OSCin
7
10
Fin
VSS
8
9
OSCout
BLOCK DIAGRAM
+VDD
DATA
4−BIT STATIC SHIFT REGISTER
Ain1
SHIFT
OSCin7
OSCout9
OSCILLATOR
AND
TWO−PHASE
CLOCK GENERATOR
LOAD
φ1
φ1 φ2
φ2
φ1
Bin14
IDENTICAL TO ABOVE STAGE
Cin3
IDENTICAL TO ABOVE STAGE
Din12
IDENTICAL TO ABOVE STAGE
Fin10
φ2
φ2
13C out
φ1
φ2
φ1
φ2
φ1
φ2
4D out
IDENTICAL TO ABOVE STAGE
IDENTICAL TO ABOVE STAGE
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2
VDD = PIN 16
VSS = PIN 8
φ1 φ2
2B out
φ1
Ein5
15 Aout
1/2−BIT
DELAY
11Eout
6F out
MC14490
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55_C
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
(VO = 0.5 or 4.5 Vdc) “1 Level”
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
Vin = 0 or VDD
Output Drive Current
Oscillator Output
(VOH = 2.5 V)
(VOH = 4.6 V)
(VOH = 9.5 V)
(VOH = 13.5 V)
Debounce Outputs
(VOH = 2.5 V)
(VOH = 4.6 V)
(VOH = 9.5 V)
(VOH = 13.5 V)
Oscillator Output
(VOL = 0.4 V)
(VOL = 0.5 V)
(VOL = 1.5 V)
Debounce Outputs
(VOL = 0.4 V)
(VOL = 0.5 V)
(VOL = 1.5 V)
VIH
Vdc
IOH
Source
Sink
Vdc
mAdc
5.0
5.0
10
15
– 0.6
– 0.12
– 0.23
– 1.4
−
−
−
−
– 0.5
– 0.1
– 0.2
– 1.2
– 1.5
– 0.3
– 0.8
– 3.0
−
−
−
−
– 0.4
– 0.08
– 0.16
– 1.0
−
−
−
−
5.0
5.0
10
15
– 0.9
– 0.19
– 0.6
1.8
−
−
−
−
– 0.75
– 0.16
– 0.5
– 1.5
– 2.2
– 0.46
– 1.2
– 4.5
−
−
−
−
– 0.6
– 0.12
– 0.4
– 1.2
−
−
−
−
5.0
10
15
0.36
0.9
4.2
−
−
−
0.3
0.75
3.5
0.9
2.3
10
−
−
−
0.24
0.6
2.8
−
−
−
5.0
10
15
2.6
4.0
12
−
−
−
2.2
3.3
10
4.0
9.0
35
−
−
−
1.8
2.7
8.1
−
−
−
IOL
mAdc
Input Current
Debounce Inputs (Vin = VDD)
IIH
15
−
2.0
−
0.2
2.0
−
11
mAdc
Input Current Oscillator — Pin 7
(Vin = VSS or VDD)
Iin
15
−
± 620
−
± 255
± 400
−
± 250
mAdc
Pullup Resistor Source Current
Debounce Inputs
(Vin = VSS)
IIL
5.0
10
15
175
340
505
375
740
1100
140
280
415
190
380
570
255
500
750
70
145
215
225
440
660
mAdc
Input Capacitance
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Vin = VSS or VDD, Iout = 0 mA)
ISS
5.0
10
15
−
−
−
150
280
840
−
−
−
40
90
225
100
225
650
−
−
−
90
180
550
mAdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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3
MC14490
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SWITCHING CHARACTERISTICS (Note 3) (CL = 50 pF, TA = 25_C)
VDD
Vdc
Min
Typ
(Note 4)
Max
Unit
5.0
10
15
−
−
−
180
90
65
360
180
130
ns
5.0
10
15
−
−
−
100
50
40
200
100
80
ns
tTHL
5.0
10
15
−
−
−
60
30
20
120
60
40
tPHL
5.0
10
15
−
−
−
285
120
95
570
240
190
tPLH
5.0
10
15
−
−
−
370
160
120
740
320
240
Clock Frequency (50% Duly Cycle)
(External Clock)
fcl
5.0
10
15
−
−
−
2.8
6
9
1.4
3.0
4.5
MHz
Setup Time (See Figure 1)
tsu
5.0
10
15
100
80
60
50
40
30
−
−
−
ns
Maximum External Clock Input
Rise and Fall Time
Oscillator Input
tr, tf
5.0
10
15
No Limit
5.0
1.5
C ext (in mF)
10
4.5
C ext (in mF)
15
6.5
C ext (in mF)
Characteristic
Symbol
Output Rise Time
All Outputs
tTLH
Output Fall Time
Oscillator Output
tTHL
Debounce Outputs
Propagation Delay Time
Oscillator Input to Debounce Outputs
Oscillator Frequency
OSCout
Cext ≥ 100 pF*
Note: These equations are intended to be a design guide.
