IC70 Series Single Inline Package (SIP) Specifications Part Number (Details) Insulation Resistance: 1,000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m W max. at 10mA/20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +150°C Mating Cycles: 10,000 insertions min. IC70 - 30 11 MF - G 4 Series No. No. of Contact Pins Design Number Materials and Finish MF = Flanged Unmarked = Not Flanged Housing: Polysulphone (PSF), glass-filled - UL94V-0 Contacts: Beryllium Copper (BeCu) Plating: Gold (0.3µm min.) over Nickel (2.5 to 4.5µm min.) Contact Plating (G = Gold Plating) Features Straight, Through Hole Type í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating Outline Socket Dimensions for IC70-5616-G4 only 1) Outline Socket Dimensions May be cut at points marked by ý into 3 separate sections 125.0 116.0 A B C D 1.78 x 55 = 97.9 1.78 0.7 ý 7.0 ý E 1.78 x 23 = 40.94 1.78 x 23 = 40.94 Æ3.2 1.78 x 7 = 12.46 0.6 13.36 3.8 0.8 4.0 2- Æ3.5 11.5 102.0 5.0 11.0 0.5 x 0.46 4.0 Recommended PC Board Layout Top View from Socket B 0.5 x 0.46 D 2- Æ3.5 E Pin Count Æ0.8 Part Number IC70-0726**-G4 IC70-1217**-G4 IC70-1521**-G4 IC70-2020**-G4 IC70-2313**-G4 IC70-2418**-G4 IC70-3011**-G4 IC70-3015**-G4 IC70-3019**-G4 IC70-4014**-G4 IC70-5616**-G41) Test & Burn-In Pin Count A B C 7 12 15 20 23 24 30 30 30 40 56 26.6 41.0 36.8 47.5 44.0 63.0 77.0 57.0 62.5 94.0 125.0 19.6 34.0 29.8 40.5 38.0 57.0 67.0 49.0 55.5 84.0 116.0 12.6 27.0 22.8 33.5 32.0 51.0 57.0 41.0 48.5 74.0 102.0 D 1.27 x 6 = 7.62 2.00 x 11 = 22.00 1.27 x 14 = 17.78 1.50 x 19 = 28.50 1.27 x 22 = 27.94 2.00 x 23 = 46.00 1.80 x 29 = 52.20 1.27 x 29 = 36.83 1.50 x 29 = 43.50 1.778 x 55 = 69.342 1.78 x 55 = 97.90 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER E 1.27 2.0 1.27 1.5 1.27 2.0 1.8 1.27 1.5 1.778 1.78