Laboratory experimentation may be required. Formulas are typically
± 15% of actual frequencies.
ns
ns
fosc, typ
Hz
3. The formulas given are for the typical characteristics only at 25_C.
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
*POWER−DOWN CONSIDERATIONS
Large values of Cext may cause problems when powering down the MC14490 because of the amount of energy stored in the
capacitor. When a system containing this device is powered down, the capacitor may discharge through the input protection
diodes at Pin 7 or the parasitic diodes at Pin 9. Current through these internal diodes must be limited to 10 mA, therefore the
turn−off time of the power supply must not be faster than t = (VDD − VSS) Cext /(10 mA). For example, If VDD − VSS = 15
V and Cext = 1 mF, the power supply must turn off no faster than t = (15 V) (1 mF)/10 mA = 1.5 ms. This is usually not a problem
because power supplies are heavily filtered and cannot discharge at this rate.
When a more rapid decrease of the power supply to zero volts occurs, the MC14490 may sustain damage. To avoid this
possibility, use external clamping diodes, D1 and D2, connected as shown in Figure 2.
Aout
VDD
50%
OSCin
tPLH
50%
0V
90%
10%
D1
tr
tPHL
Aout
90%
10%
OSCin
Ain
7
OSCin
50%
tf
50%
50%
Cext
VDD
tsu
VDD
D2
VDD
9
OSCout
MC14490
0V
VDD
0V
Figure 1. Switching Waveforms
Figure 2. Discharge Protection During Power Down
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4
MC14490
THEORY OF OPERATION
The MC14490 Hex Contact Bounce Eliminator is
basically a digital integrator. The circuit can integrate both
up and down. This enables the circuit to eliminate bounce on
both the leading and trailing edges of the signal, shown in the
timing diagram of Figure 3.
Each of the six Bounce Eliminators is composed of a
4−1/2−bit register (the integrator) and logic to compare the
input with the contents of the shift register, as shown in
Figure 4. The shift register requires a series of timing pulses
in order to shift the input signal into each shift register
location. These timing pulses (the clock signal) are
represented in the upper waveform of Figure 3. Each of the
six Bounce Eliminator circuits has an internal resistor as
shown in Figure 4. A pullup resistor was incorporated rather
than a pulldown resistor in order to implement switched
ground input signals, such as those coming from relay
contacts and push buttons. By switching ground, rather than
a power supply lead, system faults (such as shorts to ground
on the signal input leads) will not cause excessive currents
in the wiring and contacts. Signal lead shorts to ground are
much more probable than shorts to a power supply lead.
When the relay contact is closed, (see Figure 4) the low
level is inverted, and the shift register is loaded with a high
on each positive edge of the clock signal. To understand the
operation, we assume all bits of the shift register are loaded
with lows and the output is at a high level.
At clock edge 1 (Figure 3) the input has gone low and a
high has been loaded into the first bit or storage location of
the shift register. Just after the positive edge of clock 1, the
input signal has bounced back to a high. This causes the shift
register to be reset to lows in all four bits — thus starting the
timing sequence over again.
During clock edges 3 to 6 the input signal has stayed low.
Thus, a high has been shifted into all four shift register bits
and, as shown, the output goes low during the positive edge
of clock pulse 6.
It should be noted that there is a 3−1/2 to 4−1/2 clock
period delay between the clean input signal and output
signal. In this example there is a delay of 3.8 clock periods
from the beginning of the clean input signal.
OSCin OR OSCout
1
2
3
4
5
After some time period of N clock periods, the contact is
opened and at N+1 a low is loaded into the first bit. Just after
N+1, when the input bounces low, all bits are set to a high.
At N+2 nothing happens because the input and output are
low and all bits of the shift register are high. At time N+3
and thereafter the input signal is a high, clean signal. At the
positive edge of N+6 the output goes high as a result of four
lows being shifted into the shift register.
Assuming the input signal is long enough to be clocked
through the Bounce Eliminator, the output signal will be no
longer or shorter than the clean input signal plus or minus
one clock period.
The amount of time distortion between the input and
output signals is a function of the difference in bounce
characteristics on the edges of the input signal and the clock
frequency. Since most relay contacts have more bounce
when making as compared to breaking, the overall delay,
counting bounce period, will be greater on the leading edge
of the input signal than on the trailing edge. Thus, the output
signal will be shorter than the input signal — if the leading
edge bounce is included in the overall timing calculation.
The only requirement on the clock frequency in order to
obtain a bounce free output signal is that four clock periods
do not occur while the input signal is in a false state.
Referring to Figure 3, a false state is seen to occur three times
at the beginning of the input signal. The input signal goes
low three times before it finally settles down to a valid low
state. The first three low pulses are referred to as false states.
If the user has an available clock signal of the proper
frequency, it may be used by connecting it to the oscillator
input (pin 7). However, if an external clock is not available
the user can place a small capacitor across the oscillator
input and output pins in order to start up an internal clock
source (as shown in Figure 4). The clock signal at the
oscillator output pin may then be used to clock other
MC14490 Bounce Eliminator packages. With the use of the
MC14490, a large number of signals can be cleaned up, with
the requirement of only one small capacitor external to the
Hex Bounce Eliminator packages.
6
N+1
N+3
N+5
INPUT
OUTPUT
CONTACT
OPEN
CONTACT
BOUNCING
CONTACT CLOSED
(VALID TRUE SIGNAL)
CONTACT OPEN
CONTACT
BOUNCING
Figure 3. Timing Diagram
http://onsemi.com
5
N+7
MC14490
+VDD
Ain
1
FORM A"
CONTACT
OSCin 7
Cext
OSCout
9
PULLUP RESISTOR
(INTERNAL)
DATA
4−BIT STATIC SHIFT REGISTER
SHIFT
OSCILLATOR
AND
TWO−PHASE
CLOCK GENERATOR
1/2 BIT
DELAY
LOAD
15
Aout
φ1 φ2
φ1
φ1 φ2
φ2
Figure 4. Typical “Form A” Contact Debounce Circuit
(Only One Debouncer Shown)
OPERATING CHARACTERISTICS
The single most important characteristic of the MC14490
is that it works with a single signal lead as an input, making
it directly compatible with mechanical contacts (Form A
and B).
The circuit has a built−in pullup resistor on each input.
The worst case value of the pullup resistor (determined from
the Electrical Characteristics table) is used to calculate the
contact wetting current. If more contact current is required,
an external resistor may be connected between VDD and the
input.
Because of the built−in pullup resistors, the inputs cannot
be driven with a single standard CMOS gate when VDD is
below 5 V. At this voltage, the input should be driven with
Cext
OSCin
FROM CONTACTS
7
9
MC14490
paralleled standard gates or by the MC14049 or MC14050
buffers.
The clock input circuit (pin 7) has Schmitt trigger shaping
such that proper clocking will occur even with very slow
clock edges, eliminating any need for clock preshaping. In
addition, other MC14490 oscillator inputs can be driven
from a single oscillator output buffered by an MC14050 (see
Figure 5). Up to six MC14490s may be driven by a single
buffer.
The MC14490 is TTL compatible on both the inputs and
the outputs. When VDD is at 4.5 V, the buffered outputs can
sink 1.6 mA at 0.4 V. The inputs can be driven with TTL as
a result of the internal input pullup resistors.
OSCin7
1/6 MC14050
FROM
CONTACTS
OSCout
TO SYSTEM
LOGIC
NO CONNECTION
9OSC out
TO SYSTEM
LOGIC
MC14490
NO CONNECTION
9OSC out
OSCin7
FROM CONTACTS
MC14490
Figure 5. Typical Single Oscillator Debounce System
http://onsemi.com
6
TO SYSTEM
LOGIC
MC14490
TYPICAL APPLICATIONS
ASYMMETRICAL TIMING
MULTIPLE TIMING SIGNALS
In applications where different leading and trailing edge
delays are required (such as a fast attack/slow release timer.)
Clocks of different frequencies can be gated into the
MC14490 as shown in Figure 6. In order to produce a slow
attack/fast release circuit leads A and B should be
interchanged. The clock out lead can then be used to feed
clock signals to the other MC14490 packages where the
asymmetrical input/output timing is required.
As shown in Figure 8, the Bounce Eliminator circuits can
be connected in series. In this configuration each output is
delayed by four clock periods relative to its respective input.
This configuration may be used to generate multiple timing
signals such as a delay line, for programming other timing
operations.
One application of the above is shown in Figure 9, where
it is required to have a single pulse output for a single
operation (make) of the push button or relay contact. This
only requires the series connection of two Bounce
Eliminator circuits, one inverter, and one NOR gate in order
to generate the signal AB as shown in Figures 9 and 10. The
signal AB is four clock periods in length. If the inverter is
switched to the A output, the pulse AB will be generated
upon release or break of the contact. With the use of a few
additional parts many different pulses and waveshapes may
be generated.
IN
OSCin
OUT
MC14490
OSCout
MC14011B
1
A
EXTERNAL
CLOCK
Ain
B
fC
÷N
fC/N
14
Bin
B.E. 1
B.E. 2
15
2
Aout
Bout
Figure 6. Fast Attack/Slow Release Circuit
3
LATCHED OUTPUT
Cin
The contents of the Bounce Eliminator can be latched by
using several extra gates as shown in Figure 7. If the latch
lead is high the clock will be stopped when the output goes
low. This will hold the output low even though the input has
returned to the high state. Any time the clock is stopped the
outputs will be representative of the input signal four clock
periods earlier.
12
Din
5
Ein
IN
B.E. 4
B.E. 5
13
4
11
Cout
Dout
Eout
OUT
10
OSCin
B.E. 3
MC14490
Fin
B.E. 6
6
Fout
OSCout
MC14011B
CLOCK
OSCin
LATCH = 1
UNLATCH = 0
7
CLOCK
9
OSCout
Figure 8. Multiple Timing Circuit Connections
Figure 7. Latched Output Circuit
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7
MC14490
IN
A
OUT
BE 1
A
IN
OUT
BE 2
B
AB
B
A ≡ ACTIVE LOW
B ≡ ACTIVE LOW
Figure 9. Single Pulse Output Circuit
OSCin OR
OSCout
INPUT
A
B
C
D
E
F
AB
AB
Figure 10. Multiple Output Signal Timing Diagram
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8
MC14490
ORDERING INFORMATION
Device
Package
MC14490DW
SOIC−16
MC14490DWG
SOIC−16
(Pb−Free)
MC14490DWR2
SOIC−16
MC14490DWR2G
SOIC−16
(Pb−Free)
MC14490F
SOEIAJ−16
MC14490FG
SOEIAJ−16
(Pb−Free)
MC14490FEL
SOEIAJ−16
MC14490FELG
SOEIAJ−16
(Pb−Free)
MC14490P
PDIP−16
MC14490PG
PDIP−16
(Pb−Free)
Shipping †
47 Units / Rail
1000 / Tape & Reel
50 Units / Rail
2000 Units / Tape & Reel
25 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
MC14490
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SO−16 WB
CASE 751G−03
ISSUE C
A
D
9
h X 45 _
E
0.25
1
16X
M
14X
e
T A
S
B
S
L
A
0.25
B
B
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
DIM MIN
MAX
A
2.35
2.65
A1 0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0_
7_
8
A1
H
8X
M
B
M
16
q
SEATING
PLANE
T
C
http://onsemi.com
10
MC14490
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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11
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For additional information, please contact your local
Sales Representative
MC14490/D
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